BEAMTEC TFM260 Thin Film Monitor User Manual

June 17, 2024
BEAMTEC

TFM260 Thin Film Monitor

Specifications

Introduction

The Thin Film Monitor TFM260 is a device designed for monitoring
thin film deposition processes. It provides real-time measurement
and analysis of various parameters.

Intended Use

The Thin Film Monitor TFM260 is intended to be used in research
and industrial settings for monitoring and controlling thin film
deposition processes.

Liabilities and Warranty

The manufacturer does not assume any liability for damages or
accidents resulting from the use of this product. A warranty period
is provided, details of which can be found in the user manual.

Instrument Safety

It is important to follow safety guidelines when operating the
Thin Film Monitor TFM260. Please refer to the user manual for
detailed instructions.

Definition of Notes, Cautions, and Warnings

The user manual contains important information highlighted
through notes, cautions, and warnings. It is essential to read and
understand these before operating the device.

Personnel Qualifications

Qualified personnel should be responsible for the installation,
operation, and maintenance of the Thin Film Monitor TFM260. They
should be trained in handling similar equipment and have knowledge
of safe operating procedures.

General Safety Instructions

General safety instructions include precautions such as wearing
appropriate protective gear, keeping the device away from moisture
and heat sources, and ensuring proper grounding.

Technical Data

The technical specifications of the Thin Film Monitor TFM260 are
as follows:

  • Rack Mounting Options: Yes

  • External Dimensions: Refer to user manual for detailed
    dimensions

  • Initial Power-On Verification: Refer to user manual for
    detailed instructions

Rack Mounting Options

The Thin Film Monitor TFM260 can be mounted in a rack using the
provided rack mounting options. Please refer to the user manual for
instructions on rack mounting.

External Dimensions

The external dimensions of the Thin Film Monitor TFM260 can be
found in the user manual. These dimensions provide information on
the physical size and shape of the device.

Initial Power-On Verification

Prior to using the Thin Film Monitor TFM260, it is important to
perform an initial power-on verification. This ensures that the
device is functioning correctly and ready for operation. Detailed
instructions for this verification process can be found in the user
manual.

Installation

Unpacking

When unpacking the Thin Film Monitor TFM260, ensure that all
components are present and undamaged. Refer to the package contents
section of the user manual for a detailed list of what should be
included.

Package Contents

The package should include the following items:

  • Thin Film Monitor TFM260
  • Power cable
  • User manual
  • Other accessories (if applicable)

Installation Requirements

Prior to installing the Thin Film Monitor TFM260, ensure that
you have met all the necessary requirements. These requirements may
include a stable power supply, proper grounding, and suitable
environmental conditions. Refer to the user manual for detailed
installation requirements.

Front Panel

The front panel of the Thin Film Monitor TFM260 contains various
buttons, indicators, and displays. These components provide access
to the device’s functions and status information. Refer to the user
manual for a detailed description of the front panel.

Rear Panel

The rear panel of the Thin Film Monitor TFM260 features several
connectors and ports. These connections allow for external devices
to be connected to the monitor. Detailed information on the rear
panel and its components can be found in the user manual.

Sensor 1-6 [1]

The Sensor 1-6 connectors on the rear panel are used for
connecting thin film sensors to the monitor. These sensors provide
measurements of various parameters during the deposition
process.

RS-232 [2]

The RS-232 connector enables communication between the Thin Film
Monitor TFM260 and external devices using the RS-232 protocol. This
allows for remote control and data transfer.

Power Connector and Fuse and On/Off Switch [4]

The power connector, fuse, and on/off switch provide power
control for the Thin Film Monitor TFM260. The power connector is
used to connect the monitor to a stable power source.

Analogue Outputs 1-6 [5]

The analogue output connectors allow for the connection of
external devices to receive analogue output signals from the Thin
Film Monitor TFM260. These signals can be used for further analysis
or monitoring purposes.

QM Modules [6]

The QM Modules connectors are used for connecting additional
modules to the Thin Film Monitor TFM260. These modules provide
additional functionalities and expand the capabilities of the
monitor.

Relay I/O [7]

The Relay I/O connectors allow for the connection of external
devices that require relay control. These connectors enable the
Thin Film Monitor TFM260 to control external equipment during the
deposition process.

System Connections

The Thin Film Monitor TFM260 requires various system connections
to function properly. These connections include power, sensor
inputs, communication interfaces, and optional external devices.
Refer to the user manual for detailed instructions on making these
connections.

External Oscillator

The Thin Film Monitor TFM260 supports the use of an external
oscillator for precise timing in certain applications. Refer to the
user manual for information on how to connect and configure an
external oscillator.

Operation

Edit Values

The Edit Values function allows users to modify and adjust
various parameters and settings of the Thin Film Monitor TFM260.
This function provides flexibility in customizing the monitor’s
behavior to suit specific requirements. Detailed instructions on
using the Edit Values function can be found in the user manual.

Main Screen

The Main Screen of the Thin Film Monitor TFM260 provides an
overview of key information and measurements. It displays real-time
data and allows users to access different functions and screens.
Refer to the user manual for a detailed description of the Main
Screen and its components.

Home Window

The Home Window is the default screen displayed on the Main
Screen. It provides quick access to commonly used features and
functions of the Thin Film Monitor TFM260. Detailed information on
the Home Window can be found in the user manual.

Setup Menu

The Setup Menu allows users to configure various settings and
parameters of the Thin Film Monitor TFM260. It provides options for
customizing the monitor’s behavior and adjusting measurement
parameters. Refer to the user manual for detailed instructions on
navigating and using the Setup Menu.

Sensor Tooling Factor

The Sensor Tooling Factor setting in the Setup Menu allows users
to calibrate the thin film sensors connected to the monitor. This
calibration ensures accurate measurements and compensates for any
variations in sensor performance. Detailed instructions on using
the Sensor Tooling Factor can be found in the user manual.

FIFO Filter

The FIFO Filter setting in the Setup Menu enables the use of a
First-In-First-Out filter for incoming data. This filter helps
smooth out variations in measurements and provides a more stable
output. Refer to the user manual for instructions on configuring
and using the FIFO Filter.

Rate Filter Alpha

The Rate Filter Alpha setting in the Setup Menu adjusts the rate
at which measurements are updated. This parameter affects the
responsiveness of the monitor to changes in the deposition process.
Detailed information on configuring and using the Rate Filter Alpha
can be found in the user manual.

Measurement Period

The Measurement Period setting in the Setup Menu defines the
time interval over which measurements are averaged. This parameter
allows users to control the level of smoothing applied to the
output data. Refer to the user manual for instructions on
configuring and adjusting the Measurement Period.

Crystal Frequency Min/Max

The Crystal Frequency Min/Max setting in the Setup Menu defines
the acceptable range of crystal frequencies. This parameter ensures
that only valid signals are processed and used for measurements.
Detailed instructions on configuring and adjusting the Crystal
Frequency Min/Max can be found in the user manual.

Communications

The Communications setting in the Setup Menu allows users to
configure the communication interfaces of the Thin Film Monitor
TFM260. This includes settings for RS-232, Ethernet, and other
communication options. Refer to the user manual for detailed
instructions on configuring and using the Communications
settings.

Operation – Remote Control

RS232 Communication

The Thin Film Monitor TFM260 supports remote control and
communication via the RS232 interface. This allows for external
devices to send commands and receive data from the monitor.
Detailed information on using RS232 communication can be found in
the user manual.

Ethernet Port

The Thin Film Monitor TFM260 features an Ethernet port for
remote control and communication over a network. This enables users
to access and control the monitor from a remote location. Refer to
the user manual for instructions on configuring and using the
Ethernet port.

FAQ

Q: What is the warranty period for the Thin Film Monitor

TFM260?

A: Please refer to the user manual for information on the
warranty period provided by the manufacturer.

Q: Can I mount the Thin Film

USER MANUAL
Thin Film Monitor TFM260 rev 1.0

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Contents

1 INTRODUCTION

9

1.1 INTENDED TO USE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

1.2 LIABILITIES AND WARRANTY . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

1.3 INSTRUMENT SAFETY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

1.3.1 DEFINITION OF NOTES, CAUTIONS AND WARNINGS . . . . . . . . . 9

1.3.2 PERSONNEL QUALIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . 10

1.3.3 GENERAL SAFETY INSTRUCTIONS . . . . . . . . . . . . . . . . . . . . 11

2 TECHNICAL DATA

13

2.1 Rack Mounting Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

2.2 EXTERNAL DIMENSIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

2.3 INITIAL POWER-ON VERIFICATION . . . . . . . . . . . . . . . . . . . . . . . . 17

3 INSTALLATION

18

3.1 UNPACKING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

3.1.1 PACKAGE CONTENTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

3.2 INSTALLATION REQUIREMENTS . . . . . . . . . . . . . . . . . . . . . . . . . . 19

3.3 FRONT PANEL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

3.4 REAR PANEL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

3.4.1 SENSOR 1-6 [1] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

3.4.2 RS-232 [2] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

3.4.3 POWER CONNECTOR AND FUSE AND ON/OFF SWITCH [4] . . . . . . 22

3.4.4 ANALOGUE OUTPUTS 1-6 [5] . . . . . . . . . . . . . . . . . . . . . . . . 22

3.4.5 QM MODULES [6] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

3.4.6 Relay I/O [7] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

3.5 SYSTEM CONNECTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

3.6 EXTERNAL OSCILLATOR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

4 OPERATION

30

4.1 EDIT VALUES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

4.2 MAIN SCREEN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

4.2.1 HOME WINDOW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

4.3 SETUP MENU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

4.3.1 SENSOR TOOLING FACTOR . . . . . . . . . . . . . . . . . . . . . . . . 32

4.3.2 FIFO FILTER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

4.3.3 RATE FILTER ALPHA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

4.3.4 MEASURMENT PERIOD . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

4.3.5 CRYSTAL FREQUENCY MIN/MAX . . . . . . . . . . . . . . . . . . . . . 35

4.3.6 COMMUNICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

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4.3.7 ANALOGUE OUTPUTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 4.3.8 RELAY OUTPUTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 4.3.9 ASSIGNING INPUTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 4.3.10 ADVANCED SETTINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 4.3.11 EXTERNAL CHANNEL . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 4.3.12 INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 4.4 MATERIAL LIST . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 4.4.1 ADD MATERIAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 4.4.2 EDIT MATERIAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 4.4.3 DELETE MATERIAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 4.5 FILM MENU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 4.5.1 RATE SAMPLING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 4.6 SENSOR INFO MENU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

