neardi FD200S WIFI Module User Guide

neardi FD200S WIFI Module

Specifications

Product: FD7256S WIFI Module

Datasheet: V2.1

Manufacturer: Shanghai Neardi Technology Co., Ltd.

Website: www.neardi.com

Product Overview

Introduction

Shanghai Neardi Technology Co., Ltd. (Neardi Technology) provides fast and efficient support services to customers. For any inquiries, contact:

Telephone: +86 21 20952021

Email: [email protected]

Agreement

Recipients of product documentation, hardware reference drawings, and software descriptions must keep the content confidential and use it only for project implementation and development unless authorized by Neardi Technology.

Copyright Statement

All materials provided by Neardi Technology are subject to copyright protection.

Product Usage Instructions

Product Overview

Product Introduction

The FD7256S WIFI Module is designed for wireless LAN communication and supports various protocols and modes.

Wi-Fi Characteristics

• IEEE 802.11 standards supported: a/b/g/n/ac/ax (wave-2)
• Phy rate : up to 600.5Mbps, Throughput rate: up to 520Mbps
• Modes: Wi-Fi STA, AP, P2P
• Bandwidth: 2.4G 40MHz, 5G 80MHz
• Modulation: Up to 1024QAM, LDPC, STBC
• Features : OFDMA, MU-MIMO, QoS, WMM, WPA encryption, Beamforming, etc.

FAQ

• Q: How can I update the firmware of the FD7256S WIFI Module?
  • A: To update the firmware, please visit the manufacturer’s website and follow the instructions provided in the firmware update guide.
• Q: What is the recommended operating temperature range for the FD7256S WIFI Module?
  • A : The recommended operating temperature range is between 0°C to 70°C for optimal performance.

Introduction

Neardi Technology provides this document for customers to use as a reference for product design and terminal applications. It is recommended that customers confirm the specifications and parameters provided in the document in detail, and confirm whether it can meet the design or application of the required products. At the same time, it is strongly recommended that customers do detailed tests in actual application scenarios based on the samples provided by our company to ensure that they meet the end use requirements. Neardi Technology is not responsible for any damages suffered due to the use of documents, materials and product functions.

The relevant parameters or design charts in this document are only examples, and customers should base their own independent analysis, evaluation and judgment when designing or using terminal products.

Before customers use any design or service guided by this document, please read this statement carefully, understand and agree that although Neardi Technology has taken reasonable commercial efforts to provide the best possible experience, this document and its contents are PROVIDED TO YOU ON AN “AS AVAILABLE” BASIS. The information in this document is subject to change without notice.

V1.0

| ****

2023/05/17

| ****

Initial Version

V1.1

| ****

2023/09/15

| Add hardware design guide

V1.2

| ****

2023/09/22

| ****

Update pin description

V2.0

| ****

2023/12/01

| Update Mechanical Specifications, RF Characteristics, Interface Design Notice

V2.1

| ****

2024/01/05

| ****

Update WiFi Receive Sensitivity Spec

Product Overview

Product Introduction

FD7256S is a highly integrated, low-cost combo module with high performance and low-power. It supports Wi-Fi 6 and Bluetooth 5.0 protocol, supports Wi-Fi MAC of the final version of Wi-Fi 6 Wave2 protocol, Wi-Fi Baseband of 1T1R, and high-performance RF. It also supports SDIO3.0, HS-UART and PCM interfaces for connection with the main control.

This module also supports BT and Wi-Fi to work in coexistence mode. It is suitable for consumer electronics such as IPC, tablet and IOT, and can also be used in fields with high-reliability requirements such as industrial interconnection.

Wi-Fi Characteristics

• IEEE 802.11a/b/g/n/ac/ax (supports wave-2) wireless LAN communication protocol
• IEEE 802.11 d/e/h/i/k/mc/r/v/w
• Phy rate up to 600.5Mbps, Throughput rate up to 520Mbps
• Multiple modes such as Wi-Fi STA, AP, and P2P
• 2.4G 40MHZ, 5G 80MHz bandwidth, 1T/1R
• Up to 1024QAM modulation, supports LDPC and STBC
• UL/DL OFDMA, DL MU-MIMO
• QoS, WFA WMM, WMM PS
• RSSI and CSI Reporting
• Beamformee and 4*1 Tx Beamforming
• WPA, WPA2, WPA3 encryption and decryption, WAPI and WPS2.0
• ER, DCM to improve transceiver gain
• 20in40/80/160, 80in160 HE PPDU, Partial band MU MIMO to improve air interface utilization;
• BSS Color, Spatial Reuse to improve air interface utilization
• TWT, Intra-PPDU PS, VHT TXOP PS to optimize dynamic power consumption in small bandwidth and multi-BSS environment

