EM061K-GL LTE-A Module

Product Information

Specifications

• Product Name: EM061K-GL Hardware Design
• Product Version: LTE-A Module Series Version 1.0.0
• Date: 2023-02-24
• Status: Preliminary

About Quectel

Quectel Wireless Solutions Co., Ltd. aims to provide timely and
comprehensive services to our customers. For assistance, please
contact our headquarters:

Quectel Wireless Solutions Co., Ltd.

Building 5, Shanghai Business Park Phase III (Area B), No.1016
Tianlin Road, Minhang District, Shanghai 200233, China

Tel: +86 21 5108 6236

Email: [email protected]

For more information, visit our website: http://www.quectel.com/support/sales.htm

Technical Support

For technical support or to report documentation errors, you can
visit our technical support page: http://www.quectel.com/support/technical.htm.
You can also email us at: [email protected].

Legal Notices

Use and Disclosure Restrictions: Documents and
information provided by us must be kept confidential unless
specific permission is granted. They should not be accessed or used
for any purpose other than what is expressly provided.

Copyright: Except as otherwise stated, this
document does not confer any rights to use any trademark, trade
name, abbreviation, or counterfeit product owned by Quectel or any
third party.

Third-Party Rights: This document may refer to
hardware, software, and/or documentation owned by third parties.
The use of such third-party materials is subject to their specific
restrictions and obligations.

Privacy Policy: Certain device data may be
uploaded to Quectel’s or third-party servers for module
functionality. Quectel will handle the data in accordance with
relevant laws and regulations. Before interacting with third
parties, please review their privacy and data security
policies.

Disclaimer: a) We assume no liability for any
injury or damage resulting from reliance on the information
provided. b) We are not responsible for inaccuracies, omissions, or
the use of the information contained herein. c) While we strive to
ensure the accuracy of functions and features under
development.

Safety Information

The following safety precautions must be observed during all
phases of operation, including usage, service, or repair of any
cellular terminal or mobile incorporating the module. Manufacturers
of the cellular terminal should incorporate these guidelines into
all product manuals to inform users and operating personnel about
safety:

1. Ensure full attention is paid to driving at all times to reduce
   the risk of accidents. Using a mobile device while driving, even
   with a handsfree kit, can cause distraction and lead to accidents.
   Please comply with laws and regulations restricting the use of
   wireless devices while driving.

Frequently Asked Questions (FAQ)

1. 1. Where can I find technical support for the LTE-A Module  

   Series?

You can find technical support for the LTE-A Module Series by
visiting our technical support page: http://www.quectel.com/support/technical.htm.
You can also email us at [email protected].

1. 1. What should I do if I encounter inaccuracies or omissions in  

   the provided information?

If you encounter inaccuracies or omissions in the provided
information, please contact our technical support team at
[email protected].

1. 1. Can I use third-party materials with the LTE-A Module  

   Series?

Yes, you can use third-party materials with the LTE-A Module
Series. However, please ensure compliance with the specific
restrictions and obligations applicable to those materials.

EM061K-GL Hardware Design
LTE-A Module Series Version: 1.0.0 Date: 2023-02-24 Status: Preliminary

LTE-A Module Series
At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:
Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: [email protected]
Or our local offices. For more information, please visit: http://www.quectel.com/support/sales.htm.
For technical support, or to report documentation errors, please visit: http://www.quectel.com/support/technical.htm. Or email us at: [email protected].
Legal Notices
We offer information as a service to you. The provided information is based on your requirements and we make every effort to ensure its quality. You agree that you are responsible for using independent analysis and evaluation in designing intended products, and we provide reference designs for illustrative purposes only. Before using any hardware, software or service guided by this document, please read this notice carefully. Even though we employ commercially reasonable efforts to provide the best possible experience, you hereby acknowledge and agree that this document and related services hereunder are provided to you on an “as available” basis. We may revise or restate this document from time to time at our sole discretion without any prior notice to you.
Use and Disclosure Restrictions
License Agreements
Documents and information provided by us shall be kept confidential, unless specific permission is granted. They shall not be accessed or used for any purpose except as expressly provided herein.
Copyright
Our and third-party products hereunder may contain copyrighted material. Such copyrighted material shall not be copied, reproduced, distributed, merged, published, translated, or modified without prior written consent. We and the third party have exclusive rights over copyrighted material. No license shall be granted or conveyed under any patents, copyrights, trademarks, or service mark rights. To avoid ambiguities, purchasing in any form cannot be deemed as granting a license other than the normal nonexclusive, royalty-free license to use the material. We reserve the right to take legal action for noncompliance with abovementioned requirements, unauthorized use, or other illegal or malicious use of the material.

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LTE-A Module Series
Trademarks
Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects.
Third-Party Rights
This document may refer to hardware, software and/or documentation owned by one or more third parties (“third-party materials”). Use of such third-party materials shall be governed by all restrictions and obligations applicable thereto.
We make no warranty or representation, either express or implied, regarding the third-party materials, including but not limited to any implied or statutory, warranties of merchantability or fitness for a particular purpose, quiet enjoyment, system integration, information accuracy, and non- infringement of any thirdparty intellectual property rights with regard to the licensed technology or use thereof. Nothing herein constitutes a representation or warranty by us to either develop, enhance, modify, distribute, market, sell, offer for sale, or otherwise maintain production of any our products or any other hardware, software, device, tool, information, or product. We moreover disclaim any and all warranties arising from the course of dealing or usage of trade.
Privacy Policy
To implement module functionality, certain device data are uploaded to Quectel’s or third-party’s servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy.
Disclaimer
a) We acknowledge no liability for any injury or damage arising from the reliance upon the information. b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the
information contained herein. c) While we have made every effort to ensure that the functions and features under development are
free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable. d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources.
Copyright © Quectel Wireless Solutions Co., Ltd. 2023. All rights reserved.

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LTE-A Module Series
Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.
Full attention must be paid to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft.
Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergency help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances.
The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment.
In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fueling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders.

