dahua 8812CU3 802.11ac 867Mbps 2T2R WiFi USB Module User Manual

June 5, 2024
Dahua

8812CU3
User Manual

Module Name:

Module Type: 802.11ac 867Mbps 2T2R WiFi USB Module
Revision: V1.0
Customer Approval:
Company:
Title:
Signature:| Date:
BL-link Approval:
Title:
Signature:| Date:

Revision History

Revision Summary Release Date
0.1 Initial release  2020-05-20
1.0 The official release (change product picture)  2020-06-24

Introduction

8812CU3 is a highly integrated 2*2 dual-band wireless LAN module. It combines a WLAN MAC, a 2T2R capable WLAN base banda dual-band WLAN radio. It supports IEEE 802.11a/b/g/n/ac standard and provides the highest PHY rate up to 867Mbps, It can offer feature-rich wireless connectivity and reliable throughput from an extended distance.

Features
  • Operating Frequencies: 2.4~2.4835GHz and 5.15~5.85GHz
  • Host Interface is USB2.0 IEEE Standards: IEEE 802.11a/b/g/n/ac
  • The wireless data rate can reach up to 867Mbps
  • Connect to the external antenna through
  • IPEX connectors Power Supply: VDD 3.3V±0.2V
Block Diagram
General Specifications
Module Name 8812CU3
 Chipset RTL8812CU-CG
WiFi Standards IEEE802.11a/b/g/n/ac, 2T2R MIMO, 2.4G/5GHz, 867Mbps (Max)
Host Interface  USB2.0
Antenna Connect to the external antennas through IPEX connectors
Dimension SMD 12Pins, 27.017.83.1mm (LWHTolerance:±0.15mm)
Power Supply VDD 3.3V±0.2V @850mA Max
--- ---
 Operation Temperature -20 to +70
Operation Humidity 10% to 95% RH (Non-Condensing)

Pin Assignments

Pin Definition
No Pin Name Type Description Supply
1 GND RF RF Ground
2 NC RF NC (Reserved for 2.4/SG-ANT1)
3 GND RF RF Ground
4 GND RF RF Ground
5 NC RF NC (Reserved for 2.4/5G-ANTO)
6 GND RF RF Ground
7 LED 0 WiFi LED Pin (Active Low, external current limiting resistor
required) VDD
8 GND P Ground
9 DP+ I/O USB 2.0 differential pair VDD
10 DM- I/O USB 2.0 differential pair VDD
11 VDD P DC 3.3V power supply
12 PDF I Power Down, this Pin can externally shutdown the Module (Active
Low, internal pull high by 47K resistor) VDD
IPEX0 PEX1 2.4/5G-ANT0 RF 2.4G / 5G RF to IPEX connector for ANT0
IPEX1 PEX1 2.4/5G-ANT1 RF 2.4G / 5G RF to IPEX connector for ANT1

P: Power, I: Input, O: Output, I/O: In/Output, RF: Analog RF Port

Electrical and Thermal Specifications

Recommended Operating Conditions
Parameters Min Typ Max Units
Ambient Operating Temperature -20 25 70 °C
External Antenna VSWR (Voltage Standing Wave Ratio) 2. 2
Supply Voltage 1 VDD 3. 3. 4.
Digital I/O DC Specifications
Symbol Parameter Min Typ Max Units
VIA Input High Voltage 2.0 3. 4. V
VIL Input Low Voltage 0 0.9 V
VEOH Output High Voltage 3. 3. V
VOL Output Low Voltage 0 0.33 V
Current Consumption

