LAPIS TECHNOLOGY RB-D62Q2747TB100 User Manual
- June 6, 2024
- LAPIS TECHNOLOGY
Table of Contents
LAPIS TECHNOLOGY RB-D62Q2747TB100
Product Information
Specifications
- Model: RB-D62Q2747TB100
- Issue Date : May 27, 2022
- Manufacturer: ROHM Co., Ltd.
- Not designed to be radiation-tolerant
- Compliance: RoHS Directive
- Export regulations apply for international distribution
- Website: www.lapis-tech.com/en/
Product Usage Instructions
Overview
The ML62Q2747 Reference Board RB-D62Q2747TB100 is a product designed for specific applications. It is important to refer to the user manual for detailed information on usage.
Features
The product features include [insert features here from the manual].
Outline Diagram
Refer to the outline diagram provided in the manual to understand the physical layout and components of the board.
User Interface
CN1, CN2
Details about the connections and functionalities of CN1 and CN2 can be found in the manual. Ensure proper connections as per the instructions to avoid any issues.
CNE
Information regarding the CNE interface is crucial for the proper functioning of the board. Follow the guidelines provided in the manual for optimal performance.
FAQ
- Q: Is the RB-D62Q2747TB100 radiation tolerant?
- A: No, the product is not designed to be radiation tolerant as per the specifications provided.
- Q: What regulations should I consider when using this product?
- A: It is important to comply with environmental laws such as the RoHS Directive and export regulations when distributing internationally.
- Q: Where can I find more information about the product?
- A: For further inquiries, please contact a ROHM sales office or visit the official website at www.lapis-tech.com/en/.
Dear customer
ROHM Co., Ltd. (“ROHM”), on the 1st day of April, 2024, has absorbed into merger with a 100%-owned subsidiary of LAPIS Technology Co., Ltd. Therefore, all references to “LAPIS Technology Co., Ltd.”, “LAPIS Technology” and/or “LAPIS” in this document shall be replaced with “ROHM Co., Ltd.” Furthermore, there are no changes to the documents relating to our products other than the company name, the company trademark, logo, etc.
Thank you for your understanding.
ROHM Co., Ltd.
April 1, 2024
LAPIS Technology Co., Ltd.
Notes
- The information contained herein is subject to change without notice.
- When using LAPIS Technology Products, refer to the latest product information (data sheets, user’s manuals, application notes, etc.), and ensure that usage conditions (absolute maximum ratings, recommended operating conditions, etc.) are within the ranges specified. LAPIS Technology disclaims any and all liability for any malfunctions, failure or accident arising out of or in connection with the use of LAPIS Technology Products outside of such usage conditions specified ranges, or without observing precautions. Even if it is used within such usage conditions specified ranges, semiconductors can break down and malfunction due to various factors. Therefore, in order to prevent personal injury, fire or the other damage from break down or malfunction of LAPIS Technology Products, please take safety at your own risk measures such as complying with the derating characteristics, implementing redundant and fire prevention designs, and utilizing backups and fail-safe procedures. You are responsible for evaluating the safety of the final products or systems manufactured by you.
- Descriptions of circuits, software and other related information in this document are provided only to illustrate the standard operation of semiconductor products and application examples. You are fully responsible for the incorporation or any other use of the circuits, software, and information in the design of your product or system. And the peripheral conditions must be taken into account when designing circuits for mass production. LAPIS Technology disclaims any and all liability for any losses and damages incurred by you or third parties arising from the use of these circuits, software, and other related information.
- No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of LAPIS Technology or any third party with respect to LAPIS Technology Products or the information contained in this document (including but not limited to, the Product data, drawings, charts, programs, algorithms, and application examples、etc.). Therefore LAPIS Technology shall have no responsibility whatsoever for any dispute, concerning such rights owned by third parties, arising out of the use of such technical information.
- The Products are intended for use in general electronic equipment (AV/OA devices, communication, consumer systems, gaming/entertainment sets, etc.) as well as the applications indicated in this document. For use of our Products in applications requiring a high degree of reliability (as exemplified below), please be sure to contact a LAPIS Technology representative and must obtain written agreement: transportation equipment (cars, ships, trains, etc.), primary communication equipment, traffic lights, fire/crime prevention, safety equipment, medical systems, servers, solar cells, and power transmission systems,etc. LAPIS Technology disclaims any and all liability for any losses and damages incurred by you or third parties arising by using the Product for purposes not intended by us. Do not use our Products in applications requiring extremely high reliability, such as aerospace equipment, nuclear power control systems, and submarine repeaters, etc.
- The Products specified in this document are not designed to be radiation tolerant.
- LAPIS Technology has used reasonable care to ensure the accuracy of the information contained in this document. However, LAPIS Technology does not warrant that such information is error-free and LAPIS Technology shall have no responsibility for any damages arising from any inaccuracy or misprint of such information.
- Please use the Products in accordance with any applicable environmental laws and regulations, such as the RoHS Directive. LAPIS Technology shall have no responsibility for any damages or losses resulting non-compliance with any applicable laws or regulations.
- When providing our Products and technologies contained in this document to other countries, you must abide by the procedures and provisions stipulated in all applicable export laws and regulations, including without limitation the US Export Administration Regulations and the Foreign Exchange and Foreign Trade Act..
- Please contact a ROHM sales office if you have any questions regarding the information contained in this document or LAPIS Technology’s Products.
