BroadLink BL5027-P, EL5027-P Combo Module User Manual

BroadLink BL5027-P, EL5027-P Combo Module

Specifications

• Model: BL5027-P/EL5027-P
• Antenna: PCB antenna
• Working Voltage: DC 5.0V
• Memory: 512KB SRAM/4MB pSRAM External 4MB FLASH
• Wireless Standards: IEEE 802.11 b/g/n
• Working Temperature: 0~85°C

Product Usage Instructions

Overview
The BL5027-P/EL5027-P is an embedded Wi-Fi module designed by BroadLink. It features a Cortex-M33+Cortex-M23 dual-core MCU with 512KB SRAM + 4MB pSRAM and 4MB external flash, operating at a power supply of 5V. This module is suitable for applications in smart home devices, remote monitoring devices, and medical care  instruments.

Basic Specifications

Power Consumption
Please refer to the table below for power consumption data:

Working Environment
Please refer to the table below for working environment data:

Radio Specifications

Basic Radio Specification
Please refer to the table below for radio specifications:

Radio Performance

IEEE802.11b
Please refer to the tables below for IEEE802.11b specifications.

Frequently Asked Questions (FAQ)

• Q: What are some common applications of the BL5027-P/EL5027-P module?
  A: Common applications include smart transportation, smart home/appliances, instruments, health care, industrial automation, intelligent security, and smart energy.

• Q: What wireless standards does the module support?
  A: The module supports IEEE 802.11 b/g/n standards.

World’s leading smart home solution provider

BL5027-P/EL5027-P Combo Module
Version: 1.3 Release date: 27/9/2023

Features

• Cortex-M33+Cortex-M23 dual core
• 512KBSRAM/4MBpSRAM
• External 4MB FLASH
• Support XIP
• Support AES, MD5 and SHA1
• Working voltage: DC 5.0V
• Support BLE5.0
• Wi-Fi related features
• Support 802.11 b/g/n standard
• Support station and soft AP
• Support SmartConfig and AP configuration
• Support WEP/WPA2
• Support multiple cloud services.
• Integrated balun/PA/LNA
• TCP/IP stack optimized for IoT application.
• PCB antenna
• Peripherals:
• 1x UART
• Working temperature: 0~ 85 ℃

Applications

• Smart transportation
• Smart home / appliances
• Instruments
• Health care
• Industrial automation
• Intelligent security
• Smart energy

Model

Overview

BL5027-P/EL5027-P is an embedded Wi-Fi module designed by BroadLink, highly integrated with Cortex-M33+Cortex-M23 dual core MCU with 512KB SRAM + 4MB pSRAM and 4MB external flash, with 5V power supply.
The module integrates radio transceiver, MAC, baseband, all Wi-Fi protocols, configurations, and network stack. It can be widely used in applications like smart home devices, remote monitoring devices and medical care instruments.

Basic Specifications

Power Consumption
Please refer to Table 1 for power consumption data.

Table 1 Power Consumption Data

pulse current @TX

11b @17dBm 11Mbps

| | 260| | mA
pulse current @TX

11g @15dBm 54Mbps

| | 250| | mA
pulse current @TX| | 245| | mA
11n @14.5dBm 65Mbps| | | |
---|---|---|---|---
pulse current @BLE

@5.5dBm

| | 125| |

Working Environment
Please refer to Table 2 for working environment data.

Table2 WorkingEnvironment Data

Radio Specifications

Basic Radio Specification
Please refer to Table 3 for radio specification.

Table 3 Radio Specification

802.11g:14.5±1.5dBm@54Mbps
802.11n:14.5±1.5dBm@MCS7/HT20
BLE: 2.5±2.5dBm
Antenna type| Internal: PCB antenna
External: Not supported
Receiving sensitivity| 802.11b≦-90dBm@11Mbps
| 802.11g≦-76dBm@54Mbps
---|---
802.11n/HT20≦-73dBm@MCS7
BLE ≦- 97dBm
Stack| IPv4, TCP/UDP/FTP/HTTP/HTTPS/TLS/mDNS
Data rate (max)| 11M@802.11b, 54M@802.11g, MCS7@802.11n

