MOVON TDU-WBT-MSB Wi-Fi 6 and Bluetooth 5.x System Module User Guide
- June 17, 2024
- MOVON
Table of Contents
MOVON TDU-WBT-MSB Wi-Fi 6 and Bluetooth 5.x System Module
Product Specification
| Item | Wi-Fi6 and Bluetooth 5.x SOM |
|---|---|
| Customer | BIXOLON |
| Model | WBT-MSB |
| Version | 2.0 |
| Date | 2023. 12. 08 |
Revision History
| Revision | Date | Changes | Written by |
|---|---|---|---|
| Rev1.0 | 12/26/2022 | First Release (EVT) | Yanim SON |
| Rev2.0 | 12/08/2023 | 2nd Release (DVT) | Yanim SON |
Reference document
NXP 88W9098 (Concurrent Dual Wi-Fi (CDW) and Bluetooth 5.3 Combo SoC) – Data
sheet
NXP 88W9098_UM11471_Design Guide for 88Q9098 and 88W9098
SD-WLAN-UART-BT-9098-LNX_5_15_71-IMX8-17.92.1.p136.13-17.92.1.p136.13-MM
88W9098_A1_RF_Performance_Report_WLAN
88W9098_A1_RF_Performance_Report_BT_BLE
Product description
The module is that the System on Module (SOM) designed according as the BIXOLON board to board specification for use with Wi-Fi6/Bluetooth 5.3 networks that provides IEEE 802.11a/b/g/n/ac/ax and
Bluetooth SIG 5.x mobile connectivity. This module is applicable to dedicated to BIXOLON POS, KIOSK and other potable device.
The purpose of this document is to describe the Wi-Fi/Bluetooth features and specifications of the SOM and to provide BIXOLON with the information required to integrate them into products.
So, in this document, only the specifications related to Wi-Fi and Bluetooth are specified, and specification related the host part (SAM9x60D1G, NAND Flash and MFI) is excluded.
But a block diagram, pin maps and power distribution network of whole SOM including SAM9x60D5MI/4FB are provided for system integration.
Application and hardware interface requirements are discussed at a high level only; for more detail, see the following chapter
Overview
- Board to board Wi-Fi6 and Bluetooth 5.x combo system on module (SOM type)
- Compact size as 40.5mm x 29.8mm x 5.9mm
- Compliance IEEE 8021.11a/b/g/n/ac/ax standard the module uses DSSS, OFDM, DBPSK, DQPSK and QAM baseband modulation technologies
- Compliance Bluetooth 5.3 SIG standard
Key Feature
– Wi-Fi
- Supports Wi-Fi6 dual MACs, independent MACs support true
- Not support dual band CDW (Only support 1×1 Wi-Fi RF front-end and RF PHY)
- Supports a 1X1 MISO configuration in both the Wi-Fi 2.4GHZ and 5GHz bands
- Two independent basebands, each band supporting independent Wi-Fi operation at 2.4GHz and 5GHz
- 5GHz PHY data rates up to 350Mbps@HE80, 2.4GHz PHY data rates up to 180 Mbps@HE20 Based on TCP/SDIO 3.0
- Uplink and downlink OFDMA and MU-MISO
- Supports WPA 3
- Supports OFDM A up to 1024 QAM and Target Wake Time (TWT)
- Instantaneous 0-DFS
– Bluetooth
- Bluetooth 5.3 SIG standard/specifications compliant
- Supports up to EDR 3Mbps
- Supports Low Energy 2Mbps and Long Range
- Up to 16 Bluetooth LE links in the connection mode
– Antenna and Co-existence
- Integrated two antennas as Wi-Fi and Bluetooth
- Implements advanced Wi-Fi and Bluetooth coexistence hardware in conjunction with algorithms to optimize collaborative performance