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About the Document

Revision History

Version 1.0.0

Date 2023-02-24 2023-02-24

Author
Fung ZHU/ Eysen WANG Fung ZHU/ Eysen WANG

Description Creation of the document Preliminary

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Contents
Safety Information…………………………………………………………………………………………………………………….. 3 About the Document …………………………………………………………………………………………………………………. 4 Table Index……………………………………………………………………………………………………………………………….. 7 Figure Index ……………………………………………………………………………………………………………………………… 9
1 Introduction ……………………………………………………………………………………………………………………… 10 1.1. Reference Standards ………………………………………………………………………………………………… 13 1.2. Special Marks…………………………………………………………………………………………………………… 13
2 Product Overview …………………………………………………………………………………………………………….. 15 2.1. Frequency Bands and Functions ………………………………………………………………………………… 15 2.2. Key Features ……………………………………………………………………………………………………………. 16 2.3. Functional Diagram …………………………………………………………………………………………………… 18 2.4. Pin Assignment ………………………………………………………………………………………………………… 19 2.5. Pin Description …………………………………………………………………………………………………………. 20 2.6. EVB Kit ……………………………………………………………………………………………………………………. 25
3 Operating Characteristics …………………………………………………………………………………………………. 26 3.1. Operating Modes………………………………………………………………………………………………………. 26 3.2. Sleep Mode ……………………………………………………………………………………………………………… 27 3.3. Airplane Mode ………………………………………………………………………………………………………….. 28 3.4. Communication Interface with Host …………………………………………………………………………….. 28 3.5. Power Supply …………………………………………………………………………………………………………… 28 3.5.1. Power Supply Pins ………………………………………………………………………………………….. 28 3.5.2. Reference Design for Power Supply………………………………………………………………….. 28 3.5.3. Voltage Stability Requirements…………………………………………………………………………. 29 3.5.4. Power Supply Voltage Monitoring……………………………………………………………………… 30 3.6. Turn On …………………………………………………………………………………………………………………… 30 3.7. Turn Off …………………………………………………………………………………………………………………… 32 3.8. Reset ………………………………………………………………………………………………………………………. 32
4 Application Interfaces ………………………………………………………………………………………………………. 34 4.1. (U)SIM Interfaces ……………………………………………………………………………………………………… 34 4.1.1. Pin definition of (U)SIM ……………………………………………………………………………………. 34 4.1.2. (U)SIM Hot- Swap ……………………………………………………………………………………………. 35 4.1.3. Normally Closed (U)SIM Card Connector…………………………………………………………… 36 4.1.4. Normally Open (U)SIM Card Connector …………………………………………………………….. 36 4.1.5. (U)SIM Card Connector Without Hot-swap…………………………………………………………. 37 4.1.6. (U)SIM2 Card Compatible Design …………………………………………………………………….. 38 4.1.7. (U)SIM Design Notices…………………………………………………………………………………….. 38 4.2. USB Interface…………………………………………………………………………………………………………… 39 4.3. PCM Interface*…………………………………………………………………………………………………………. 40 4.4. Control and Indication Interfaces ………………………………………………………………………………… 42 4.4.1. W_DISABLE1#……………………………………………………………………………………………….. 42

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4.4.2. W_DISABLE2#……………………………………………………………………………………………….. 43 4.4.3. WWAN_LED#…………………………………………………………………………………………………. 44 4.4.4. WAKE_ON_WAN#………………………………………………………………………………………….. 44 4.4.5. DPR ………………………………………………………………………………………………………………. 45 4.4.6. WLAN_PA_EN ……………………………………………………………………………………………….. 45 4.5. Antenna Tuner Control Interface* ……………………………………………………………………………….. 46
4.5.1.1. Antenna Tuner Control Interface through GPIOs ………………………………………. 46 4.5.1.2. Antenna Tuner Control Interface through RFFE………………………………………… 46 4.6. Configuration Pins…………………………………………………………………………………………………….. 47
5 Antenna Interfaces……………………………………………………………………………………………………………. 48 5.1. Cellular Network……………………………………………………………………………………………………….. 48 5.1.1. Antenna Interfaces & Frequency Bands …………………………………………………………….. 48 5.1.2. Tx Power ……………………………………………………………………………………………………….. 50 5.1.3. Rx Sensitivity………………………………………………………………………………………………….. 51 5.2. GNSS ……………………………………………………………………………………………………………………… 53 5.2.1. Antenna Interface & Frequency Bands………………………………………………………………. 53 5.2.2. GNSS Performance ………………………………………………………………………………………… 53 5.3. Antenna Design Requirements …………………………………………………………………………………… 54 5.4. Antenna Connectors …………………………………………………………………………………………………. 55 5.4.1. Antenna Connector Location ……………………………………………………………………………. 55 5.4.2. Antenna Connector Specifications…………………………………………………………………….. 55 5.4.3. Antenna Connector Installation…………………………………………………………………………. 56
6 Electrical Characteristics and Reliability …………………………………………………………………………… 58 6.1. Absolute Maximum Ratings ……………………………………………………………………………………….. 58 6.2. Power Supply Ratings……………………………………………………………………………………………….. 58 6.3. Power consumption ………………………………………………………………………………………………….. 59 6.4. Digital I/O Characteristics ………………………………………………………………………………………….. 62 6.5. ESD Protection…………………………………………………………………………………………………………. 63 6.6. Operating and Storage Temperatures …………………………………………………………………………. 64 6.7. Thermal Dissipation ………………………………………………………………………………………………….. 64 6.8. Notification ………………………………………………………………………………………………………………. 65 6.8.1. Coating ………………………………………………………………………………………………………….. 66 6.8.2. Cleaning ………………………………………………………………………………………………………… 66 6.8.3. Installing ………………………………………………………………………………………………………… 66
7 Mechanical Information and Packaging …………………………………………………………………………….. 67 7.1. Mechanical Dimensions …………………………………………………………………………………………….. 67 7.2. Top and Bottom Views ………………………………………………………………………………………………. 68 7.3. M.2 Connector………………………………………………………………………………………………………….. 68 7.4. Packaging ……………………………………………………………………………………………………………….. 68 7.4.1. Blister Tray …………………………………………………………………………………………………….. 68 7.4.2. Packaging Process …………………………………………………………………………………………. 69
8 Appendix References ……………………………………………………………………………………………………….. 71