Bluetooth Characteristics

• Support Bluetooth (Classic BT+BLE) v2.1, v3.0, v4.2, v5.0 features
• SDIO interface for BT data transmission
• PCM/IIS interface for audio transmission
• BR/EDR/LE 1M/LE 2M/LE LR
• Support sco and esco link
• SSP/Secure Connection
• Low power mode (sniff, sniff sub-rating)
• Support BT/Wi-Fi coexistence

Block Diagram

Parameters

5.0 comb module
Dimension| 12.0(±0.1)mm12.0(±0.1)mm1.65(±0.2)mm
Power supply| VBAT：3.0~3.6V；VDDIO：1.62V~1.92V/3.0V~3.6V
Host interface| SDIO3.0 + UART + PCM
Footprint| LCC 44pin
Operating temperature| -30°C to 70°C
Operating humidity| 10% to 90% (Non-Condensing)
Storage temperature| – 40°C to 85°C

Pin Definition

Pin Number

Pin Description

GND

| G| ****

Ground connections

2| ****

WL_BT_ANT

| RF| ****

Wi-Fi & BT antenna I/O port

3| ****

GND

| G| ****

Ground connections

4| ****

NC

| –| ****

Floating (Don’t connected to ground)

5| ****

NC

| –| ****

Floating (Don’t connected to ground)

6| ****

NC

| –| ****

Floating (Don’t connected to ground)

7| ****

NC

| –| ****

Floating (Don’t connected to ground)

8| ****

GND

| –| ****

Ground connections

9| ****

VBAT

| P| ****

Main power voltage source input

10| ****

NC

| –| ****

Floating (Don’t connected to ground)

11| ****

NC

| –| ****

Floating (Don’t connected to ground)

12| ****

CHIP_EN

| I| ****

Module enable signal

13| ****

HOST_WAKE_WL

| I/O| ****

Wake up signal with auto negotiation

---|---|---|---
14| ****

SDIO_DATA_2

| I/O| ****

SDIO data line 2

15| ****

SDIO_DATA_3

| I/O| ****

SDIO data line 3

16| ****

SDIO_DATA_CMD

| I/O| ****

SDIO command line

17| ****

SDIO_DATA_CLK

| I/O| ****

SDIO clock line

18| ****

SDIO_DATA_0

| I/O| ****

SDIO data line 0

19| ****

SDIO_DATA_1

| I/O| ****

SDIO data line 1

20| ****

GND

| G| ****

Ground connections

21| ****

NC

| –| ****

Floating (Don’t connected to ground)

22| ****

VDDIO

| P| ****

I/O Voltage supply input

23| ****

NC

| –| ****

Floating (Don’t connected to ground)

24| ****

NC

| –| ****

Floating (Don’t connected to ground)

25| ****

PCM_OUT

| O| ****

PCM Data output

26| ****

PCM_CLK

| I/O| ****

PCM clock

27| ****

PCM_IN

| I| ****

PCM data input

28| ****

PCM_SYNC

| I/O| ****

PCM sync signal

29| ****

NC

| –| ****

Floating (Don’t connected to ground)

30| ****

NC

| –| ****

Floating (Don’t connected to ground)

33| ****

GND

| G| ****

Ground connections

32| NC| –| ****

Floating (Don’t connected to ground)

33| GND| G| ****

Ground connections

33| WL_WAKE_HOST| I/O| ****

Wake up signal with auto negotiation

35| NC| –| ****

Floating (Don’t connected to ground)

36| GND| G| Ground connections
37| NC| –| ****

Floating (Don’t connected to ground)

38| NC| –| ****

Floating (Don’t connected to ground)

39| NC| –| ****

Floating (Don’t connected to ground)

40| NC| –| ****

Floating (Don’t connected to ground)

