QUECTEL FCS950R Wi-Fi and Bluetooth Module Series User Manual

FCS950R Hardware Design
Wi-Fi&Bluetooth Module Series
Version: 1.0.0
Date: 2023-06-13
Status: Preliminary 

FCS950R Wi-Fi and Bluetooth Module Series

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Quectel Wireless Solutions Co., Ltd.
Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China
Tel: +86 21 5108 6236
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Or email us at: support@quectel.com.

Legal Notices
We offer information as a service to you. The provided information is based on your requirements and we make every effort to ensure its quality. You agree that you are responsible for using independent analysis and evaluation in designing intended products, and we provide reference designs for illustrative purposes only. Before using any hardware, software or service guided by this document, please read this notice carefully. Even though we employ commercially reasonable efforts to provide the best possible experience, you hereby acknowledge and agree that this document and related services hereunder are provided to you on an “as available” basis. We may revise or restate this document from time to time at our sole discretion without any prior notice to you.

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Disclaimer

a) We acknowledge no liability for any injury or damage arising from the reliance upon the information.
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Copyright © Quectel Wireless Solutions Co., Ltd. 2023. All rights reserved.

Safety Information

The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal shall notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.

| Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving.
---|---
| Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it shall be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft.
| Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities.
| Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergency help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances.
| The cellular terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment.
| In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders.

**About the Document

**

Revision History

Introduction

This document defines the FCS950R and describes its air interfaces and hardware interfaces, which are connected with your application. The document provides a quickly insight into interface specifications, RF performance, electrical and mechanical details, as well as other related information of the module.

1.1. Special Mark
Table 1: Special Mark

all pins of the same type. For example, SDIO_DATA[0:3] refers to all four SDIO pins: SDIO_DATA0, SDIO_DATA1, SDIO_DATA2, and SDIO_DATA3.

Product Overview

FCS950R is a low-energy and high-performance IEEE 802.11a/b/g/n/ac Wi-Fi 5 and Bluetooth 4.2 module supporting 2.4 GHz&5 GHz dual-band and 1T1R mode with maximum data transmission rate up to 433.3 Mbps. It provides Wi-Fi functions with an SDIO 3.0 interface, and Bluetooth functions with a UART and a PCM interface.
It is an SMD module with compact packaging. Related information is listed in the table below:
Table 2: Basic Information
FCS950R

2.1. Key Features
Table 3: Key Features
Basic Information

Basic Information

Protocol and Standard| ● Wi-Fi protocols: IEEE 802.11a/b/g/n/ac
● Bluetooth protocol: Bluetooth 4.2
● All hardware components are fully compliant with EU RoHS directive
Power Supplies| VBAT Power Supply:
● 3.0–3.6 V
● Typ.: 3.3 V
VDD_IO Power Supply:
● 1.62–3.6 V
● Typ.: 1.8/3.3 V
Temperature Ranges| ● Operating temperature 1: 0 °C  to +70 °C
● Storage temperature: -55 °C  to +125 °C
EVB Kit| FCS950R-M.2
RF Antenna Interface
Wi-Fi/Bluetooth Antenna Interface| ● ANT_WIFI/BT
● 50 Ω characteristic impedance
Application Interface
Wi-Fi Application Interface| SDIO 3.0
Bluetooth Application Interfaces| UART, PCM

1 To meet the normal operating temperature range requirements, it is necessary to ensure effective thermal dissipation, e.g., by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within this range, the module’s indicators comply with IEEE and Bluetooth specification requirements.

2.2. Functional Diagram
The main components of the block diagram are explained below.

1. Main chip
2. Radio frequency
3. Peripheral interfaces

RF Performances

3.1. Wi-Fi Performances
Table 4: Wi-Fi Performances
Operating Frequency

• 2.4 GHz: 2.400–2.4835 GHz
• 5 GHz: 5.150–5.850 GHz

Modulation
DBPSK, DQPSK, CCK, BPSK, QPSK, 16QAM, 64QAM, 256QAM
Operating Mode

• AP
• STA

Transmission Data Rate

• 802.11b: 1 Mbps, 2 Mbps, 5.5 Mbps, 11 Mbps
• 802.11a/g: 6 Mbps, 9 Mbps, 12 Mbps, 18 Mbps, 24 Mbps, 36 Mbps, 48 Mbps, 54 Mbps
• 802.11n: HT20 (MCS 0–7), HT40 (MCS 0–7)
• 802.11ac: VHT20 (MCS 0–8), VHT40 (MCS 0–9), VHT80 (MCS 0–9)