5 OPERATION – REMOTE CONTROL

47

5.1 RS232 COMMUNICATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

5.2 ETHERNET PORT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

5.3 COMMUNICATIONS PROTOCOL . . . . . . . . . . . . . . . . . . . . . . . . . . 48

5.4 COMMAND PACKET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

5.5 RESPONSE PACKET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

5.6 CALCULATING THE CRC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

5.7 COMMANDS LIST . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

6 TROUBLESHOOTING

52

7 CALIBRATION PROCEDURES

57

7.1 IMPORTANCE OF DENSITY, TOOLING AND Z-RATIO . . . . . . . . . . . . . . 57

7.2 DETERMINING DENSITY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

7.3 DETERMINING TOOLING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

7.4 Laboratory Determination of Z-Ratio . . . . . . . . . . . . . . . . . . . . . . . . . 58

8 Measurement and Theory

60

8.1 TOLLING FACTOR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61

8.2 MATERIAL LIST . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

9 MAINTANCE AND SERVICE

72

9.1 MAINTANCE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72

9.2 CLEANING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72

9.3 CHECK FOR CORRECT OPERATION – TEST QUARTZ . . . . . . . . . . . . . 72

9.4 FIRMWARE UPDATE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72

9.4.1 DOWNLOAD FIRMWARE FILE . . . . . . . . . . . . . . . . . . . . . . . . 72

9.4.2 DEVICE BOOT-LOADER MODE . . . . . . . . . . . . . . . . . . . . . . . 73

9.4.3 FIRMWARE UPDATE PROCEDURE . . . . . . . . . . . . . . . . . . . . . 73

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10 STORAGE AND DISPOSAL

74

10.1 PACKING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74

10.2 STORAGE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74

10.3 DISPOSAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74

10.3.1 Waste Electrical and Electronic Equipment (WEEE) . . . . . . . . . . . . 74

11 WARRANTY CONDITIONS

76

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List of Tables
2.1 Technical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 2.2 IO Interface Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2.3 Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2.4 Operating Environment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2.5 Dimensions & Weight . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2.6 Film Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3.1 Package set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 3.2 RS232 connector – Pin functions and descriptions . . . . . . . . . . . . . . . . . 21 3.3 RJ-45 Connector Pinout(Data & Power) . . . . . . . . . . . . . . . . . . . . . . . 22 3.4 Relay I/O – Pin functions and descriptions . . . . . . . . . . . . . . . . . . . . . . 26 4.1 Analogue outputs functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 4.2 Relay outputs function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 4.3 Digital inputs function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 5.1 Command packet – field descriptions . . . . . . . . . . . . . . . . . . . . . . . . . 48 5.2 Response packet – field descriptions . . . . . . . . . . . . . . . . . . . . . . . . . 49 5.3 TFM260 commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 6.1 Write device address . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 8.1 Material table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 10.1 Storage parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
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List of Figures
2.1 TFM260 external dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 2.2 External dimensions External oscillator(EO) . . . . . . . . . . . . . . . . . . . . . 17 2.3 Main screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.1 TFM260 front panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 3.2 TFM260 external dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 3.3 RS232 connector (D-sub female 9 pin ) . . . . . . . . . . . . . . . . . . . . . . . 21 3.4 Power connector module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 3.5 Power connector module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 3.6 External QMB6 module – RS232 . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 3.7 External QMB6 module – RS485 . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 3.8 RS232 connector (D-sub male 15 pin ) . . . . . . . . . . . . . . . . . . . . . . . 25 3.9 System connection – example diagram . . . . . . . . . . . . . . . . . . . . . . . . 26 3.10 QMB6-EO connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
4.1 Edit Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 4.2 Main Screen Buttons . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 4.3 TFM260 Home Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 4.4 Unit change example screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 4.5 Setup menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 4.6 Toolng Factor submenu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 4.7 FIFO filter submenu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 4.8 Alpha filter submenu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 4.9 Alpha filtering diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 4.10 Measurment peroid submenu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 4.11 Crystal Min/Max submenu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 4.12 Serial interface and Ethernet parameters . . . . . . . . . . . . . . . . . . . . . . 36 4.13 Analogue Outputs Submenu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 4.14 Relay Outputs Submenu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 4.15 Digital Inputs Submenu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 4.16 Configuration Submenu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 4.17 External channel configuration Submenu . . . . . . . . . . . . . . . . . . . . . . 41 4.18 External channels avalible on Sensor List . . . . . . . . . . . . . . . . . . . . . . 42 4.19 External channels avalible on Setup menu(example) . . . . . . . . . . . . . . . . 42 4.20 Material Menu Buttons . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 4.21 Material Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 4.22 Add Material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 4.23 Edit Material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 4.24 Film menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
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TFM260 Thin Film Monitor

8

4.25 Sensor Info . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
8.1 Tooling factor over 100% . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 8.2 Tooling factor under 100% . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
10.1 Waste Electrical and Electronic Equipment (WEEE) Symbol . . . . . . . . . . . . 75

BeamTec Wolfgang-Paul-Str. 4, 89081 Ulm, Germany

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9

TFM260 Thin Film Monitor

1 INTRODUCTION
Please read this manual carefully to ensure optimum operating conditions right from the start. This user manual handbook contains important information about the functionality, installation, start-up and operation of the Thin Film Monitor TFM260 .
1.1 INTENDED TO USE
TFM260 uses quartz crystal sensor technology to measure rate and thickness in a thin film deposition process. Two sensor inputs are standard and four additional sensor inputs are optional. Six recorder outputs provide both analog rate, thickness or frequency signals. Sensor inputs are assigned to different materials, averaged for accurate deposition control in large systems or configured for a dual sensor. The rate sampling mode allows a shuttered sensor to extend sensor life in high rate processes. Rate displays of 0.01 Å/s. In addition, frequency or mass displays can be selected. Four relay outputs allow TFM260 to control source or sensor shutters, signal time and thickness setpoints, and signal crystal failure. Digital inputs allow external signals to start/stop and zero readings. TFM260 comes with an RS-232 and Ethernet port. The implemented protocol is compatible with Inficon SQM-160 and you can use the same software to operate the TFM260 . The software can be used to set and store all parameters, operate TFM260 and save process data in a .txt file that can be imported into Excel.
1.2 LIABILITIES AND WARRANTY
BeamTec company is not liable for damages resulting from improper use of the device and the guarantee expires, if the user, or third party:
· ignores information contained in this manual, · utilizes the product in a manner inconsistent with intended purpose, · makes any modification or alteration of the product, · unit should not be used with unauthorized accessories (compatible accessories, types
and models can be found in the product documentation)
BeamTec company reserves the right to make changes without prior notice. Illustrations may vary depending on the version of the device.
1.3 INSTRUMENT SAFETY
1.3.1 DEFINITION OF NOTES, CAUTIONS AND WARNINGS
When using this manual, please pay attention to the notes, cautions and warnings found throughout. For the purposes of this manual they are defined as follows: NOTE: Pertinent information that is useful in achieving maximum TFM260 efficiency when followed.

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CAUTION

Indicates particularly important, but not safety-relevant information. Failure to heed these messages could result in damage to TFM260 or the loss of data.
WARNING

Failure to heed these messages could result in personal injury. Information on correct handling or use. Disregarding safety notes can lead to malfunctions.

1.3.2 PERSONNEL QUALIFICATIONS
All work described in this document may only be carried out by persons who have suitable technical training and the necessary experience or who have been instructed by the end user of the product.

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WARNING

Risk Of Electric Shock Dangerous voltages are present, which could result in personal injury.
1.3.3 GENERAL SAFETY INSTRUCTIONS
CAUTION

TFM260 contains delicate circuitry, susceptible to transient power line voltages. Disconnect the power cord whenever making any sensor connections
CAUTION

TFM260 may not be suitable for use with RF sputtering systems or other electrically noisy environments.
For all work you are going to do, adhere to the applicable safety regulations. Also observe all safety notes given in this document and forward the information to all other users of the product.

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CAUTION
Do not open the instrument case! There are no user-serviceable components within instrument case Do not open the TFM260 case. Refer all maintenance to qualified personnel. There are no user-serviceable components within the TFM260 case. Dangerous voltages may be present whenever the power cable or external input/relay connectors are present.

CAUTION
TFM260 contains delicate circuitry TFM260 contains delicate circuitry, susceptible to transient power line voltages. Disconnect the power cable whenever making any interface connections. Refer all maintenance to qualified personnel.

WARNING
Risk Of Electric Shock TFM260 must be connected to earth ground through a sealed three-conductor power cable plugged into a socket outlet with protective ground terminal. Extension cables must have three conductors including a protective earth ground.
WARNING
Failure to operate TFM260 in the manner intended by BeamTec can circumvent the safety protection provided by the instrument and may result in personal injury.

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2 TECHNICAL DATA

PARAMETER Frequency Resolution Measurement Interval Quartz oscillator type Reference frequency stability Sensor inputs External sensor inputs
Input type Protocol Thickness and Rate Resolution/Measurement

VALUE 0.01 Hz at 10 readings/s 0.1s to 2s (adjustable in 0.1s step) 6 MHz 0.5 ppm
2(standard), up to 6(optional) 1 inputs RS232/RS485 (up to 3 devices working with RS485 interface) female BNC Compatible with INFICON SQM160 ASCII Protocol ±0.012 A @ tooling/density/z-ratio = 100/1/1, fundamental frequency = 6 MHz, 0.1s measurement interval

Table 2.1: Technical specifications

2.1 Rack Mounting Options
Rack mount kits allow one or two TFM260 instruments to be installed in a standard 48.3 cm (19 in.) rack. TFM260 is designed to mount in a standard 48.3 cm (19 in.) rack using optional rack mount kits or can be used on a benchtop. Two rack mount kits are available:
· Full Rack Extender · Rack Adapter
For detail information please contact the sales department of BeamTec .

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PARAMETER Digital inputs Functions Input rating Relay outputs Functions Relay rating Analogue outputs Functions
Output rating

VALUE 4 User-selected see chapter 4.3.9 0-5V, non-isolated, active low(0 volts) 4 User-selected see chapter 4.3.8 30V(rms) or 30V (dc), 2A maximum 6 Frequency, rate, thickness. User-selected see chapter 4.3.7 for detail information 0-10V

Table 2.2: IO Interface Parameters

PARAMETER Mains Power Supply Power Consumption Fuse Installation (Overvoltage)

VALUE 100 to 240V (ac), ±10% nominal, 50/60 Hz, autodetect 45W 250 V, 500 mA, Type T, 5 x 20 mm, time lag Class 1 Equipment (grounded type).