- Wi-Fi/Bluetooth coexistence protocol support
– Host interface
- Supports SDIO 3.0 for Wi-Fi host interface and high-speed UART for Bluetooth host interface
Standard Compliance
- IEEE 802.11 a/b/g/n/ac/ax
- Bluetooth V5.3 SIG conformance
Application
- Dedicated BIXOLON portable devices (POS, fixed printer and portable printer)
Product Specifications
SW Block Diagram
(Software structure is depended on Operating Systems)
Specification Overview
| Item | Description |
|---|
Hardware
Wi-Fi6 and Bluetooth 5.3 SoC
Wi-Fi6 and Bluetooth SoC| NXP 88W9098-A2-NYGC/MP| Independent ARM-based Wi-Fi
and Bluetooth CPUs Integrated Buck regulator for core power supply
Separate power block for independent of Wi-Fi/Bluetooth OFDMA 1024QAM and
Fully MU-MIMO
Target Wake Time (TWT) WPA3
Bluetooth 5.3
BDR and EDR: 1Mbps, 2Mbps and 3Mbps Bluetooth Low Energy (LE): 1Mbps and 2Mbps
Bluetooth Low Energy Long Range
Bluetooth Two wide-bands speech links Up to 16 Bluetooth links
Wi-Fi/Bluetooth coexistence protocol
148-pins 11.0mm x 11.0mm x 0.85mm HVQFN
Interface| Wi-Fi| SDIO3.0
Bluetooth| High speed UART
GPIOs| BT/Wi-Fi RST for each network independent reset BT/Wi-Fi HOST WKU for
control Host wakes up or sleep
PDN for control module power turns on or off
Host AP SoC/Memory/Power
Host AP SoC| Microchip SAM9x60D5M-I/4FB| ARM926EJ-S Arm Thumb processor
running up to 600 MHz Integrates with up to 64Mb SDR-SDRAM in package
High Bandwidth Multi-port DDR2/LPDDR Controller 8bit EBI supporting 8bit NAND
Flash connected on D16-D23 One USB Device High Speed, three USB Host High
Speed with dedicated On-Chip Transceivers
One dual-port 16-channel DMA Controller Two 10/100 Mbps Ethernet Mac
Controller Thirteen FLEXCOMs (USART, SPI and TWI)
Up to 112 programmable I/O Lines multiplexed with up to three peripheral I/Os
TFBGA 233-ball 14mmx14mmx1.2mm
Power supply| DC 3.3V, DC 1.8V| Please refer to page.17 in this document for
details
Memory| NAND Flash| Voltage Supply: 3.3V (2.7V~3.6V)
| F59L1GB1A-25BIG| Memory Cell Array: (128M + 4M) x 8bit Data Register: (2K +
64) x 8bit Program/Erase Lockout During Power Transitions ECC Requirement: – 1
bit/528 Byte Boot from NAND support Automatic Memory Download BGA 63-ball
9mmx11mmxx1.0mm
---|---|---
MFI| MFI343S00177| Apple MFI CP3.0 signal communication codec chip
Radio Interface
RF PHY / Front-end| Wi-Fi and Bluetooth| Supports concurrent use 1X1 Wi-Fi and
Bluetooth as 2 antennas.
Diplexers, bandpass filters, PAMs, LNAs and SPDT switches are assembled for
simultaneous use of Wi-Fi and Bluetooth.
Baseband/MACs| Wi-Fi| Two independent direct conversion Wi-Fi radios to
support true independent operation in the 2.4 GHz and 5 GHz Bands.
Supports Wi-Fi6 1×1 MU-MISO DL and UL as just 1 spatial stream.
Up to 1×1 802.11ax 80MHz 1024QAM.
Bluetooth| Supports Bluetooth 5.3
Supports up to Bluetooth power class 1.5
Packet types: 1Mbps (GFSK), 2Mbps(pi/4-DQPSK), 3Mbps (8DPSK).
Fully functional AFH using Packet Error Rate.