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Table Index
Table 1: Special Marks………………………………………………………………………………………………………………. 13 Table 2: Frequency Bands and GNSS Functions of EM061K-GL……………………………………………………. 15 Table 3: Key Features ……………………………………………………………………………………………………………….. 16 Table 4: Definition of I/O Parameters…………………………………………………………………………………………… 20 Table 5: Pin Description …………………………………………………………………………………………………………….. 20 Table 6: Overview of Operating Modes ……………………………………………………………………………………….. 26 Table 7: Definition of VCC and GND Pins ……………………………………………………………………………………. 28 Table 8: Pin Definition of FULL_CARD_POWER_OFF#………………………………………………………………… 30 Table 9: Turn-on Timing of the Module………………………………………………………………………………………… 31 Table 10: Turn-off Timing of the Module………………………………………………………………………………………. 32 Table 11: Pin Definition of RESET# …………………………………………………………………………………………….. 32 Table 12: Reset Timing of the Module …………………………………………………………………………………………. 33 Table 13: Pin Definition of (U)SIM Interfaces ……………………………………………………………………………….. 34 Table 14: Pin Definition of USB Interface …………………………………………………………………………………….. 39 Table 15: Pin Definition of PCM Interface…………………………………………………………………………………….. 41 Table 16: Pin Definition of Control and Indication Interfaces…………………………………………………………… 42 Table 17: RF Function Status …………………………………………………………………………………………………….. 42 Table 18: GNSS Function Status ………………………………………………………………………………………………… 43 Table 19: Network Status Indications of WWAN_LED# …………………………………………………………………. 44 Table 20: State of the WAKE_ON_WAN# ……………………………………………………………………………………. 44 Table 21: Pin definition of DPR …………………………………………………………………………………………………… 45 Table 22: Function of the DPR Signal………………………………………………………………………………………….. 45 Table 23: Pin definition of WLAN_PA_EN ……………………………………………………………………………………. 46 Table 29: Pin Definition of Antenna Tuner Control Interface through GPIOs…………………………………….. 46 Table 30: Pin Definition of Antenna Tuner Control Interface through RFFE ……………………………………… 46 Table 25: List of Configuration Pins …………………………………………………………………………………………….. 47 Table 26: Pin Definition of Configuration Pins ………………………………………………………………………………. 47 Table 27: Antenna Connectors Definition …………………………………………………………………………………….. 48 Table 28: Frequency Bands ……………………………………………………………………………………………………….. 48 Table 31: EM061K-GL Conducted RF Output Power…………………………………………………………………….. 50 Table 32: EM061K-GL Rx Sensitivity…………………………………………………………………………………………… 51 Table 34: GNSS Frequency ……………………………………………………………………………………………………….. 53 Table 35: GNSS Performance ……………………………………………………………………………………………………. 53 Table 36: Antenna Requirements ……………………………………………………………………………………………….. 54 Table 37: Major Specifications of the RF Connectors ……………………………………………………………………. 56 Table 38: Absolute Maximum Ratings …………………………………………………………………………………………. 58 Table 39: Power Supply Requirements ……………………………………………………………………………………….. 58 Table 40: Averaged Power Consumption …………………………………………………………………………………….. 59 Table 41: (U)SIM Low-voltage I/O Requirements………………………………………………………………………….. 62 Table 45: (U)SIM High-voltage I/O Requirements …………………………………………………………………………. 62 Table 46: 1.8 V Digital I/O Requirements …………………………………………………………………………………….. 62

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Table 47: 3.3 V Digital I/O Requirements …………………………………………………………………………………….. 63 Table 45: Electrostatic Discharge Characteristics (Temperature: 25­30 ºC, Humidity: 40 ±5 %) ………… 63 Table 46: Operating and Storage Temperatures …………………………………………………………………………… 64 Table 47: Maximum Operating Temperature for Main Chips (Unit: °C) ……………………………………………. 65 Table 48: Related Documents…………………………………………………………………………………………………….. 71 Table 49: Terms and Abbreviations …………………………………………………………………………………………….. 71

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Figure Index
Figure 1: Functional Diagram……………………………………………………………………………………………………… 18 Figure 2: Pin Assignment …………………………………………………………………………………………………………… 19 Figure 3: DRX Run Time and Power Consumption in Sleep Mode………………………………………………….. 27 Figure 4: Sleep Mode Application with USB Remote Wakeup Function …………………………………………… 27 Figure 5: Reference Circuit for Power Supply ………………………………………………………………………………. 29 Figure 6: Power Supply Limits During Burst Transmission …………………………………………………………….. 29 Figure 7: Reference Circuit for VCC Pins …………………………………………………………………………………….. 30 Figure 8: Turn on the Module Using Host GPIO……………………………………………………………………………. 31 Figure 9: Turn-on Timing of the Module……………………………………………………………………………………….. 31 Figure 10: Turn-off Timing of the Module …………………………………………………………………………………….. 32 Figure 11: Reference Circuit for RESET# with Open Collector Driving Circuit ………………………………….. 33 Figure 12: Reset Timing of the Module………………………………………………………………………………………… 33 Figure 13: Reference Circuit for Normally Closed (U)SIM Card Connector ………………………………………. 36 Figure 14: Reference Circuit for Normally Open (U)SIM Card Connector ………………………………………… 37 Figure 15: Reference Circuit for 6-Pin (U)SIM Card Connector ………………………………………………………. 37 Figure 16: Recommended Compatible Design for (U)SIM2 Interface………………………………………………. 38 Figure 17: Reference Circuit for USB Interface …………………………………………………………………………….. 39 Figure 18: Primary Mode Timing…………………………………………………………………………………………………. 41 Figure 19: Auxiliary Mode Timing ……………………………………………………………………………………………….. 41 Figure 20: Reference Circuit of W_DISABLE1# and W_DISABLE2# ………………………………………………. 43 Figure 21: WWAN_LED# Reference Circuit …………………………………………………………………………………. 44 Figure 22: Reference Circuit of WAKE_ON_WAN# ………………………………………………………………………. 45 Figure 23: Recommended Circuit of Configuration Pins ………………………………………………………………… 47 Figure 24: Antenna Connectors on EM061K-GL …………………………………………………………………………… 55 Figure 25: Dimensions of the Receptacle (Unit: mm) …………………………………………………………………….. 55 Figure 26: Dimensions of Mated Plugs (Ø0.81/Ø1.13 mm Coaxial Cables) (Unit: mm) ……………………… 56 Figure 27: Space Factor of Mated Connectors (Ø0.81 mm Coaxial Cables) (Unit: mm)…………………….. 57 Figure 28: Space Factor of Mated Connectors (Ø 1.13 mm Coaxial Cables) (Unit: mm)……………………. 57 Figure 29: Distribution of Heat Source Chips Inside the Module……………………………………………………… 64 Figure 30: Placement and Fixing of the Heatsink ………………………………………………………………………….. 65 Figure 31: Module Top and Side Dimensions……………………………………………………………………………….. 67 Figure 32: Top and Bottom Views of the Module…………………………………………………………………………… 68 Figure 33: Blister Tray Dimension Drawing ………………………………………………………………………………….. 69 Figure 34: Packaging Process ……………………………………………………………………………………………………. 70

