LeapFive LF-WM05 Wireless Module User Manual
- June 4, 2024
- LeapFive
Table of Contents
LeapFive LF-WM05 Wireless Module
- Module name: Wireless Module
- Version number: LF_WM_FW_1.0.0
- Model Name: LF-WM05
- Days: 2020-10-20
Outline
The name of the module
Wireless Module
characteristic
- Supports the 802.11 b/g/n standard, frequency range 2400M to 2483.5MHz
- Contains 276KB SRAM/128KB ROM/1Kb eFuse
- Operating voltage:DC 2.5 V to 3.6 V
- Wi-Fi-related features
- Support for IEEE 802.11 b/g/n standard
- 20MHz bandwidth
- Supports STA, SoftAP and sniffer mode
- PCB onboard antenna
- BLuetooth® low energy 5.0
- BLE 5.0 Channel Selection#2 is supported
- 1M PHY / Coded PHY / ADV extension is not supported
- Peripheral
- 2*UART
- 1*I2C
- 5*PWM
- 1*SPI
- 1*SDIO
- 1*12bit ADC
- 1*10bit DAC
- 13*GPIO
Scenario
- Smart Home / Home Appliances
- Smart transportation
- Smart lighting
- Intelligent security
- Industrial automation
Introduction
The LF-WM05 module is alow-cost, high-performance WIFI/BLE5.0 module based on the LF686C(32-bit RISC CPU with FPU) to create a cost-effective IoT module for customers. Figure 1 shows the hardware block diagram of the LF-WM05 module, consisting of the following three major parts:
- 32-bit RISC-V core CPU
- WiFi/BLE RF module
- Enrich peripherals
- 32-bit RISC-V core CPU with up to 192MHz operating frequency
- Internal integration 276KB SRAM,128KB ROM
- Supports high-speed UART,I2C,SPI,PWM,andmultiple GPIO portes
- Enter typical voltage:3.3V
Package size
The LF-WM05 patch module has a dimensions of (16.00±0.10) mm x (24.00±0.10) mm
x
(3.00±0.10)mm. The exact dimensions are shown in Table 1.
Table 1 Module Size Reference Table
Long | Wide | High | PAD size | PIN foot spacing |
---|---|---|---|---|
24mm | 16mm | 3.0mm | 1*1.4mm | 2mm |
The LF-WM05 module is designed in a stamp package as shown in Figure 2 for easy commissioning, easy disassembly and a variety of options for customer design. A total of 16 pins are drawn, with a 2mm pin spacing and evenly distributed on both sides of the module.
Pin
definition
Pin distribution
The pin distribution of the LF-WM05 patch module is shown in Figure 3, resulting in a total of 16 feet, 13 GPIO, and one power, ground, and reset pin each.
Pin definition
The LF-WM05 pin definition is shown in Table 2.
Table 2 LF-WM05 Pin Definition Table
Serial
number
| Pin name| Description of the function
---|---|---
1| RST| Reset the foot
2| IO_05| SDIO, SPI, I2C, UART, PWM, GPIO
3| IO_02| SDIO, SFLASH, SPI, I2C, UART, PWM, GPIO
4| IO_11| SPI, I2C, UART, PWM, AUXADC, GPIO
5| IO_12| SPI, I2C, UART, PWM, AUXADC, GPIO
6| IO_14| SPI, I2C, UART, PWM, AUXADC, GPIO
7| IO_17| SFLASH, SPI, I2C, UART, PWM, GPIO
8| VCC| 3.3V
Serial number| Pin name| Description of the function
---|---|---
9| GND| GND
10| IO_00| SDIO, SFLASH, SPI, I2C, UART, PWM, GPIO
11| IO_08| SPI, I2C, UART, PWM, AUXADC, GPIO
12| IO_01| SDIO, SFLASH, SPI, I2C, UART, PWM, GPIO
13| IO_03| SDIO, SPI, I2C, UART, PWM, GPIO
14| IO_04| SDIO, SPI, I2C, UART, PWM, GPIO
15| IO_07| SPI, I2C, UART, PWM, AUXADC, GPIO
16| IO_16| SPI, I2C, UART, PWM, GPIO
Note: IO08 port needs to be pulled up when downloading burning, not when using it.
Electrical parameters
working conditions
The LF-WM05 module recommends working parameters as shown in Table 3.