Condition (VBAT = 3.3 V; Temp.: 25 °C)| EVM| Typ.; Unit: dBm; Tolerance: ±2  dB
---|---|---
Transmitting Power| Receiving Sensitivity
2.4 GHz| 802.11b @ 1 Mbps| ≤ 35%| 21.5| -97
802.11b @ 11 Mbps| 18| -89
802.11g @ 6 Mbps| ≤ -5 dB| 21.5| -92.5
802.11g @ 54 Mbps| ≤ -27 dB| 15| -75
802.11n, HT20 @ MCS 0| ≤ -5 dB| 21.5| -91.5
802.11n, HT20 @ MCS 7| ≤ -28 dB| 14| -72
802.11n, HT40 @ MCS 0| ≤ -5 dB| 21.5| -89
802.11n, HT40 @ MCS 7| ≤ -28 dB| 14| -70
5 GHz| 802.11a @ 6 Mbps| ≤ -5 dB| 16.5| -90
802.11a @ 54 Mbps| ≤ -25 dB| 14| -72
802.11n, HT20 @ MCS 0| ≤ -5 dB| 16.5| -89
802.11n, HT20 @ MCS 7| ≤ -27 dB| 13| -70
802.11n, HT40 @ MCS 0| ≤ -5 dB| 16.5| -86.5
802.11n, HT40 @ MCS 7| ≤ -27 dB| 13| -68
802.11ac, VHT20 MCS 0| ≤ -5 dB| 16.5| -89
802.11ac, VHT20 MCS 8| ≤ -30 dB| 12| -65
802.11ac, VHT40 @ MCS 0| ≤ -5 dB| 16.5| -86.5
802.11ac, VHT40 @ MCS 9| ≤ -32 dB| 11| -62.5
802.11ac, VHT80 @ MCS 0| ≤ -5 dB| 16.5| -83
802.11ac, VHT80 @ MCS 9| ≤ -32 dB| 11| -59

3.2. Bluetooth Performances
Table 5: Bluetooth Performances

Operating Frequency
2.400–2.4835 GHz
Modulation
GFSK, π/4-DQPSK, 8-DPSK
Operating Mode

• Classic Bluetooth (BR + EDR)
• Bluetooth Low Energy (BLE)

Condition (VBAT = 3.3 V; Temp.: 25 °C)| Typ.; Unit: dBm; Tolerance: ±2 dB
---|---
Transmitting Power| Receiving Sensitivity
BR| 8.5| -91
EDR (π/4-DQPSK)| 8.5| -96.5
EDR (8-DPSK)| 8.5| -97
BLE (1 Mbps)| 5| -95

Application Interfaces

4.1. Pin Assignment

NOTE

1. Keep all RESERVED and unused pins unconnected.
2. All GND pins should be connected to ground.

4.2. Pin Description
Table 6: I/O Parameter Definition

DC characteristics include power domain and rate current.