41| UART_RTS_N| I/O| ****

UART DCE request send signal

42| UART_TXD| I/O| ****

UART TX signal

43| UART_RXD| I/O| ****

UART RX signal

44| UART_CTS_N| I/O| ****

UART DEC clear send signal

Mechanical Specifications

Mechanical Dimensions

Recommended PCB Layout Footprint

Electrical Performance and Reliability

Absolute Maximum Voltage Range

Recommended Operation Conditions

VDDIO

| ****

Digital/Bluetooth/SDIO/ I/O Voltage

| 1.62| 1.8| 1.92| V
3.0| 3.3| 3.6| V

Power On/Off Sequence

Reliability

ESD

| HBM| 2| 2000V| ANSI/ESDA/JEDEC JS-001-2017
CDM| C2a| 500V| ANSI/ESDA/JEDEC JS-002-2018

Latch-up

| Current| II A| 200mA| JEDEC STANDARD NO.78F JANUARY 2022
Voltage| II A| 1.5xVmax| JEDEC STANDARD NO.78F JANUARY 2022

**Interface Timing Parameters

**

SDIO Interface Timing

Default Speed Mode

Table 5 -1-1 SDIO Bus Timing Parameters (Default Speed Mode)

Clock
Clock Freq Data Transfer Mode| fPP| 0| 25| MHZ| Cload ≤ 10 pF
Clock Freq Identification Mode| fO| 0| 400| KHZ| Cload ≤ 10 pF
Clock low time| wxya| 10|  | ns| Cload ≤ 10 pF
Clock high time| tWH| 10|  | ns| Cload ≤ 10 pF
Clock rise time| tTLH|  | 10| ns| Cload ≤ 10 pF
Clock fall time| tTHL|  | 10| ns| Cload ≤ 10 pF
Inputs CMD,DAT(referenced to CLK)
Input set-up time| tISU| 5|  | ns| Cload ≤ 10 pF
Input hold time| tIHU| 5|  | ns| Cload ≤ 10 pF
Outputs CMD,DAT(referenced to CLK)
Output Delay time during Data Transfer Mode| tODLY| 0| 14| ns| Cload ≤ 40 pF
Output Delay time during Identification Mode| tODLY| 0| 50| ns| Cload ≤ 40 pF

High-Speed Mode

Table 5 -1- 2 SDIO Bus Timing Parameters (High Speed Mode)

Clock
Clock Freq Data Transfer Mode| fPP| 0| 50| MHZ| Cload ≤ 10 pF
Clock Freq Identification Mode| fO| 0| 400| KHZ| Cload ≤ 10 pF
Clock low time| wxya| 7|  | ns| Cload ≤ 10 pF
Clock high time| tWH| 7|  | ns| Cload ≤ 10 pF
Clock rise time| tTLH|  | 3| ns| Cload ≤ 10 pF
Clock fall time| tTHL|  | 3| ns| Cload ≤ 10 pF
Inputs CMD,DAT(referenced to CLK)
Input set-up time| tISU| 6|  | ns| Cload ≤ 10 pF
Input hold time| tIHU| 2|  | ns| Cload ≤ 10 pF
Outputs CMD,DAT(referenced to CLK)
Output Delay time during Data Transfer Mode| tODLY| 0| 14| ns| Cload ≤ 4 0 pF
Output Delay time during Identification Mode| tODLY| 2.5|  | ns| Cload ≤ 15 pF

PCM Interface Timing

RF Characteristics

GHZ Wi-Fi Radio Frequency (RF) Characteristics

Conditions: VBAT=3.3V; VDDIO=1.8V; Ta:25 ℃

Features| Description
Wi-Fi Standard| IEEE 802.11b/g/n/ac/ax
Frequency Range| 2.4~2.4835GHz(2.4GHz ISM Band)
Channels| Ch1~Ch13

Modulation

| 802.11b (DSSS): CCK, DQPSK, DBPSK;

802.11g (OFDM): BPSK, QPSK, QAM16, QAM64;

802.11n (OFDM): BPSK, QPSK, QAM16, QAM64;

802.11ac (OFDM): BPSK, QPSK, QAM16, QAM64, QAM256;

802.11ax (OFDMA): BPSK, BPSK_DCM, QPSK, QPSK_DCM, QAM16, QAM16_DCM, QAM64, QAM256, QAM1024;

