DELL P2425B 24 Inch Computer Monitor Instruction Manual

DELL P2425B 24 Inch Computer Monitor Instruction Manual

Disassembly Procedures

S1 :Turn off the monitor.
S2 :Place the monitor on a soft cloth or cushion
Press and hold the stand release button at the back of the display
Lift the stand assembly up and away from the monitor

S3: Unlock 4 screws on “Rear Cover”

(Screw Torque: 9±1 kgf)
S4:Use hands or “Bar Scraper” to disassemble “Rear Cover” from “Middle Frame” according to the sequence shown in the picture

S5 :Pull out “Control board FFC” from “Interface board” and tear off it from “Main Shielding” to take off “Rear Cover”

S6: Unlock 3 screws to disassemble “Control board” from “Rear Cover” Tear off “Control board FFC” from “Rear Cover” and take off “Control board” from **“Rear Cover”

(Screw Torque: 1.6-1.8 kgf)
S7: Disassemble “Control board FFC” from “Control board

S8 Tear off a black tape from “USB board   FFC” and “Panel
Disassemble “USB board FFC” from “USB board” and “Interface board”
Unlock 1 screw on “USB board”
Disassemble “USB board” from “Middle Frame”

(Screw Torque: 4.5±0.5 kgf)
S9: Tear off a gasket from “USB Shielding” (see pink mark)
Tear off a gasket from “USB board” (see red mark)

S10 Disassemble “USB board” from “USB Shielding

S11 Tear off a tape from “Backlight wire” on “Panel”
Unplug “Backlight wire” from “Panel” and “Power Board”

S12 Tear off a long tape from “LVDS FFC” Disassemble “LVDS FFC” from “Panel” Take off “Main Shielding” from “Panel”

S13: Unlock 13 screws to disassemble “Middle Frame” from “Panel”
Take off “Middle Frame” from “Panel”**

(Screw Torque: 4.5-5.0 kgf)
S14: Disassemble “MYLAR” from “Main Shielding

S15: Unlock 2 hexagonal screws

(Screw Torque: 5.0±0.6 kgf)
S16: Unlock 5 PCBA screws

(Screw Torque: 9±1 kgf)
S17: Disassemble “Interface board” and “Power board” from “Main Shielding”
Unplug all cables from “Interface board

S18: Remove electrolyte capacitors (red mark) from printed circuit boards

S18-1: Cut the glue between bulk cap. and PCB with a knife

S18-2 :Ensure cutting path within the glue, don’t touch bulk cap. or PCB

S18-3: Take out bulk cap. pin solder with soldering iron and absorber

S18-4: Lift the bulk cap. up and away from the PCB

Product material information

The following substances, preparations, or components should be disposed of or recovered separately from other WEEE in compliance with Article 4 of EU Council Directive 75/442/EEC.

printed circuit boards (with a surface greater than 10 square cm)
Component contain toner, ink and liquids| No used
Plastic containing BFR| No used
Component and waste contain asbestos| No used
CRT| No used
Component contain CFC, HCFC, HFC and HC| No used
Gas discharge lamps| No used
LCD display > 100 cm2| Product has an LCD greater than 100 cm2
External electric cable| Product has external cables
Component contain refractory ceramic fibers| No used
Component contain radio-active substances| No used
Electrolyte capacitors (height > 25mm, diameter > 25mm)| Product has electrolyte capacitors (height >25mm, diameter > 25mm)

Tools Required

List the type and size of the tools that would typically can be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.
Tool Description:

• Screwdriver
• Scraper Bar
• Penknife
• Soldering iron and absorber

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