Table 2.3: Power

PARAMETER Usage Storage temperature Operation temperature Relative humidity
Altitude Pollution Degree Warm Up Period

VALUE Use indoors only -20…50°C 15…40°C 0 to 80 % RH non-condensing. Ordinary protection (not protected against harmful ingress of moisture). Up to 2000 meters 2 (per EN 61010) None required. For maximum stability allow 5 minutes.

Table 2.4: Operating Environment

PARAMETER Case Dimensions H x W x D Weight

88 x 252.6 x 264 mm 1.7 kg

VALUE

Table 2.5: Dimensions & Weight

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PARAMETER Stored Films Density Tooling Acoustic impedance Final Thickness Time Setpoint Sample/Hold. Sensor Average

VALUE 99 0.50 to 99.99 g/cm3 10 to 399% 0.10 to 10.00 0.000 to 9999 kÅ 0:00 to 99:59 mm:ss 0 to 5999 s 1 to 6, depending on sensors installed
Table 2.6: Film Parameters

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2.2 EXTERNAL DIMENSIONS

Figure 2.1: TFM260 external dimensions
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TFM260 cooperating with QMB6-EO is the external oscillator and the dimensions shown below.

Figure 2.2: External dimensions External oscillator(EO)
2.3 INITIAL POWER-ON VERIFICATION
A preliminary functional check of TFM260 can be made before formal installation. It is not necessary to have sensors, source controls, inputs, or relays connected to do this. For more complete installation see chapter 3.
1. Confirm that the proper AC line mains voltage is supplied to TFM260 . 2. Confirm that the rear panel (main) AC switch is in the ON Position. 3. After the initial boot-up screen, TFM260 will display the main screen. This screen will be
similar to the screen displayed in figure 2.3.
Figure 2.3: Main screen
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3 INSTALLATION
This chapter describes the procedures for unpacking, mechanical installation and electrical installation.
3.1 UNPACKING
1. If the TFM260 has not been removed from its packaging, do so now. 2. Carefully examine TFM260 for damage that may have occurred during shipping. It is
especially important to note obvious rough handling on the outside of the container. Immediately report any damage to the carrier and to BeamTec .
NOTE: Do not discard the packaging material until inventory has been taken and installation is successful. 3. Refer to the invoice and take inventory. 4. To install TFM260 , see next sections in this Chapter. 5. For additional information or technical assistance, contact BeamTec .

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3.1.1 PACKAGE CONTENTS

Compare the contents of the package with the list below appropriate for your version of the hardware device.

TFM260 Power cord 1.8m User Manual

Description

Quantity 1 pcs. 1 pcs. 1 pcs.

Table 3.1: Package set

3.2 INSTALLATION REQUIREMENTS
· TFM260 Monitor · Crystal sensor with feedthrough · Oscillator kit for the crystal sensor · Quartz crystals appropriate for the application

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3.3 FRONT PANEL

Figure 3.1: TFM260 front panel
1. Screen TFT screen 480×272 dpi. With integrated resistive touchscreen.
2. Control Knob Used to adjust values and select menu items. The functions of the knob change to adapt to different operations and are displayed on the the screen.
3. USB socket USB type A socket. Allows to update the device by inserting a pendrive with firmware files. Allows to read/write device configuration and transfer it to another the same type device.
3.4 REAR PANEL

Figure 3.2: TFM260 external dimensions
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3.4.1 SENSOR 1-6 [1] BNC connection to the oscillators for sensors 1 to 6 (depending of device configuration, available version 2CH, 4CH and 6CH)

3.4.2 RS-232 [2] Connection to computer for programming and data acquisition 9 pin female d-sub type connector.

Figure 3.3: RS232 connector (D-sub female 9 pin )

PIN NUMBER Pin 2 Pin 3 Pin 5

FUNCTION Rx Tx GND

DESCRIPTION Data input(receive line) Data output(transmit line) Reference signal for data lines

Table 3.2: RS232 connector – Pin functions and descriptions

Ethernet port [3] Connection to computer for programming and data acquisition. Detail information about port configuration see section 4.3.6.

Figure 3.4: Power connector module

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PIN NUMBER Pin 1: Pin 2: Pin 3: Pin 4 Pin 5 Pin 6 Pin 7 Pin 8

FUNCTION RX+ RXTX+ n.c n.c TXn.c n.c

DESCRIPTION Data receive(+) Data receive(-) Data transmit(+) not connected not connected Data transmit(-) not connected not connected

Table 3.3: RJ-45 Connector Pinout(Data & Power)

3.4.3 POWER CONNECTOR AND FUSE AND ON/OFF SWITCH [4] Receptacle for mains power. TFM260 contains a universal power supply capable of accepting 100 to 240 V (ac) input at 50/60 Hz. Fuse is 5 x 20 mm, 500 mA, 250 V time

Figure 3.5: Power connector module
1. The ON/OFF Switch Turns the TFM260 power ON(I) or OFF(O). 2. Fuse sockets 3. Receptacle for mains power.
3.4.4 ANALOGUE OUTPUTS 1-6 [5] Provides 0 to 10 V (DC) analogue outputs for rate, thickness and frequency readings. Value provide to each output is configurable by SETUP MENU. The assignment of the value type(rate, thickness, freq) and value range to each output is configurable in setup menu see section 4.3.7.
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3.4.5 QM MODULES [6] The device has been equipped with a connector enabling direct connection of the QM module. It is possible to connect up to 3 modules depends on TFM260 hardware configuration and QMB6 interface kind. The device can support up to 6 channels at the same time. At the purchase stage, the number of internal channels of the device (2, 4 or 6 channels) is defined. In the case of the number of channels smaller than 6, it is possible to connect an external QMB6 module. Each external QMB6 module uses two measuring channel of the TFM260 . For example, a device equipped with 2 internal channels can be connected with a maximum of 2 (using 4 measuring channels) external modules.
The connection cable should be made in the standard 1 to 1. To make the cable, use a wire with a minimum wire diameter of 0.5mm2 see picture 3.6.
The configuration of the attached module is done from the user interface level, see section: 4.3.11

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3.4.5.1 EXTERNAL RS232 MODULE
Only one QMB6 module can be connected with the RS232 interface. Example wiring diagram see picture 3.6.

Figure 3.6: External QMB6 module – RS232

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3.4.5.2 EXTERNAL RS485 MODULE
Up to 3 QMB6 module can be connected with the RS485 interface. Maximum module count depends on hardware configuration. The modules are connected in parallel. Example wiring diagram see picture 3.7.

Figure 3.7: External QMB6 module – RS485
3.4.6 Relay I/O [7] Connects 4 relays and 4 digital inputs to external devices. Each of the inputs and outputs can be assigned one of several functions. Is configurable in setup menu, see section 4.3.8.
Figure 3.8: RS232 connector (D-sub male 15 pin )
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PIN NUMBER Pins 1,2

FUNCTION Relay 1

Pins 3,4

Relay 2

Pins 5,6

Relay 3

Pins 7,8

Relay 4

Pin 9

Input 1

Pin 10

Input 2

Pin 11

Input 3

Pin 12

Input 4

Pins 13, 14, 15

Ground

DESCRIPTION
Normal open contact, activating dependent on user setting
Normal open contact, activating dependent on user setting
Normal open contact, activating dependent on user setting
Normal open contact, activating dependent on user setting
Digital input pin, active low, action dependent on user settings
Digital input pin, active low, action dependent on user settings
Digital input pin, active low, action dependent on user settings
Digital input pin, active low, action dependent on user settings

Table 3.4: Relay I/O – Pin functions and descriptions

3.5 SYSTEM CONNECTIONS

A maximum of 6 sensors can be connected to the device (depending on the device’s hardware version).

Figure 3.9: System connection – example diagram
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CAUTION

The inputs are not isolated. The inputs are not isolated. The voltage level applied must be limited between 0 and +5 V (dc), with respect to ground.
CAUTION

Output relays Output relays are rated for 30 V (rms) or 30 V (dc), at 2 A maximum. Provide proper fusing and adequate wiring insulation and separation in case the limits are exceeded.

· Sensor Holds the quartz crystal used to measure rate and thickness. Crystals must routinely be replaced. Refer to the appropriate sensor operating manual for installation and maintenance instructions particular to that sensor.
· In-Vacuum Cable Connects the sensor to the feedthrough.
· Feedthrough Provides isolation between vacuum and atmosphere for electrical connections, water, air, and/or purge gas tubes.
· BNC Cable – 15cm Provides a flexible connection from the feedthrough to the oscillator.
· Oscillator Contains the electronics to operate the quartz crystal. The length from the oscillator to the crystal should be under 10 m.
· BNC Cable – 3m Connects the oscillator to TFM260 . Lengths up to 10m are acceptable.
An external oscillator QMB6-EO need be used for each channel separately. Connecting to the TFM260 :
1. Connect one end of the oscillator cable(coaxial cable) to selected TFM260 sensor connector.

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WARNING

Maintain adequate insulation and physical separation of sensor and I/O wiring from hazardous voltages.
2. Connect the other end of the oscillator cable(coaxial cable) to BNC connector on the external oscillator(QMB6-EO ) labelled INSTRUMENT
3. Connect one end of the 15cm BNC cable to the BNC connector on the external oscillator(QMB6EO ) labelled SENSOR.
4. Connect the other end of the 15cm BNC cable to the BNC connector on the feedthrough
CAUTION

Proper TFM260 performance
· To maintain proper TFM260 performance, use only the provided 15 cm BNC cable to connect TFM260 or the oscillator to the crystal sensor. The length of the in-vacuum cable (Front Load and Sputtering sensors) or electrical conduit tube (Cool Drawer and Bakeable sensors) must not exceed 75cm.
· The maximum BNC cable length between external oscillator TFM260 -EO and TFM260 is 10m.

