Telink Semiconductor BLE002 SoC EMI Test User Manual

Telink SoC
EMI Test User Guide
AN-20071700-E3
Ver.0.3.0
2020/10/23

BLE002 SoC EMI Test

Keyword
EMI, Test, Function
Brief
This document briefs Telink SoC EMI test steps and related protocols
Published by
Telink Semiconductor
Bldg 3, 1500 Zuchongzhi Rd,
Zhangjiang Hi-Tech Park, Shanghai, China
© Telink Semiconductor
All Right Reserved
Legal Disclaimer
This document is provided as-is. Telink Semiconductor reserves the right to make improvements without further notice to this document or any products herein. This document may contain technical inaccuracies or typographical errors. Telink Semiconductor disclaims any and all liability for any errors, inaccuracies or incompleteness contained herein.
Copyright © 2020 Telink Semiconductor (Shanghai) Ltd, Co.

Information
For further information on the technology, product and business term, please contact Telink Semiconductor Company (www.telink-semi.com).
For sales or technical support, please send email to the address of:
telinkcnsales@telink-semi.com
telinkcnsupport@telink-semi.com

Revision History

3-7
2.7.1
**** 3
V0.3.0| Add TLSRB91 related information

Overview

The steps of EMI test on the DUT board based on Telink chip are: first burn the corresponding EMI bin file onto the DUT board; at the same time ensure that the corresponding calibration parameters have been written to the corresponding flash position (such as cap, Tp0, Tp1); then modify the corresponding test parameters to achieve different test functions. There are two ways to modify the test parameters:

1. Modify the value in the corresponding address of Flash. After modifying the test parameters with this method, you must power on the board again to make the settings valid. Telink provides BDT and Wtcdb for modifying Flash data. This function is only supported by the program of some chip models, please refer to Chapter 2 for function supported.
2. Modify the value in the corresponding address of SRAM. After modifying the test parameters with this method, the settings is valid right after reset (cannot be reset by re-booting, and need to be set again after re-booting). Tools for modifying SRAM provided by Telink are BDT, Wtcdb, and EMI special test tool EMI_Test.
   This function supports all chips.

EMI_BIN Support Functions

2.1 TLSR8261
2.1.1 Bin File Description
The 4 bin files used for 8261 EMI testing are:
“8261_emi_test_12M_external_cap.bin”, Support 12MHz crystal, use external capacitor;
“8261_emi_test_12M_internal_cap.bin”, Support 12MHz crystal, use internal capacitor;
“8261_emi_test_16M_external_cap.bin”, Support 16MHz crystal, use external capacitor;
“8261_emi_test_16M_internal_cap.bin”, Support 16MHz crystal, use internal capacitor;
In addition, users can configure the internal capacitance (cap) size and calibration parameter (Tp) setting by writing the value at the corresponding address of the Flash. For the specific addresses of each parameter in the Flash, refer to the following table.
Table 2-1 8261 Parameter Configuration Flash Address Table

2.1.2 Test Tool Support Functions
The EMI tool “EMI_Tool” and the non-signaling test tool “Non_Signaling_Test_Tool” support the functions of the above bin files as shown in the following table.
Table 2-2 8261 Test Bin File Supporting Function Table

EMI_Tool
RF| Carrier| Carrier, CarrierData (Support Hop)
RX| Rx Test
Type 1| Type 2| Supporting Function
---|---|---
| PA| Support Self-defined PA
PM| PM| Deep, Suspend
Non_Signaling_Test_Tool
**** RF| TX| PRBS9,0x55,0xf
(Support circular sending and single sending 1000 packets)
RX| Rx Test, Read_Rx_Cnt, ReadRssi
PA| **** Support Self-defined PA
PM| PM| Deep, Suspend

2.2 TLSR8266
2.2.1 bin File Description
The 4 bin files used for 8266 EMI testing are:
“8266_12M_emi_test_external_cap.bin”, support 12MHz crystal, use external capacitor;
“8266_12M_emi_test_internal_cap.bin”, support 12MHz crystal, use internal capacitor;
“8266_16M_emi_test_external_cap.bin”, support 16MHz crystal, use external capacitor;
“8266_16M_emi_test_internal_cap.bin”, support 16MHz crystal, use internal capacitor;
In addition, users can configure the internal capacitance (cap) size and calibration parameter (Tp) setting by
writing the value at the corresponding address of the Flash. For the specific addresses of each parameter in
the Flash, refer to the following table.
Table 2-3 8266 Parameter Configuration Flash Address Table