Table 7: Pin Description

Power Supply

Pin Name| Pin No.| I/O| Description| DC Characteristics| Comment
VBAT| 9| PI| Main power supply for the module| Vmin = 3.0 V
Vnom = 3.3 V
Vmax = 3.6 V| It must be provided with sufficient current of at least
0.6 A.
VDD_IO| 22| PI| Power supply for module’s I/O pins| Vmin = 1.62 V
Vnom = 1.8/3.3 V
Vmax = 3.6 V| It must be provided with sufficient current of at least
0.2 A.
GND| 1, 3, 20, 31, 33, 36
Wi-Fi Application Interfaces
Pin Name| Pin No.| I/O| Description| DC Characteristics| Comment
WLAN_EN| 12| DI| Wi-Fi function enable control| VDD_IO| Active high.
If unused, pull it up to VDD_IO with a 100 kΩ resistor.
WLAN_WAKE| 13| DO| Wi-Fi wakes up host| | Active high.
SDIO_DATA2| 14| –| NC (1-bit mode)| Supports 1-bit or 4-bit mode.
DIO| SDIO data bit 2 (4-bit mode)
SDIO_DATA3| 15| –| NC (1-bit mode)
DIO| SDIO data bit 3 (4-bit mode)
SDIO_CMD| 16| DIO| SDIO command
SDIO_CLK| 17| DIO| SDIO clock
SDIO_DATA0| 18| DI| SDIO data bit 0
SDIO_DATA1| 19| DIO| IRQ (1-bit mode)
DO| SDIO data bit 1 (4-bit mode)
Bluetooth Application Interfaces
Pin Name| Pin No.| I/O| Description| DC Characteristics| Comment
BT_EN| 34| DI| Bluetooth enable control| VDD_IO| Active high.
If unused, pull it up to VDD_IO with a 100 kΩ resistor.
HOST_WAKE_BT| 6| DI| Host wakes up Bluetooth| Active high.
BT_WAKE_HOST| 7| DO| Bluetooth wakes up host|
PCM_DOUT| 25| DO| PCM data output|
PCM_CLK| 26| DI| PCM clock|
PCM_DIN| 27| DI| PCM data input|
PCM_SYNC| 28| DI| PCM data frame sync|
BT_RTS| 41| DO| Request to send signal from the module|
BT_TXD| 42| DO| transmit Bluetooth UART|
BT_RXD| 43| DI| Bluetooth UART receive|
BT_CTS| 44| DI| to the module Clear to send signal|
RF Antenna Interface
Pin Name| Pin No.| I/O| Description| DC Characteristics| Comment
ANT_WIFI/BT| 2| AIO| Wi-Fi/Bluetooth antenna interface| | 50 Ω characteristic impedance.
Pin Name
WLAN_SLP_CLK| Pin No.| I/O| Description| DC Characteristics| Comment
Other Interface| 24| DI| Wi-Fi sleep clock| VDD_IO| External 32.768 kHz clock input. If unused, keep it open.
RESERVED Pins
Pin Name| Pin No.| Comment
RESERVED| 4, 5, 8, 10, 11, 21, 23, 29, 30, 32, 35, 37–40| Keep them open.

4.3. Power Supply
The module is powered by VBAT, and it should use a power supply chip that can provide sufficient current of at least 0.6 A. To ensure better power supply performance, it is recommended to parallel a 22 μF decoupling capacitor and three filter capacitors (100  nF, 33 pF and 10 pF) near the module’s VBAT pin. Meanwhile, it is recommended to add a TVS near the VBAT to improve the surge voltage bearing capacity of the module. In principle, the longer the VBAT trace, the wider it should be.

The reference circuit for module’s power supply is shown in the figure below:

The following figure shows the recommended power-up timing of the module.

4.4. Wi-Fi Application Interfaces
Wi-Fi application interface connection between the module and the host is illustrated in the figure below.

4.4.1. SDIO Interface
The module supports 1-bit or 4-bit SDIO 3.0 interface. It can detect the SDIO mode of the host automatically when it is connected. SDIO interface connection between the module and the host is illustrated in the following figure.

To ensure compliance of interface design with the SDIO 3.0 specification, it is recommended to adopt the following principles:

• Add 0 Ω resistors in series and 5.6 pF capacitors (not mounted by default) between the module and the host. All resistors and capacitors should be placed close to the module.

• To avoid the impact of jitter, pull up SDIO signal traces (SDIO_CLK, SDIO_CMD, and SDIO_DATA[0:3]) to VDD_IO with 2.2 kΩ resistors.

• The impedance of SDIO signal trace is 50 Ω ±10 %. Route the SDIO traces in inner layer of the PCB, and surround the traces with ground on that layer and with ground planes above and below.
  And the SDIO_CLK signal trace should be routed with ground surrounded separately.

• Keep SDIO signals far away from other sensitive circuits/signals such as RF circuits and analog signals, as well as noise signals such as clock signals and DC-DC signals.

• SDIO signal traces (SDIO_CLK and SDIO_DATA[0:3]/SDIO_CMD) need to be equal in length (less than 2.5 mm distance between the traces) and the total routing length of each signal trace is less than 63.5 mm.
  The total trace inside the module is 11 mm, so the exterior total trace length should be less than 52.5 mm.

• Ensure the SDIO signal traces a complete reference ground and keep them free of stubs. Keep the adjacent trace clearance twice the trace width and the load capacitance of SDIO bus less than 15 pF.

• The vias of SDIO signal traces (SDIO_CLK and SDIO_DATA[0:3]/SDIO_CMD) should be less than 4.

Table 8: SDIO Interface Trace Length Inside the Module (Unit: mm)

4.5. Bluetooth Application Interfaces
Bluetooth application interface connection between the module and the host is illustrated in the figure below.