Table 3 recommends working conditions
Parameter| Name| Minimum| Typical
value
| Maximum| Unit
---|---|---|---|---|---
Store the temperature| /| –40 °C| 25℃| 125 °C| /
Operating temperature| /| –30 °C| 25℃| 85 °C| /
Supply voltage| VDD| 2.5| 3.3| 3.6| V
In-logic low level| V IL| –0.3| /| 0.25 VDD| V
In-logic high level| V IH| 0.75 VDD| /| VDD + 0.3| V
Output logic low level| V OL| /| /| 0.1 VDD| V
Output logic high level| V OH| 0.8 VDD| /| /| V
The maximum rating for electrostatic protection for the LF-WM05 module is shown in Table 4, and exceeding the maximum rating can cause permanent damage to the hardware.
Table 4 Maximum rating for electrostatic protection
Parameter | Minimum | Maximum | Unit |
---|
ESD Protection
(HBM)
| /| 2000| V
---|---|---|---
Hardware and software parameters
Type | Parameter | Illustrate |
---|
Wireless parameters
| WIFI protocol| 802.11 b/g/n
Frequency range| 2400M ~ 2483.5MHz
Hardware parameters
|
The data interface
| UART/I2C/SPI/IR remote control
GPIO/PWM
Operating voltage| 2.5 V ~ 3.6 V
Operating current| The average current is 80mA
The current is
supplied
| Minimum 500mA
Operating
temperature
| –30°C ~ 85 °C
Package size| (16.00±0.10) mm x (24.00±0.10) mm x (3.00±0.10) mm
Software parameters
| Wireless network
mode
| Supports STA, SoftAP, and sniffer mode
Security
mechanisms
| WPA/WPA2
Type of
encryption
| WEP/TKIP/AES
Upgrade the
firmware
| Local serial burn / cloud upgrade / host download burn
Software development| Supports customers to customize servers and provide the
SDK required for secondary development
Network
protocols
| IPv4,TCP/UDP/HTTP
Power parameters
Table 5 LF-WM05 Power Parameters
Mode
|
Remark
| Power consumption at 25℃
---|---|---
Minimum| Typical value| Maximum| Unit
RX
| 11b| /| /| 35| /|
mA
11g| /| /| 39| /
11n| /| /| 39| /
TX| | Duty 50%| /| 190| /|
---|---|---|---|---|---|---
| 11b – 11Mbps @21dBm| Duty 99%| /| 310| /|
---|---|---|---|---|---|---
11g – 54Mbps @18dBm| Duty 50%| /| 145| /
Duty 99%| /| 230| /
11n – MCS7
@17dBm
| Duty 50%| /| 130| /
Duty 99%| /| 215| /
MCU
| Run| Freq@192MHz| /| 22| /
StandBy| Freq@<10MHz| /| 2| /
Sleep| PDS7| Fast recover| /| 12| /|
uA
Hibernate| HBN| RTC or GPIO wakeup| /| 0.5| /
Shut-down| /| /| /| 0.1| /
RF parameters
RX features
Table 6 RX features
Mode
| Test data at 25 ℃
---|---
Minimum| Typical
value
| Maximum| Un it
RX receives sensitivity
| 11b – 1Mbps| /| -98| /|
dB m
11b – 11Mbps| /| -91| /
11g – 6Mbps| /| -93| /
11g – 54Mbps| /| -77| /
11n – MCS0| /| -93| /
11n – MCS7| /| -73| /
Maximum receive level
| 11b – 1Mbps| /| 5| /
11n – MCS0| /| -4| /
11n – MCS7| /| -13| /
Adjacent channel suppression| 11b – 1Mbps| /| 40| /|
dB
11b – 11Mbps| /| 40| /
| 11g – 6Mbps| /| 36| /|
---|---|---|---|---|---
11g – 54Mbps| /| 22| /
11n – MCS0| /| 36| /
11n – MCS7| /| 19| /
S11| /| /| <-10| /
TX features
Table 7 TX features
mod e
| Test data at 25 ℃
---|---
Minimum| Typical value| Maxim um| Unit
Transfer power
| 11b – 1Mbps| /| 17.5| 21|
dBm
11b – 11Mbps| /| 17.7| 21
11g – 6Mbps| /| 17.3| 19
11g – 54Mbps| /| 17.3| 18
11n – MCS0| /| 16.2| 19
11n – MCS7| /| 15.2| 17
EVM
| 11g – 54Mbps| /| -28| /|
dB
11n – MCS7| /| -30| /
Frequency offset
| 11b – 1Mbps| /| -0.95| /|
ppm
11b – 11Mbps| /| 0.71| /
11g – 6Mbps| /| -0.82| /
11g – 54Mbps| /| -0.95| /
11n – MCS0| /| -0.78| /
11n – MCS7| /| -0.73| /
MCU
CPU
LF-WM05 built-in ultra-low power LeapFive LF686C 32-bit RISC processor,CPU Clock speeds can be reached up to 192 MHz,backing Wi-Fi Protocol stack,deep sleep mode consumes up to <1uA。The CPU includes the following interfaces。
- The configurable RAM/ROM connector for the internal storage controller and external Flash can be connected
- Connect the data RAM connector of the storage controller
- Access the AHB port of the register
storage
The LF-WM05 chip has a built-in storage controller that includes ROM and SRAM.