Conditions : VDD=3.3V ; Ta:25℃

Use Case

| VDD Current (average)
Typ| Max| Units
WiFi Radio Off (Linux Driver)| 20| 50| mA
WiFi Unassociated (Linux Driver)| 100| 150| mA
2.4G 11Mbps TX (RF-Test,1TX) for 18dBm| 340| 380| mA
2.4G 11Mbps RX (RF-Test,1RX)| 200| 250| mA
---|---|---|---
2.4G 6Mbps TX (RF-Test,1TX) for 16dBm| 330| 370| mA
2.4G 6Mbps RX (RF-Test,1RX)| 200| 240| mA
2.4G 54Mbps TX (RF-Test,1TX) for 16dBm| 240| 270| mA
2.4G 54Mbps RX (RF-Test,1RX)| 200| 230| mA
2.4G MCS15(HT20) TX (RF-Test,2TX) for 16dBm| 270| 310| mA
2.4G MCS15(HT20) RX (RF-Test,2RX)| 210| 230| mA
2.4G MCS15(HT40) TX (RF-Test,2TX) for 16dBm| 255| 285| mA
2.4G MCS15(HT40) RX (RF-Test,2RX)| 220| 260| mA
5.8G 6Mbps TX (RF-Test,1TX) for 16dBm| 390| 430| mA
5.8G 6Mbps RX (RF-Test,1RX)| 190| 210| mA
5.8G 54Mbps TX (RF-Test,1TX) for 16dBm| 255| 285| mA
5.8G 54Mbps RX (RF-Test,1RX)| 210| 260| mA
5.8G MCS0(HT20) TX (RF-Test,2TX) for 16dBm| 290| 340| mA
5.8G MCS0(HT20) RX (RF-Test,2RX)| 190| 200| mA
5.8G MCS15(HT40) TX (RF-Test,2TX) for 16dBm| 260| 290| mA
5.8G MCS15(HT40) RX (RF-Test,2RX)| 210| 240| mA
5.8G MCS9(VHT80) TX (RF-Test,2TX) for 14dBm| 250| 290| mA
5.8G MCS9(VHT80) RX (RF-Test,2RX)| 210| 230| mA

WiFi RF Specifications

2.4G WiFi RF Specification

Conditions : VDD=3.3V ; Ta:25℃

Features| Description
WLAN Standard| IEEE 802.11b/g/n CSMA/CA
Frequency Range| 2.4~2.4835GHz (2.4GHz ISM Band)
---|---
Channels| Ch1~Ch11 (For 20MHz Channels)

Modulation

| 802.11b (DSSS): DBPSK, DQPSK, CCK;

802.11g (OFDM): BPSK, QPSK, 16QAM, 64QAM;

802.11n (OFDM): BPSK, QPSK, 16QAM, 64QAM;

Date Rate

| 802.11b: 1, 2, 5.5, 11Mbps;

802.11g: 6, 9, 12, 18, 24, 36, 48, 54Mbps;

802.11n (HT20): MCS0~MCS7(1T1R_SISO) 6.5~72.2Mbps;

802.11n (HT20): MCS8~MCS15(2T2R_MIMO) 13~144.4Mbps;

802.11n (HT40): MCS0~MCS7(1T1R_SISO) 13.5~150Mbps;

802.11n (HT40): MCS8~MCS15(2T2R_MIMO) 27~300Mbps;

Antenna type| PCB antenna
Antenna Gain| Ant0: 6.07dBi ant1: 5.15dBi
Frequency Tolerance| ≦ ±20ppm
2.4G Transmitter Specifications (Ant0/Ant1)
TX Rate| TX Power| TX Power Tolerance| EVM
802.11b@1~11Mbps| 18dBm| ±1.5dBm| ≦-10dB
802.11g@6Mbps| 16dBm| ±1.5dBm| ≦-10dB
802.11g@54Mbps| 16dBm| ±1.5dBm| ≦-25dB
802.11n@HT20_MCS0| 16dBm| ±1.5dBm| ≦-10dB
802.11n@HT20_MCS7| 16dBm| ±1.5dBm| ≦-28dB
802.11n@HT40_MCS0| 16dBm| ±1.5dBm| ≦-10dB
802.11n@HT40_MCS7| 16dBm| ±1.5dBm| ≦-28dB
2.4G Receiver Specifications (Ant0/Ant1)
RX Rate| Min Input Level (Typ)| Max Input Level (Typ)| PER
802.11b@1Mbps| -93dBm| -5dBm| < 8%
802.11b@11Mbps| -87dBm| -5dBm| < 8%
802.11g@6Mbps| -91dBm| -10dBm| < 10%
802.11g@54Mbps| -73dBm| -10dBm| < 10%
802.11n@HT20_MCS0| -90dBm| -10dBm| < 10%
802.11n@HT20_MCS7| -71dBm| -10dBm| < 10%
802.11n@HT40_MCS0| -86dBm| -10dBm| < 10%
802.11n@HT40_MCS7| -68dBm| -10dBm| < 10%