2.2.2 Test Tool Support Functions
“EMI_Tool” and the non-signaling test tool “Non_Signaling_Test_Tool” support the functions of the above bin files as shown in the following table.
Table 2-4 8266 Test Bin File Supporting Function Table

EMI_Tool

**** RF

| Carrier| Carrier, CarrierData (Support Hop)
RX| Rx Test
PA| Support Self-defined PA
PM| PM| Not Support
Non_Signaling_Test_Tool
RF| TX| PRBS9,0x55,0xf
(Support circular sending and single sending 1000 packets)
RX| Rx Test, Read_Rx_Cnt, ReadRssi
PA| **** Support Self-defined PA
PM| PM| Not Support

2.3 TLSR8267/8269/8646
2.3.1 bin File Description
The 4 bin files used for 8267/8269/8646 EMI testing are:
“8267_8269_8646_emi_test_12M_external_cap.bin”, support 12MHz crystal, use external capacitor;
“8267_8269_8646_emi_test_12M_internal_cap.bin”, support 12MHz crystal, use internal capacitor;
“8267_8269_8646_emi_test_16M_external_cap.bin”, support 16MHz crystal, use external capacitor;
“8267_8269_8646_emi_test_16M_internal_cap.bin”, support 16MHz crystal, use internal capacitor;
In addition, users can configure the internal capacitance (cap) size and calibration parameter (Tp) setting by writing the value at the corresponding address of the Flash. For the specific addresses of each parameter in the Flash, refer to the following table.
Table 2-5 8267/8269/8646 Parameter Configuration Flash Address Table

2.3.2 Test Tool Support Functions
Please refer to Table 2-2 in Chapter 2.1.2 for supporting functions of the above bin files of the EMI tool “EMI_Tool “ and the non-signaling test tool “Non_Signaling_Test_Tool “.
2.4 TLSR8258/8253/8251/8656/8359
2.4.1 bin File Description
The bin file used for 8258/8253/8251/8656/8359 EMI testing is “8258_Test_EMI_V0005.bin”.
In addition, users can configure the size of the internal capacitor (cap) by writing the value in the corresponding address of Flash. The specific address is shown in the following table.
Table 2-6 8258/8253/8251/8656/8359 Parameter Configuration Flash Address Table

2.4.2 Test Tool Support Functions
The EMI tool “EMI_Tool” and the non-signaling test tool “Non_Signaling_Test_Tool” support the functions of the above bin files as shown in the following table.
Table 2-7 8258/8253/8251/8656/8359 Test Bin File Supporting Function Table

EMI_Tool
**** RF| Carrier| Carrier, CarrierData (Support Hop)
---|---|---
RX| Rx Test
PA| **** Support Self-defined PA
PM| PM| Deep, Suspend, Deep with retention
Non_Signaling_Test_Tool
RF| TX| PRBS9,0x55,0xf(
Support circular sending and single sending 1000 packets)
RX| Rx Test,Read_Rx_Cnt, ReadRssi
PA| Support Self-defined PA
PM| PM| Deep, Suspend, Deep with retention

2.5 TLSR8367/8369
2.5.1 bin File Description
The bin file used for 8367/8369 EMI testing is “8367_EMI_Test_SRAM_OTP_V0001”.
In addition, users can configure the internal capacitance (cap) size and calibration parameter (Tp) setting by writing the value at the corresponding address of the Flash. For the specific addresses of each parameter in the Flash, refer to the following table.
Table 2-8 8367/8369 Parameter Configuration Flash Address Table

2.5.2 Test Tool Support Functions
The EMI tool “EMI_Tool “ and the non-signaling test tool “Non_Signaling_Test_Tool “ support the functions ofthe above bin files as shown in the following table.
Table 2-9 8367/8369 Test Bin File Supporting Function Table

EMI_Tool

**** RF

| Carrier| Carrier, CarrierData
(Not Support Hop)
RX| Rx Test
PA| Support Self-defined PA
PM| PM| Not Support
Non_Signaling_Test_Tool
RF| TX| PRBS9,0x55,0xf
(Support circular sending and single sending 1000 packets)
RX| Rx Test, Read_Rx_Cnt, ReadRssi
PA| Support Self-defined PA
PM| PM| Not Support

2.6 TLSR8232
2.6.1 bin File Description
The bin file used for the 8232 EMI test is “8232_EMI_Test_V0004.bin “. The user can choose whether to use the internal capacitor by modifying the value on the corresponding address (0x00000004) of the bin file; support 128K Flash or 512K Flash, etc., please refer to Table 2- 10.
Table 2-10 bin file configuration value setting reference table