Date Rate

| 802.11b: 1, 2, 5.5, 11Mbps;

802.11g: 6, 9, 12, 18, 24, 36, 48, 54Mbps;

802.11n (HT20): MCS0~MCS7 6.5~72.2Mbps;

802.11n (HT40): MCS0~MCS7 13.5~150Mbps;

802.11ac(VHT20): MCS0~MCS8 6.5~86.7Mbps;

802.11ac(VHT40): MCS0~MCS9 13.5~200Mbps;

802.11ax (HE20): MCS0~MCS11 8~143.4Mbps;

802.11ax (HE40): MCS0~MCS11 16~286.8Mbps;

Frequency

Tolerance

|

≤±5ppm

2.4G Transmitter Specifications
Modulation| TX Rate| TX Power（±2dBm）| TX EVM（dB）| TX Mask| VBAT current（mA）
802.11b| 1Mbps| 17| ≤35%| PASS| 413
802.11b| 11Mbps| 17| ≤35%| PASS| 253
802.11g| 6Mbps| 17| ≤-5| PASS| 256
802.11g| 54Mbps| 15| ≤-25| PASS| 317
802.11n| HT20 MCS0| 17| ≤-5| PASS| 251
802.11n| HT20 MCS7| 14| ≤-27| PASS| 253
802.11n| HT40 MCS0| 17| ≤-5| PASS| 254
802.11n| HT40 MCS7| 14| ≤-27| PASS| 231
802.11ac| VHT20 MCS0| 17| ≤-5| PASS| 247
802.11ac| VHT20 MCS8| 13| ≤-30| PASS| 220
802.11ac| VHT40 MCS0| 17| ≤-5| PASS| 251
802.11ac| VHT40 MCS9| 12| ≤-32| PASS| 188
802.11ax| HE20 MCS0| 17| ≤-5| PASS| 224
802.11ax| HE20 MCS11| 11| ≤-35| PASS| 210
---|---|---|---|---|---
802.11ax| HE40 MCS0| 17| ≤-5| PASS| 234
802.11ax| HE40 MCS11| 11| ≤-35| PASS| 150
2.4G Receiver Specifications

Modulation

|

RX Rate

| Min Input Level

（dBm）

|

Max Input Level（dBm）

|

PER

|

VBAT current（mA）

802.11b| 1Mbps| ≤-96| -5| 8%| 77.8
802.11b| 11Mbps| ≤-87| -5| 8%| 77.8
802.11g| 6Mbps| ≤-92| -5| 10%| 80.4
802.11g| 54Mbps| ≤-75| -5| 10%| 80.7
802.11n| HT20 MCS0| ≤-92| -5| 10%| 82.8
802.11n| HT20 MCS7| ≤-72| -5| 10%| 84.5
802.11n| HT40 MCS0| ≤-89| -5| 10%| 86.7
802.11n| HT40 MCS7| ≤-70| -5| 10%| 89.7
802.11ac| VHT20 MCS0| ≤-91| -5| 10%| 83.1
802.11ac| VHT20 MCS8| ≤-68| -5| 10%| 84.9
802.11ac| VHT40 MCS0| ≤-89| -5| 10%| 87.2
802.11ac| VHT40 MCS9| ≤-63| -5| 10%| 90.6
802.11ax| HE20 MCS0| ≤-92| -5| 10%| 83.6
802.11ax| HE20 MCS11| ≤-60| -5| 10%| 83.6
802.11ax| HE40 MCS0| ≤-89| -5| 10%| 87.6
802.11ax| HE40 MCS11| ≤-58| -5| 10%| 88.5

5GHZ Wi-Fi RF Characteristics

Conditions: VBAT=3.3V; VDDIO=1.8V; Ta:25 ℃

Features| Description
Wi-Fi Standard| IEEE 802.11a/n/ac/ax
Frequency Range| 5.15~5.25GHz; 5.25~5.35GHz; 5.47~5.73GHz; 5.735~5.835GHz (5GHz ISM Band)
Channels| Ch36,Ch40, Ch44, Ch48; Ch52~Ch64; Ch100~Ch140; Ch149~Ch165

Modulation

| 802.11a (OFDM): BPSK, QPSK, QAM16, QAM64;