4.5.1. PCM Interface
The module provides a PCM interface for Bluetooth audio application. It supports the following features:

• Both master and slave modes
• Programmable long/short frame synchronization
• 8-bit A-law/µ-law, 13/16-bit linear PCM format
• Symbol expansion and zero padding for 8-bit and 13-bit samples
• Fill audio gain to 13-bit sampling
• PCM master clock output: 64 kHz, 128 kHz, 256 kHz or 512 kHz
• SCO/eSCO link

PCM interface timing is shown below:

Table 9: PCM Interface Clock Specifications

Table 10: PCM Interface Timing

4.5.2. UART
The module supports a Bluetooth HCI (Host Controller Interface) UART defined by Bluetooth 4.2 protocol.
It supports hardware flow control (RTS/CTS), and can be used for data transmission with the host. The baud rate, which is 115200 bps by default, can be up to 4 Mbps.
The voltage range of the Bluetooth UART is determined by VDD_IO. It is necessary to monitor the consistency of the voltage range between the host and Bluetooth UART. If necessary, adopt a voltage-level translator.

The UART connection between the module and the host supporting software flow control is as below:

The UART connection between the module and the host supporting hardware flow control is as below:

The UART connection between the module and the host not supporting flow control is as below:

NOTE

1. When paired with Quectel’s LTE modules, you need to pay attention to the input and output of BT_CTS and BT_RTS.
2. Reserve 0 Ω resistors between the module and host for Bluetooth signaling test.

4.6. RF Antenna Interface
Appropriate antenna type and design should be used with matched antenna parameters according to specific application.
It is required to perform a comprehensive functional test for the RF design before mass production of terminal products. The entire content of this chapter is provided for illustration only.
Analysis, evaluation and determination are still necessary when designing target products.
The module provides one RF antenna interface (ANT_WIFI/BT), and the RF port requires 50 Ω characteristic impedance.

4.6.1. Reference Design
A reference circuit for the RF antenna interface is shown below.
It is recommended to reserve a π-type matching circuit and add an ESD protection component for better RF performance. Reserved matching components (C1, R1, C2 and D1) should be placed as close to the antenna as possible.
C1, C2 and D1 are not mounted by default. The parasitic capacitance of TVS should be less than 0.05 pF and R1 is recommended to be 0 Ω.

4.6.2. Antenna Design Requirements

Table 11: Antenna Design Requirements

● 5.150–5.850
VSWR| < 1
MAX Gain (dBi)| ≤ 2 (Typ.)
Max Input Power (W)| 1.14
Input Impedance (Ω)| 50
Polarization Type| 50
Parameter| Vertical

4.6.3. RF Routing Guidelines
For user’s PCB, the characteristic impedance of all RF traces should be controlled to 50 Ω. The impedance of the RF traces is usually determined by the trace width (W), the materials’ dielectric constant, the height from the reference ground to the signal layer  (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB  structures.

To ensure RF performance and reliability, follow the principles below in RF layout design:

• Use an impedance simulation tool to control the characteristic impedance of RF traces to 50 Ω.
• The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground.
• The distance between the RF pins and the RF connector should be as short as possible and all the right-angle traces should be changed to curved ones. The recommended trace angle is 135°.
• There should be clearance under the signal pin of the antenna connector or solder joint.
• The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be not less than twice the width of RF signal traces (2 × W).
• Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers.

For more details about RF layout, see document [1].

4.6.4. RF Connector Recommendation
If RF connector is used for antenna connection, it is recommended to use the U.FL-R-SMT connector provided by Hirose. U.FL-LP series mated plugs listed in the following figure can be used to match the U.FL-R-SMT connector.

The following figure describes the space factor of mated connectors. For more details, please visit https://www.hirose.com.

Electrical Characteristics & Reliability

5.1. Absolute Maximum Ratings
Table 12: Absolute Maximum Ratings (Unit: V)

5.2. Power Supply Ratings

Table 13: Module Power Supply Ratings (Unit: V)

Parameter| Description| Condition| Min.| Typ.| Max.
---|---|---|---|---|---
VBAT| Main power supply
for the module| The actual input voltages must be kept between the minimum and maximum values.| 3| 3.3| 3.6
VDD_IO| module’s I/O pins
Power supply for| –| 1.62| 1.8/3.3| 3.6

5.3. Power Consumption

5.3.1. Wi-Fi Power Consumption
Table 14: Power Consumption in Low Power Modes 

Table 15: Power Consumption in Non-signalling Mode (Unit: mA)

5.3.2. Bluetooth Power Consumption

Table 16: Power Consumption in Non-signalling Mode

5.4. Digital I/O Characteristics

Table 17: VDD_IO High Level I/O Requirements (Unit: V)

Table 18: VDD_IO Low Level I/O Requirements (Unit: V)

5.5. ESD Protection
Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the  module; add ESD protection components to the ESD sensitive interfaces and points in the product design.