In addition, users can configure the internal capacitance (cap) size and calibration parameter (Tp) setting by writing the value at the corresponding address of the Flash. For the specific addresses of each parameter in the Flash, refer to the following table.
Table 2-11 8232 Parameter Configuration Flash Address Table

2.6.2 Test Tool Support Functions
The EMI tool “EMI_Tool “ and the non-signaling test tool “Non_Signaling_Test_Tool “ support the functions of the above bin files as shown in the following table.
Table 2-12 8232 Test Bin File Supporting Function Table

EMI_Tool
RF| Carrier| Carrier, CarrierData (Not Support Hop)
RX| Rx Test
| PA| Support Self-defined PA
---|---|---
PM| PM| Not Support
Non_Signaling_Test_Tool
RF| TX| PRBS9,0x55,0xf
(Support circular sending and single sending 1000 packets)
RX| Rx Test,Read_Rx_Cnt, ReadRssi
PA| Support Self-defined PA
PM| PM| Not Support

2.7 TLSR8278
2.7.1 bin File Description
There are 3 bin files used for 8278Emi test, which are:
“8278_EMI_DCDC _SRAM64K_V0002.bin”, adopts DCDC power supply mode and supports 64KSRAM;
“8278_EMI_LDO _SRAM32K_FLASH512K_V0002.bin”, using LDO power supply mode, supporting 32K SRAM and 512K Flash;
“8278_EMI_LDO _SRAM64K_FLASH512K_V0002.bin”, using LDO power supply mode, supporting 64K SRAM and 512K Flash;
In addition, users can configure the size of the internal capacitor (cap) by writing the value in the corresponding address of Flash. The specific address is shown in the following table.

Table 2-13 8278 Parameter Configuration Flash Address Table

The EMI tool
“EMI_ Tool “and the non-signaling test tool “Non_SignalingTest Tool “support the functions of the above bin files as shown in the following table.

Table 2-14 8232 Test Bin File Supporting Function Table

2.7.2 Test Tool Support Functions
The EMI tool “EMI_ Tool “and the non-signaling test tool “Non_SignalingTest Tool “support the functions of the above bin files as shown in the following table.
Table 2-14 8232 Test Bin File Supporting Function Table

EMI_Tool
RF| Carrier| Carrier, CarrierData (Support Hop)
RX| Rx Test
PA| **** Support Self-defined PA
PM| PM| Deep, Suspend, Deep with retention
Non_Signaling_Test_Tool
RF| TX| PRBS9,0x55,0xf
(Support circular sending and single sending 1000 packets)
RX| Rx Test,Read_Rx_Cnt, ReadRssi
PA| Support Self-defined PA
PM| PM| Deep, Suspend, Deep with retention

2.8 TLSRB91
2.8.1 bin File Description
There are 4 bin files used for B91Emi test, supporting 256K SRAM and 1M Flash, which are:
“B91_EMI_DCDC _V0001_FLASH.bin”, using DCDC power supply mode, supporting downloading configuration to Flash;
“B91_EMI_LDO _V0001_FLASH.bin”, using LDO power supply mode, supporting downloading configuration to Flash;

“B91_EMI_DCDC _V0001_SRAM.bin”, using DCDC power supply mode, supporting downloading configuration to SRAM;
“B91_EMI_LDO _V0001_SRAM.bin”, using LDO power supply mode, supporting downloading configuration to SRAM;
In addition, users can configure the size of the internal capacitor (cap) by writing the value in the corresponding address of Flash. The specific address is shown in the following table.
Table 2-15 8278 Parameter Configuration Flash Address Table

2.8.2 Test Tool Support Functions
The EMI tool “EMI_ Tool “and the non-signaling test tool “Non_SignalingTest Tool “support the functions of the above bin files as shown in the following table.
Table 2-16 B91 Test Bin File Supporting Function Table

EMI_Tool

RF

| Carrier| Carrier, CarrierData (Support Hop)
RX| Rx Test
PA| Not support Self-defined PA
PM| PM| Not Support deep, Suspend, Deep with retention
Non_Signaling_Test_Tool
RF| **** TX| PRBS9,0x55,0xf
(Support circular sending and single sending 1000 packets)
RX| Rx Test,Read_Rx_Cnt, ReadRssi
PA| Not support Self-defined PA
PM| PM| Not support Deep, Suspend, Deep with retention