802.11n (OFDM): BPSK, QPSK, QAM16, QAM64;

802.11ac (OFDM): BPSK, QPSK, QAM16, QAM64, QAM256;

802.11ax (OFDMA): BPSK, BPSK_DCM, QPSK, QPSK_DCM, QAM16, QAM16_DCM, QAM64, QAM256, QAM1024;

Date Rate

| 802.11a: 6, 9, 12, 18, 24, 36, 48, 54Mbps;

802.11n (HT20): MCS0~MCS7: 6.5~72.2Mbps;

802.11n (HT40): MCS0~MCS7: 13.5~150Mbps;

802.11ac (VHT20): MCS0~MCS8: 6.5~86.7Mbps;

802.11ac (VHT40): MCS0~MCS9: 13.5~200Mbps;

802.11ac (VHT80): MCS0~MCS9: 29.3~433.3Mbps;

802.11ax (HE20): MCS0~MCS11: 8~143.4Mbps;

 | 802.11ax             (HE40):              MCS0~MCS11:

16~286.8Mbps;             802.11ax              (HE80):

---|---
Frequency Tolerance| ≤±5ppm
5G Transmitter Specifications

Modulation

|

TX Rate

|

TX Power（±2dBm）

|

TX EVM（dB）

|

TX Mask

| VBAT current

（mA）

802.11a| 6Mbps| 17| ≤-5| PASS| 276
802.11a| 54Mbps| 15| ≤-25| PASS| 342
802.11n| HT20 MCS0| 17| ≤-5| PASS| 273
802.11n| HT20 MCS7| 14| ≤-27| PASS| 276
802.11n| HT40 MCS0| 17| ≤-5| PASS| 258
802.11n| HT40 MCS7| 14| ≤-27| PASS| 232
802.11ac| VHT20 MCS0| 17| ≤-5| PASS| 273
802.11ac| VHT20 MCS8| 13| ≤-30| PASS| 242
802.11ac| VHT40 MCS0| 17| ≤-5| PASS| 258
802.11ac| VHT40 MCS9| 12| ≤-32| PASS| 186
802.11ac| VHT80 MCS0| 17| ≤-5| PASS| 256
802.11ac| VHT80 MCS9| 12| ≤-32| PASS| 285
802.11ax| HE20 MCS0| 17| ≤-5| PASS| 247
802.11ax| HE20 MCS11| 11| ≤-35| PASS| 221
802.11ax| HE40 MCS0| 17| ≤-5| PASS| 243
802.11ax| HE40 MCS11| 11| ≤-35| PASS| 149
802.11ax| HE80 MCS0| 17| ≤-5| PASS| 246
802.11ax| HE80 MCS11| 11| ≤-35| PASS| 267
5G Receiver Specifications

Modulation

|

RX Rate

|

Min Input Level（dBm）

| Max Input Level

（dBm）

|

PER

| VBAT current

（mA）

802.11a| 6Mbps| -91| -5| 10%| 87.5
802.11a| 54Mbps| -74| -5| 10%| 88.1
802.11n| HT20 MCS0| -91| -5| 10%| 90.5
802.11n| HT20 MCS7| -71| -5| 10%| 92.7
802.11n| HT40 MCS0| -88| -5| 10%| 94.1
802.11n| HT40 MCS7| -69| -5| 10%| 98.2
802.11ac| VHT20 MCS0| -91| -5| 10%| 90.9
802.11ac| VHT20 MCS8| -67| -5| 10%| 92.4
802.11ac| VHT40 MCS0| -88| -5| 10%| 95.6
802.11ac| VHT40 MCS9| -63| -5| 10%| 98.7
802.11ac| VHT80 MCS0| -85| -5| 10%| 102.5
802.11ac| VHT80 MCS9| -59| -5| 10%| 109.2
802.11ax| HE20 MCS0| -91| -5| 10%| 92.1
802.11ax| HE20 MCS11| -60| -5| 10%| 92.5
802.11ax| HE40 MCS0| -89| -5| 10%| 96.7
802.11ax| HE40 MCS11| -58| -5| 10%| 96.6
802.11ax| HE80 MCS0| -86| -5| 10%| 105.3
---|---|---|---|---|---
802.11ax| HE80 MCS11| -53| -5| 10%| 106.5