5G WiFi RF Specification

Conditions: VDD=3.3V; Ta:25℃

Features| Description
WLAN Standard| IEEE 802.11a/n/ac CSMA/CA

Frequency Range

| 5.15~5.25GHz; 5.25~5.35GHz; 5.47~5.725GHz;
5.725~5.85GHz (5GHz ISM Band)
---|---

Channels

| Ch36, Ch40, Ch44, Ch48; Ch52~Ch64; Ch100~Ch140;
Ch149~Ch165 (For 20MHz Channels)

Modulation

| 802.11a (OFDM): BPSK, QPSK, 16QAM, 64QAM;
802.11n (OFDM): BPSK, QPSK, 16QAM, 64QAM;
802.11ac (OFDM): BPSK, QPSK, 16QAM, 64QAM, 256QAM;

Date Rate

| 802.11a: 6, 9, 12, 18, 24, 36, 48, 54Mbps;
802.11n (HT20): MCS0~MCS7(1T1R_SISO) 6.5~72.2Mbps;
802.11n (HT20): MCS8~MCS15(2T2R_MIMO) 13~144.4Mbps;
802.11n (HT40): MCS0~MCS7(1T1R_SISO) 13.5~150Mbps;
802.11n (HT40): MCS8~MCS15(2T2R_MIMO) 27~300Mbps;
802.11ac (VHT20): MCS0~MCS8(1T1R_SISO) 6.5~86.7Mbps;
802.11ac (VHT20): MCS0~MCS8(2T2R_MIMO) 13~173.3Mbps;
802.11ac (VHT40): MCS0~MCS9(1T1R_SISO)13.5~200Mbps;
802.11ac (VHT40): MCS0~MCS9(2T2R_MIMO)27~400Mbps;
802.11ac (VHT80): MCS0~MCS9(1T1R_SISO)29.3~433.3Mbps;
802.11ac (VHT80): MCS0~MCS9(2T2R_MIMO)58.5~866.7Mbps;
Antenna type| PCB antenna

Antenna Gain

| Ant0| 5150 -5250MHz| 5.02 dBi
5250-5350MHz| 6.15 dBi
5470-5725MHz| 8.46 dBi
5725-5850MHz| 9.23 dBi
Ant1| 5150 -5250MHz| 6.45 dBi
5250-5350MHz| 6.48 dBi
5470-5725MHz| 7.26 dBi
5725-5850MHz| 5.38 dBi
Frequency Tolerance| ≦ ±20ppm
5G Transmitter Specifications ( Ant0/Ant1 )
TX Rate| TX Power| TX Power Tolerance| EVM
802.11a@6Mbps| 16dBm| ±2dBm| ≦-10dB
802.11a@54Mbps| 16dBm| ±2dBm| ≦-25dB
802.11n@HT20_MCS0
802.11ac@VHT20_MCS0| 16dBm| ±2dBm| ≦-10dB
802.11n@HT20_MCS7
802.11ac@VHT20_MCS7|

16dBm

|

±2dBm

|

≦-28dB

---|---|---|---
802.11n@HT40_MCS0
802.11ac@VHT40_MCS0| 16dBm| ±2dBm| ≦-10dB
| | |
802.11n@HT40_MCS7
802.11ac@VHT40_MCS7| 16dBm| ±2dBm| ≦-28dB
802.11ac@VHT20_MCS8| 16dBm| ±2dBm| ≦-30dB
802.11ac@VHT40_MCS8
802.11ac@VHT40_MCS9| 16dBm| ±2dBm| ≦-32dB
802.11ac@VHT80_MCS0| 14dBm| ±2dBm| ≦-10dB
802.11ac@VHT80_MCS9| 14dBm| ±2dBm| ≦-32dB
5G Receiver Specifications ( Ant0/Ant1 )
RX Rate| Min Input Level(Typ)| Max Input Level(Typ)| PER
802.11a@6Mbps| -90dBm| -10dBm| < 10%
802.11a@54Mbps| -72dBm| -10dBm| < 10%
802.11n@HT20_MCS0| -89dBm| -15dBm| < 10%
802.11n@HT20_MCS7| -70dBm| -15dBm| < 10%
802.11n@HT40_MCS0| -86dBm| -15dBm| < 10%
802.11n@HT40_MCS7| -68dBm| -15dBm| < 10%
802.11ac@VHT80_MCS0| -84dBm| -15dBm| < 10%
802.11ac@VHT80_MCS9| -58dBm| -15dBm| < 10%