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1 Introduction
The hardware design defines the air and hardware interfaces of EM061K-GL which connect to your applications.
This document can help you quickly understand the interface specifications, electrical and mechanical details as well as other related information of EM061K-GL. Besides, reference designs will be offered to exemplify diverse applications of the modules. With this hardware design coupled with application notes and user guides, you can use the modules to design and set up mobile applications easily.
CE Statement Regulatory Conformance Hereby, [Quectel Wireless Solutions Co., Ltd.] declares that the radio equipment type [EM061K-GL] is in compliance with Directive 2014/53/EU. The full text of the EU declaration of conformity is available at the following internet address: http://www.quectel.com/support/technical.htm

The device could be used with a separation distance of 20cm to the human body.
UK Statement Regulations 2017 (SI 2017/1206) Declaration of Conformity Hereby, [Quectel Wireless Solutions Co., Ltd.] declares that [EM061K-GL] is in compliance with the essential requirements and other relevant provisions of the UK Radio Equipment Regulations 2017 (SI 2017/1206).
Product Marketing NameQUECTEL EM061K-GL FCC Certification Requirements According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met: 1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable sourcebased timeaveraging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion

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Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the user’s body and must not transmit simultaneously with any other antenna or transmitter. 3. A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR2023EM061KGL, XMR2023EM061KGL2, XMR2023EM061KGL3 4. To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:

radiation, maximum antenna gain (including cable loss) must not exceed:
Operating Band

FCC Max Antenna GaindBi

IC Max Antenna GaindBi

WCDMA B2

8.00

6.22

WCDMA B4

5.00

5.00

WCDMA B5

9.43

6.13

LTE B2

8.50

8.50

LTE B4

5.50

5.50

LTE B5

9.91

6.62

LTE B7

9.00

9.00

LTE B12

9.20

6.14

LTE B13

9.66

6.46

LTE B14

9.73

6.50

LTE B17

9.24

6.16

LTE B25

8.50

8.50

LTE B26(814-824)

9.86

NA

LTE B26(824-849)

9.91

6.62

LTE B30

0.98

0.98

LTE B38

9.00

9.00

LTE B41

9.00

9.00

LTE B66

5.50

5.50

LTE B71

8.98

5.99

5. This module must not transmit simultaneously with any other antenna or transmitter

6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines.

For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is

required to satisfy the SAR requirements of FCC Part 2.1093 If the device is used for other equipment that separate approval is required for all other operating

configurations, including portable configurations with respect to 2.1093 and different antenna

configurations. For this device, OEM integrators must be provided with labeling instructions of finished products.

Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:

A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID – Section 2.926 (see 2.2

Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining

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to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the module’s FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible; then an additional permanent label referring to the enclosed module: “Contains Transmitter Module FCC ID: XMR2023EM061KGL/XMR2023EM061KGL2/XMR2023EM061KGL3” or “Contains FCC ID: XMR2023EM061KGL/XMR2023EM061KGL2/XMR2023EM061KGL3” must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The user’s manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the user’s authority to operate the equipment. To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring compliance with the module(s) installed and fully operational. For example, if a host was previously authorized as an unintentional radiator under the Supplier’s Declaration of Conformity procedure without a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring that the after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements. Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. IC Statement IRSS-GEN “This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device.” The transmitter module may not be co-located with any other transmitter or antenna. or “Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes : 1) l’appareil ne doit pas produire de brouillage; 2) l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement.” Déclaration sur l’exposition aux rayonnements RF

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L’autre utilisé pour l’émetteur doit être installé pour fournir une distance de séparation d’au moins 20 cm de toutes les personnes et ne doit pas être colocalisé ou fonctionner conjointement avec une autre antenne ou un autre émetteur. The host product shall be properly labeled to identify the modules within the host product. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word “Contains” or similar wording expressing the same meaning, as follows: “Contains IC: 10224A- 23EM061KGL” or “where: 10224A-23EM061KGL is the module’s certification number”. Le produit hôte doit être correctement étiqueté pour identifier les modules dans le produit hôte. L’étiquette de certification d’Innovation, Sciences et Développement économique Canada d’un module doit être clairement visible en tout temps lorsqu’il est installédans le produit hôte; sinon, le produit hôte doit porter une étiquette indiquant le numéro de certification d’Innovation, Sciences et Développement économique Canada pour le module, précédé du mot «Contient» ou d’un libellé semblable exprimant la même signification, comme suit: “Contient IC: 10224A-23EM061KGL ” ou “où: 10224A- 23EM061KGL est le numéro de certification du module”.

1.1. Reference Standards
The module complies with the following standards:
PCI Express M.2 Specification Revision 4.0, Version 1.1 Universal Serial Bus Specification, Revision 4.0 ISO/IEC 7816-3 MIPI Alliance Specification for RF Front-End Control Interface Version 2.0 3GPP TS 27.007 and 3GPP 27.005 3GPP TS 34.121-1 and 3GPP TS 36.521-1

1.2. Special Marks

Table 1: Special Marks

Mark *

Definition
Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface, pin name, AT command, or argument, it indicates that the function, feature, interface, pin, AT

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command, or argument is under development and currently not supported; and the asterisk (*) after a model indicates that the sample of the model is currently unavailable. Brackets ([…]) used after a pin enclosing a range of numbers indicate all pins of the same type. […] For example, SDIO_DATA [0:3] refers to all four SDIO pins: SDIO_DATA0, SDIO_DATA1, SDIO_DATA2, and SDIO_DATA3.

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2 Product Overview

2.1. Frequency Bands and Functions
EM061K-GL are LTE-A/UMTS/HSPA+ wireless communication modules with diversity receiver. They provide data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA networks. They are standard WWAN M.2 Key-B modules. For more details, see PCI Express M.2 Specification Revision 4.0, Version 1.1.
They support embedded operating systems such as Windows, Linux and Android, and also provide GNSS and voice functionality 1 to meet specific application demands.
The following table shows the frequency bands and GNSS functions of the module. For details about CA combinations, you can see document [1].

