Lenovo P5 Future Proof Industry Workhorse

Product Information

Specifications

• CPU: 4th Generation Intel Xeon Scalable Processor E6 Socket LGA-477)
• Operating System Support: Windows 11, Windows 10, Ubuntu 20.04 LTS
• Memory: Up to 8 DDR4 DIMMs, 288-Pin, ECC RDIMM, Up to 4800MHz, Max System Memory Size: 512GB
• Storage: 3 SATA 3.0 connectors, 2 M.2 PCIe connectors, 1 Flex Bay Drive
• Video: Integrated Graphics, Multi-GPU Support
• Front I/O: USB-A Gen 1, USB-A Gen 2, USB-C Gen 2, Audio Jack, Media Card Reader, Flex Bay
• Rear I/O: USB-A, Audio Jack, DisplayPort, HDMI, Serial Port, Ethernet, PS/2, Network Adapter

Product Usage Instructions

Installation

To install the Lenovo ThinkStation P, follow the steps below:

1. Unpack the product and place it in a suitable location.
2. Connect the necessary cables to the power supply and other peripherals.
3. Turn on the power and follow the on-screen instructions to complete the initial setup.

Memory Configuration

To configure the memory of the Lenovo ThinkStation P, follow the steps below:

1. Locate the memory slots on the motherboard.
2. Insert the DDR4 DIMMs into the slots, ensuring they are properly aligned.
3. If necessary, refer to the CPU specifications to determine the maximum memory supported.

Storage Configuration

To configure the storage of the Lenovo ThinkStation P, follow the steps below:

1. Identify the SATA connectors and M.2 PCIe connectors on the motherboard.
2. Connect the SATA cables to the SATA connectors for traditional hard drives or SSDs.
3. Insert the M.2 PCIe drives into the corresponding M.2 slots.

FAQ

• Q: What operating systems are supported by the Lenovo ThinkStation P?
• A: The Lenovo ThinkStation P supports Windows 11, Windows 10, and Ubuntu 20.04 LTS.
• Q: How many memory slots are available in the Lenovo ThinkStation P?
• A: The Lenovo ThinkStation P has up to 8 DDR4 DIMM slots for memory configuration.
• Q: What types of storage drives can be used with the Lenovo ThinkStation P?
• A: The Lenovo ThinkStation P supports SATA drives and M.2 PCIe drives for storage.
• Q: Does the Lenovo ThinkStation P support multi-GPU configurations?
• A: Yes, the Lenovo ThinkStation P supports multi-GPU configurations.

Downloads

Hardware Maintenance Manual| P5 HMM
---|---
Drivers & Software| P5 Drivers & Software
Available Whitepapers| Power Configurator Memory Configurator Storage Configurator Windows 11 Installation Windows 10 Installation

Red Hat Enterprise Linux 9 Installation Ubuntu Linux 22.04 LTS Installation

SECTION I: Platform Overview

Description| Engineered for ultimate versatility, the Lenovo ThinkStation P5 is the all- around industry workhorse for professionals that demand scalable, future-proof solutions. Featuring an all-new Aston Martin-inspired chassis design, the latest Intel® Xeon® W processors, and support for up to two NVIDIA RTX™ A6000 graphics cards, you can rely on the P5 to pack enough punch for any workflow, even in mission-critical environments.
---|---

CPU

Operating Systems

Preloaded| Windows 11 Pro 64-bit for Workstation Windows 10 Pro 64-bit for Workstation Windows 10 IOT

Ubuntu 22.04 LTS (configuration specific)

---|---
Supported| Windows 10 Enterprise Edition Red Hat Enterprise Linux 9.x Ubuntu 22.04 LTS
Disclaimers|

Memory

Storage

2280 Flex Bay Drive
Disclaimers| *See Storage Whitepaper for details on the available usage options.

Video

Slots

Front I/O

USB| 1 x USB-A 3.2 Gen 2 (10Gbps)

1 x USB-A 3.2 Gen 2 (10Gbps) (with Always On Charging) 2 x USB-C 3.2 Gen 2 (10Gbps)

---|---
Audio| 1 x 3.5mm Global Headset Jack (Headphone + Mic in)
Media Card Reader| 15-in-1 Media Card Reader
Flex Bay| Front access drive bay
Disclaimers| Note: Actual USB throughout will vary depending on the type and quantity of USB devices used.