System interface
Board to board connector| NL BS05-30C-2.2H| 30pin, 2.2T B2B socket
System environment
Operating condition| Operating temperature| -40°C ~ +85°C
Storage temperature| -40°C ~ +85°C
Humidity| 10~90% Relative/Non-condensing
Certification| Alliance|
Appearance
Dimension| Length| 40.5mm±0.1mm
Width| 29.8mm±0.1mm
Height| 5.9mm±0.3mm
Package| Board to Board connection
Software
System SW
OS| Linux, Android
---|---
Protocol| Wi-Fi| 802.11 a/b/g/n/ac/ax
Bluetooth| Bluetooth 5.3 Classic/BLE
Networking| Wi-Fi| 2.4Ghz / 5Ghz
Bluetooth| BR and EDR 1Mbps, 2Mbps and 3Mbps LE 1Mbps/2Mbps, Long Range
Power class 1.5
Encryption| Wi-Fi| AES, TKIP
Bluetooth| AES
Security| Wi-Fi| WEP, WPA2, WPA3
Bluetooth| Security Mode 4
Management| Wi-Fi| Station mode / Access Point mode / P2P (Wi-Fi direct) mode
Bluetooth| TBD
Supported OS and Browser| Linux, Android
Indication| Not support
OTA| None
– Wi-Fi RF performance
Wi-Fi 2.4GHz
Item| Functional Item| Detailed Specification| Remark
Standard| IEEE802.11| b/g/n/ax|
Band Class| Frequency range| 2.401~2.483GHz|
Channels| 1~13ch|
Channel BW| 802.11b/g| 20MHz|
802.11n/ax| 20MHz/40MHz|
RF| 802.11b| Modulation| DSSS/CCK|
Rate| 11/5.5/2/1Mbps| Auto fallback
Max. Sensitivity| -84dBm| Conducted, 11M
Output power| 16dBm| Conducted, 11M
@EVM<35%
802.11g| Modulation| OFDM|
Rate| 54/48/36/24/18/12/9/6Mbps| Auto fallback
Max. Sensitivity| -71dBm| Conducted, 54M
Output power| 14dBm| Conducted, 54M @EVM<-27dB
802.11n| Modulation| OFDM|
Rate| MCS0 ~ MCS7|
Max. Sensitivity| -68dBm| Conducted, HT20 MCS7
Output power| HT20: 12dBm
HT40: 12dBm| Conducted, HT20 MCS7 @EVM-28dB
Max. throughput| 30Mbps| HT20 MCS7/DL/AP mode
802.11ax| Modulation| OFDM|
Rate| MCS0 ~ MCS9|
Max. Sensitivity| -55dBm| Conducted, HE20 MCS11
Output power| HE20: 12dBm
HE40: 10dBm
| Conducted, HE40 MCS11 @EVM<-32dB
Max. throughput| 55Mbps| VHT40 MCS9/DL/AP mode
Wi-Fi 5GHz
Item| Functional Item| Detailed Specification| Remark
Standard| IEEE 802.11| a/n/ac/ax|
Band Class| Frequency range| 5.150~5.825GHz| Support all DFS bands
Channels| 36~165ch|
Channel BW| 802.11a| 20MHz|
802.11n| 20MHz/40MHz|
| 802.11ac/ax| 20MHz/40MHz/80MHz|
---|---|---|---
RF| 802.11a| Modulation| OFDM|
Rate| 54/48/36/24/18/12/9/6Mbps| Auto fallback
Max. Sensitivity| -68dBm| Conducted, 54M
Output power| 14 dBm| Conducted, 54M
@EVM<-27dB
802.11n| Modulation| OFDM|
Rate| MCS0 ~ MCS7|
Max. Sensitivity| -65dBm| Conducted, HT20 MCS7
Output power| HT20: 12dBm
HT40: 12dBm| Conducted, HT20 MCS7 @EVM<-28dB
Max throughput| 58Mbps| HT40 MCS7/DL/AP mode
802.11ac| Modulation| OFDM|
Rate| MCS0 ~ MCS9|
Max. Sensitivity| -63dBm| Conducted, VHT20 MCS8
Output power| VHT20:12dBm VHT40: 10dBm
VHT80: 5dBm| Conducted, VHT20 MCS8 @EVM<-32dB
Max throughput| 65Mbps| VHT80 MCS9/DL/AP mode
802.11ax| Modulation| OFDM|
Rate| MCS0 ~ MCS11|
Max. Sensitivity| -52dBm| Conducted, HE20 MCS11
Output power| HE20: 12 dBm HE40: 10dBm