Protocols

Different test functions can be realized by modifying test parameters such as “run”, “mode”, “power”, “channel”, “cmd”, and “hop”. The definition of each parameter is: “run” parameter is used to control the start and stop of EMI test; “mode” parameter is used to select the RF working mode; “power” parameter is used to select the energy level of Tx; “channel” parameter is used to select the frequency point; “cmd” parameter is used to select EMI Test mode; “hop” parameter is used to control whether to use frequency hopping mode in “carrier_data” test mode (controlled by “cmd”). In addition to the above main parameters that control EMI testing, there are also parameters for users to obtain certain key values and calibration parameters. The above parameters related test protocols will be described in details in the following sections.
3.1 TLSR8261
The detailed description of each parameter of TLSR8261 is shown in Table 3-1. Table 3-1 TLSR8261Chip EMI test reference table

1: ble_1M
2: zigbee| 1| Flash: 0xf00a SRAM: 0x80800a
power| 0: 7dBm
1: 6dBm
2: 5dBm
3: -0.6dBm
4: -4.3dBm
5: -9.5dBm| 6: -11dBm
7: -11.5dBm
8: -12dBm
9: -13dBm
10: -14dBm
11:-15dBm| 12: -18.8dBm
13: -23.3dBm
14: -27.5dBm
15: -30dBm
16: -37dBm
17: Disable PA| 0| Flash: 0xf008 SRAM: 0x808008
channel| frequency = (2400 + channel)MHz(0 ≤ channel ≤ 100)| 2| Flash: 0xf009 SRAM: 0x808009
**** cmd| 1: emi_carrier_only
2: emi_carrier_data
3: emi_rx_test| 1| Flash: 0xf007 SRAM: 0x808007
Parameter| Value description| Default Value| Storage Address
---|---|---|---
| 4: emi_tx _prbs9
5: emi_tx_0x55
6: emi_tx_0x0f
7: pm_pad_deep
8: pm_32kTimer_deep
9: pm_pad_suspend
10: pm_32kTImer_suspend| |
hop| For cmd(2), the following two modes can be configured:
0: Turn off frequency hopping mode 1: Turn on frequency hopping mode| **** 0|

**** SRAM: 0x80800b

cap| 0xbf < cap < 0xe0| | Flash: 0x1e000
Tp0| BLE 1M: 0x13 < Tp0 < 0x27
BLE 2M: 0x36 < Tp0 < 0x4a| | Flash: 0x1e040
Tp1| BLE 1M: 0x0f < Tp0 < 0x23
BLE 2M: 0x2f < Tp0 < 0x43| | Flash: 0x1e041
rssi| Read only| | SRAM: 0x808004
tx_mode| For cmd (4/5/6), it can be configured as the following two modes:
1: sending 1000 packets 0: keep sending packets| **** 0| **** SRAM: 0x808005
rx_packet_num| Read only| | SRAM: 0x80800c

3.2 TLSR8266
The detailed description of each parameter of TLSR8266 is shown in Table 3-2.

Table 3-2 TLSR8266 Chip EMI test reference table

0x808006
**** mode| 0: ble_2M
1: ble_1M
2: zigbee| 1| Flash: 0x3f00a SRAM: 0x80800a
power| 0: 7dBm
1: 5dBm
2: – 0.6dBm
3: – 4.3dBm| 4: -9.5dBm
5: -13.6dBm
6: -18.8dBm
7: -23.3dBm| 8: -27.5dBm
9: -30dBm
10: -37dBm
11: Disable PA| 0| Flash: 0x3f008 SRAM: 0x808008
channel| frequency = (2400 + channel)MHz(0 ≤ channel ≤ 100)| 2| Flash: 0x3f009 SRAM: 0x808009
**** cmd| 1: emi_carrier_only
2: emi_carrier_data
3: emi_rx_test
4: emi_tx _prbs9
5: emi_tx_0x55
6: emi_tx_0x0f| **** 1| Flash: 0x3f007 SRAM: 0x808007
op| For cmd(2), the following two modes can be configured:
0: Turn off frequency hopping mode 1: Turn on frequency hopping mode| 0| SRAM: 0x80800b
cap| 0xbf < cap < 0xe0| | Flash: 0x77000
Tp0| BLE 1M: 0x15 < Tp0 < 0x29
BLE 2M: 0x39 < Tp0 < 0x4a| | Flash: 0x77040
Tp1| BLE 1M: 0x11 < Tp0 < 0x25| | Flash: 0x77041
Parameter| Value description| Default Value| Storage Address
---|---|---|---
| BLE 2M: 0x32 < Tp0 < 0x46| |
rssi| Read only| | SRAM: 0x808004
**** tx_mode| For cmd (4/5/6), it can be configured as the following two modes:
1: sending 1000 packets 0: keep sending packets| | SRAM:0x808005
rx_packet_num| Read only| | SRAM: 0x80800c