Mechanical Specifications

Module Outline Drawing

(Top View) Module dimension: 27.0mm17.8mm3.1mm LWH , Tolerance: ±0.15mm
IPEX connector dimension: 2.63.01.2mm (LWH, Ø2.0mm)

Mechanical Dimensions

Application Information

Typical Application Circuit
Recommend PCB Layout Footprint
Reflow Soldering Standard Conditions

Please use the reflow within 2 times. Set up the highest temperature within 250.

Key Components Of Module

No. Parts Specification Manufacturer Note
1 Chipset RTL8812CU-CG Realtek

2

| ****

PCB

| ****

BL-M8812CU3

| Shen Zhen Tie Fa Technology limited|
MILLION SOURCE PRINTED CIRCUIT BOARD CO., LTD|
Quzhou Sunlord Electronics Co., Ltd|


3

| ****

Crystal

| ****

40MHz-10pF-10ppm-3225

| HUBEI TKD ELECTRONICS TECHNOLOGY CO., LTD.|
LUCKI CM ELECTRONICS CO., LTD|
HOSONIC ELECTRONIC CO., LTD.|


4

| ****

Diplexer

| DPX166000DT-8093A1 /DP1608-A2455BKH0T| TDK China Co., Ltd.|
Advanced Ceramic X|

Package and Storage Information

Package Dimensions
ITEM W AO BO KO E F P PO P2 DO
DIM 44.00+0.3 18.10+0.1 27.40+0.1 3.50+0.1 1.75±0.1 20.2+0.1 24.00+0.1
4.00+0.1 2.00+0.1 01.5+0.1

Package specification:

  1. 700 modules per roll and 2,800 modules per box.
  2. Outer box size: 53629cm.
  3. The diameter of the blue environment-friendly rubber plate is 13 inches, with a total thickness of 48mm (with a width of 44mm carrying belt).
  4. Put 1 package of dry agent (20g) and a humidity card in each anti-static vacuum bag.
  5. Each carton is packed with 4 boxes.
Storage Conditions

Absolute Maximum Ratings:
Storage temperature: -45℃ to +85℃
Storage humidity: 10% to 95% RH(Non-Condensing)

Recommended Storage Conditions:
Storage temperature: 5℃ to +40℃
Storage humidity: 20% to 90% RH
Please use this Module within 12month after being vacuum-packaged. The Module shall be stored without opening the packing.
After the packing opened, the Module shall be used within 72hours. When the color of the humidity indicator in the packing changed, the Module shall be baked before soldering.
Baking condition: 60℃, 24hours, 1time.

ESD Sensitivity:

The Module is a static-sensitive electronic device.
Do not operate or store near strong electrostatic fields. Take proper ESD precautions!

U.S. FCC Part 15 Regulatory Information

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.

Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
–Reorient or relocate the receiving antenna.
–Increase the separation between the equipment and receiver.
–Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
–Consult the dealer or an experienced radio/TV technician for help.

This modular complies with FCC RF radiation exposure limits set for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. This modular must be installed and operated with a minimum distance of 20 cm between the radiator and the user’s body.
The device is going to be operated in the 5150~5350MHz frequency range. It is restricted to the indoor environment only.
The end product must carry a label stating “Contains FCC ID: SVN-R8812AF” or shall use e-labeling.
Manufacturer’s name and address: SHENZHEN BILAN ELECTRONIC CO., LTD 10~11/F, Building 1A, Huaqiang idea park, Guangming district, Shenzhen. Guangdong, China

http://www.b-link.net.cn

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