Bluetooth Radio Frequency (RF) Characteristics

Conditions: VBAT=3.3V; VDDIO=1.8V; Ta:25 ℃

Features                         Description
Bluetooth Standard        Bluetooth v2.1+EDR/3.0+HS/4.2/5. 0
Frequency Range          2.4~2.4835GHz
Bluetooth Classic: Ch0~Ch78 (For 1MHz Channels);

Channels

Bluetooth Low Energy: Ch0~Ch39 (For 2MHz Channels);

Power class

| Bluetooth Classic: Class1;

Bluetooth Low Energy: Class1.5;

Modulation

| BR_1Mbps: GFSK; EDR_2Mbps: π/4-DQPSK; EDR_3Mbps: 8DPSK;

LE_125Kbps: GFSK (Coded_S=8); LE_500Kbps: GFSK (Coded_S=2); LE_1Mbps: GFSK (Uncoded);

LE_2Mbps: GFSK (Uncoded);

Bluetooth Transmitter Specifications

Item

| TX Power（dBm）| VBAT current

（mA）

Min| Type| Max
BR_1M| 6| 8| 10| 33
EDR_2M /3M| 6| 8| 10| 33
LE_125/500K| 6| 8| 10| 33
LE_1M| 6| 8| 10| 33
LE_2M| 6| 8| 10| 33
Bluetooth Receiver Specifications

Item

| Sensitivity（dBm）                    Max Input Level（dBm）| VBAT current

（mA）

Input Level (Typ)| BER                     Input Level (Typ) BER
BR_1M                                TBD| TBD                              TBD TBD                              TBD
EDR_2M /3M                           TBD| TBD                              TBD TBD                              TBD
LE_125/500K                           TBD| TBD TBD                           TBD                              TBD
LE_1M                                TBD| TBD                              TBD TBD                              TBD
LE_2M                                TBD| TBD                              TBD TBD                              TBD

Hardware Design Guide

Power Design Notice

Voltage Requirement

The main power supply (VBAT) input range of the module is 3.3V+/-10%, and the interface VDDIO supports two level ranges, 1.8V+/-10% or 3.3V+/-10%. Due to the ripple of the main power can affect the RF performance of Wi-Fi and Bluetooth, therefore the power supply ripple VPP is required to be less than 50mV.

Current Requirement

Under different standards, when Wi-Fi transmits continuously, the peak value and amplitude of the operating current on the main power supply are as shown in the table below. The 3.3V power converter must be able to provide 650mA RMS current and fast transient response (when the transient current change rate is 80mA/us, the voltage drop is less than 100mV).

Mode| Burst power (dBm)| Peak current (mA)| RMS current (mA)
---|---|---|---
11b 11M long 2.4G ch1| 23.5| 833| 607
21.8| 753| 573
19.6| 647| 473
17.4| 593| 440
15.5| 566| 407
11ax MCS0

2.4G CH1

| 22| 720| 500
20| 640| 427
18| 587| 420
16| 553| 393
11ax MCS0

5G CH36

| 22| 827| 560
19.9| 667| 433
18| 620| 380
16| 540| 307

Power Supply Reference

It is recommended to use a separate power regulator to power the module. The ripples caused by other current loads will affect the RF performance of the module. Therefore, it is not recommended to share the power supply with other devices in the system. It is recommended to use SILERGY’s Synchronous Step- down Regulator SY8089AAC as the main power supply VBAT of the module. The circuit schematic is as follows:

For the power on/off sequence of the module, please refer to the requirements in the “4.3 Power On/Off Sequence” .

Interface Design Notice

Wake-up Signals

This module require two GPIOs as handshake signals with the host controller, the wake-up direction of these two GPIOs support auto-negotiation. As default, for example, WL WAKE HOST is the output signal “CP wakes up the main control”, and HOST WAKE WL is the input signal “Master wakes up CP”, also we can swap then when connected with the host. Wi-Fi and Bluetooth use the same handshake signal. The working mechanism is as follows.

HCI Commend Interface

The Bluetooth supports SDIO3.0 and HS-UART (4Mbps) as HCI (Host Controller Interface). SDIO3.0 is used as HCI by default, which means the HS-UART port does not need in the HOST controller.