Table 2: Frequency Bands and GNSS Functions of EM061K-GL

Mode LTE-FDD (with Rx-diversity) LTE-TDD (with Rx-diversity) WCDMA (with Rx- diversity) GNSS

Frequency Band B1/B2/B3/B4/B5/B7/B8/B12/B13/B14/B17 2/B18/B19/B20/B25/B26 /B28/B29 3/B30/B32 3/B66/B71 B34/B38/B39/B40/B41
B1/B2/B3/B4/B5/B6/B8/B19
GPS/GLONASS/BDS/Galileo

The module can be applied to a wide range of applications such as industrial routers, home gateways, settop boxes, industrial laptops, consumer laptops, industrial PDAs, rugged tablet PCs and digital signage, etc.

1 The module contains DataVoice and Data-only version. DataVoice version supports voice and data functions, while Data-only version only supports data function. 2 B17 is supported through MFBI + B12.
3 LTE-FDD B29/B32 and support Rx only and are only for secondary component carrier.

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2.2. Key Features

LTE-A Module Series

Table 3: Key Features

Feature Function Interface Power Supply (U)SIM Interface eSIM
USB Interface
PCM Interface* Rx-diversity Antenna Interfaces Transmitting Power
LTE Features

Details
PCI Express M.2 Interface
Supply voltage: 3.135­4.4 V Typical supply voltage: 3.7 V Compliant with ISO/IEC 7816-3 and ETSI and IMT-2000 Supports (U)SIM card: 1.8/3.0 V Supports Dual SIM Single Standby
Optional eSIM function
Compliant with USB 2.0 specifications, with maximum transmission rates up to 480 Mbps.
Used for AT command communication, data transmission, firmware upgrade (USB 2.0 only), software debugging, GNSS NMEA sentence output, and voice over USB*.
Supports USB serial drivers: – Windows 7/8/8.1/10/11 – Linux 2.6­5.18 – Android 4.x­12.x
Used for audio function through external codecs Supports 16-bit linear data format Supports long and short frame synchronization Supports master and slave modes, but must be the master in long frame
synchronization
LTE/WCDMA
Main antenna connector and RX-diversity/GNSS antenna connector 50 impedance WCDMA: Class 3 (23 dBm ±2 dB) LTE B7/B38/B40/B41: Class 3 (23 dBm ±1 dB) LTE B30: Class 3 (22 dBm ±1 dB) Other bands: Class 3 (23.5 dBm ±1 dB) Supports 3GPP Rel-12 LTE-FDD and LTE-TDD Supports CA category: up to UL CA Cat 6/DL CA Cat 6 Supports modulations:
– UL: QPSK and 16QAM modulations – DL: QPSK, 16QAM and 64QAM modulations Supports 1.4/3/5/10/15/20 MHz RF bandwidths

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UMTS Features
GNSS Features AT Commands Internet Protocol Features Firmware Upgrade
SMS
Physical Characteristics Temperature Range RoHS

Max. transmission data rates: – LTE-FDD: 300 Mbps (DL)/50 Mbps (UL) – LTE-TDD: 226 Mbps (DL)/28 Mbps (UL)
Supports 3GPP Rel-9 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA Supports DL BPSK, QPSK, 16QAM and 64QAM modulations Supports UL BPSK, QPSK DC-HSDPA: Max. 42 Mbps (DL) HSUPA: Max. 5.76 Mbps (UL) WCDMA: Max. 384 kbps (DL)/384 kbps (UL) Supports GPS, GLONASS, BDS and Galileo Data update rate: 1 Hz by default Compliant with 3GPP TS 27.007 and 3GPP TS 27.005 Quectel enhanced AT commands QMI/MBIM/NITZ/HTTP/HTTPS/FTP/LwM2M/PING Supports PAP and CHAP for PPP connections
Via USB 2.0 or DFOTA
Point-to-point MO and MT Text and PDU modes SMS cell broadcast SMS storage: ME by default Windows OS SMS push feature M.2 Key-B Size: 30.0 mm × 42.0 mm × 2.3 mm Weight: approx. 6.2 g Operating temperature range: -25 to +75 °C 4 Extended temperature range: -40 to +85 °C 5 Storage temperature range: -40 to +90 °C
All hardware components are fully compliant with EU RoHS directive

4 To meet this operating temperature range, you need to ensure effective thermal dissipation, for example, by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within the temperature range of -10 °C to +55 °Cthe
mentioned RF performance margins higher than 3GPP specifications can be guaranteed. When temperature goes beyond temperature range of -10 °C to 55 °C, a few RF performances of module may be slightly off 3GPP specifications. 5 To meet this extended temperature range, you need to ensure effective thermal dissipation, for example, by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within this range, the module remains the ability to establish and maintain functions such as voice, SMS, emergency call, etc., without any unrecoverable malfunction. Radio spectrum and radio network are not influenced, while one or more specifications, such as Pout, may undergo a reduction in value, exceeding the specified tolerances of 3GPP. When the temperature returns to the normal operating temperature level, the module will meet 3GPP specifications again.

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2.3. Functional Diagram
The following figure shows a functional diagram of EM061K-GL. Power management Baseband LPDDR2 SDRAM+NAND flash Radio frequency M.2 Key-B interface
Figure 1: Functional Diagram

LTE-A Module Series

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2.4. Pin Assignment

The following figure shows the pin assignment of the module. It is recommended to keep RESERVED pins unconnected. Please contact Quectel for more details if required.

No.

Pin Name

74

VCC

72

VCC

70

VCC

68

NC

66

USIM1_DET

64

RESERVED

62

RESERVED

60

WLAN_PA_EN

58

RFFE_DATA

56

RFFE_CLK

54

RESERVED

52

RESERVED

50

RESERVED

48

USIM2_VDD

46

USIM2_RST

44

USIM2_CLK

42

USIM2_DATA

40

USIM2_DET

38

NC

36

USIM1_VDD

34

USIM1_DATA

32

USIM1_CLK

30

USIM1_RST

28

PCM_SYNC

26

W_DISABLE2#

24

PCM_DOUT

22

PCM_DIN

20

PCM_CLK

Notch

Notch

Notch

Notch

10

WWAN_LED#

8

W_DISABLE1#

6

FULL_CARD_POWER_OFF#

4

VCC

2

VCC

PIN74
BOT
PIN10 PIN2

PIN75
TOP
PIN11 PIN1

Pin Name

No.

