RENESAS RZ-G2L Evaluation Board Kits Instructions

RENESAS RZ-G2L Evaluation Board Kits

All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by Renesas Electronics Corp. without notice. Please review the latest information published by Renesas Electronics Corp. through various means, including the Renesas Electronics Corp. website (http://www.renesas.com).

Notice

1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation or any other use of the circuits, software, and information in the design of your product or system. Renesas Electronics disclaims any and all liability for any losses and damages incurred by you or third parties arising from the use of these circuits, software, or information.

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   “Standard”: Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; industrial robots; etc.
   “High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control (traffic lights); large-scale communication equipment; key financial terminal systems; safety control equipment; etc.
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7. No semiconductor product is absolutely secure. Notwithstanding any security measures or features that may be implemented in Renesas Electronics hardware or software products, Renesas Electronics shall have absolutely no liability arising out of any vulnerability or security breach, including but not limited to any unauthorized access to or use of a Renesas Electronics product or a system that uses a Renesas Electronics product. RENESAS ELECTRONICS DOES NOT WARRANT OR GUARANTEE THAT RENESAS ELECTRONICS PRODUCTS, OR ANY SYSTEMS CREATED USING RENESAS ELECTRONICS PRODUCTS WILL BE INVULNERABLE OR FREE FROM CORRUPTION, ATTACK, VIRUSES, INTERFERENCE, HACKING, DATA LOSS OR THEFT, OR OTHER SECURITY INTRUSION (“Vulnerability Issues”). RENESAS ELECTRONICS DISCLAIMS ANY AND ALL RESPONSIBILITY OR LIABILITY ARISING FROM OR RELATED TO ANY VULNERABILITY ISSUES. FURTHERMORE, TO THE EXTENT PERMITTED BY APPLICABLE LAW, RENESAS ELECTRONICS DISCLAIMS ANY AND ALL WARRANTIES, EXPRESS OR IMPLIED, WITH RESPECT TO THIS DOCUMENT AND ANY RELATED OR ACCOMPANYING SOFTWARE OR HARDWARE, INCLUDING BUT NOT LIMITED TO THE IMPLIED WARRANTIES OF MERCHANTABILITY, OR FITNESS FOR A PARTICULAR PURPOSE.

8. When using Renesas Electronics products, refer to the latest product information (data sheets, user’s manuals, application notes, “General Notes for Handling and Using Semiconductor Devices” in the reliability handbook, etc.), and ensure that usage conditions are within the ranges specified by Renesas Electronics with respect to maximum ratings, operating power supply voltage range, heat dissipation characteristics, installation, etc. Renesas Electronics disclaims any and all liability for any malfunctions, failure or accident arising out of the use of Renesas Electronics products outside of such specified ranges.

9. Although Renesas Electronics endeavors to improve the quality and reliability of Renesas Electronics products, semiconductor products have specific characteristics, such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Unless designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas Electronics document, Renesas Electronics products are not subject to radiation resistance design. You are responsible for implementing safety measures to guard against the possibility of bodily injury, injury or damage caused by fire, and/or danger to the public in the event of a failure or malfunction of Renesas Electronics products, such as safety design for hardware and software, including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult and impractical, you are responsible for evaluating the safety of the final products or systems manufactured by you.

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General Precautions

The Handling of Microprocessing Unit and Microcontroller Unit Products
The following usage notes are applicable to all Microprocessing unit and Microcontroller unit products from Renesas. For detailed usage notes on the products covered by this document, refer to the relevant sections of the document as well as any technical updates that have been issued for the products.

1. Precaution against Electrostatic Discharge (ESD)
   A strong electrical field, when exposed to a CMOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop the generation of static electricity as much as possible, and quickly dissipate it when it occurs. Environmental control must be adequate. When it is dry, a humidifier should be used. This is recommended to avoid using insulators that can easily build up static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work benches and floors must be grounded. The operator must also be grounded using a wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions must be taken for printed circuit boards with mounted semiconductor devices.

2. Processing at power-on
   The state of the product is undefined at the time when power is supplied. The states of internal circuits in the LSI are indeterminate and the states of register settings and pins are undefined at the time when power is supplied. In a finished product where the reset signal is applied to the external reset pin, the states of pins are not guaranteed from the time when power is supplied until the reset process is completed. In a similar way, the states of pins in a product that is reset by an on-chip power-on reset function are not guaranteed from the time when power is supplied until the power reaches the level at which resetting is specified.

3. Input of signal during power-off state
   Do not input signals or an I/O pull-up power supply while the device is powered off. The current injection that results from input of such a signal or I/O pull-up power supply may cause malfunction and the abnormal current that passes in the device at this time may cause degradation of internal elements. Follow the guideline for input signal during power-off state as described in your product documentation.

4. Handling of unused pins
   Handle unused pins in accordance with the directions given under handling of unused pins in the manual. The input pins of CMOS products are generally in the high-impedance state. In operation with an unused pin in the open-circuit state, extra electromagnetic noise is induced in the vicinity of the LSI, an associated shoot-through current flows internally, and malfunctions occur due to the false recognition of the pin state as an input signal become possible.