3.6 EXTERNAL OSCILLATOR
An external oscillator QMB6-EO need be used for each internal channel separately. In order to connect QMB6-EO to the TFM260 :
1. Connect one end of the oscillator cable(coaxial cable) to selected TFM260 sensor connector.
2. Connect the other end of the oscillator cable(coaxial cable) to BNC connector on the external oscillator(QMB6-EO ) labelled INSTRUMENT
3. Connect one end of the 10cm BNC cable to the BNC connector on the external oscillator(QMB6EO ) labelled SENSOR.
4. Connect the other end of the 10cm BNC cable to the BNC connector on the feedthrough,

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Figure 3.10: QMB6-EO connectors
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4 OPERATION
This chapter details the operation of the TFM260 menus and front panel controls.
4.1 EDIT VALUES
Editing the values that appear on the screen when using the device is done using the knob or buttons on the left side of the screen. Editing the value by turning the knob: turning to the right increases the edited value, while to the left it decreases. Editing the value using the buttons: By means of the “+” and “-” buttons, the edited value is increased and decreased accordingly.
Figure 4.1: Edit Values
4.2 MAIN SCREEN
On the left side of the screen there are buttons for selecting individual views available in the device:
1. HOME – display Home Window with main sensor parameters. 2. FILM MENU – displays the configuration window of individual films defined in the device. 3. SENSORS INFO – summarized in Table displays detailed information on the current status
of measuring inputs.
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Figure 4.2: Main Screen Buttons
4. GRAPH – draws a graph based on the parameters defined in Setup Menu. 5. SETUP MENU – opens a menu with options enabling advanced configuration of device
operation parameters, input and output settings, etc.
4.2.1 HOME WINDOW

Figure 4.3: TFM260 Home Screen
1. Sensor select list – selection of the sensor. all parameters below are directly related to the sensor selected from the list.
2. Film select list – assigning selected film to the selected sensor. In order to modify the settings of a given module, go to the FILM MENU, see section 4.5.
3. Crystal life indicator – show crystal life status for selected sensor. The indications depend on the settings in the menu 4.3.5. Pressing this field displays the Crystal Min/Max configuration menu.
4. Rate value – show current rate value for selected sensor 5. Rate unit – Pressing this field displays unit change list see figure 4.4 6. Thickness value – show current thickness value for selected sensor, 7. Thickness unit – Pressing this field displays unit change list see figure 4.4
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8. Time value – show current time value, when shutter is opened then value is increment, for selected sensor
9. Setpoint mode – indicate current setpoint mode for select film. Pressing this field displays the FILM MENU.
10. Shutter button pressing button open shutter(if configured) and reset Time
11. Zero button – pressing button reset thickness value for selected sensor

Figure 4.4: Unit change example screen
4.3 SETUP MENU

Figure 4.5: Setup menu
1. “Go Back” button – Depending on the menu level you are currently in, it causes various actions: return to the level menu above or return to the main screen.
2. “UP” button – move swipe list Up 3. “DOWN” button – move swipe list Down 4. “MATERIAL EDIT” – displays the material editing menu 5. Items list – selecting and pressing the item will take you to the next menu level,
4.3.1 SENSOR TOOLING FACTOR
Sensor Tooling adjusts for the difference in deposition rate between the sensor and the substrate being coated. It is an empirically determined value that aligns the sensor readings to the vacuum system.
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Figure 4.6: Toolng Factor submenu
1. Sensor Item, 2. Tooling factor value for sensor,
· 100% tooling indicates that the sensor and substrate receive the same amount of material during deposition.
· Tooling values over 100% indicate that the sensor receives less material than the substrate (see section 8.1).
· Tooling values under 100% indicate that the sensor receives more material than the substrate (see section 8.1).
Tooling is set in the System menu. It adjusts the tooling for each individual sensor before it is averaged. Sensor Tooling for a sensor applies to all films. If the Sensor Tooling parameters are set properly, a sensor failure will not cause a jump in the average Rate and Thickness reading. The value can be set in the range from 10% to 400% Also check: “Film Tooling Factor” section 4.5.
4.3.2 FIFO FILTER
The number of readings averaged for the frequency, thickness and rate display. Values of 1 to 63 are valid. A value of 0 indicates no averaging. The parameter value is set for each channel separately.
1. Sensor Item, 2. Fifo Filter value for sensor, NOTE: The number of readings averaged per second is dependent on the Measurement period settings see 4.3.4.
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Figure 4.7: FIFO filter submenu
4.3.3 RATE FILTER ALPHA
Selects the amount of filtering used to display rate data. An Alpha of 1 is no filtering. An Alpha of 0.1 is heavy filtering. The parameter value is set for each channel separately.

Figure 4.8: Alpha filter submenu 1. Sensor Item, 2. Alpha Filter value for sensor, NOTE: Low alpha values give a very stable display, but will lag actual rate readings and can hide noise problems.
Figure 4.9: Alpha filtering diagram
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4.3.4 MEASURMENT PERIOD
Sets the measurement interval between 0.1 second (10 readings per second) and 2 second. The parameter value is common to all internal measurement channels. For external channels(if available), the value can be set individually. A longer period gives higher reading accuracy, especially in low rate and low density applications. Time required for a measurement. Longer times yield higher accuracy.

Figure 4.10: Measurment peroid submenu
1. Sensor Item, 2. Measurement period for internal channels, 3. (*) Measurement period for connected external modules,
4.3.5 CRYSTAL FREQUENCY MIN/MAX
Sensor Minimum and Maximum frequencies establish the operating range for the sensing quartz crystals. Both values are used to determine the % life that is displayed in Xtal Life mode. When the sensor frequency reads below the minimum or above the maximum, TFM260 indicates a sensor failure (crystal fail) with a red color Crystal Status indicator.

Figure 4.11: Crystal Min/Max submenu
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Figure 4.11 description:
1. Sensor Item,
2. Crystal frequency minimum, if the value is smaller then the device displays the status “XTAL FAIL”,
3. Crystal frequency maxiumum, if the value is bigger then the device displays the status “XTAL FAIL”
Crystals sometimes fail unexpectedly, or exhibit erratic frequency shifts (mode hopping) before total failure. Depending on the material, crystals may fail well before the typical 5 MHz minimum. If the crystals consistently fail early, set FREQ MIN to a value higher than 5 MHz to provide a Crystal Life warning that is consistent with actual failure. A sensor crystal with an initial value that exceeds the maximum frequency will also cause a flashing Crystal Status indicator. The maximum frequency can be set slightly above the nominal values with no effect on accuracy.
TFM260 calculates the crystal life value based on the current frequency compared to the / values set in the System menu. A new crystal should indicate between 95 and 100% crystal life.
CAUTION

Crystal life status Usable crystal life depends on the material being evaporated and other process characteristics. Rate noise and other failure modes may be observed before the crystal life value reaches 0%.

4.3.6 COMMUNICATIONS

Figure 4.12: Serial interface and Ethernet parameters
1. Baudrate select list 2. DHCP checkbox – if checked then DHCP is enabled
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3. Cable status – display information about ethernet cable, in order to easily diagnose basic connection problems.
· Cable disconnected – when cable is not plug to the RJ45 socket · Cable connected – when cable is plug correctly and TFM260 communicates correctly
with another network device (router, switch, computer)
4. Internet protocol address – the value is editable when DHCP is disabled, otherwise the value is greyed out and can not be edited.
5. Net mask – the value is editable when DHCP is disabled, otherwise the value is greyed out and can not be edited.
6. Gateway address – the value is editable when DHCP is disabled, otherwise the value is greyed out and can not be edited.

4.3.6.1 RS232
RS-232 serial communications are accomplished through an industry standard 9-pin female connector found on the TFM260 rear panel (refer to 3.4.2). A mating male connector is required to attach a host interface. The host and TFM260 can be separated by up to 15 m using a multiconductor shielded data cable. For successful communications, the baud rate of the host computer and TFM260 must match. Available baud rate options are: 19200, 38400, 57600, and 115200 bps. NOTE: Unpredictable RS-232 hardware/software combinations may occasionally cause a command to not be recognized by TFM260 . Consequently, all communications should include an automatic retry procedure. If a command sent using RS-232 does not produce a response from TFM260 within three seconds, it should be sent again.
4.3.6.2 Ethernet
For Ethernet communications, TFM260 uses the static Internet Protocol (IP) (default address 192.168.0.100) The optional TCP/IP interface supports only the Standard Ethernet TCP/IP protocol. TFM260 will communicate using TCP/IP on TCP port number 2101. DHCP is also supported.
4.3.7 ANALOGUE OUTPUTS
TFM260 features analog outputs that will produce a 0 to 10 V (dc) representative of the current rate, thickness or frequency. Analogue outputs connectors are available on rear panel see section 3.4.4 You can assign any type of signal from any sensor to any analogue output. It is also possible to assign the same signal several times to several analogue outputs.
1. Analogue output Item,
2. Parameter selection list
3. Sensor selection list
4. Minimum value for selected parameter – corresponds with 0V on analogue output

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Figure 4.13: Analogue Outputs Submenu

5. Maxiumum value for selected parameter – corresponds with 10V on analogue output

Analogue outputs must be set to match the device that will be attached to the Rate, Thickness or Frequency output. The value of the analogue output is constantly updated 10 times per second.

PARAMETER Frequency Rate Thickness

MIN VALUE 4500000Hz -100 A/s 0

Table 4.1: Analogue outputs functions

MAX VALUE 6500000Hz 100 A/s 9999kA

4.3.8 RELAY OUTPUTS
The Relay outputs menus of the System Parameters menu allow the operator to display and edit relays function. Allows to assign relay functions to physical relay output.

Figure 4.14: Relay Outputs Submenu
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PARAMETER Thickness setpoint Crystal Failure
Shutter Dual sensor Forced ON Forced OFF

VALUE
Relay is activate when thickness value reached setpoint
Relay is activate when the sensor frequency reads below the minimum or above the maximum
Relay is connected with button on main screen, and is activated when button is pressed
Relay is connected with button on main screen, and is activated when button is
Selected relay is switched ON permanently
Selected relay is switched OFF permanently

Table 4.2: Relay outputs function

4.3.9 ASSIGNING INPUTS
The options allow you to configure the behavior of the device in relation to the input signals.

Figure 4.15: Digital Inputs Submenu

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PARAMETER Zero Time Zero Thickness Open/Close shutter
None

VALUE The time of the assigned sensor is reset The thickness of the assigned sensor is reset The shutter open/close signal is provided to assigned sensor input inactive

Table 4.3: Digital inputs function

4.3.10 ADVANCED SETTINGS
The options available in this submenu allow advanced configuration of device parameters.

Figure 4.16: Configuration Submenu
1. BEEP SIGNAL – turns on / off the sound signal when using the device 2. ETCHING MODE – Sets the rate and thickness to negative values for etching applications. 3. CONFIGURATION – Allows you to save / load the device configuration. To do this, connect
a USB stick to the device and select the: · “SAVE FILE” for export device configuration to USB stick, · “LOAD FILE” for load device configuration from USB stick,
Configuration is save as a text file that can be previewed and edited using any text editor. 4. USB STATUS – display current USB status:
· DISCONECTED – usb media not connected to the device or not recognized correctly, · CONNECTED – usb carrier correctly recognized and ready to read / write, 5. LOAD DEFAULT SETTINGS – Set all device parameters to default · Setup menu settings, · Material menu parameters(Remove user define parameters),
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TFM260 Thin Film Monitor

· Film menu settings(all films are set to default parameters), 6. SERVICE MENU – Menu available only for the device manufacturer, is used for calibration
and testing of the device at the production stage.
4.3.11 EXTERNAL CHANNEL

Figure 4.17: External channel configuration Submenu
External channel submenu is used to configure the operating parameters with the external measuring module. Default, the support of external modules is disabled: parameter Number of modules is set to 0. Selecting from the list a value other than 0 activates the operation of external modules. The module is visible in the device as two consecutive measurement channels, with the extension “ext” added, example main screen and setup menu see pictures 4.18, 4.19.