5.6. Thermal Dissipation
The module offers the best performance when all internal IC chips are working within their operating temperatures. When the IC chip reaches or exceeds the maximum junction temperature, the module may still work but the performance and function (such as  RF output power, data rate, etc.) will be affected to a certain extent. Therefore, the thermal design should be maximally optimized to ensure all internal IC chips always work within the recommended operating temperature range.

The following principles for thermal consideration are provided for reference:

• Keep the module away from heat sources on your PCB, especially high-power components such as processor, power amplifier, and power supply.
• Maintain the integrity of the PCB copper layer and drill as many thermal vias as possible.
• Follow the principles below when the heatsink is necessary:
  – Do not place large size components in the area where the module is mounted on your PCB to reserve enough place for heatsink installation.
  – Attach the heatsink to the shielding cover of the module; In general, the base plate area of the heatsink should be larger than the module area to cover the module completely;
  – Choose the heatsink with adequate fins to dissipate heat;
  – Choose a TIM (Thermal Interface Material) with high thermal conductivity, good softness and good wettability and place it between the heatsink and the module;
  – Fasten the heatsink with four screws to ensure that it is in close contact with the module to prevent the heatsink from falling off during the drop, vibration test, or transportation.

Mechanical Information

This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ±0.2 mm unless otherwise specified.

6.1. Mechanical Dimensions

NOTE
The package warpage level of the module conforms to the JEITA ED-7306 standard.

6.2. Recommended Footprint

NOTE
Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience.

6.3. Top and Bottom Views

NOTE
Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel.

Storage, Manufacturing & Packaging

7.1. Storage Conditions
The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below.

1. Recommended Storage Condition: the temperature should be 23 ±5 °C and the relative humidity should be 35–60 %.

2. Shelf life (in a vacuum-sealed packaging): 12 months in Recommended Storage Condition.

3. Floor life: 168 hours3 in a factory where the temperature is 23 ±5 °C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168  hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g., a dry cabinet).

4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:
   ● The module is not stored in Recommended Storage Condition;
   ● Violation of the third requirement mentioned above;
   ● Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;
   ● Before module repairing.

5. If needed, the pre-baking should follow the requirements below:
   ● The module should be baked for 8 hours at 120 ±5 °C;
   ● The module must be soldered to PCB within 24 hours after the baking, otherwise it should be put in a dry environment such as in a dry cabinet.

3 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. Do not unpack the modules in large quantities until they are ready for soldering.

NOTE

1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden.
2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure.
3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules.

7.2. Manufacturing and Soldering
Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To guarantee module  soldering quality, the thickness of stencil for the module is recommended to be 0.15–0.18 mm. For more details, see document [2].
The recommended peak reflow temperature should be 235–246 ºC, with 246 ºC as the absolute maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is recommended that the module should be mounted only after reflow  soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below.

Table 19: Recommended Thermal Profile Parameters

Soak Zone
Ramp-to-soak slope| 0–3 °C/s
Soak time (between A and B: 150 °C  and 200 °C)| 70–120 s
Reflow Zone
Ramp-up slope| 0–3 °C/s
Reflow time (D: over 217 °C)| 40–70 s
Max. temperature| 235–246 °C
Cool-down slope| -3–0 °C/s
Reflow Cycle
Max. reflow cycle| 1

● NOTE

1. The above profile parameter requirements are for the measured temperature of the solder joints. Both the hottest and coldest spots of solder joints on the PCB should meet the above requirements.
2. During manufacturing and soldering, or any other processes that may contact the module directly, NEVER wipe the module’s shielding can with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc. Otherwise, the  shielding can may become rusted.
3. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12 hours’ Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly identifiable and the QR code is still readable, although  white rust may be found.
4. If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module.
5. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module.
6. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [2].