3.3 TLSR8267/8269/8646
The detailed description of each parameter of TLSR8267/8269/8646 is shown in Table 3-3.
Table 3-3TLSR8267/8269/8646 Chip EMI test reference table

1: ble_1M
2: zigbee| 1| Flash: 0x3f00a SRAM: 0x80800a
power| 0: 7dBm
1: 6dBm
2: 5dBm
3: -0.6dBm
4: -4.3dBm
5: -9.5dBm| 6: -11dBm
7: -11.5dBm
8: -12dBm
9: -13dBm
10: -14dBm
11:-15dBm| 12: -18.8dBm
13: -23.3dBm
14: -27.5dBm
15: -30dBm
16: -37dBm
17: Disable PA| 0| Flash: 0x3f008 SRAM: 0x808008
channel| frequency = (2400 + channel)MHz(0 ≤ channel ≤ 100)| 2| Flash: 0x3f009
| | | SRAM: 0x808009
---|---|---|---
cmd| 1: emi_carrier_only
2: emi_carrier_data
3: emi_rx_test
4: emi_tx _prbs9
5: emi_tx_0x55
6: emi_tx_0x0f
7: pm_pad_deep
8: pm_32kTimer_deep
9: pm_pad_suspend
10: pm_32kTImer_suspend|

**** 1

| Flash: 0x3f007 SRAM: 0x808007
hop| For cmd(2), the following two modes can be configured:
0: Turn off frequency hopping mode 1: Turn on frequency hopping mode| 0| **** SRAM: 0x80800b
cap| 0xbf < cap < 0xe0| | Flash: 0x77000
Tp0| BLE 1M: 0x13 < Tp0 < 0x27
BLE 2M: 0x36 < Tp0 < 0x4a| | Flash: 0x77040
Tp1| BLE 1M: 0x0f < Tp0 < 0x23
BLE 2M: 0x2f < Tp0 < 0x43| | Flash: 0x77041
rssi| Read only| | SRAM: 0x808004
tx_mode| For cmd (4/5/6), it can be configured as the following two modes:
1: sending 1000 packets 0: keep sending packets| | SRAM: 0x808005
rx_packet_num| Read only| | SRAM: 0x80800c

3.4 TLSR8258/8253/8251/8656/8359

The detailed description of each parameter of TLSR8258/8253/8251/8656/8359 is shown in Table 3-4.
Table 3-4TLSR8258/8253/8251/8656/8359Chip EMI test reference table

1: ble_1M
2: zigbee
3: ble_125k
4: ble_500k| 1| SRAM: 0x84000a
power| 0 : 10.5dBm
1 : 10.3dBm
2 : 10.0dBm
3 : 9.8dBm
4 : 9.5dBm
5 : 9.2dBm
6 : 9.0dBm
7 : 8.7dBm
8 : 8.4dBm
9 : 8.1dBm
10 : 7.8dBm
11 : 7.4dBm
12 : 7.0dBm
13 : 6.6dBm
14 : 6.1dBm
15 : 5.6dBm
16 : 5.1dBm| 17 : 4.6dBm
18 : 3.9dBm
19 : 3.2dBm
20 : 3.0dBm
21 : 2.1dBm
22 : 2.6dBm
23 : 2.4dBm
24 : 2.0dBm
25 : 1.7dBm
26 : 1.4dBm
27 : 1.1dBm
28 : 0.9dBm
29 : 0.5dBm
30 : 0.0dBm
31 : -0.1dBm
32 : -0.9dBm
33 : -1.4dBm| 34 : -1.8dBm
35 : -2.5dBm
36 : -3.0dBm
37 : -3.6dBm
38 : -4.2dBm
39 : -5.0dBm
40 : -5.8dBm
41 : -6.6dBm
42 : -7.6dBm
43 : -8.6dBm
44 : -9.8dBm
45 : -11.4dBm
46 : -13.2dBm
47 : -15.8dBm
48 : -19.2dBm
49 : -25.1dBm| ****

**** 0

| SRAM: 0x840008
Parameter| Value description| Default Value| Storage Address
---|---|---|---
channel| frequency = (2400 + channel)MHz(0 ≤ channel ≤ 100)| 2| SRAM: 0x840009
cmd| 1: emi_carrier_only
2: emi_con_prbs9
3: emi_rx_test
4: emi_tx_prbs9
5: emi_tx_0x55
6: emi_tx_0x0f
7: emi_deep_io_no_retention
8: emi_deep_timer_no_retention
9: emi_suspend_io_no_retention 10:emi_suspend_timer_no_retention 11: mi_deep_io_retention
12: emi_deep_timer_retention|