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Figure 4.18: External channels avalible on Sensor List
Figure 4.19: External channels avalible on Setup menu(example)
1. Interface type of the included QM module, available options: · RS232 · RS485
2. The number of modules connected to the device, for the RS232 interface, the option is not active and always equal to 1. For RS485, up to three modules can be selected.
3. This option is used when connecting a module with an RS485 interface. It allows you to choose the address under which you should look for the first module. For example, for two connected modules and the starting address 5, the device assumes that the second module has the address 6.
4. Module status items, return information about current status of connected external modules · “CONNECTION ESTABLISHED” – the external module is connected and the communication has been correctly established, · “NO DEVICE” – module is enabled for communication but is not connected · “DISABLED” – module disabled for communication,
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4.3.12 INFORMATION
Contains information about the software version on the device and the modules attached to it.

4.4 MATERIAL LIST
The device has factory defined over 80 materials and additionally allows you to define up to 10 of your materials. The list consists of three columns: material name, acoustic impedance value and A Z-Factor value. The materials are displayed in alphabetical order. The material defined by the user may have an individual name and parameters.

Figure 4.20: Material Menu Buttons

Figure 4.21: Material Menu
4.4.1 ADD MATERIAL
The material is added by pressing the ADD MATERIAL button. Default parameters for each added material item.
· Name: UserDef(n), · Acoustic Impedance: 1.00, · Z-Factor: 1.00,
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4.4.2 EDIT MATERIAL

Figure 4.22: Add Material

Figure 4.23: Edit Material Acoustic Impedance value and Z-Factor value for all items on the material list can be modified by the user. In addition, for material defined by the user, the name of the material can be modified at any time. The modified material will appear in the material list in alphabetical order. it is possible to restore the list of materials to the factory state (default values). To do this, use the option “Load default parameters”. See the section: 4.3.10
4.4.3 DELETE MATERIAL
if for any reason you want to delete the material, you can do it using the DELETE MATERIAL button. It is possible to remove only those materials that we previously defined ourselves. It is not possible to delete factory-defined materials.
4.5 FILM MENU
The Film menu aids in programming TFM260 for the materials that will be deposited. Ninetynine films can be stored, but only one film for each sensor is active at any time.
1. Film select list – selection of film to edit 2. Material select list – assigning the selected material to the selected sensor. Material list
and edit material parameters see section 4.4 3. Setpoint selection:
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TFM260 Thin Film Monitor

Figure 4.24: Film menu
· Thickness – The desired final thickness of this layer. The deposition phase of this layer will end when this thickness is reached.
· Time Setpoint – Sets a time, after shutter open, when the shutter is automatic closed. · Manual – Allows manual shutter control
4. Film Tooling- Compensates for sensor sensitivity to the selected material. Use Crystal Tooling in the System menu to compensate for each sensor individually.
5. Sensor 1-6 – Activates/Deactivates each quartz crystal sensor to be used for the selected film. If multiple sensors are assigned to a film, their readings are averaged. If multiple sensors are assigned to a film, and one fails, it is excluded from measurements. Sensors 3, 4, 5 and 6 will not be displayed unless the optional sensor board is installed in TFM260 .
6. Material Parameters: Material: Selects a material assigned to this film. As materials change, their density and Z-Ratio is updated. Density: Material density has a significant impact on deposition calculations. Z-Factor: an empirically determined measure of the effect a material has on quartz crystal frequency change. Common materials, densities, and Z-Ratios are listed in Appendix A.
4.5.1 RATE SAMPLING
Rate sampling can extend the life of crystals. With rate sampling, the deposition rate is sampled for a period of time, then the sensor shutter is closed. Sample The time for the sensor shutter to remain open when Sampling is enabled in the System menu. Not available when Sampling is disabled in System menu. Hold The time for the sensor shutter to remain closed when Sampling is enabled in the System menu. Not available when Sampling is disabled in System menu.
4.6 SENSOR INFO MENU
The screen combines information about the individual sensors attached to the device. The data is constantly updated and refreshed. Between channels switch to using the buttons “2” – “NEXT SENS” and “3”- “PREV SENS”.
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Figure 4.25: Sensor Info
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5 OPERATION – REMOTE CONTROL
TFM260 offers the following types of data communications hardware ports.
· Serial RS-232 port · Ethernet port
Both the host and server must have the same form of communications equipment and complementary setup. For serial communications, the baud rates and data word format must match. The word format for bit serial lines (RS-232) is comprised of ten signal bits: eight data bits, one start bit, one stop bit, and no parity. The eight data bits contain a byte of information or character whose ASCII value ranges from 0 to 255.
5.1 RS232 COMMUNICATION
RS-232 serial communications are accomplished through an industry standard 9-pin female connector found on the TFM260 rear panel (3.4.2). A mating male connector is required to attach a host interface. The host and TFM260 can be separated by up to 15.2 m (50 ft.) using multiconductor shielded data cable. For successful communications, the baud rate of the host and SQM-160 must match. Available baud rate options are: 2,400, 4,800, 9,600, 19,200, 38,400, 57,600, and 115,200 bps. TFM260 is configured as DCE (Data Communication Equipment).
CAUTION
Unpredictable RS-232 Unpredictable RS-232 hardware/software combinations may occasionally cause a command to not be recognized by TFM260 . Consequently, all communications should include an automatic retry procedure. If a command sent via RS-232 does not produce a response from TFM260 within three seconds, it should be sent again.
5.2 ETHERNET PORT
For Ethernet communications, TFM260 uses the static IP address 192.168.1.200. The optional Ethernet port supports only the Standard Ethernet TCP/IP protocol. TFM260 will communicate using TCP/IP on TCP port number 2101. The interface supports static and DHCP addressing. Ethernet parameters allow the IP address and the net mask to be set. A standard Ethernet cable is required to connect TFM260 through a network or hub connection.
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5.3 COMMUNICATIONS PROTOCOL
TFM260 communicates with a host computer using an ASCII based protocol. TFM260 defaults to 19,200 baud, 8 data bits, and no parity. The baud rate can be changed in the TFM260 System menu, but is always 8 data bits with no parity.

5.4 COMMAND PACKET

FIELD Sync
Length
Message CRC

DESCRIPTIONS
The Sync character is an exclamation point (!). When this character is received, the communications for that packet is reset. The Sync character is not included in the CRC calculation. NOTE: The Sync character (!) is reserved for the Sync usage, and cannot be used (sent) in any of the following message characters. It always marks the start of a new packet.
This is based on the decimal number of characters in the packet (excluding the Sync, Length, and CRC characters). This character has a decimal 34 added to it so there cannot be a Sync character (!) embedded in the packet. NOTE: The maximum value for length should not exceed 190 (or 224 including the added 34).
Command (see section 3.4.4).
Cyclic Redundancy Check (CRC) is a method to verify there are no errors in the packet. See section 5.3.3 on page 5-11 for detailed instructions to calculate the CRC and section 5.5 on page 5-22 for code examples.
Table 5.1: Command packet – field descriptions

5.5 RESPONSE PACKET

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FIELD Sync

Length

Response sage
Response sage
CRC

MesMes-

DESCRIPTIONS
The Sync character is an exclamation point (!). When this character is received, the communications for that packet is reset. The Sync character is not included in the CRC calculation. NOTE: The Sync character (!) is reserved for the Sync usage, and cannot be used (sent) in any of the following message characters. It always marks the start of a new packet.
This is based on the decimal number of characters in the packet (excluding the Sync, Length, and CRC characters). The response Length character has a decimal 35 added to the decimal count value instead of 34 like the Length character of the command packet.
This character indicates the status of the Command Packet
Command (see section 3.4.4).
Cyclic Redundancy Check (CRC) is a method to verify there are no errors in the packet. See section 5.3.3 on page 5-11 for detailed instructions to calculate the CRC and section 5.5 on page 5-22 for code examples.

Table 5.2: Response packet – field descriptions

5.6 CALCULATING THE CRC

The following algorithm is used to compute the Cyclic Redundancy Check (CRC): NOTE: The Sync character and CRC are not included in the CRC calculation. All other characters should be included.

1. The CRC register (16 bits) is initialized to hexadecimal 3FFF.
2. Each 8 bit character in the packet is examined and added to the CRC in the following manner (excluding the Sync character)
(a) The character byte is exclusive OR’d (XOR) with the least significant byte of the CRC register with the result replaced in the CRC register least significant byte. The most significant byte remains unchanged (one time per character byte).
(b) Perform the following loop eight times: i. Preserve state of least significant bit (LSB) of the CRC register, named Cy. ii. The CRC register is shifted one bit position to the right with a zero shifted into the most significant bit (MSB). iii. If bit position 0 has a value of 1 before each shift (Cy=1), the CRC is exclusive OR’d with hexadecimal 2001 with the result replaced in the CRC register.
3. Mask the contents of the CRC register by logical AND with 3FFF hexadecimal and save the result into the CRC register.

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4. The CRC register contains 14 significant bits. This is split into two pieces of 7 bits each to send at the end of the packet as CRC1 and CRC2. A decimal 34 (hexadecimal 22) is added to each CRC piece in order to avoid there being an embedded sync character.
(a) Extract by masking with hexadecimal 7F the LSB 6 to 0 of the CRC register and add a decimal 34 (hexadecimal 22). This is CRC1.
(b) Extract bits 13 to 7 of the CRC register, shift right seven times, and add a decimal 34 (hexadecimal 22). This is CRC2.
CRC code examples can be found in section????, CRC Examples.