7.3. Packaging Specifications
This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery.
The module adopts carrier tape packaging and details are as follow:

7.3.1. Carrier Tape
Dimension details are as follow:

Table 20: Carrier Tape Dimension Table (Unit: mm)

7.3.2. Plastic Reel

Table 21: Plastic Reel Dimension Table (Unit: mm)

7.3.3. Mounting Direction

7.3.4. Packaging Process Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 500 modules.
Place the packaged plastic reel, 1 humidity indicator card and 1 desiccant bag into a vacuum bag, vacuumize it. Place the vacuum-packed plastic reel into the pizza box. Put 4 packaged pizza boxes into 1 carton box and seal it. 1 carton box can pack 2000 modules.

Figure 31: Packaging Process

Appendix References

Table 22: Related Documents
Document Name
[1] Quectel_RF_Layout_Application_Note
[2] Quectel_Module_SMT_Application_Note

Table 23: Terms and Abbreviations

Worning

9.1. Important Notice to OEM integrators
Product Marketing Name：Quectel FCS950R

1. This module is limited to OEM installation ONLY.
2. This module is limited to installation in fixed applications, according to Part 2.1091(b).
3. This module has been tested and found to comply with the limits for Part 15.247 & 15.407 of the FCC Rules.
4. The separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different antenna configurations 4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify compliance as a composite system. When testing the host device for compliance with Part 15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation should confirm that the module’s intentional emissions are compliant (i.e. fundamental and out of band emissions). The host manufacturer must verify that there are no additional unintentional emissions other than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s). The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed.
   Important Note Important Note notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify to Quectel Wireless Solutions Co., Ltd.. that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the USI, or the host manufacturer can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application. End Product LabelingWhen the module is installed in the host device, the FCC/IC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re- moved. If not, a second label must be placed on the outside of the final device that contains the following text: “Contains FCC ID: XMR2023FCS950R” The FCC ID can be used only when all FCC mpliance requirements are met.

Antenna Installation

1. The antenna must be installed such that 20 cm is maintained between the antenna and users,
2. The transmitter module may not be co-located with any other transmitter or antenna.
3. Only antennas of the same type and with equal or less gains as shown below may be used with thismodule.

Operating Band| Frequency (MHz)| Antenna Type| Antenna P/N| Antenna Gain (dBi)
---|---|---|---|---
Bluetooth| 2400~2483.5| Dipole| YE0038AA| 0.73 dBi
2.4G WiFi| 0.73 dBi
5G WiFi| 5150~5850| 5150~5250 MHz: 1.14 dBi
5250~5350 MHz: 1.14 dBi
5470~5725 MHz: 1.14 dBi
5725~5850 MHz: 1.14 dBi

Other types of antennas and/or higher gain antennas may require additional authorization for operation.
In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID/IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization. Manual Information to the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.

9.2. FCC Statement
Federal Communication Commission Interference Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

1. This device may not cause harmful interference, and
2. this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation.

This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
This device is intended only for OEM integrators under the following conditions:
(For module device use)

1. The antenna must be installed such that 20 cm is maintained between the antenna and users, and
2. The transmitter module may not be co-located with any other transmitter or antenna. As long as 2conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator & your body.

9.3. IC Statement
IRSS-GEN
“This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following two conditions:

1. This device may not cause interference; and
2. This device must accept any interference, including interference that may cause undesired operation of the device.

Radio frequency radiation exposure statement
The other one used for the transmitter must be installed at a distance of at least 20 cm from all personnel and must not be shared or operated together with any other antenna or transmitter.
The host product shall be properly labeled to identify the modules within the host product.
The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word “Contains” or similar wording expressing the same meaning, as follows: “Contains IC: 10224A-2023FCS950R” or “where: 10224A- 2023FCS950R is the module’s certification
number”.
i. the device for operation in the band 5150–5250 MHz is only for indoor use to reduce the potential for harmful interference to co-channel mobile satellite systems;
ii. for devices with detachable antenna(s), the maximum antenna gain permitted for devices in the bands 5250-5350 MHz and 5470-5725 MHz shall be such that the equipment still complies with the e.i.r.p. limit;
iii.for devices with detachable antenna(s), the maximum antenna gain permitted for devices in the band 5725-5850 MHz shall be such that the equipment still complies with the e.i.r.p. limits as appropriate;
iv.Omnidirectional antenna is recommended

References

• Contact us | Quectel
• Electrical and Electronic Connectors - HIROSE Electric Group [Connector]
• Electrical and Electronic Connectors - HIROSE Electric Group [Connector]

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