**** 1

| **** SRAM: 0x840007
**** hop| For cmd(2), the following two modes can be configured:
0: Turn off frequency hopping mode 1: Turn on frequency hopping mode| **** 0| SRAM: 0x84000b
cap| 0x40 < cap < 0x7f| | Flash: 0x77000
rssi| Read only| | SRAM: 0x840004
tx_mode| For cmd (4/5/6), it can be configured as the following two modes:
1: sending 1000 packets 0: keep sending packets| 0| SRAM: 0x840005
rx_packet_num| Read only| | SRAM: 0x84000c

3.5 TLSR8367/8369
The detailed description of each parameter of TLSR8367/8369 is shown in Table 3-5.

Table 3-5 TLSR8367/8369Chip EMI test reference table

1: 6dBm
2: 3dBm
3: 2dBm| 4: 0dBm
5: -1dBm
6: -2dBm
7: -10dBm| 8: –12dBm
9: -14dBm
10: -15dBm
11: -17dBm| 1| SRAM: 0x808008
channel| frequency = (2400 + channel)MHz(0 ≤ channel ≤ 100)| 2| SRAM: 0x808009
cmd| 1: emi_carrier_only
2: emi_con_prbs9
3: emi_rx_test
4: emi_tx_prbs9
5: emi_tx_0x55.
6: emi_tx_0x0f|

1

| SRAM: 0x808007
hop| For cmd(2), the following two modes can be configured:
0: Turn off frequency hopping mode 1: Turn on frequency hopping mode| **** 0| **** SRAM: 0x80800b
cap| 0xbf < cap < 0xe0| | Flash:0x77000
Tp0| 0 < Tp0 < 0xff| | Flash:0x77040
Tp1| 0 < Tp1 < 0xff| | Flash:0x77041
rssi| Read only| | SRAM: 0x808004
tx_mode| For cmd (4/5/6), it can be configured as the following two modes:
1: Sending 1000 packets| **** 0| **** SRAM: 0x808005
| 0: keep sending packets| |
---|---|---|---
rx_packet_num| Read only| | SRAM: 0x80800c

3.6 TLSR8232
The detailed description of each parameter of TLSR8232 is shown in Table 3-6.
Table 3-6 TLSR8232 Chip EMI test reference table

run

| 0: Stop EMI Test 1: Start EMI Test| ****

0

| ****

SRAM: 0x808006

mode| 0: ble_2M
1: ble_1M
2: zigbee| 1| SRAM: 0x80800a
power| 0: 7.9dBm
1: 7dBm
2: 6.3dBm
3: 4.9dBm
4: 3.3dBm
5: 1.6dBm| 6: 0dBm
7: -1.5dBm
8:-3.1dBm
9: -5dBm
10: -7.3dBm
11: -9.6dBm| 12: -11.5dBm
13: -13.3dBm
14: -16dBm
15: -17.8dBm
16: -19.5dBm
17: Disable PA| 0| SRAM: 0x808008
channel| frequency = (2400 + channel)MHz(0 ≤ channel ≤ 100)| 2| SRAM: 0x808009
cmd| 1: emi_carrier_only
2: emi_con_prbs9
3: emi_rx_test
4: emi_tx_prbs9
5: emi_tx_0x55
6: emi_tx_0x0f| 1| SRAM: 0x808007
hop| For cmd(2), the following two modes can be configured:| 0| SRAM: 0x80800b
| 0: Turn off frequency hopping mode 1: Turn on frequency hopping mode| |
---|---|---|---
cap| 0xbf < cap < 0xe0| | Flash:0x77000
Tp0| 0 < Tp0 < 0xff| | Flash:0x77040
Tp1| 0 < Tp1 < 0xff| | Flash:0x77041
rssi| Read only| | SRAM: 0x808004
tx_mode| For cmd (4/5/6), it can be configured as the following two modes:
1: sending 1000 packets 0: keep sending packets| 0| **** SRAM: 0x808005
rx_packet_num| Read only| | SRAM: 0x80800c

3.7 TLSR8278
The detailed description of each parameter of TLSR8278 is shown in Table 3-7.
Table 3-7 TLSR8278 Chip EMI test reference table

run

| 0: Stop EMI Test 1: Start EMI Test| 0| SRAM: 0x840006
mode| 0: ble_2M
1: ble_1M
2: zigbee_250K
3: ble_125K
4: ble_500K| 1| SRAM: 0x84000a
Flash: 0x7c004(512K) Flash: 0x1c004(128K)
power| 0: 11.3dBm
1: 11.1dBm
2: 10.8dBm| 17: 5.3dBm
18: 4.7dBm
19: 4.0dBm| 34: -0.7dBm
35: -1.2dBm
36: -1.7dBm| ****