5.7 COMMANDS LIST
TFM260 uses several command types. Query – Returns the requested information about parameter settings from TFM260 . Update – Updates parameters in SQM-160. Remote – Performs an action. Status – Reads system status information. Several commands can act as more than one command type, depending on how they are sent. For example, the A command can be used to query or update Film parameters.

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Command @ A B C D J
L M N O P R S
T U
W Y Z

Command Type Query Query/Update Query/Update Query/Update Update Query
Status Status Status Status Status Status Remote
Remote Remote/Status
Status Status Update

Parameters send/Returned TFM260 Version Film Parameters System 1 Parameters System 2 Parameters Set Active Film Number of Installed Sensor Channels Current Sensor Rate Current Average Rate Current Sensor Thickness Current Average Thickness Current Sensor Frequency Crystal Life Zero Average Thickness and Rate Zero Time Toggle Source Shutter Open/Close Query Source Shutter State Rate, Thickness, Frequency Power-Up Reset Flag State Default All Parameters

Table 5.3: TFM260 commands

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6 TROUBLESHOOTING

SYMPTOM Frequency reading in Sensor Information screen is unstable or drifting (not a normal frequency decrease associated with material being deposited on the crystal).
TFM260 does not turn on.

CAUSE Temperature of the crystal is unstable (an AT-cut crystal may drift as much as 10 Hz/°C).
Humidity level on the crystal is changing. Moisture being absorbed or exuded from the crystal surface.
Defective in-vacuum cable or coax cables. Crystal seating on the crystal holder surface is scratched or contaminated. TFM260 or oscillator is malfunctioning.
Excessive cable length between oscillator and crystal causes a self- oscillation condition. Line cord is not plugged into TFM260 or rear panel power switch is not on.

REMEDY
Control the vacuum chamber temperature. Move the crystal farther away from the source (at least 25cm from source). Check sensor water cooling for correct flow and temperature. Refer to the sensor operating manual. Clean or replace the crystal holder. Refer to the sensor operating manual.
Avoid condensation by turning off cooling water to sensor before opening the vacuum chamber to air. Flow water above the dew point of the room through the sensor when the chamber is open.
Use an ohmmeter to check electrical continuity and isolation.
Clean or replace crystal holder. Refer to the sensor operating manual.
Test the TFM260 and oscillator using the test crystal module(see section 9.3) Substitute a known good TFM260 . Substitute a known good oscillator.
Use no longer than a 90 cm in-vacuum cable. Use only the 15 cm cable between TFM260 or oscillator and feedthrough.
Connect line cord. Set the rear panel power switch to position 1 (ON).
continued on next page

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continued from previous page

SYMPTOM

CAUSE

Incorrect line voltage.

Fuse open.

TFM260 is malfunctioning.

TFM260 up.”.

“locks

Covers / panels not installed or not secured.
Electrical noise is being picked up by cables connected to TFM260 .

Inadequate system grounding.

TFM260 is malfunctioning.

Frequency reading in Sensor Information screen is an incorrect value.

Excessive cable length between oscillator and crystal is causing a self- oscillation at a frequency different than the crystal frequency.
TFM260 or oscillator is malfunctioning.

Crystal Fail is displayed.

Failed or defective crystal, or no crystal in sensor.
Two crystals were installed or crystal is upside down.

REMEDY
Line voltage must be within TFM260 line voltage specification
Remove the fuse drawer from the power inlet and examine both fuses, or use an ohmmeter to check the fuses. Replace open fuses with the specified fuse
Contact the device manufacturer department
Install / securely fasten all covers and panels.
Locate the sensor, oscillator cables, source output cables, I/O cables, and line cord at least 30cm away from high voltage / high power cables and other sources of electrical noise.
Ground wires or straps should be short with large surface area to minimize impedance to ground. Ground wires or straps must connect to an appropriate earth ground
Contact the device manufacturer department
In-vacuum cable length should not exceed 80 cm. Use the 15.2 cm cable between oscillator and feedthrough
Test the TFM260 and oscillator using the test crystal module(see section 9.3) Substitute a known good TFM260 . Substitute a known good oscillator.
Install a new crystal.
Remove extra crystal. Reverse crystal orientation. Inspect crystal for scratches; if scratched, replace with new crystal.
continued on next page

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continued from previous page

SYMPTOM

CAUSE

Build-up of material at crystal holder aperture is touching the crystal.

Crystal frequency is not within the frequency range of TFM260

Crystal Fail is displayed

Oscillator and sensor not connected to the Sensor channel(s)
Sensor not connected, or bad electrical connection in sensor head or feedthrough, or bad cables.

Bad coax cable between feedthrough and TFM260 or oscillator, or bad coax cable between oscillator and TFM260 .
TFM260 or QMB6-EO is malfunctioning.

REMEDY
Clean or replace the crystal holder. Refer to the sensor operating manual.
Use a crystal with starting frequency appropriate for TFM260 frequency range. Change the Min / Max Frequency settings in the
Connect oscillator and sensor to all active Sensor channel(s).
Check sensor connections. Refer to the sensor operating manual. Use an ohmmeter to check electrical continuity / isolation of sensor head, feedthrough, in-vacuum cable, BNC adapter cable, and BNC cables. Refer to the sensor operating manual. Substitute a 5.5 MHz test crystal or a known good sensor for the suspect sensor.
Use an ohmmeter to check electrical continuity / isolation. Substitute a known good coax cable.
Substitute a known good TFM260 (or other quartz monitor). Substitute a known good oscillator. Substitute known good BNC cables. Substitute a known good in- vacuum cable. Substitute a known good sensor/feedthrough Test the TFM260 and oscillator using the test crystal module(see section 9.3)
continued on next page

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continued from previous page

SYMPTOM

CAUSE

Crystal Fail is displayed during deposition before “normal” life of crystal is exceeded.

Crystal is being hit by small droplets of molten material from the evaporation source.

Damaged crystal or deposited material is causing stress to crystal.

Material build-up on crystal holder is partially masking the crystal surface.

Shutter is partially obstructing deposition flux or sensor is poorly positioned, causing uneven distribution of material on crystal.

Crystal oscillation is weak due to excessive cable length between oscillator and crystal.

Crystal Fail is displayed when vacuum chamber is opened to air.

Crystal was near the end of its life; opening to air causes film oxidation, which increases film stress.

Excessive moisture accumulation on the crystal.

Rate, Thickness,

and Frequency

readings

are

noisy.

Excessive cable length between oscillator and crystal.

REMEDY Use a shutter to shield the sensor during source conditioning. Move the crystal farther away (at least 25cm) from the source.
Replace the crystal. Use an Alloy crystal if appropriate for deposited material. Clean or replace the crystal holder. Refer to the sensor operating manual for cleaning instructions. Visually check crystal for an uneven coating, and if present, correct shutter or sensor positioning problem.
In-vacuum cable length should not exceed 80 cm Use the 15 cm cable between oscillator and feedthrough. Replace the crystal.
Avoid condensation by turning off cooling water to sensor before opening the vacuum chamber to air, and then flow heated water above the dew point of the room through the sensor when the chamber is open. In-vacuum cable length should not exceed 80 cm Use the 15 cm cable between oscillator and feedthrough.
continued on next page

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continued from previous page

SYMPTOM

CAUSE

Electrical noise is being picked up by cables connected to TFM260 .

Inadequate system grounding.

Thickness reading has large excursions during deposition.

Mode hopping due to damaged crystal.
Crystal is near the end of its life. Scratches or foreign particles on the crystal holder crystal seating surface.

Uneven coating onto crystal.

Particles on crystal.
Intermittent cables or connections.

Inadequate cooling of crystal.

REMEDY
Locate the sensor, oscillator cables, source output cables, I/O cables, communications cable, and line cord at least 30 cm away from high Voltage / high power cables and other sources of electrical noise.
Ground wires or straps should be short with large surface area to minimize impedance to ground.
Replace the crystal.
Replace the crystal.
Clean the crystal seating surface inside the crystal holder or replace crystal holder. Refer to sensor operating manual for cleaning instructions
A straight line from center of source to center of crystal should be perpendicular to face of crystal.
Replace crystal. Remove source of particles.
Use an ohmmeter to check electrical continuity / isolation of sensor head, feedthrough, in-vacuum cable, and BNC cables. Refer to the sensor operating manual for detailed troubleshooting information.
Check water flow rate and temperature for sensor cooling.

Table 6.1: Write device address

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7 CALIBRATION PROCEDURES
7.1 IMPORTANCE OF DENSITY, TOOLING AND Z-RATIO
The quartz crystal microbalance is capable of precisely measuring the mass added to the face of the oscillating quartz crystal sensor. The density of this added material allows conversion of the mass information into thickness. In some instances, where highest accuracy is required, it is necessary to make a density calibration as outlined in section 7.2. Because the flow of material from a deposition is not uniform, it is necessary to account for the different amount of material flow onto the sensor compared to the substrates. This factor is accounted for in the tooling factor. The tooling factor can be experimentally established by following the guidelines in section 7.3. If the Z-Ratio is not known, it could be estimated from the procedures outlined in section 7.4.

7.2 DETERMINING DENSITY

NOTE: The bulk density values retrieved from Table 8.1 are sufficiently accurate for most applications. Follow the steps below to determine density value.

1. Place a substrate (with proper masking for film thickness measurement) adjacent to the sensor, so that the same thickness will be accumulated on the crystal and substrate.

2. Set density to the bulk value of the film material or to an approximate value.

3. Set Z-Ratio to 1.000 and tooling to 100

4. Place a new crystal in the sensor and make a short deposition (1000 to 5000 Å).

5. After deposition, remove the test substrate and measure the film thickness with either a multiple beam interferometer or a stylus-type profilometer.

6. Determine the new density value with equation [1]:

(/

)=

(

)

(7.1)

where:
· = Initial density setting · = Thickness reading on TFM260 · = Measured thickness

7. A quick check of the calculated density may be made by programming TFM260 with the new density value and observing that the displayed thickness is equal to the measured thickness, provided that the thickness displayed on TFM260 has not been zeroed between the test deposition and entering the calculated density.

NOTE: Slight adjustment of density may be necessary in order to achieve Tx = Tm.

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7.3 DETERMINING TOOLING

1. Place a test substrate in the system substrate holder.

2. Make a short deposition and determine actual thickness.

3. Calculate tooling from the relationship shown in equation:

(%)

=

(

)

where:

· = Actual thickness at substrate holder · = Thickness reading on TFM260 · = Initial tooling factor

(7.2)

4. Round off percent tooling to the nearest 0.1%. 5. When entering this new value for tooling, will equal if calculations are done properly.