CONFIG_2

75

GND

73

GND

71

CONFIG_1

69

RESET#

67

ANTCTL3

65

ANTCTL2

63

ANTCTL1

61

ANTCTL0

59

GND

57

RESERVED

55

RESERVED

53

GND

51

RESERVED

49

RESERVED

47

GND

45

RESERVED

43

RESERVED

41

GND

39

RESERVED

37

RESERVED

35

GND

33

RESERVED

31

RESERVED

29

GND

27

DPR

25

WAKE_ON_WAN#

23

CONFIG_0

21

Notch

Notch

Notch

Notch

GND

11

USB_DM

9

USB_DP

7

GND

5

GND

3

CONFIG_3

1

Figure 2: Pin Assignment

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2.5. Pin Description

Table 4: Definition of I/O Parameters

Type AI AO AIO DI DO DIO OD PI PO PU PD

Description Analog Input Analog Output Analog Input/Output Digital Input Digital Output Digital Input/Output Open Drain Power Input Power Output Pull Up Pull Down

DC characteristics include power domain and rate current, etc.

Table 5: Pin Description

Pin

Pin Name

I/O

No.

1

CONFIG_3

DO

2

VCC

PI

3

GND

4

VCC

PI

Description

DC Comment
Characteristic

Not connected internally

Power supply for the module

Vmin = 3.135 V Vnom = 3.7 V Vmax = 4.4 V

Ground

Power supply for the module

Vmin = 3.135 V Vnom = 3.7 V

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Vmax = 4.4 V

5

GND

Ground

FULLCARD

Turn on/off the module VIHmax = 4.4 V Internally pulled

6

DI, PD High level: turn on

POWER_OFF#

VIHmin = 1.19 V down with a

Low level: turn off

VILmax = 0.2 V 100 k resistor.

7

USB_DP

AIO USB differential data (+)

Test point must be reserved.

Airplane mode control

VIHmin = 1.8 V

8

W_DISABLE1#

DI, PU

Active low

VILmax = 0.4 V

VILmin = -0.4 V

9

USB_DM

AIO USB differential data (-)

Test point must be reserved.

RF status indication LED

10

WWAN_LED#

OD

VCC

Active low

11

GND

Ground

12

Notch

Notch

13

Notch

Notch

14

Notch

Notch

15

Notch

Notch

16

Notch

Notch

17

Notch

Notch

18

Notch

Notch

19

Notch

20

PCM_CLK*

21

CONFIG_0

22

PCM_DIN*

23

WAKEON WAN#*

Notch

DIO, PD

PCM clock

Connected to GND DO
internally DI, PD PCM data input

Wake up the host OD
Active low

VIHmin = 1.8 V VILmax = 0.4 V VOHmin = 1.8 V VOLmax = 0.4 V

VIHmin = 3.3 V VILmax = 0.4 V High-Voltage: Vmin = 3.5 V Vnom = 3.3 V Vmax = 3.0 V

Externally pull up to 1.8 V or 3.3 V.

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Low-Voltage:

Vmin = 1.95 V

Vnom = 1.8 V

Vmax = 1.65 V

24

PCM_DOUT*

DO, PD

PCM data output

VOHmin = 1.8 V VOLmax = 0.4 V

25

DPR

DI, PU Dynamic power reduction VIHmin = 1.8 V High level by

Active low

VILmax = 0.4 V default.

GNSS control

26

W_DISABLE2#* DI, PU

Active low

VIHmin = 1.8 V VILmax = 0.4 V VILmin = -0.4 V

27

GND

Ground

28

PCM_SYNC*

DIO, PCM data frame sync
PD

VIHmin = 1.8 V VILmax = 0.4 V VOHmin = 1.8 V VOLmax = 0.4 V

29

RESERVED

30

USIM1_RST

DO, (U)SIM1 card reset
PD

USIM1_VDD

31

RESERVED

32

USIM1_CLK

DO, (U)SIM1 card clock PD

USIM1_VDD

33

GND

Ground

34

USIM1_DATA

DIO, (U)SIM1 card data
PD

USIM1_VDD

35

RESERVED

36

USIM1_VDD

(U)SIM1 card power PO
supply

High-Voltage: Vmin = 3.05 V Vnom = 2.85 V Vmax = 2.7 V
Low-Voltage: Vmin = 1.95 V Vnom = 1.8 V Vmax = 1.65 V

37

RESERVED

38

NC

Not connected

39

GND

Ground

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40

USIM2_DET 6

(U)SIM2 card hot-swap DI, PD

VIHmin = 1.8 V Internally pulled up

detect

VILmax = 0.4 V to 1.8 V.

41

RESERVED

AO

42

USIM2_DATA

DIO, (U)SIM2 card data
PD

USIM2_VDD

43

RESERVED

44

USIM2_CLK

DO, (U)SIM2 card clock
PD

USIM2_VDD

45

GND

Ground

46

USIM2_RST

DO, (U)SIM2 card reset
PD

USIM2_VDD

47

RESERVED

48

USIM2_VDD

(U)SIM2 card power PO
supply

High-Voltage: Vmin = 3.05 V Vnom = 2.85 V Vmax = 2.7 V
Low-Voltage: Vmin = 1.95 V Vnom = 1.8 V Vmax = 1.65 V

49

RESERVED

50

RESERVED

51

GND

Ground

52

RESERVED

53

RESERVED

54

RESERVED

55

RESERVED

56

RFFE_CLK* 7

DO, Used for external MIPI IC VOHmin = 1.8 V

PD control

VOLmax = 0.4 V

57

GND

Ground

58

RFFE_DATA* 7

DIO, Used for external MIPI IC VIHmin = 1.8 V

PD control

VILmax = 0.4 V

6 This pin is pulled low by default, and will be internally pulled up to 1.8 V by software configuration only when (U)SIM hot-swap is enabled by AT+QSIMDET. For more details, see document [3]. 7 If RFFE_CLK and RFFE_DATA are required, please contact Quectel for more details.

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VOHmin = 1.8 V

VOLmax = 0.4 V

59

ANTCTL0*

DO, Antenna GPIO control
PD

VOHmin = 1.8 V VOLmax = 0.4 V

60

WLAN_PA_EN*

DI PD Self-protection of QLN , control

VIHmin = 1.8 V VILmax = 0.4 V

61

ANTCTL1*

DO, Antenna GPIO control
PD

VOHmin = 1.8 V VOLmax = 0.4 V

62

RESERVED

63

ANTCTL2*

DO, Antenna GPIO control
PD

VOHmin = 1.8 V VOLmax = 0.4 V

64

RESERVED

65

ANTCTL3*

66

USIM1_DET 6

67

RESET#

DO, Antenna GPIO control
PD (U)SIM1 card hot-swap
DI, PD detect
Reset the module DI, PU
Active low

VOHmin = 1.8 V VOLmax = 0.4 V VIHmin = 1.8 V VILmax = 0.4 V VIHmax = 2.1 V VIHmin = 1.3 V VILmax = 0.5 V

Internally pulled up to 1.8 V. Internally pulled up to 1.8 V with a 10 k resistor.