HE80: 5dBm| Conducted, HE20 MCS11 @EVM<-35dB
Max throughput| 68Mbps| HE80 MCS11/DL/AP mode
– Bluetooth RF performance
| Item | Functional Item | Detailed Specification | Remark |
|---|---|---|---|
| Standard | IEEE802.15.1 | Up to Bluetooth 5.3 | |
| Band Class | Frequency range | 2.401~2.480GHz | |
| Channels | 0~78ch | ||
| Channel BW | LE, LE2M, BDR, EDR2 and EDR3 | ||
| RF | Power class | 4dBm ~ 10dBm | |
| Typical. 8.0dBm | Conducted, Class 1.5 | ||
| Transmission Rate / Modulation | Header/GFSK 2Mbps/ㅠ/4-DQPSK | ||
| 3Mbps/8DPSK | |||
| --- | --- | --- | --- |
| Max Rx. Sensitivity | 0.001% @ -70dBm | Conducted | |
| RF Spread | Frequency Hopping Spread Spectrum (FHSS) | 1600hops/sec, 1MHz |
channel space
Profile| TBD|
Max throughput| Classic| Max 3Mb/s| @ EDR3
LE| Max 2Mb/s|
Pin Assignment
Pin allocations
Pin description
Pin #| Port name| Voltage level and I/O| When is
signal needed| Description
---|---|---|---|---
1| DGND| Digital Ground| Always|
2| VCC_3.3V| | Always| Power supply for Host chip
3| TXD| VCC_1.8V| Host UART| For Host chip UART Transmission interface
4| VCC_3.3V| | Always| Power supply for Host chip
5| RXD| VCC_1.8V| Host UART| For Host chip UART Receive interface
6| VCC_3.3V| | Always| Power supply for Host chip
7| CTS| VCC_1.8V| Host UART| For Host chip UART CTS interface
8| DGND| Digital Ground| Always|
9| DGND| Digital Ground| Always|
10| WIFI_GREEN| VCC_1.8V| Indicator| WiFi indicator
11| EMR_DM| VCC_3.3V| Host USB| For FW download/host USB data negative
12| WIFI_RED| VCC_1.8V| Debug UART| WiFi indicator
13| EMR_DP| VCC_3.3V| Host USB| For FW download/host USB data negative
14| NRESET| VCC_1.8V| reset| For SW reset
15| DGND| Digital Ground| Always|
16| EMR_DET| VCC_1.8V| Debug USB| For debugging USB detect
17| USBB_DP| VCC_3.3V| Debug USB| For debugging/RF calibration USB bridge data
positive interface
18| EMR_SW| VCC_3.3V| Read/write to NAND| To enable/disable the NAND Flash
19| USBB_DM| VCC_3.3V| Debug USB| For debugging/RF calibration USB bridge data
negative interface
20| DGND| Digital Ground| Always|
21| DGND| Digital Ground| Always|
22| DGND| Digital Ground| Always|
23| 1.8V_DUT| | Wi-Fi/BT| 88W9098 Wi-Fi/BT power supply
24| 3.3V_DUT| | Wi-Fi/BT| 88W9098 Wi-Fi/BT power supply
25| 1.8V_DUT| | Wi-Fi/BT| 88W9098 Wi-Fi/BT power supply
26| 3.3V_DUT| | Wi-Fi/BT| 88W9098 Wi-Fi/BT power supply
27| 1.8V_DUT| | Wi-Fi/BT| 88W9098 Wi-Fi/BT power supply
28| 3.3V_DUT| | Wi-Fi/BT| 88W9098 Wi-Fi/BT power supply
29| 1.8V_DUT| | Wi-Fi/BT| 88W9098 Wi-Fi/BT power supply
30| 3.3V_DUT| | Wi-Fi/BT| 88W9098 Wi-Fi/BT power supply
Electrical Specification
Power sequence
– Power up sequence
The external 1.8V_DUT and 3.3V_DUT shall not rise (10 – 90%) faster than 40 microseconds for minimize in-rush current and not slower than 100 milliseconds. PDN must be held low for at least 100 milliseconds after external 1.8V_DUT and 3.3V_DUT has reached specification level before pulled high.