Security

| Encryption standard: Open/WEP-Open/WPA/WPA2
Encryption algorithm: WEP64/WEP128/TKIP/AES
Network types| STA/AP

Radio Performance

IEEE802.11b

Table 4 Basic specifications under IEEE802.11b

Table 5 Transmitting performance under IEEE802.11b

Transmit spectrum mask
Pass

Table 6 Receiving performance under IEEE802.11b

11Mbps Input Level Sensitivity
Minimum Input Level (FER≦ 8%)| | | -90| dBm

IEEE 802.11g

Table 7 Basic specifications under IEEE802.11g

Table 8 Transmitting performance under IEEE802.11g

Transmit spectrum mask
Pass

Table 9 Receiving performance under IEEE802.11g

54Mbps Input Level Sensitivity
Minimum Input Level (FER≦10%)| | | -76| dBm

IEEE802.11n
IEEE802.11n 20MHz bandwidth mode

Table 10 Basic specifications under IEEE802.11n with 20MHz

Table 11 Transmitting performance under IEEE802.11n with 20MHz

Transmit spectrum mask
Pass

Table 12 Receiving performance under IEEE802.11n with 20MHz

MCS7 Input Level Sensitivity
Minimum Input Level (FER≦10%)| | | -73| dBm

Hardware Information

PIN Sequence
Please refer to Fig 1 for the pin sequence.

PIN Definitions
Please refertoTable 13 forpin definitions.

LV effective

8| NC|
9| PB31| GPIO
10| PA0| GPIO
11| PA4| GPIO
12| PA2| GPIO
13| NC|
14| PA8| UART_RX_LOG
15| PA7| UART_TX_LOG
16| PA12| LP_UART_TX

Table 13 BL5027-P pin definitions

Note

1. Pin1~Pin16 can be used if the module is modified on hardware for 3.3V input.
2. LP_UART; HS_UART and UART_LOG only support 3.3V level.
3. UART_TX_5V, UART_TX_5V is used for communication with external MCU powered by 5V.Please refer to the description 1.1.3.DC Characteristics for UART output current level.
4. DO NOT add current-limiting resistor in the circuit of UART_TX_5V and UART_RX_5V to avoid abnormal communication due to abnormal level conversion on chipset.
5. Pulling down PA7 will switch the module to firmware programming mode.

Recommendations
The following precautions should be considered during PCB designing:
It is recommended to not place any electrical components within 10mm range of module antenna and not design any circuit or bond copper on main board under this area.
Do not use the module inside any metal caseo rcontainers with metal painting.

Mechanical Dimensions
Please refer to Fig 3 for the dimensions of module.

Note: Dimensions (17±0.2) mm (30±0.2) mm () mm (with shielding case)

4.5. Connector Dimensions
Please refer to Fig 4 for the dimensions of connector

Certifications

1. Certified for SRRC standard
2. Compliant with requirement of RoHS 2.0.
3. Compliant with requirement of REACH.

Label

To be updated

Fig 5 label content Please refer to Fig 8 for the content description on label. Model: ***: Module model
SN： : Serial Number, module unique MAC address NOTE: Label for reference and may vary from actual spec.

Mechanical Dimensions
Please refer to Fig 6 for the dimensions of shielding case.

Packaging
Electrostatic bag + honeycomb pallet box

Reference Design

UART Interface Design

For devices with 5V power supply, you can directly connect the device UART port with module UART port according to the illustration.
DO NOT add current-limiting resistor in the circuit of UART_TX_5V and UART_RX_5V to avoid abnormal communication due to abnormal level conversion on chipset.

Power Supply Requirement
Please ensure that the power supply can provide a sufficiently large current. During the DPD phase, the module will experience consecutive pulses with a duration of approximately 50us. It is recommended that the power supply be capable of providing a pulse current of at least 600mA. During the normal operation of the module inthedata transmission phase, the power supply should be able to sustain a current of at least 400mA.
You can change the spec of capacitor at C1 according to actual hardware design to fit the needs for ripple control (recommended to apply capacitance higher than 22uF)

List of applicable FCC rules

FCC Part 15.247
Label and compliance information
FCC ID label on the final system must be labeled with “Contains FCC ID:
2ATEV-BL5027-P” or “Contains transmitter module FCC ID: 2ATEV-BL5027-P”.