68

NC

Not connected

69

CONFIG_1

70

VCC

Connected to GND DO
internally Power supply for the PI module

Vmin = 3.135 V Vnom = 3.7 V Vmax = 4.4 V

71

GND

Ground

72

VCC

Power supply for the PI
module

Vmin = 3.135 V Vnom = 3.7 V Vmax = 4.4 V

73

GND

Ground

74

VCC

Power supply for the PI
module

Vmin = 3.135 V Vnom = 3.7 V Vmax = 4.4 V

75

CONFIG_2

DO Not connected internally

NOTE Keep all NC and unused pins unconnected.

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LTE-A Module Series
2.6. EVB Kit
To help you develop applications conveniently with EM061K-GL, Quectel supplies an evaluation board (5G-M2 EVB). For more details, see document [2].

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3 Operating Characteristics

3.1. Operating Modes
The table below summarizes different operating modes of the module.

Table 6: Overview of Operating Modes

Mode
Full Functionality Mode
Minimum Functionality Mode Airplane Mode Sleep Mode
Power Down Mode

Details
Software is active. The module has registered on the Idle
network, and it is ready to send and receive data. Network is connected. In this mode, the power consumption Voice/Data is decided by network setting and data transfer rate. AT+CFUN=0 sets the module to a minimum functionality mode without removing the power supply. In this mode, both RF function and (U)SIM card are invalid. AT+CFUN=4 or driving W_DISABLE1# pin low will set the module to airplane mode. In this mode, the RF function is invalid. The module keeps receiving paging messages, SMS, voice call and TCP/UDP data from the network with its power consumption reduced to the minimal level. In this mode, the power management unit shuts down the power supply. Software is inactive, while all interfaces are inaccessible and the operating voltage (connected to VCC) remains applied.

NOTE For more details about the AT command, see document [3].

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3.2. Sleep Mode
In sleep mode, DRX (Discontinuous Reception) of the module is able to reduce the power consumption to a minimum level, and DRX cycle index values are broadcasted by the wireless network. The figure below shows the relationship between the DRX run time and the power consumption in sleep mode. The longer the DRX cycle is, the lower the power consumption will be.

Power Consumption

DRX OFF ON OFF ON OFF ON OFF ON OFF
Run Time
Figure 3: DRX Run Time and Power Consumption in Sleep Mode

The following part of this chapter describes the power saving procedure and sleep mode entrance of the module.
If the host supports USB suspend/resume and remote wakeup function, the following two conditions must be met simultaneously to bring the module into sleep mode.
Execute AT+QSCLK=1. The host’s USB bus, which is connected to the module’s USB interface, enters suspend state.
The following figure shows the connection between the module and the host.

Module

Host

USB Interface GND

USB Interface GND

Figure 4: Sleep Mode Application with USB Remote Wakeup Function The module will wake up when the host sends data to the module through USB interface.

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3.3. Airplane Mode
Execution of AT+CFUN=4 or driving W_DISABLE1# pin low will set the module to airplane mode. For more details, see Chapter 4.4.1.

3.4. Communication Interface with Host
The module supports communication with the host through USB interface. USB 2.0 should be reserved for firmware upgrade. See the USB mode features as below:
USB Mode:
Supports all USB 2.0 features. Supports MBIM/QMI/QRTR/AT.

3.5. Power Supply

3.5.1. Power Supply Pins

Table 7: Definition of VCC and GND Pins

Pin No. 2, 4, 70, 72, 74 3, 5, 11, 27, 33, 39, 45, 51, 57, 71, 73

Pin Name I/O Description Comment

VCC

Vmin = 3.135 V

Power supply

PI

Vnom = 3.7 V

for the module

Vmax = 4.4 V

GND

Ground

3.5.2. Reference Design for Power Supply
The performance of the module largely depends on the power supply design. The continuous current of the power supply should be 3 A at least and the peak current should be 4 A at least. In case of a slight difference between input and output voltages, use an LDO when supplying power to the module. In case of a large difference between input and desired output (typically 3.7 V) voltages, using a buck DC-DC converter is preferred.
The following figure shows a reference design for +5 V input power supply based on DC-DC converter.

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The typical output of the power supply is about 3.7 V.

PWR_IN

U1

VIN

PH

D1

C1 C2 C3

R1 205K

VIN

PH

VIN

PH

EN

BOOT

TVS 470 F 100 nF 33 pF

R2

VFB

80.6K

VSNS COMP RT/CLK

PWRGD GND GND

R3 R4

SS

AGND

EP

R7

10K 182K

PWR_EN

4.7K

Q1

R8

NPN

C5 C4

C7

47K

NM 10 nF

10 nF

L1 1.5 H

PWR_OUT

C6 100 nF
PWRGD
VFB

C8

C9 C10 C11

220 F 100 nF 33 pF 10 pF

R5 383K 1 % R6 100K 1 %

Figure 5: Reference Circuit for Power Supply

NOTE
To avoid corrupting the data in the internal flash, do not cut off the power supply before the module is completely turned off, and do not cut off power supply directly when the module is working.

3.5.3. Voltage Stability Requirements
The power supply of the module ranges from 3.135 V to 4.4 V. Please ensure that the input voltage never drops below 3.135 V, otherwise the module will be powered off automatically. The following figure shows the maximum voltage drop during burst transmission in 3G/4G networks.

Load (A)

Burst Transmission

VCC (V)
Voltage Drop 3.135 V

Burst Transmission

Voltage Ripple < 100 mV

Figure 6: Power Supply Limits During Burst Transmission
To decrease the voltage drop, two bypass capacitors of about 220 µF with low ESR (ESR = 0.7 ) should be used. To avoid disturbing the power supply, two multi-layer ceramic chip capacitor (MLCC) arrays also should be used due to their ultra-low ESR. It is recommended to use eight ceramic capacitors (1 µF, 100 nF, 33 pF, 10 pF) to compose the MLCC arrays, and to place these capacitors close to VCC pins. The width of VCC trace should be not less than 2.5 mm. In principle, the longer the VCC trace is, the wider it should be.