Rear I/O

USB| 2 x USB-A 2.0 (480Mbps)

4 x USB-A 3.2 Gen 1 (10Gbps)

1 x USB-C 3.2 Gen 2×2 (20Gbps)

---|---
Audio| 2 x Rear (Line Out, Line In retasked as Mic)
DisplayPort| As Supported by GPU
HDMI| As Supported by GPU
Serial Port| Optional 1x Rear Port
Ethernet| 1 x 1GbE – RJ45
PS/2| Optional PS/2 (2 port) PCIe adapter
Optional Network Adapter| Bitland RTL8168H 1000M PCIe Ethernet Adapter

Intel I210-T1 Single Port Gigabit PCIe Ethernet Adapter Intel I350-T2 Dual Port Gigabit PCIe Ethernet Adapter Intel I350-T4 Quad Port Gigabit PCIe Ethernet Adapter Intel AX211 WIFI (via onboard M.2) with Internal Antennas

Disclaimers| Note: Actual USB throughout will vary depending on the type and quantity of USB devices used.

Ethernet

Audio

1 x Front 3.5mm Global Headset Jack (Headphone + Mic in)

Chipset| Realtek ALC897Q (rear) Realtec ALC4032 (front)
Number of Channels| Rear Audio: 2 Channels Front Audio: 2 Channels
Number of Bits/Audio Resolution| Rear Codec:

10 Channel DAC Supports 16/20/24-bit PCM 2 Stereo ADC Supports 16/20/24-bit PCM Front Codec:

One stereo DAC supports 8/16/22.05/24/32/44.1/48/96/176.4/192KHz Sample Rate, 16/24-bit

One stereo ADC supports 8/16/22.05/24/32/44.1/48/96KHz Sample Rate, 16/24-bit

Disclaimers| *Note: Audio Codec ALC897Q can support 7.1 channel, but motherboard only has 2 rear jacks – MIC in and Line out, only 2 channel for Line out.

Thermal

Temp Sensors| Ambient Cabled Sensor – Thermistor, MB Header cabled to chassis front bezel

PCIe Zone 1 Sensor – Thermistor PCIe Zone 2 Sensor – Thermistor PCIe Zone 3 Sensor – Thermistor

M.2 Zone 1 Sensor – Thermistor

M.2 Zone 2 Sensor – Thermistor VCORE Thermal Sensor – Thermistor HDD Bay – Thermistor

Flex Bay Sensor – 1 I2C Temp Sensor, placed at Flex Bay

---|---
Fans| 1 x Front Fan (FRONT_FAN) – 4-pin header with 3-pin key 1 x Rear Fan (REAR_FAN) – 4-pin header with 3-pin key

1   x CPU 1 Fan (CPU_FAN) – 4-pin header with 3-pin key

2     x DDR5 Fan (DUCT_FANX) – 4-pin header with 3-pin key

1 x HDD Optional Fan (HDD_FAN) – 4-pin header with 3-pin key

1 x Flex Bay Optional Fan (FLEX_BAY_FAN) – 4-pin header with 4-pin key

PSU1 Fans – provided by PSU vendor

Power Specifications

1000W 6A-12A

Graphics| Up to 4 x 8-pin (6+2) PCIe
Power Supply Fan| Yes
ENERGY STAR® Qualified (config dependent)| Yes
80 PLUS Compliant| Yes
Built-in Self Test (BIST) LED| Yes
Disclaimers| Quantity of Graphics power cables is configuration-dependent

*See Power Configuration Whitepaper for additional details.

BIOS

Chassis Information

Optional: 1000W, Autosensing, 92% PSU, 80 PLUS Platinum Qualified
Thermal Solutions| 1 Rear Fan

1 Front Fan

1 CPU Fan

1   Fan HDD Bay (Optional) 1 Fan Flex Bay (Optional) 2 Memory Fans

2     PSU Fans

Dimensions| 440mm/17.3″ H (without feet) 446mm/17.6″ H (with feet)
 | 453.9mm/17.9″ D

165mm/6.5″ W

---|---
Weight| 19kg /41.9lbs
Disclaimers|

Packaging Dimensions

Security & Serviceability

Restore CD/DVD/USB Set| Not Included, Restore Media Available via Lenovo Download Recovery Service

or available through Lenovo Support.

---|---
Disclaimers| *Note: CPU Heatsink assembly requires a T30 bit.