Information on test modes and additional testing requirements
Contact Hangzhou BroadLink Technology Co., Ltd will provide stand-alone modular transmitter test mode. Additional testing and certification may be necessary when multiple modules are used in a host.

Additional testing, Part 15 Subpart B disclaimer
To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring compliance with the module(s) installed and fully operational. For example, if a host was previously authorized as an unintentional radiator under the Supplier’s Declaration of Conformity procedure without a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring that the after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements. Since this may depend on the details of how the module is integrated with the host, Hangzhou BroadLink Technology Co., Ltd. shall provide guidance to the host manufacturer for compliance with the Part 15B requirements.

FCC Warning

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

1. This device may not cause harmful interference, and
2. This device must accept any interference received, including interference that may cause undesired operation.

NOTE 1: Any changes or modifications to this unit not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.

FCC Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying RF exposure compliance.
Note 1: This module certified that complies with RF exposure requirement under mobile or fixed condition, this module is to be installed only in mobile or fixed applications.
A mobile device is defined as a transmitting device designed to be used in other than fixed locations and to generally be used in such a way that a separation distance of at least 20 centimeters is normally maintained between the transmitter’s radiating structure(s) and the body of the user or nearby persons. Transmitting devices designed to be used by consumers or workers that can be easily re-located, such as wireless devices associated with a personal computer, are considered to be mobile devices if they meet the 20 centimeter separation requirement.
A fixed device is defined as a device is physically secured at one location and is not able to be easily moved to another location.
Note 2: Any modifications made to the module will void the Grant of Certification, this module is limited to OEM installation only and must not be sold to end-users, end-user has no manual instructions to remove or install the device, only software or operating procedure shall be placed in the end- user operating manual of final products.
Note 3: The module may be operated only with the antenna with which it is authorized. Any antenna that is of the same type and of equal or less directional gain as an antenna that is authorized with the intentional radiator may be marketed with, and used with, that intentional radiator.
Note 4: For all products market in US, OEM has to limit the operation channels in CH1 to CH11 for 2.4G band by supplied firmware programming tool. OEM shall not supply any tool or info to the end-user regarding to Regulatory Domain change.

IC WARNING
This device contains licence-exempt transmitter(s) that comply with Innovation, Science and Economic Development Canada’s licence-exempt RSS(s). Operation is subject to the following two conditions:

1. This device may not cause interference.
2. This device must accept any interference, including interference that may cause undesired operation of the device.

IC Radiation Exposure Statement:
This device and its antenna(s) must not be co-located with any other transmitters except in accordance with IC multi-transmitter product procedures. Referring to the multi-transmitter policy, multiple-transmitter(s) and module(s) can be operated simultaneously without reassessment permissive change.

This module is limited to OEM installation only and must not be sold to end- users, end-user has no manual instructions to remove or install the device, only software or operating procedure shall be placed in the end-user operating manual of final products. Additional testing and certification may be necessary when multiple modules are used.
Any changes or modifications not expressly approved by the manufacturer could void the user’s authority to operate this equipment.
The final end product must be labeled in a visible area with the following ” Contains IC: 25062-BL5027P “.

Revision History

5V UART
7/4/2023| 1.2| Updated the value of VIH, changed the power supply requirement, added the current consumption when sending BLE packets, added size of shielding case and added support of XIP
27/9/2023| 1.3| Add instructions for entering download mode

Copyrights
It is prohibited to use or copy all or any part of contents in this manual without prior permission, especially applicable for trademarks, models, part numbers and figures.

Contact Us
Hangzhou BroadLink Technology Co., Ltd.
Add: Building C, 57 Jiang’er Road, Binjiang District, Hangzhou, P.R.China
Postcode: 310052
Tel: +86-571-85071744-8010
Email: bingqi.zhou@broadlink.com.cn —————————————————————————————-
For more information of BroadLink Wi-Fi modules, please visit our website: www.broadlink.com.cn

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