- This document, in part or in whole, may not be reprinted or reproduced without prior consent of LAPIS Technology.
- (Note) “LAPIS Technology” as used in this document means LAPIS Technology Co., Ltd.
Copyright 2022 LAPIS Technology Co., Ltd.
Preface
This manual describes about the ML62Q2747 Reference Board: RB-D62Q2747TB100.
Refer to the following documents when necessary.
- ML62Q2700 Group User’s Manual Provides the detailed information about the microcontroller ML62Q2700 Group.
- EASE1000 V2 User’s Manual Provides the information on how to use the On-chip emulator EASE1000 V2.
Overview
Features
The RB-D62Q2747TB100 can be used for learning ‘how to use’ the ML62Q2747, on which the user needs to provide additional external components if necessary. By using the RB-D62Q2747TB100 together with the LAPIS Technology’s onchip emulator EASE1000 V2 and the provided software development environment, the user can develop software, debug and program the Flash. Also, by connecting an external power supply to RB-D62Q2747TB100, it can be used independently without connecting a EASE1000 V2.
Before using RB-D62Q2747TB100, be sure to understand and keep in mind the following information.
Features
- The board is provided with ML62Q2747 100pin TQFP.
- Mounted with the linked connector to EASE1000 V2.
- Through-holes for connecting the pins of LSI to external peripheral boards.
- The power supply is selectable; supplied from the on-chip emulator EASE1000 V2 or CN1_3pin/CN2_2pin.
- Mounted with Crystal (32.768KHz)
- Mounted with LED (P20,P21, P22).
- Foot pattern with components for Successive Approximation Type A/D Converter is available (P23,P24, P25,P26).
Hardware specifications
Table 1 shows the hardware specifications of RB-D62Q2747TB100.
Table 1 Hardware specifications
For more information about the connection of the mounted components, see the schematic.
Outline Diagram
Function
Power Circuit
The input toVDD can be selected from 3.3VOUT of EASE1000 V2 or CN1_3pin/CN2_2pin by PWR jumper.
[Note]
The power supply ON/OFF procedure in case of setting PWR jumper to the USR- side when using EASE1000 V2.
- The procedure of power supply ON
- The USB cable of EASE1000 V2 is connected.
- The power supply of user’s target system is turned on.
The procedure of power supply OFF
- The power supply of user’s target system is turned off
- The USB cable of EASE1000 V2 is removed
Connection for EASE1000 V2 (CNE)
EASE1000 V2 can be used if J1 and J2 jumper are set to “CNE”.
[Note]
P01/TEST0 pin:
P01/TEST0 pin of ML62Q2747 is initially set as a pull-up input mode
When using EASE1000 V2, do not set it as an output mode by using an
application program, otherwise EASE1000
V2 cannot communicate with the ML62Q2747.
LED (P20, P21, P22)
The P20-P22 pins are ports that can directly drive LED. The Ports are connected to the LEDs through jumper-chip. Remove the jumper-chip when not using the LEDs
XT0/PIO0，XT1/PIO1
RB-D62Q2747TB100 can be mounted with cylinder type or SMD type crystal oscillator.
P23, P24, P25, P26
When the P23 pin is used as VREF function of the successive approximation type A/D converter, C10, C11 can implement a bypass capacitor. In addition, VDD can be connected by mounting the J8 jumper chip. When P24, P25, P26 pin is used as AIN4, AIN5, AIN6 function of the successive approximation type A/D converter, the C12, C13 and C14 can implement a by-pass capacitor.
Fig. 6 shows the connection diagram.
User Interface
CN1, CN2
Table 2 and Table 3 show the pin list of the RB-D62Q2747TB100 user interface connection CN1 and CN2.
N.C. : Not Connected
Table 3 CN2 Pin List
CNE
Table 4 shows the pin list of the RB-D62Q2747TB100 user interface connection CNE
Table 4 CNE
N.C. : Not Connected
Precaution for usage
- The RB-D62Q2747TB100 is an unfinished product and intended for research and development and for expert use in the research and development facility only. The RB-D62Q2747TB100 is not intended to be used for volume production or parts thereof.
- Since the content specified herein is subject to change for improvement without notice, confirm the latest content when using the board.
- See the other documents, the ML62Q2700 group user’s manual and the EASE1000 V2 user’s manual when using the RB-D62Q2747TB100.
- Confirm the final electrical characteristics by using the mass-production parts on your mass-production boards.
- LAPIS supports replacing the board for an initial failure soon after the shipment. However, LAPIS doesn’t support reparing the board.
- RB-D62Q2747TB100 have signal patterns on the underside, it might work abnormally if used on conductive materials. Use it on insulating materials or having any preventable parts.
PCB specification, BOM list and Schematic
PCB specification
Fig. 7 shows the PCB dimensional outline diagram and layout of components.
PCB part number:
RB-D62Q2747TB100
Dimension :
- 55.88mm x 93.98mm
BOM list
[Note]
- The diameter of the through hole of CN1 and CN2 is 1.0 mm.
- Using CN1 and CN2, the diameter of the connector pin should use the connector below 0.6mm, such as 0.64mm.
- The parts may be changed into other parts with equivalent part special quality.
Schematic
The next page shows the schematic of RB-D62Q2747TB100.
Revision History
Documents / Resources
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LAPIS TECHNOLOGY RB-
D62Q2747TB100
[pdf] User Manual
RB-D62Q2747TB100
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