Operating Environment

Storage: -10⁰C to 60⁰C (14⁰F to 140⁰F) Without Carton
Humidity| Relative Humidity Operating: 10% to 80% (non-condensing) Relative Humidity Storage/Transit: 10% to 90% (non-condensing) Wet Bulb Temperature Operating: 25⁰C (77⁰F) max

Wet Bulb Temperature Non-operating: 40⁰C (104⁰F) max

Altitude| Upper limits decrease 1°C (1.8°F) per 300 m (1000 ft) above sea level
Vibration| Operating Vibration:

Random,0.27G at 5-500 Hz, 30 Minutes Per Surface (X,Y,Z) Non-Operating Vibration:

Random,1.04G at 2-200 Hz, 15 Minutes Per Surface (±X,±Y,±Z)

Shock| Operating: X,Y axis: +- 15G/3ms Z axis: +- 30G/3ms Operating (Rack mounted): X,Y,Z axis: +- 15G/3ms

Non-operating target: Trapezoidal shock, 35g average, 11ms

Disclaimers|

SECTION II: Platform Detail

Motherboard Core

(FPIO)
Ethernet| Intel 1Gb I219
Disclaimers|

Supported Components

Xeon W5-2455X Intel Xeon W5-2445 Intel Xeon W3-2435 Intel Xeon W3-2425 Intel Xeon W3-2423
Memory Type| RDIMMs – 4800MHz, CPU Dependent
Memory| 16GB DDR5 ECC RDIMM PC5-4800

32GB DDR5 ECC RDIMM PC5-4800

64GB DDR5 ECC RDIMM PC5-4800

Disclaimers| Additional CPU SKUs Certified

Storage

3.5″ SATA Hard Disk Drive (HDD)| 2TB SATA – 7200rpm, 6Gb/s, 3.5″

6TB SATA – 7200rpm, 6Gb/s, Enterprise, 3.5″ 12TB SATA – 7200rpm, 6Gb/s, Enterprise, 3.5″

---|---
2.5″ SAS Hard Disk Drive (HDD)|
2.5″ SATA Hard Disk Drive (HDD)|
2.5″ SATA Solid State Drive (SSD)|
M.2 PCIe Solid State Drive (SSD)| 512GB M.2 PCIe – SSD, 2280, Gen4 (x4), NVMe, TLC, OPAL2.0

1024GB M.2 PCIe – SSD, 2280, Gen4 (x4), NVMe, TLC, OPAL2.0

2048GB M.2 PCIe – SSD, 2280, Gen4 (x4), NVMe, TLC, OPAL2.0

4096GB M.2 PCIe – SSD, 2280, Gen4 (x4), NVMe, TLC, OPAL2.0

U.2 PCIe Solid State Drive (SSD)|
PCIe Add-in-Card Solid State Drive (SSD)|
Intel Optane Storage Technology|
Disclaimers| Additional Storage Devices Certified

RAID

capabilities of the RAID controller due to dependencies on the number and capacity of physical disks in the system and on customer requirements for performance, fault tolerance, or data redundancy.

Max supported RAID 0/1/5/10.

Optional Hard Disk Drive Controllers|
Intel VROC| Intel Virtual RAID On CPU (VROC) – Basic, Supports 0/1/10

Intel Virtual RAID On CPU (VROC) – Premium, Supports 0/1/5/10

Disclaimers| *NOTE: Some features available after launch

Optical Drive/Removable Media

Disclaimers|

---|---

Keyboard and Pointing Devices

Keyboard| USB Traditional Keyboard PS/2 Traditional Keyboard Smart Card Keyboard USB Calliope Keyboard
---|---
Pointing Devices| USB Fingerprint Mouse USB Calliope Mouse

PS/2 Black Optical Mouse

Disclaimers|

Expansion Bays

PCIe Adapters

Network| Bitland RTL8168H 1000M PCIE Ethernet Adapter Intel I210-T1 Single Port Gigabit Ethernet Adapter Intel I350-T2 Dual Port Gigabit Ethernet Adapter Intel I350-T4 Quad Port Gigabit Ethernet Adapter

Intel X550-T2 Dual Port Copper 10Gb Ethernet Adapter

Intel X710-DA2 Dual Port 10G Ethernet Converged Network Adapter

---|---
Thunderbolt|

USB|
---|---
WiFi Cards| Intel PCIe WiFi Card With BT Internal Antenna Kit (AX211)
PS/2| PS/2 (2 Port) PCIe adapter
Com port| Serial COM port cable with 5V transceiver
PCIe to M.2 Adapter Card| ThinkStation Quad AIC Gen 3 M.2 Adapter
Disclaimers| Note: The Intel X710 requires SFP+ modules for operation