SDIO Interface

This module supports SDIO3.0. When the input level of VDDIO is 3.3v, SDIO supports the clock frequencies of 25MHz and 50MHz.When the input level of VDDIO is 1.8v, SDIO supports SDR25, SDR50 and SDR104, and the clock frequency of SDR104 is 208MHz. The clock frequency of the SDIO3.0 interface is up to 208MHz. The SDIO bus needs to be controlled with a single-ended 50 ohm impedance. The maximum length of the bus routing is 15cm. The SDIO signal group needs to be controlled to be of equal length with 100mil.

PCM and UART Interface

As shown in the figure below, the PCM bus and UART bus and data lines between the main control and the module need to be cross-connected.

Storage, Production and Packaging

Storage Conditions

• FD7256S module is 3 (MSL3) and packed in a vacuum-sealed bag when shipped, the recommended storage temperature is 25±5°C, and the relative humidity is 35%~60%. Under this condition, the module can be stored for 12 months.
• The Module shall be stored without opening the packing. After the packing is opened, the module shall complete the patch soldering within 24 hours.
• FD7256S module can be stored for no more than 168 hours in a workshop environment with a temperature of 25±5°C, a relative humidity below 60% and in compliance with IPC/JEDEC J-STD-033. It is not recommended to expose the module unpacked to the air for a long time. If not immediately patch soldering, it is recommended to store the module in a moisture-proof cabinet with a relative humidity of less than 10% to keep the module dry.
• If the module is not stored according to the above-recommended method, it needs to be baked at high temperature (120±5°C) for 8 hours. The re-baked module shall be patched within 24 hours.
• Please pay attention to ESD protection when unpacking and handling modules.

Production Welding

During the production welding process, please do not use any organic solvents (such as alcohol, isopropanol, acetone, trichloroethylene, etc.) to wipe the shield of the FD7256S module, otherwise it may cause the shield to rust. Please do not ultrasonically clean the module, it may cause damage to the crystal inside the module. Please make sure that the spray material used will not chemically react with the module shield or PCB and will not flow into the module when spraying modules.

In order to ensure the welding quality and reliability of the FD7256S module, the thickness of the printed stencil is recommended to be 0.15~0.18mm; the recommended reflow curve is as follows:

Endothermic Zone

Heating Rate

|

Interval A

| ≤3℃/s
Soak time| From the end of interval A to the beginning of interval B| 60~120s
Reflow Zone

Heating Rate

|

Interval C

| ≤3 ℃/s
Maximum

Temperature

|

Highest point of the curve

|

246℃(+5/-0℃)

Cooling Rate| Interval D| ＜6 ℃/s
Reflow Time| Interval E| 60~150 seconds

Packing Specifications

The key parameters and packaging processes described in this chapter are for reference only. The appearance and structure of the specific packaging materials are subject to actual delivery.

Tape Dimensions

Plastic Reel Dimensions

Packaging Process

Antenna Design

Summarize

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may
cause undesired operation.This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
• This modular has been tested and found to comply with part 15 requirements for Modular Approval.
• FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
• Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01r01

List of applicable FCC rules

CFR 47 FCC Part 15 Subpart C and Subpart F has been investigated. It is applicable to the modular transmitter

Specific Operational Use Conditions – Antenna Placement Within the Host Platform

The module is tested for standalone mobile RF exposure use conditions.

• The antenna must be installed such that 20cm is maintained between the antenna and users,
• The transmitter module may not be co-located with any other transmitter or antenna. In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.

Trace Antenna Designs

Users should connect antennas to half hole pad through copper tube structures or FP types of RF trace and the trace impedance must be controlled in 50Ω.recommends that the total insertion loss between the antenna pads and antennas should meet

the following requirements:

To facilitate the antenna tuning and certification test, a RF connector and an antenna matching circuit should be added. The following figure is the recommended circuit.

The module needs to be attached to the PCB board and connected to the external antenna through the solder joint of the circuit on the PCB. The gain of the external antenna is 2dB （i Max.）,the internal structure is copper tube structure or FPC. A resistance of 0R is added between the module and the antenna at C1003 to ensure that the impedance of the connection between the module and the antenna reaches 50R.The J0800 position on the PCB is where the external antenna is connected. RF traces layout

1. Keep the RF trace from module ant pin to antenna as short as possible
2. RF trace should be 50 Ω either on the top layer or in the inner layer
3. RF trace should be avoided right angle and sharp angle.
4. Put enough GND vias around RF traces.
5. RF trace should be far away from other high speed signal lines.