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In addition, to guarantee the stability of the power supply, please use a TVS component with a reverse TVS voltage of 5.1 V and a dissipation power higher than 0.5 W. The following figure shows a reference circuit of the VCC.

VCC (3.3 V Typ.)

Module
VCC 2, 4

C2 C4

C6 C8 C10

220 F 1 F 100 nF 33 pF 10 pF

APT

GND 3, 5, 11

VCC 70, 72, 74

D1

C1 C3

C5 C7

C9

5.1 V 220 F 1 F 100 nF 33 pF 10 pF

GND

27, 33, 39, 45, 51, 57,

71, 73

PMU

Figure 7: Reference Circuit for VCC Pins

3.5.4. Power Supply Voltage Monitoring
You can use AT+CBC to monitor the voltage value of VCC. For more details, see document [3].

3.6. Turn On
FULL_CARD_POWER_OFF# serves to turn on/off the module. This input signal is 3.3 V tolerant and can be driven by either 1.8 V or 3.3 V GPIO. Also, it has been internally pulled down with a 100 k resistor. When FULL_CARD_POWER_OFF# is de-asserted (driven high, 1.19 V), the module will be turned on.

Table 8: Pin Definition of FULL_CARD_POWER_OFF#

Pin No. Pin Name FULLCARD
6 POWER_OFF#

I/O

Description

DI, PD

Turn on/off the module High level: turn on Low level: turn off

Comment
Internally pulled down with a 100 k resistor

It is recommended to use a host GPIO to control FULL_CARD_POWER_OFF#. A simple reference circuit is illustrated in the following figure.

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Host
GPIO

1.8 V or 3.3 V

Module

FULL_CARD_POWER_OFF#

D 6 GS
R1 100K

PMU

NOTE: The voltage of pin 6 should be not less than 1.19 V when it is at high level.
Figure 8: Turn on the Module Using Host GPIO

The turn-on timing is illustrated in the following figure.
T1 VCC

RESET#

1.19 V VIH 4.4 V

FULL_CARD_POWER_OFF# VIL 0.2 V

Module State

OFF

T2
Booting

Active

Figure 9: Turn-on Timing of the Module

Table 9: Turn-on Timing of the Module

Symbol Min. Typ.

T1

30 ms –

T2

–

TBD

Max. –

Comment The turn-on time of the module. The system booting time of the module.

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3.7. Turn Off

If the module is turned off using a host GPIO, when VCC is supplied with power, pulling down FULL_CARD_POWER_OFF# pin ( 0.2 V) will turn off the module normally. The turn-off timing is illustrated in the following figure.

VCC
FULLCARD POWER_OFF#

Module Status

Active

Turn-off procedure

T1

NOTE: As shown by the dotted line, it is suggested to disconnect VCC after the module shuts down.

OFF

Figure 10: Turn-off Timing of the Module

Table 10: Turn-off Timing of the Module

Symbol Min.

T1

TBD

Typ. –

Max. –

Comment The turn-off time of the module

3.8. Reset
The RESET# pin serves to reset the module. Triggering the RESET# signal will lead to loss of all data from the modem and removal of system drivers. It will also lead to disconnection of the modem from the network.

Table 11: Pin Definition of RESET#

Pin No. 67

Pin Name RESET#

I/O DI, PU

Description
Reset the module Active LOW

Comment
Internally pulled up to 1.8 V with a 10 k resistor.

The module can be reset by pulling down the RESET# pin for 250­600 ms. An open collector (OC)/drain driver or a button can be used to control the RESET# pin.

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LTE-A Module Series

Host
Reset pulse GPIO
R4 1K

R3 100K

Module

RESET# 67

1.8 V
R1 10K

R2
1K Q1

250­600 ms

PMIC

Figure 11: Reference Circuit for RESET# with Open Collector Driving Circuit The reset timing is illustrated in the following figure.

VCC RESET#

Active

Resetting T

Figure 12: Reset Timing of the Module

Restarting

Table 12: Reset Timing of the Module

Symbol T

Min.

Typ.

Max. Comment

250 ms

400 ms

500 ms

RESET# should be pulled down for 250­500 ms. Asserting time of less than 250 ms is unreliable and asserting time higher than 500 ms will cause repeated reset.

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LTE-A Module Series

4 Application Interfaces
The physical connections and signal levels of the module comply with the PCI Express M.2 specification. This chapter mainly describes the definition and application of the following interfaces/pins of the module:
(U)SIM interfaces USB interface PCM interface Control and indication interfaces Antenna Tuner Control Interface Configuration pins

4.1. (U)SIM Interfaces
The (U)SIM interface circuitry meets ETSI and IMT-2000 requirements and ISO/IEC 7816-3. Both Class B (3.0 V) and Class C (1.8 V) (U)SIM cards are supported, and dual SIM single standby function is supported.

4.1.1. Pin definition of (U)SIM

Table 13: Pin Definition of (U)SIM Interfaces

Pin No. Pin Name

36

USIM1_VDD

34

USIM1_DATA

32

USIM1_CLK

30

USIM1_RST

66

USIM1_DET

I/O PO DIO, PD DO, PD DO, PD DI, PD

Description (U)SIM1 card power supply (U)SIM1 card data (U)SIM1 card clock (U)SIM1 card reset (U)SIM1 card hot-swap detect

40

USIM2_DET

DI, PD

(U)SIM2 card hot-swap detect

42

USIM2_DATA DIO, PD (U)SIM2 card data

Comments
Internally pulled up to 1.8 V. Internally pulled up to 1.8 V.

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44

USIM2_CLK

DO, PD

(U)SIM2 card clock

46

USIM2_RST

DO, PD

(U)SIM2 card reset

48

USIM2_VDD

PO

(U)SIM2 card power supply

LTE-A Module Series

4.1.2. (U)SIM Hot-Swap
The module supports (U)SIM card hot-swap via (U)SIM card hot-swap detect pins USIM1_DET and USIM2_DET. (U)SIM card insertion can be detected by high/low level. (U)SIM card hot-swap function is disabled by default.

The following command configures (U)SIM card hot-swap detection.

AT+QSIMDET Configure (U)SIM Card Hot-swap Detection

Test Command AT+QSIMDET=?

Response +QSIMDET: (list of supported s),(list of supported