NOTE: It is recommended that a minimum of three separate evaporations be made when calibrating tooling. Variations in source distribution and other system factors will contribute to slight thickness variations. An average value tooling factor should be used for final calibrations.

7.4 Laboratory Determination of Z-Ratio

A list of Z-Ratios for materials commonly used are available in 8.1. For other materials, Z can be calculated from the following formula:

=

(

)(

1 2

)

(7.3)

where:

= 9.37810

(

)( –

1 2

)

(7.4)

· = Density (/ ) of deposited film · = Shear modulus (/ ) of deposited film · = Density of quartz (crystal) (2.649/ ) · = Shear modulus of quartz (crystal) (3.3210 1/ )

The densities and shear moduli of many materials can be found in a number of handbooks. Laboratory results indicate that Z-Ratios of materials in thin-film form are very close to the bulk values. However, for high stress producing materials, Z-Ratios of thin films are slightly smaller than those of the bulk materials. For applications that require more precise calibration, the following direct method is suggested:

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TFM260 Thin Film Monitor

1. Establish the correct density value as described in section 7.2.
2. Install a new crystal and record its starting frequency, . The starting frequency will be displayed on the TFM260 Main screen.
3. Make a deposition on a test substrate such that the percent crystal life display will read approximately 50 %, or near the end of crystal life for the particular material, whichever is smaller.
4. Stop the deposition and record the ending crystal frequency, .
5. Remove the test substrate and measure the film thickness with either a multiple beam interferometer or a stylus-type profilometer.
6. Using the density value from step 1 and the recorded values for and , adjust the ZRatio value in thickness equation [5] to bring the calculated thickness value into agreement with the actual thickness. If the calculated value of thickness is greater than the actual thickness, increase the Z-Ratio value. If the calculated value of thickness is less than the actual thickness, decrease the Z-Ratio value.
For multiple layer deposition (for example, two layers), the Z-Ratio used for the second layer is determined by the relative thickness of the two layers. For most applications the following three rules will provide reasonable accuracies:
· If the thickness of layer 1 is large compared to layer 2, use material 1 Z-Ratio for both layers.
· If the thickness of layer 1 is thin compared to layer 2, use material 2 Z-Ratio for both layers.
· If the thickness of both layers is similar, use a value for Z-Ratio which is the weighted average of the two Z-Ratios for deposition of layer 2 and subsequent layers.

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8 Measurement and Theory

The TFM260 utilizes the piezoelectric sensitivity of a quartz monitor crystal to added mass. The TFM260 uses this mass sensitivity to control the deposition rate and final thickness of a vacuum deposition. When a voltage is applied across the faces of a properly shaped piezoelectric crystal, the crystal is distorted and changes shape in proportion to the applied voltage. At certain discrete frequencies of applied voltage, a condition of sharp electro- mechanical resonance is encountered. When mass is added to the face of a resonating quartz crystal, the frequency of these resonances are reduced. This change in frequency is very repeatable and is precisely understood for specific oscillating modes of quartz. This heuristically easy-to-understand phenomenon is the basis of an indispensable measurement and process control tool that can easily detect the addition of less than an atomic layer of an adhered foreign material. It is generally accepted that when the mass loading from the deposit causes a change in frequency of less than 2% of the frequency of the unloaded crystal, Sauerbrey’s equation can be used to obtain accurate results in thin-film thickness calculations. As the thickness of the film increases, the Sauerbrey equation must be extended to incorporate the elasticity of the deposit. Lu and Lewis gave a simple equation for the calculation of the dependence of f on m, which is currently applied by most Quartz Monitor users to calculate rigid thin-film thicknesses:

=

2

10

[

1

(

)

1

(

(

))]

(8.1)

where:

Thicknes of deposided film (kA) Starting frequency of the sensor crystal (Hz) Final frequency of the sensor crystal (Hz) Nominal blank frequency = 6045000(Hz) Z-Ratio of deposited film material Specific acoustic impedance of quartz = 8765000( ) Density of deposited film

This analysis of frequency changes, including the acoustic impedances of the quartz and film, is often called the “Z-match” method. The accuracy of the mass load and film thickness calculation is often limited by how well the Z-Factor and density of the material are known. Density and Z-Factor values are typically very close to bulk values. The bulk density and shear modulus values for common film materials can be found in many material reference handbooks. The Lu and Lewis equation is generally considered to be a good match to the experimental results for frequency changes up to 40% (relative to the unloaded crystal). Keep also in mind that the Z-match equation strictly applies to “rigid” deposits. Films which behave viscoelastically, such as some organic polymer films with large thickness or viscosity, will exhibit significant deviations from equation.

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Crystal failures are also often seen before a 40% shift in frequency is reached. Common problems are shorts in the crystal electrodes due to excessive buildup, mode hopping to other (anharmonic) resonant frequencies due to the buildup of composite resonant modes, deviations from theory due to fringing electrode fields developed between the electrodes and the film, unexpected shifts in fundamental frequency due to stress build up on the crystal surface, splitting of source material resulting in nonuniform films, etc.

8.1 TOLLING FACTOR
Tooling Factor is a correction for the difference in material deposited on the quartz sensor versus the substrate. Illustrated below is an example of how difference in distance between the sensor and substrate causes an incorrect reading as you would see in an electron or thermal evaporation system. It is impossible to place a sensor in exactly the same place as your substrate unless the sensor is your substrate.

Figure 8.1: Tooling factor over 100%

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Figure 8.2: Tooling factor under 100%
8.2 MATERIAL LIST
The following Table represents the density and Z-Ratio for various materials. The list is alphabetical by chemical formula An * is used to indicate that a Z-Ratio has not been established for a certain material. A value of 1.000 is defaulted in these situations.

Formula

Density 10.500 6.470 5.560 2.700 3.970 2.360 3.070 3.260 4.360 5.730 4.750 19.300 2.370

Z-Ratio 0.539 1.180 1.320 1.080 0.336 1.000 1.000 1.000 0.743 0.966 1.000 0.381 0.389

Material Name silver silver bromide silver chloride aluminum aluminum oxide aluminum carbide aluminum fluoride aluminum nitride aluminum antimonide arsenic arsenic selenide gold boron
continued on next page

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Formula

Density

0

1.820

2.370

1.860

3.500

4.886

3.244

5.720

5.999

6.035

1.850

1.990

3.010

9.800

8.900

7.390

6.820

7.700

5.320

2.250

3.520

1.100

1.550

3.180

3.350

2.900

2.962

4.100

6.060

8.640

TFM260 Thin Film Monitor

Z-Ratio 1.000 1.000 1.000 2.100 0.793 1.261 1.000 0.464 0.412 0.543 1.000 1.000 0.790 1.000 1.000 1.000 1.000 1.000 3.260 0.220 1.000 2.620 0.775 1.000 1.000 0.955 1.000 1.000 0.682

Material Name boron oxide boron carbide boron nitride barium barium fluoride barium nitrate barium oxide barium titanate (tetr) barium titanate (cubic) beryllium beryllium fluoride beryllium oxide bismuth bismuth oxide bismuth trisulfide bismuth selenide bismuth telluride bismuth fluoride carbon (graphite) carbon (diamond) parlyene (union carbide) calcium calcium fluoride calcium oxide calcium silicate (3) calcium sulfate calcium titanate calcium tungstate cadmium
continued on next page

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TFM260 Thin Film Monitor

continued from previous page

Formula

Density

6.640

8.150

4.830

5.810

6.200

6.780

6.160

7.130

8.900

6.440

7.200

5.210

6.680

6.170

1.870

4.243

4.456

3.988

4.516

8.930

6.000

5.600

5.800

4.600

8.550

7.810

9.050

8.640

5.260

Z-Ratio 1.000 1.000 1.020 1.000 0.980 1.000 1.000 1.000 0.343 0.412 0.305 1.000 1.000 1.000 1.000 1.212 1.410 1.399 1.542 0.437 1.000 0.690 0.670 0.820 0.600 1.000 0.740 1.000 1.000

64
Material Name cadmium fluoride cadmium oxide cadmium sulfide cadmium selenide cadmium telluride cerium cerium (III) fluoride cerium (IV) dioxide cobalt cobalt oxide chromium chromium (III) oxide chromium carbide chromium boride cesium cesium sulfate cesium bromide cesium chloride cesium iodide copper copper oxide copper (I) sulfide (alpha) copper (I) sulfide (beta) copper (II) sulfide dysprosium dysprosium oxide erbium erbium oxide europium
continued on next page

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continued from previous page

Formula

Density

6.500

7.860

5.240

5.700

4.840

5.930

5.880

5.310

6.100

4.100

5.600

7.890

7.410

5.350

5.200

6.240

6.200

13.090

10.500

12.200

13.800

9.680

7.200

13.460

8.800

8.410

7.300

7.180

5.700

TFM260 Thin Film Monitor

Z-Ratio 1.000 0.349 1.000 1.000 1.000 0.593 1.000 1.590 1.000 1.000 1.000 0.670 1.000 0.516 1.000 1.000 1.000 0.360 1.000 1.000 1.000 1.000 1.000 0.740 0.580 1.000 0.841 1.000 1.000

Material Name europium fluoride iron iron oxide iron oxide iron sulfide gallium gallium oxide (B) gallium arsenide gallium nitride gallium phosphide gallium antimonide gadolinium gadolinium oxide germanium germanium nitride germanium oxide germanium telluride hafnium hafnium boride hafnium carbide hafnium nitride hafnium oxide hafnium silicide mercury holmium holmium oxide indium indium sesquioxide indium selenide
continued on next page

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TFM260 Thin Film Monitor

continued from previous page

Formula

Density

5.800

5.700

4.800

5.760

22.400

0.860

2.750

1.980

2.480

3.128

6.170

6.510

2.610

5.940

0.530

3.470

2.638

4.700

9.840

1.740

3.600

8.000

3.180

3.580

7.200

5.390

3.990

10.200

9.180

Z-Ratio 1.000 1.000 1.000 0.769 0.129 10.189 1.893 2.050 1.000 2.077 0.920 1.000 1.000 1.000 5.900 1.230 0.778 0.463 1.000 1.610 1.000 1.000 0.637 0.411 0.377 0.467 0.940 0.257 *1.000