External Antenna VSWR

RF Exposure Considerations

This device complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body.

Antenna Type and Gain

The following antennas have been certified for use with this module. Only antennas of the same type with equal or lower gain may also be used with this module. Other types of antennas and/or higher gain antennas may require the additional authorization    for operation.

Antenna Specification list below:

Model

|

Type

|

Connector

| Peak gain ( dBi )
---|---|---|---
2400-2483.5

MHz

| 5150- 5250

MHz

| 5250- 5350

MHz

| 5470- 5725

MHz

| 5725- 5850

MHz

FD200S| External Antenna| /| 2.00dBi| 2.00dBi| 2.00dBi| 2.00dBi| 2.00dBi

End Product Labelling Compliance Information

When the module is installed in the host device, the FCC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily removed. If not, a second label must be placed on the outside of the final device that contains the following text: “Contains FCC ID: 2BFAK-FD200S”. The FCC ID can be used only when all FCC compliance requirements are met.

Information on Test Modes and Additional Testing Requirements

This transmitter is tested in a standalone mobile RF exposure condition and any co-located or simultaneous transmission with other transmitter(s) class II permissive change re-evaluation or new FCC authorization. Host manufacturer installed this modular with single modular approval should perform the test of radiated emission and spurious emission according to FCC part 15C, Part 15E,
15.209, 15.207 requirements, only if the test result comply with FCC part 15C, Part 15E,
15.209, 15.207 requirements, then the host can be sold legally.

Additional testing, Part 15 Subpart B Disclaimer

This transmitter modular us tested as a subsystem and its certification does not cover the FCC Part 15 Subpart B rules requirement applicable to the final host. The final host will still need to be reassessed for compliance to this portion of rules requirements if applicable. As long as all conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this modular installed.

Manual Information to The End User

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The host integrator must follow the integration instructions provided in this document and ensure that the composite system end product complies with the requirements by a technical assessment or evaluation to the rules and to KDB Publication 996369. The host integrator installing this module into their product must ensure that the final composite product complies with the requirements by a technical assessment or evaluation to the rules, including the transmitter operation and should refer to guidance in KDB Publication 996369.

OEM/Host Manufacturer Responsibilities

OEM/Host manufacturers are ultimately responsible for the compliance of the Host and Module. The final product must be reassessed against all the essential requirements of the FCC rule such as FCC Part 15 Subpart B before it can be placed on the US market.

This includes reassessing the transmitter module for compliance with the Radio and RF Exposure essential requirements of the FCC rules.

How to Make Changes – Important Note

In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.

Shanghai Neardi Technology Co., Ltd.
www.neardi.com

Shanghai Neardi Technology Co., Ltd. (referred to as “Neardi Technology”) always adheres to the customer-first service tenet and provides customers with fast and efficient support services. If you have any needs, please feel free to contact our company, the contact information is as follows:

• Shanghai Neardi Technology Co., Ltd.
•   www.neardi.com
• Tel : +86 21 20952021
• Email: [email protected]

Agreement

Unless specifically authorized by Neardi Technology, the recipient of the product documentation, hardware reference drawings, software descriptions and other materials provided by our company must keep the received content confidential and shall not use it for any other purpose other than the implementation and development of this project.

Copyright Statement

Documents and information provided by our company may not be obtained, used or disclosed to third parties, or such copyrighted materials may be copied, reproduced, plagiarized, published, displayed, translated, distributed or merged, modified or created derivative works unless obtain prior written consent.

Neardi Technology has exclusive rights to copyrighted materials and does not grant or convey a license to any patent, copyright, trademark or service mark rights, and no purchase of any kind shall be deemed to be the grant of a license. Neardi Technology has the right to pursue legal responsibility for any illegal infringements that violate confidentiality, use without authorization or maliciously use the documents and information in other illegal forms.

© 2023 Shanghai Neardi Technology Co., Ltd. All Rights Reserved.

Version History

References

• 企业级开源硬件平台-瑞芯微-核心板-开发板|RK3399Pro,RK3399,RK3288,RK1808,RV1126,RV1109,RK3368,ARM开发板,Android开发板

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