With 276KB SRAM,128KB ROM, and 1Kb eFuse. 2MB Flash is integrated inside the
chip.
Crystal
The LF-WM05 enables the use of 40MHz crystals, which are selected with an
accuracy of ±10 PPM , and load capacitor of less than 12pF.
Note:
- The accuracy of the selected crystal itself needs to be10ppm±, and the operating temperature of the crystal is -30 °C to 85 °C;
- The location of the crystal oscillator should be as close as possible to the XTAL Pins of the chip (the traces should not be too long), and the traces of the crystal oscillator must be grounded and shielded.
- The input and output lines of the crystal cannot be punched into the line, i.e. they cannot cross layers. The input and output lines of the crystal cannot cross, nor can the cross-layer cross-overs.
- The capacitance of the switch of the input and output of the crystal should be placed near the left and right side of the chip and should not be on the line as far as possible.
- Crystals Below can not go up frequency digital signal, the best case is the crystal below do not take any signal lines, crystal TOP surface of the copper-paved area the bigger the better. Crystals are sensitive devices, and there can be no magnetic induction devices around the crystal, such as large inductors.
Assembly information and production guidance
Assembly dimensions
PCB antenna clearance area
When using a PCB antenna on a WIFI module, as shown in Figure 5, you need
to ensure that the motherboard PCB antenna is at least as far away from other
metal devices more than 16mm.
Production
precautions
- The LF-WM05 module must be sliced by an SMT machine and baked before the patch.
- The instrument required for the SMT patch
- Reflow welding patch machine
- AOI tester
- Caliber 6-8mm nozzle
- Bake the required equipment
- Cabinet oven
- Anti-static, high temperature tray
- Anti-static high temperature gloves
- In the production process of the operators of each station must wear static gloves;
- After baking, wait for the module to naturally cool down to the temperature of 36℃, before wearing static gloves to take out, so as not to burn;
FCC statements
This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions:
- this device may not cause harmful interference, and
- this device must accept any interference received, including interference that may cause undesired operation. NOTE: The manufacturer is not responsible for any radio or TV interference caused by unauthorized modifications or changes to this equipment. Such modifications or changes could void the user’s authority to operate the equipment.
The device has been evaluated to meet general RF exposure requirement, The device can be used in portable exposure condition without restriction. Federal Communication Commission
(FCC) Radiation Exposure Statement Power is so low that no RF exposure calculation is needed.
This device is intended only for OEM integrators under the following conditions:
The antenna must be installed such that 20 cm is maintained between the antenna and users. 2. The transmitter module may not be co-located with any other transmitter or antenna. As long as the two conditions above are met, additional transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required for the installed module. Important Note: In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the Federal Communications Commission of the U.S. Government (FCC) and the Canadian Government authorizations are no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator shall be responsible for re-evaluating the end-product (including the transmitter) and obtaining a separate FCC authorization in the U.S. and candada. OEM Integrators – End Product Labeling Considerations: This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: ” Contains, FCC ID:2AZXW-LF-WM05″. The grantee’s FCC ID can be used only when all FCC compliance requirements are met. OEM Integrators – End Product Manual Provided to the End User: The OEM integrator shall not provide information to the end user regarding how to install or remove this RF module in end product user manual. The end user manual must include all required regulatory information and warnings as outlined in this document.
IC statements
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.
The wireless module has been labelled with its own IC number. If the IC number is not visible when the module is installed inside another device, the outside of the finished product into which the module is installed must display a label referring to the enclosed module. This exterior label can use wording as follows: Contains transmitter module IC: 27307-LFWM05 or Contains IC: 27307-LFWM05
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