66
Material Name indium telluride indium arsenide indium phosphide indium antimonide iridium potassium potassium bromide potassium chloride potassium fluoride potassium iodide lanthanum lanthanum oxide lanthanum boride lanthanum fluoride lithium lithium bromide lithium fluoride lithium niobate lutetium magnesium magnesium aluminate spinel magnesium fluoride magnesium oxide manganese manganese oxide manganese (II) sulfide molybdenum molybdenum carbide
continued on next page

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continued from previous page

Formula

Density

7.120

4.700

4.800

0.970

2.900

2.900

3.200

2.170

2.164

2.558

2.270

8.578

7.500

4.470

6.970

7.820

8.400

7.000

7.240

3

6.506

8.910

8.500

8.500

8.700

8.900

7.450

5

2.510

11.300

5.850

TFM260 Thin Film Monitor

Z-Ratio 1.000 1.000 1.000 4.800 1.000 1.000 1.000 1.570 1.565 1.645 1.194 0.492 1.000 1.000 1.000 1.000 1.000 1.000 1.000 1.000 0.331 1.000 1.000 1.000 1.000 1.000 1.000 1.130 *1.000

Material Name molybdenum boride molybdenum trioxide molybdenum disulfide sodium cryolite chiolite sodium bromide sodium chloride sodium chlorate sodium fluoride sodium nitrate niobium(columbium) niobium trioxide niobium (V) oxide niobium boride niobium carbide niobium nitride neodymium neodymium oxide neodymium fluoride nickel nichrome Inconel permalloy supermalloy nickel oxide phosphorus nitride lead lead chloride
continued on next page

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TFM260 Thin Film Monitor

continued from previous page

Formula

Density

8.240

9.530

7.500

8.100

8.100

8.160

12.038

8.310

9.400

6.780

6.880

21.400

10.200

5.000

1.530

3.550

21.040

12.410

12.362

8

2.070

6.620

5.200

4.640

3.000

3.860

4.810

2.320

3.440

3.220

Z-Ratio 0.661 1.000 0.566 1.000 1.000 0.651 0.357 1.000 1.000 1.000 1.000 0.245 1.000 1.000 2.540 1.000 0.150 0.210 0.182 2.290 0.768 1.000 1.000 0.910 1.000 0.864 0.712 1.000 *1.000

68
Material Name lead fluoride lead oxide lead sulfide lead selenide lead stannate leadtelluride palladium palladium oxide polonium praseodymium praseodymium oxide platinum platinum oxide radium rubidium rubidium iodide rhenium rhodium ruthenium sulfur antimony antimony trioxide antimony trisulfide scandium scandium oxide selenium silicon silicon nitride silicon carbide
continued on next page

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Formula

Density

2.130

2.648

7.540

2

7.430

7.300

6.950

5.080

6.180

6.440

2.600

4.277

4.990

16.600

2

8.200

11.150

13.900

16.300

8.270

11.500

6.250

5.990

11.694

6.320

9.860

9.100

4.500

0

4.600

4.500

4.930

TFM260 Thin Film Monitor

Z-Ratio 0.870 1.000 0.890 1.000 0.724 1.000 1.000 1.000 1.000 1.000 0.727 0.517 0.262 0.300 1.000 1.000 1.000 0.660 1.000 0.900 0.862 0.484 1.000 0.284 1.000 0.628 1.000 1.000 *1.000

Material Name silicon (II) oxide silicon dioxide samarium samarium oxide tin tin oxide tin sulfide tin selenide tin telluride strontium strontium fluoride strontium oxide tantalum tantalum (V) oxide tantalum boride tantalum carbide tantalum nitride terbium technetium tellurium tellurium oxide thorium thorium (IV) fluoride thorium dioxide thorium oxyfluoride titanium titanium sesquioxide titanium boride titanium carbide
continued on next page

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TFM260 Thin Film Monitor

continued from previous page

Formula

Density

5.430

4.900

4.260

11.850

7.560

7.000

7.090

19.050

8.300

10.969

10.970

5.960

3.360

5.100

5.770

6.130

4.340

19.300

10.770

15.600

7.160

7.500

9.400

4.340

0

5.010

6.980

9.170

7.040

6.300

Z-Ratio 1.000 1.000 0.400 1.550 1.000 1.000 1.000 0.238 1.000 0.348 0.286 0.530 1.000 1.000 1.000 1.000 1.000 0.163 1.000 0.151 1.000 1.000 1.000 0.835 1.000 1.130 1.000 0.514 1.000

70
Material Name titanium nitride titanium oxide titanium (IV) oxide thallium thallium bromide thallium chloride thallium iodide (B) uranium tri uranium octoxide uranium oxide uranium dioxide vanadium vanadium pentoxide vanadium boride vanadium carbide vanadium nitride vanadium dioxide tungsten tungsten boride tungsten carbide tungsten trioxide tungsten disulfide tungsten silicide yttrium yttrium oxide ytterbium ytterbium oxide zinc zinc antimonide
continued on next page

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71

TFM260 Thin Film Monitor

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Formula

Density

4.950

5.610

4.090

5.260

6.340

6.490

6.080

6.730

7.090

5.600

Z-Ratio 1.000 0.556 0.775 0.722 0.770 0.600 1.000 0.264 1.000 1.000

Table 8.1: Material table

Material Name zinc fluoride zinc oxide zinc sulfide zinc selenide zinc telluride zirconium zirconium boride zirconium carbide zirconium nitride zirconium oxide

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9 MAINTANCE AND SERVICE
9.1 MAINTANCE
The TFM260 does not require any special maintenance work.
9.2 CLEANING
For cleaning of the outside of the device, a slightly moistened cloth will usually do. Do not use any aggressive or abrasive cleaning agents.
9.3 CHECK FOR CORRECT OPERATION – TEST QUARTZ
Using the QMB6-EO Oscillator with Test Quartz to help isolate persistent crystal fail problems. To activate the test feature, press connect the Test Crystal to BNC connector. If TFM260 and the oscillator are functioning correctly, the Sensor Information will display a Frequency of approximately 6.0 MHz while the Test Crystal is connected. If the Sensor Information screen continues to display Frequency of zero while the Test Crystal is connected, the problem is either the programming of the sensor selection, in the electronics of the oscillator, or TFM260 .
9.4 FIRMWARE UPDATE
The device can be updated via the USB port on the front panel. To do this, download the appropriate files from the manufacturer’s website and copy them to the USB stick. The unit should be run in bootloader mode and perform the update procedure.
9.4.1 DOWNLOAD FIRMWARE FILE
The steps necessary to prepare a USB storage for updating the device’s software are described below.
1. Download the latest files from the manufacturer’s website appropriate for the hardware version of your device. For the media to be detected correctly by the device it must be formatted in the FAT32 system.
2. Insert the USB drive into the USB connector on the computer 3. Copy the downloaded files to a USB storage medium to the root directory. 4. Remove correctly the media from the computer.
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CAUTION

To avoid unwanted device behaviour during the update, it is recommended that the USB device be empty. It can not contain files with other programming versions. Only the version you want to currently upload to the device.
9.4.2 DEVICE BOOT-LOADER MODE
In order to perform a software update, the device should be launched in the bootloader mode as described below.
1. Turn the TFM260 OFF using the switch on the rear panel. 2. Insert USB storage into the USB port on the front panel of the TFM260 . 3. Press the knob and simultaneously turn on the power of the device using the button on
the back panel. 4. Release the knob button. 5. The screen should display a graphic like the one in the picture.
9.4.3 FIRMWARE UPDATE PROCEDURE
1. Follow the information on the screen. 2. If the USB stick is detected correctly, the following message will appear on the display:
Press Knob button to find firmware files 3. Press the Knob button to go to the next stage. 4. The device searches for files with software. The file names found are displayed on the
screen. Then TFM260 display message Press Knob button to start firmware update 5. Press the Knob button to go to the next stage. 6. The device performs the software update procedure. It takes place in two stages: updating
the processor software responsible for the user interface and next updating the executive processor software. 7. after the update is completed, the following message is displayed: Press Knob button to run Main Application 8. Press the Knob button to run Main Application. 9. The device starts in normal mode and is ready for operation. 10. The update procedure has been completed

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10 STORAGE AND DISPOSAL
10.1 PACKING
Please retain the original packaging. The packaging is required for storing the device and for shipping it to an authorized service center.

10.2 STORAGE

The TFM260 should only be stored in a dry room. The following requirements must be met:

PARAMETER Ambient temperature Humidity

VALUE
-20…50°C
as low as possible; preferably in an air-tight plastic bag with a desiccant

Table 10.1: Storage parameters

10.3 DISPOSAL
The product must be disposed of in accordance with the relevant local regulations for the environmentally safe disposal of systems and electronic components.
10.3.1 Waste Electrical and Electronic Equipment (WEEE)
The use of the WEEE symbol indicates that this product may not be treated as household waste. By ensuring this product is disposed of correctly you will protect the environment. Recycling information of this product can be obtained at the place of sale, your household waste disposal service provider, or local authority.

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TFM260 Thin Film Monitor

Figure 10.1: Waste Electrical and Electronic Equipment (WEEE) Symbol
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11 WARRANTY CONDITIONS
BeamTec warrants to the purchaser or end user of the equipment it sells that such equipment will be free from defects in material and workmanship under normal use and service. This warranty is for a period of 27 months from the date of original shipment or two years (24 months) from the date the equipment is placed in use by the purchaser or end user thereof, whichever occurs first. This warranty is void if the equipment is not used, operated, and maintained in accordance with the manual accompanying the equipment. BeamTec shall not be responsible for any direct or indirect loss or damage resulting from accident, negligence of a user, alteration, abuse, or misuse of the equipment. Upon acceptance of this Limited Warranty, purchaser waives all warranties, guarantee, or remedies not specifically stated in this Limited Warranty. This warranty does not cover ordinary wear and tear or expendable components. BeamTec obligation under this Limited Warranty is, at EDFelectronics’s option, to repair or replace any defective equipment or parts of the equipment, without charge to the purchaser, which are returned, shipping prepaid, to the BeamTec facility. For return or repair of equipment, purchaser must contact BeamTec for a Return Materials Authorization (RMA) prior to shipment of the equipment to BeamTec . If BeamTec has designated an Authorized Warranty Service Representative in the purchaser’s country, contact may be made with the Authorized Warranty Service Representative and defective equipment may be delivered to such Authorized Warranty Service Representative to service warranty claims. This warranty is in lieu of all other warranties, expressed or implied, including the implied warranties of merchantability and fitness for any particular purpose. The purchaser acknowledges the purchaser is not relying in BeamTec skill or judgment to select or furnish equipment suitable for any particular purpose.
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