0

| SRAM: 0x840008
Flash: 0x7c002(512K) Flash: 0x1c002(128K)
| 3: 10.6dBm| 20: 3.5dBm| 37: -2.2dBm| |
---|---|---|---|---|---
4: 10.3dBm| 21: 3.3dBm| 38: -2.8dBm
5: 10.1dBm| 22: 3.1dBm| 39: -3.5dBm
6: 9.8dBm| 23: 2.9dBm| 40: -4.2dBm
7: 9.5dBm| 24: 2.6dBm| 41: -5.0dBm
8: 9.2dBm| 25: 2.4dBm| 42: -5.9dBm
9: 8.9dBm| 26: 2.1dBm| 43: -6.8dBm
10: 8.6dBm| 27: 1.8dBm| 44: -7.9dBm
11: 8.2dBm| 28: 1.6dBm| 45: -9.1dBm
12: 7.8dBm| 29: 1.3dBm| 46: -10.7dBm
13: 7.4dBm| 30: 0.7dBm| 47: -12.6dBm
14: 6.9dBm| 31: 0.5dBm| 48: -15.0dBm
15: 6.5dBm| 32: -0.3dBm| 49: -18.4dBm
16: 5.9dBm| 33: -0.5dBm| 50: -24.3dBm
**** channel| frequency = (2400 + channel)MHz(0 ≤ channel ≤ 100)| 2| SRAM: 0x840009
Flash: 0x7c003(512K) Flash: 0x1c003(128K)
| 1: emi_carrier_only| |
| 2: emi_con_prbs9| |
| 3: emi_rx_test| |
| 4: emi_tx_prbs9| |

cmd

| 5: emi_tx_0x55
6: emi_tx_0x0f
7: emi_deep_io_no_retention
8: emi_deep_timer_no _retention| ****

1

| SRAM: 0x840007
Flash: 0x7c001(512K) Flash: 0x1c001(128K)
| 9: emi_suspend_io_no _retention| |
| 10: emi_suspend_timer_no_retention| |
| 11: emi_deep_io_retention| |
| 12: emi_deep_timer_retention| |
hop| For cmd(2), the following two modes can be configured:| 0| SRAM: 0x84000b
Flash: 0x7c005(512K)
| 0: Turn off frequency hopping mode 1: Turn on frequency hopping mode| | Flash: 0x1c005(128K)
---|---|---|---
cap| 0x00 < cap < 0x7f| | Flash: 0x77000(512K)
Flash: 0x1e000(128K)
cap_close_en| 0xff:enable internal capacitor      0：disable internal capacitor| 0xff| Flash: 0x7c006(512K) Flash: 0x1c006(128K)
rssi| Read only| | SRAM: 0x840004
tx_num_mode| For cmd (4/5/6), it can be configured as the following two modes:
1: sending 1000 packets 0: keep sending packets| 0| SRAM: 0x840005
Flash: 0x7c000(512K) Flash: 0x1c000(128K)
rx_packet_num| Read only| | SRAM: 0x84000c

3.8 TLSRB91
The detailed description of each parameter of TLSRB91 is shown in Table below.
Table 3-8 TLSRB91 Chip EMI test reference table

6: 4.4dBm
7: 3.8dBm| 13: 0dBm
14: -0.5dBm
15: -1.4dBm| 21: -12.1dBm
22: -17.8dBm
23: –
23.5dBm| |
---|---|---|---|---|---

channel

| frequency = (2400 + channel)MHz（0 ≤ channel

≤ 100）

| ****

2

| ****

SRAM: 0xc0000009

cmd| 1: emi_carrier_only
2: emi_con_prbs9
3: emi_rx_test
4: emi_tx_prbs9
5: emi_tx_0x55
6: emi_tx_0x0f|

**** 1

| SRAM: 0xc0000007
cap| 0x40 < cap < 0x7f| | Flash: 0xfe000
rssi| Read only| | SRAM: 0xc0000004
tx_num_mode| For cmd (4/5/6), it can be configured as the following two modes:
1: sending 1000 packets 0: keep sending packets| 0| SRAM: 0xc0000005
rx_packet_nu m| **** Read only| | SRAM: 0xc000000c

FCC STATEMENT
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
This device may not cause harmful interference, and This device must accept any interference received, including interference that may cause undesired operation.
Warning: Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.
Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

The device has been evaluated to meet general RF exposure requirement.
The device can be used in portable exposure condition without restriction.
This device complies with Industry Canada licence-exempt RSS standard( s).
Operation is subject to the following two conditions:

1. this device may not cause interference, and
2. this device must accept any interference, including interference that may cause undesired operation of the device.”