SECTION III: Supported Component Detail

CPU Specifications

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---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---

of Cores| 2

8

| 2

4

| 1

8

| 1

8

| 1

6

| 1

6

| 1

2

| 2

2

| 8| 8| 2

0

| 6| 4| 4| 1

4

| 1

6

| 1

2

| 1

0

| 1

6

| 1

2

| 8| 1

2

| 1

0

| 1

of Threads| 5

6

| 4

8

| 3

6

| 3

6

| 3

2

| 3

2

| 2

4

| 4

4

| 1

6

| 1

6

| 4

0

| 1

2

| 8| 8| 2

8

| 3

2

| 2

4

| 2

0

| 3

2

| 2

4

| 1

6

| 2

4

| 2

0

|
Processor Base Frequency| 2

. 7

G H

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| 2

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| 3

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| 3

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| 2

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| 2

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Max Turbo Frequency| 4

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| 3

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G H

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| 4

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| 3

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| 3

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Cache| 3

5

M B

| 3

3

M B L 3

| 2

4

.7

5

M B

| 2

4

.7

5

M B L 3

| 2

2

M B

| 2

2

M B L 3

| 2

4

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5

M B L 3

| 3

0

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M B

| 2

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M B

| 2

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M B L 3

| 2

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M B

| 1

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M B L 3

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M B

| 1

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M B L 3

| 1

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M B L 3

| 2

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M B

| 1

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M B L 3

| 1

7

5

M B L 3

| 2

2

M B

| 1

6

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M B L 3

| 1
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---
TDP| 2

0

5

W

| 15

0

W

| 2

0

0

W

| 2

0

0

W

| 15

0

W

| 15

0

W

| 15

0

W

| 12

5

W

| 13

0

W

| 13

0

W

| 12

5

W

| 11

5

W

| 10

5

W

| 10

5

W

| 10

5

W

| 12

5

W

| 10

5

W

| 8

5

W

Intel ARK Spec Link| I

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| I

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| I

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| I

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| I

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Disclaimers|  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  | |  |  |  |  |  |  |  |  |  |

HDD Specifications

c| 500GB SATA –

7200rpm, 6Gb/s, 2.5″

| 1TB SATA –

7200rpm, 6Gb/s, 3.5″

| 2TB SATA –

7200rpm, 6Gb/s, 3.5″

| 4TB SATA –

7200rpm, 6Gb/s, 3.5″

| 6TB SATA –

7200rpm, 6Gb/s, 3.5″

---|---|---|---|---|---
3.5″ SATA Hard Disk Drive (HDD)| Not Available| Yes| Yes| Yes| Yes
2.5″ SATA Hard Disk Drive (HDD)| Yes| Not Available| Not Available| Not Available| Not Available
Connector| SATA| SATA| SATA| SATA| SATA
Transfer Rate (Gb/sec)| 160MB/s OD

read

| Average data rate, read/write 156MB/s| Average data rate, read/write 156MB/s| Sustained data transfer rate 216 – 226MB/s| Sustained data transfer rate 216 – 226MB/s
Spindle Speed (RPM)| 7,200| 7,200| 7,200| 7,200| 7,200
DC Power to Drive Ready (sec)| 3.5| <10.0| <17.0| <17.0| <17.0
Average Latency (msec)| 4.2| 4.16| 4.16| 4.16| 4.16
Input (VDC)| 5| 5| 5| 5| 5
Typical (Watts)| 1.9| 6.19| 6.7| 7.35| 8.13
Idle (Watts)| 0.7| 4.6| 4.5| 5.45| 6.21
Physical Dimensions| 69.85mm x 100.34mm x 7mm| 101.6mm x 146.99mm x 19.88mm| 101.6mm x 146.99mm x 26.1mm| 101.85mm x 147mm x 26.1mm| 101.85mm x 147mm x 26.1mm
---|---|---|---|---|---
Weight (grams)| 90| 420| 535| 680| 705
Operating (C) Ambient| 0 to 60| 0 to 60| 0 to 60| 5 to 60| 5 to 60
Operating (C) Base Casting| 60| 60| 60| 60| 60
Non-Operating (C) Ambient| (-40 to 70)| (-40 to 70)| (-40 to 70)| (-40 to 70)| (-40 to 70)
Gradient (C per Hour)| 20| 20| 20| 20| 20
Operating (Gs @ 2ms)| 400| 70| 80| Read 70 Gs

