E E ELEKTRONIK HTEx Series Digital Humidity and Temperature Sensors Instruction Manual
- June 9, 2024
- E E ELEKTRONIK
Table of Contents
E E ELEKTRONIK HTEx Series Digital Humidity and Temperature Sensors
HANDLING INSTRUCTIONS
for the digital humidity and temperature sensors HTEx
Introduction
This document provides handling instructions for the digital humidity and temperature sensor HTEx.
Processing Information
Storage Instructions
The digital HTEx series are highly accurate humidity and temperature sensors.
Therefore the storage instructions should be precisely followed. Pursuant to
IPC/JEDEC J-STD-020 the Moisture Sensitivity Level (MSL) is 1. At the same
time, it is recommended to further process the sensors within 1 year after
date of delivery. Please also note that highly concentrated chemical vapors
and long exposure times can influence the characteristic of the sensor.
It is advisable to keep the sensor package in the original manufacturing
packaging. If it is necessary to remove the packaging, ESD trays made from PS
(Polystyrol) are recommended, keeping the storage temperature in the range of
0…55 °C. In addition, sealed ESD bags are further recommended.
Soldering Instructions
For mechanical as well as electrical connection the pads have to be soldered
to the PCB. The center pad (die pad) may be left floating, anyway it is
recommended to connect it to the PCB for accurate measurement results.
For the exact dimensions of the land pattern, please see the product
datasheet.
For soldering, a standard convection reflow soldering oven may be used (no
vapour phase and no wave soldering). For this purpose, a lead-free, air, and
nitrogen reflowable no-clean type 3 solder paste, which meets the requirements
of the RoHS Directives 2011/65/EU and (EU) 2015/863, as well as the standards
by J STD 004 is recommended. Figure 1 below shows a typical soldering profile.
Please make sure that if there is more than 1 soldering cycle, the sensor is
soldered in the last one to avoid contamination of the active surface.
If this is not possible (e.g., selective soldering after the reflow soldering
process), the humidity sensor must be covered in such a way that no liquid or
gaseous fluxing agents can get onto the humidity sensor.
The sensor is rated MSL 1 according to JEDEC J-STD-020.
Please note that the sensor package itself is qualified to withstand the
profile given in JEDEC J STD-020 for lead-free soldering with a peak
temperature of 260 °C and a time in the critical zone above (Tpeak – 5 °C) of
up to 30 seconds. The packages passed the tests according to: J-STD-0021), AEC
Q100, method
AEC- Q0052), IEC 60068-2-583), MIL-202 M2104) and IEC 60068-2-215),
respectively.
The sensor is assigned a process sensitivity level (PSL) according to
EIA/IPC/JEDEC J-STD-075. The PSL is R4Y: The E+E proprietary coating in the
sensor opening must not be exposed to flux. The sensors must not be submerged
in a cleaning solution.
Post Reflow Treatment
We strongly recommend high humidity storage of the boards including the sensor packages after reflow soldering. 4 – 6 hours at 90 %RH (room temperature) is advisable (see also “moistening” in chapter 2.4.4). Measurement should be done after a short further rest (>1 hour) at room conditions.
General Information
During the whole transportation and manufacturing process it should be avoided
to expose the sensor to high concentrations of chemical solvents for extended
periods of time. Otherwise, the reconditioning procedure (see chapter 2.4.3)
must be followed.
Furthermore, the instructions given in chapter 2.4.1 and 2.4.2 shall be
considered. It must be ensured that the sensor is processed according to state
of the art electronic manufacturing services.
Recommended Packaging Materials
The best packaging is the original manufacturer packaging. If the sensor has
to be removed from this packaging ESD trays made from PS (Polystyrol) or
sealed ESD bags are recommended.
Forbidden Packaging Materials
The use of certain outgassing packaging materials such as foams (e.g.: Type
MOS 2200) glues, adhesive tapes and foils shall be avoided since it may change
the sensor characteristics.
Reconditioning Procedure
After exposure to extreme conditions or chemical solvents or storage time of
several months, the sensor characteristic curve may offset.
Exposure to higher temperature will reset the offset (e.g. 125 °C, 6 hours).
For further instructions, see chapter 2.4.4.
If heating up to 125 °C is not possible, the following is suggested:
Store the sensor at 70±5 °C, 75±5 %RH for min. 8 hours to complete the
reconditioning process.
- Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires: Tests B1 and S1
- Wearout reliability tests, Table 2: Qualification Test Methods, Test E12: lead- (Pb-) free
- Environmental testing – Part 2-58: Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) – Test Td1 (group 3), Td2 (group 3)
- Resistance to soldering heat –Test conditions B and K
- Environmental testing – Part 2-21: Tests – test U: Robustness of terminations and integral mounting devices – Tests Ue2 and Ue3
Measurements should be done after a short further rest (>1 hour) at room conditions.
Performance Measurement
In order to obtain precise, repeatable and meaningful measurement results, it
is absolutely necessary to subject the test samples to a defined procedure
consisting of a defined heating and reconditioning step before a
characteristic curve can be measured.
The following procedure must be followed:
- Heat the sensor from room temperature to 125 °C
- Store them at 125 °C ±5 °C for at least 6 hours.
- Allow the sensor to cool down to room conditions
- Moistening:
- Store sensor at 23 °C and 90 %RH between 4 and 6 hours
- Take 2 measurements at 23 °C and relative humidity between 15 %RH and 95 %RH
- Perform your characteristic curve measurement
INFORMATION
+43 7235 605 0 / info@epluse.com
E+E Elektronik Ges.m.b.H.
Langwiesen 7 • 4209 Engerwitzdorf • Austria Tel: +43 7235 605-0 • Fax: +43
7235 605-8 info@epluse.com •
www.epluse.com
LG Linz Fn 165761 t • VAT No. ATU44043101 Place of Jurisdiction: 4020 Linz •
DVR0962759
References
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