5. Clock signals
   After applying a reset, only release the reset line after the operating clock signal becomes stable. When switching the clock signal during program execution, wait until the target clock signal is stabilized. When the clock signal is generated with an external resonator or from an external oscillator during a reset, ensure that the reset line is only released after full stabilization of the clock signal. Additionally, when switching to a clock signal produced with an external resonator or by an external oscillator while program execution is in progress, wait until the target clock signal is stable.

6. Voltage application waveform at input pin
   Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the CMOS device stays in the area between VIL (Max.) and VIH (Min.) due to noise, for example, the device may malfunction. Take care to prevent chattering noise from entering the device when the input level is fixed, and also in the transition period when the input level passes through the area between VIL (Max.) and VIH (Min.).

7. Prohibition of access to reserved addresses
   Access to reserved addresses is prohibited. The reserved addresses are provided for possible future expansion of functions. Do not access these addresses as the correct operation of the LSI is not guaranteed.

8. Differences between products
   Before changing from one product to another, for example to a product with a different part number, confirm that the change will not lead to problems. The characteristics of a microprocessing unit or microcontroller unit products in the same group but having a different part number might differ in terms of internal memory capacity, layout pattern, and other factors, which can affect the ranges of electrical characteristics, such as characteristic values, operating margins, immunity to noise, and amount of radiated noise. When changing to a product with a different part number, implement a system- evaluation test for the given product.

The purpose of this guide
This guide helps PCB design engineers to estimate product lifetimes for the RZ/G2L, RZ/G2LC, RZ/V2L, RZ/G2UL, RZ/Five and RZ/A3UL based on the criteria used in the qualification process. The product lifetimes described here are estimates and do not represent a guaranteed lifetime for a product. The RZ/G2L, RZ/G2LC, RZ/V2L, RZ/G2UL, RZ/Five and RZ/A3UL consist of several processors that deliver a wide range of processing and multimedia capabilities across various qualification levels. This document is intended to provide users with guidance on how to interpret the different RZ/G2L, RZ/G2LC, RZ/V2L, RZ/G2UL, RZ/Five and RZ/A3UL qualification levels in terms of the target operating frequency of the device, the maximum supported junction temperature(Tj) of the processor, and how it relates to the lifetime of the device.
All information shown in this guide, including product specifications, represents the information at the time of publication and is subject to change by Renesas Electronics Corp. without notice. Please review the latest information published by Renesas Electronics Corp. SOC means RZ/G2L, RZ/G2LC, RZ/V2L, RZ/G2UL, RZ/Five and RZ/A3UL (PBGA) in this document.

Device Qualification Level and available Power-on Hours

Device qualification level defines a number of Power-on Hours (PoH) available to the processor under a given set of the conditions. For example,

• The lifetime is limited by the SOC operating voltage.
• For the Industrial tier, the maximum performance mode is 1.2 GHz.
  • The Tj of the processor.
    Users must ensure that their device is appropriately thermally managed such that the maximum junction temperature is not exceeded. All data provided within this document are estimates for PoH that are based on extensive qualification experience and testing with the RZ/G2L, RZ/G2LC, RZ/V2L, RZ/G2UL, RZ/Five and RZ/A3UL. These statistically derived estimates should not be viewed as a limit on an individual device lifetime, nor should they be construed as a guarantee by Renesas as to the actual lifetime of the device. Sales and warranty terms and conditions still apply.

Table 1.1 Device lifetime estimates provides the number of PoH for the typical use conditions for the industrial device.
Figure 1.1 establishes guidelines for estimating PoH as a function of junction temperature. PoH can be read directly from the curves below to determine the necessary trade-offs to junction temperature at the maximum CPU frequency.

Conclusion

Selecting the optimal operating performance point and thermal envelope is paramount to meeting the application lifetime targets. The operating Tj of the processor can greatly improve the lifetime of the device. Lowering the operating junction temperature in the application is the most effective means to increase the lifetime of the device without affecting the performance of the device. This can be accomplished by increasing the thermal dissipation capacity in the application. In cases where the thermal properties cannot be altered, a lower operating voltage can be used to increase the lifetime of the device. Lowering the voltage may result in lowered performance; the operating frequency may have to be adjusted lower to match the voltage as specified in the datasheet. The data and examples provided in this application note help users determine the estimated lifetime for their particular application.

REVISION HISTORY| RZ/G2L, RZ/G2LC, RZ/G2UL, RZ/V2L, RZ/Five, RZ/A3UL Lifetime Guideline
---|---
Rev.| Date| Description
---|---|---
Page| Summary
1.00| Oct 05, 2021| ¾| First edition issued
1.01| Dec 01, 2021| All| RZ/G2UL is added.
1.02| Jun 20, 2022| All| RZ/Five is added.
1.03| Jun 24, 2022| All| RZ/A3UL is added.

RZ/G2L, RZ/G2LC, RZ/G2UL, RZ/V2L, RZ/Five, RZ/A3UL Lifetime Guideline

• Publication Date:
  • Rev.1.00 Oct 05, 2021
  • Rev.1.03 Jun 24, 2022
• Published by: Renesas Electronics Corporation

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References

• Renesas Electronics Corporation
• Distributor Network | Renesas Semiconductors | Renesas
• Renesas Electronics Corporation

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