Integration instructions for host product manufacturers according to KDB 996369 D03 Emmanuel v01

Conditions on using Shandong Goldencell Power Technology Co.,Ltd regulatory approvals:
A. Customer must ensure that its product (the“CUSTOMER Product”) is electrically identical to Shandong Goldencell Power Technology Co.,Ltd reference designs. Customer acknowledges that any modifications to Shandong Goldencell Power Technology Co.,Ltd reference designs may invalidate regulatory approvals in relation to the CUSTOMER Product, or may necessitate notifications to the relevant regulatory authorities.
B. Customer is responsible for ensuring that antennas used with the product are of the same type, with same or lower gains as approved and providing antenna reports to Shandong Goldencell Power Technology Co.,Ltd.
C. Customer is responsible for regression testing to accommodate changes to Shandong Goldencell Power Technology Co.,Ltd reference designs, new antennas, and portable RF exposure safety testing/approvals.
D. Appropriate labels must be affixed to the CUSTOMER Product that comply with applicable regulations in all respects.
E. A user’s manual or instruction manual must be included with the customer product that contains the text as required by applicable law. Without limitation of the foregoing, an example (for illustration purposes only) of possible text to
include is set forth below:
2.2 List of applicable FCC rules and RSS rules
FCC Part 15 Subpart C 15.247 & 15.207 & 15.209& 15.205
RSS-Gen Issue 5 Amendment 2, February 2021
RSS-247 Issue 2, February 2017
2.3 Specific operational use conditions
Operation Frequency:2402~2480MHz
Number of Channel:40 Channels
Modulation Type:GFSK
Antenna Type:PCB antenna
Antenna Gain(Peak):0 dBi (Provided by customer)
The module can be used for mobile or portable applications with a maximum 0 dBi antenna. The host manufacturer installing this module into their product must ensure that the final composit product complies with the FCC requirements by a technical assessment or evaluation to the FCC rules, including the transmitter operation. The host manufacturer has to be aware not to provide informationto the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.

2.4 Limited module procedures
Not applicable. The module is a Single module and complies with the requirement of FCC Part 15.212.
2.5 Trace antenna designs
Applicable.

2.6 RF exposure considerations
The device can be used in portable exposure condition without restriction and if RF exposure statement or module layout is changed, then the host product manufacturer required to take responsibility of the module through a change in
FCC ID or new application. The FCC ID of the module cannot be used on the final product. In these circumstances, the host manufacturer will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate
FCC authorization.
2.7 Antennas
Antenna Specification are as follows:
Antenna Type:PCB antenna
Antenna Gain(Peak):0 dBi (Provided by customer)
This device is intended only for host manufacturers under the following conditions:
The transmitter module may not be co-located with any other transmitter or antenna;
The module shall be only used with the External antenna(s) that has been originally tested and certified with this module. The antenna must be either permanently attached or employ a ‘unique’antenna coupler.
As long as the conditions above are met, further transmitter test will not be required. However, the host manufacturer is still responsible for testing their endproduct for any additional compliance requirements required with this module
installed (for example, digital device emissions, PC peripheral requirements, etc.).

2.8 Label and compliance information
Host product manufacturers need to provide a physical or e-label stating “Contains FCC ID 2BC4G-BLE002”/” “Contains IC: 31403-JBDBLE002” With their finished product.
2.9 Information on test modes and additional testing requirements
Operation Frequency:2402~2480MHz
Number of Channel:40 Channels
Modulation Type:GFSK
Antenna Type:PCB antenna
Antenna Gain(Peak):0 dBi (Provided by customer)
Host manufacturer must perfom test of radiated & conducted emission and spurious emission, etcaccording to the actual test modes for a stand-alone modular transmitter in a host, as well as for multiple simultaneously transmitting modules or other transmitters in a host product.
Only when all the test results of test modes comply with FCC requirements, then the end product canbe sold legally.

2.10 Additional testing, Part 15 Subpart B disclaimer
The modular transmitter is only FCC authorized for FCC Part 15 Subpart C 15.247 & 15.207 & 15.209 & 15.205 and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

AN-20071700-E3
Ver.0.3.0

Documents / Resources

| Telink Semiconductor BLE002 SoC EMI Test [pdf] User Manual
BLE002 SoC EMI Test, BLE002, SoC EMI Test, EMI Test, Test
---|---

References

• Telink | Chips for a Smarter IoT
• Telink | Chips for a Smarter IoT

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