| Parameter | Min | Typ | Max | Unit |
|---|---|---|---|---|
| Delay from 1.8V_DUT high (at least 90%) to start of 3.3V_DUT ramp-up | 0 | – | – | |
| ms | ||||
| Delay from 3.3V_DUT high (at least 90%) to start of AVDD18 ramp-up | 0 | 100 | – | |
| ms | ||||
| Delay from 1.8V_DUT high (at least 90%) to start of PDN ramp-up | 0 | – | – | ms |
| Delay from AVDD 18 high (at least 90%) to start of Boot ROM | – | 10 | – | ms |
– Power down sequence
| Parameter | Min | Typ | Max | Unit |
|---|---|---|---|---|
| Recommended delay from PDN low (less than 0.2V) to start of AVDD18 ramp-down | ||||
| 0 | – | – | ms |
Recommended delay from start of AVDD18 ramp-down to start of 3.3V_DUT ramp- down| 0| –| –| ms|
– Reset
| Parameter | Min | Typ | Max | Unit |
|---|---|---|---|---|
| T1 | Delay from PDN low (at least 0.2V) to time of VDD_CORE_DUT ramp- down | 1 | ||
| – | – | us | ||
| T2 | Delay from PDN low (at least 0.2V) to time of VDD_CORE_DUT high (at least | |||
| 90%) | 0 | – | – | us |
DC characteristics
– Power Tree
The module utilizes VDD_3.3V, 3.3V_DUT and 1.8V_DUT power sources.
Do not exceed minimum or maximum voltage. Module will be permanently damaged
above this limit.
– Electrical characteristics
| Parameter | Minimum | Typical | Maximum | Unit |
|---|
External Power supply
DC 3.3V_9098| Voltage range| 3.135| 3.30| 3.465| V
Current consumption| –| –| 1.2| A
DC 1.8V| Voltage range| 1.71| 1.80| 1.89| V
Current consumption| –| –| 1.9| A
DC 3.3V_Host| Voltage range| 3.0| 3.30| 3.6| V
*** Current consumption| –| –| 2.0| A
_Internal PMU output power88W9098
3.3V_DUT| AVDD33 VPA| 3.135| 3.30| 3.465|
1.8V_DUT| VIO VIO_SD VIO_RF AVDD18 DCDC BUCK IN| 1.71| 1.80| 1.89| V
System Core| Core power (Internal Buck out)| 1.03| 1.05| 1.155| V
Internal PMU output _powerSAM9x60D1G/MFI343S00
/F59L1G81A-25BIG**
VCC_3.3V| VDDNF VDDSPI VDDANA VDDIOP1 VDDIN33 VDDBU VDDNAND VDDMFI| 3.0| 3.30|
3.6| V
VCC_1.8V| IDIOM DDR VDD VDDIO_P0| 1.70| 1.80| 1.90| V
VCC_1.15V| VDC CORE| 1.12| 1.15| 1.21| V
- The power supply must be designed for this maximum current
Power dashboard according to Wi-Fi/Bluetooth use cases
Mode| Conditions| 3.3V_DUT (Avg)| 1.8V_DUT (Avg)|
Unit
---|---|---|---|---
Power down
Power down| –| 0.03| 0.26| mA
Deep sleep
Bluetooth only| | 0.6| 2.1| mA
Wi-Fi only| | 0.6| 2.0| mA
Wi-Fi + Bluetooth| | 0.4| 2.0| mA
Wi-Fi Uplink (1X1 Tx)
2.4GHz 802.11b, 20MHz| Tx power=16dBm, 11Mbps| 133.5| 193.3| mA
2.4GHz 802.11g, 20MHz| Tx power=14dBm, 54Mbps| 122.9| 218.3| mA
2.4GHz 802.11n, 20MHz| Tx power=12dBm, MCS7| 135.2| 239.3| mA
2.4GHz 802.11ax, 20MHz| Tx power=5dBm, MCS9| 136.4| 247.9| mA
5GHz 802.11a, 20MHz| Tx power=14dBm, 54Mbps| 149.4| 293.5| mA
5GHz 802.11n, 20MHz| Tx power=12dBm, MCS7| 187.1| 316.5| mA
5GHz 802.11n, 40MHz| Tx power=10dBm, MCS7| 138.5| 300.2| mA
5GHz 802.11ac, 20MHz| Tx power=10dBm, MCS9| 190.4| 306.3| mA
5GHz 802.11ac, 40MHz| Tx power=10dBm, MCS9| 114.8| 289.6| mA
5GHz 802.11ax, 80MHz| Tx power=5dBm, MCS11| 65.1| 288.8| mA
Wi-Fi Downlink (1X1 Rx)
2.4GHz 802.11b, 20MHz| 11Mbps| 14.67| 170.7| mA
2.4GHz 802.11ax, 20MHz| MCS9| 7.08| 261.2| mA
5GHz 802.11a, 20MHz| 54Mbps| 17.17| 270.4| mA
5GHz 802.11ax,| MCS11| 24.91| 335.8| mA
80MHz| | | |
---|---|---|---|---
Bluetooth LE
LE advertise| Interval=1.28s| 1.72| 0.3| mA
LE scan| Interval=1.28s
Window=11.25ms| 1.93| 0.3| mA
LE link| Interval=1.28s| 1.98| 0.3| mA
LE Peak transmit| @ 4dBm, 1Mbps| 71| 0.56| mA
LE Peak receive| 1Mbps| 41| 0.56| mA
Bluetooth BR/EDR
Idle| | 20.11| 0.56| mA
Page scan| | 2.01| 0.3| mA
ACL link| Master sniff mode Interval=500ms| 2.74| 0.3| mA
SCO HV3 peak Tx| @ 4dBm| 71| 0.56| mA
SCO HV3 peak Rx| | 38| 0.56| mA
Peak Tx| @ 4dBm| 73| 0.56| mA
Peak Rx| | 36| 0.56| mA
Mechanical Specifications
Product Drawing
Recommended B2B plug selection guide
Please refer to dimension in red box of figure below that is recommended plug dimension.
< B2B socket of module>
< Recommended B2B Plug>
Regulatory and compliance
FCC Compliance Statement
This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
FCC Interference Statement
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to correct the interference by one of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
FCC Caution
Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
FCC Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an
uncontrolled environment.
This equipment should be installed and operated with minimum distance 20 cm
between the radiator and your body. This transmitter must not be co-located or
operating in conjunction with any other antenna or transmitter.
Industry Canada Statement
This device complies with RSS-247 of the Industry Canada Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Industry Canada Radiation Exposure Statement
This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator & your body
Information on test modes and additional testing requirements
a) The modular transmitter has been fully tested by the module grantee on
the required number of channels, modulation types and modes, it should not be
necessary for the host installer to retest all the available transmitter modes
or settings. It is recommended that the host product manufacturer installing
the modular transmitter, perform some investigative measurements to confirm
that the resulting composite system does not exceed the spurious emissions
limits or band edge limits(e.g., where a different antenna may be causing
additional emissions).
b) The testing should check for emissions that may occur due to the
intermixing of emissions with the other transmitter, digital circuitry, or due
to physical properties of the host product(enclosure).
This investigation is especially important when integrating multiple modular
transmitters where the certification is based on testing each of them in a
standalone configuration. It is important to note that host product
manufactures should not assume that because the modular transmitter is
certified that they do not have any responsibility for final product
compliance.
Additional testing, Part 15 subpart B disclaimer
The final host/module combination need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device.
The host integrator installing this module into their product must ensure that the final composite product complies with the FCC requirements by a technical assessment or evaluation to the FCC rules, including the transmitter operation and should refer to guidance in KDB 996369.
This appliance and its antenna must not be co-located or operation in conjunction with any other antenna or transmitter.
-
OEM integrators must ensure that its product is electrically identical to the device, FCC ID:
TDU-WBT-MSB reference designs . Any modifications to module reference designs may invalidate regulatory approvals in relation to the product, or may necessitate notifications to the relevant regulatory authorities. -
OEM integrators are responsible for regression testing to accommodate changes to designs, new antennas, and host and submit for C2PC filings.
-
Colocation with other transmitter modules will be addressed through filings for those co-located transmitters when necessary or that colocation of other transmitters will be according to applicable KDB guidelines including those for RF exposure
-
Appropriate labels must be affixed to the product that complies with applicable regulations in all respects. The regulatory label on the final system must include the statement:
“Contains FCC ID: TDU-WBT-MSB”.
“Contains IC Number: 6432A-WBTMSB”.
- The module is limited to OEM installation ONLY.
- OEM integrators are responsible for ensuring that the end-user has no manual instructions to remove or install module.
- The module is limited to installation in mobile or fixed applications, according to Part 2.1091(b).
- Separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different antenna configurations.
End Product Labeling
The module is labeled with its own FCC ID & IC Number. If the FCC ID & IC number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following:
“Contains FCC ID: TDU-WBT-MSB”
“Contains IC Number: 6432A-WBTMSB”.
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