/ Write 40 Gs

| Read 70 Gs

/ Write 40 Gs

Non-Operating (Gs @ 2ms)| 1000| 350| 300| 300| 250
Disclaimers|  |  |  |  |

Solid State Storage Specifications

Drive| 256G B 2.5″ SATA SSD| 512G B 2.5″ SATA SSD| 1TB

2.5″ SATA SSD

| 2TB

2.5″ SATA SSD

| 256G B NVM e M.2 SSD TLC| 512G B NVM e M.2 SSD TLC| 1024

GB NVM e M.2 SSD TLC

| 2048

GB NVM e M.2 SSD TLC

| 480

GB AIC

Opta ne™ SSD

| 1.5TB U.2

Opta ne ™ SSD

---|---|---|---|---|---|---|---|---|---|---
Dimensions Millimeters (W x D x H)| 70 x

100 x

7.0

| 70 x

100 x

7.0

| 70 x

100 x

7.0

| 70 x

100 x

7.0

| 22 x

80 x

2.3

| 22 x

80 x

2.3

| 22 x

80 x

2.3

| 22 x

80 x

2.3

| 20 x

168 x

104

| 70 x

100 x

15

Interface Type| SATA

-III

| SATA

-III

| SATA

-III

| SATA

-III

| PCIe

Gen 3.0

x4 NVM

e

| PCIe

Gen 3.0

x4 NVM

e

| PCIe

Gen 3.0

x4 NVM

e

| PCIe

Gen 3.0

x4 NVM

e

| PCIe

Gen 3.0

x4 NVM

e

| PCIe

Gen 3.0

x4 NVM

e

Power Active (AVG)| 1.8W| 1.9W| 2.2W| 6W| 5W| 5W| 5W| 5W| 18W| 18W
Power Idle| 50m W| 50m W| 50m W| 50m W| 50m W| 50m W| 50m W| 50m W| 7W| 7W
Typical Sequential Read| 540

MB/s

| 540

MB/s

| 540

MB/s

| 530

MB/s

| 300

0MB

/s

| 3200

MB/s

| 3200

MB/s

| 3500

MB/s

| 2700

MB/s

| 2700

MB/s

Typical Sequential Write| 500

MB/s

| 500

MB/s

| 500

MB/s

| 500

MB/s

| 1300

MB/s

| 1600

MB/s

| 1600

MB/s

| 300

0MB

/s

| 2200

MB/s

| 2200

MB/s

Operating Temperature Range| 0 to 55°C| 0 to 55°C| 0 to 55°C| 0 to 55°C| 0 to 55°C| 0 to 55°C| 0 to 55°C| 0 to 55°C| 0 to 85°C| 0 to 85°C
Endurance Rating (Lifetime Writes)| 85TB| 150T B| 300T B| 600T B| 85TB| 150T B| 300T B| 600T B| 8.76

PB

| 27.3P B
Mean Time Between Failures (MTBF)| 2.0M POH| 2.0M POH| 2.0M POH| 2.0M POH| 2.0M POH| 2.0M POH| 2.0M POH| 2.0M POH| 2.0M POH| 2.0M POH
Hardware Encryption| AES 256

bit

| AES 256

bit

| AES 256

bit

| AES 256

bit

| AES 256

bit

| AES 256

bit

| AES 256

bit

| AES 256

bit

| No| No
Disclaimers| SSD performance measured with Crystal Disk Mark version|  |

HDD Controllers

Optical Drive Specifications

Relative Humidity|
---|---
Maximum Wet Bulb Temperature|
Disclaimers|

Integrated Graphics Adapter

Disclaimers|

---|---

Discrete Graphics Adapter

c| Qu ad ro P4 00| Qu ad ro P6 20| Qu ad ro P1 00

0

| Qu ad ro P2 20

0

| T4 00| T6 00| T1 00

0

| Qu ad ro RT X 40

00

| Qu ad ro RT X 50

00

| Qu ad ro RT X 60

00

| Qu ad ro RT X 80

00

| RT X A4 00

0

| RT X A5 00

0

| RT X A6 00

0

| Qu ad ro GV 10

0

---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---
Bus Interface| PC

Ie 3.

0

x1 6

| PC

Ie 3.

0

x1 6

| PC

Ie 3.

0

x1 6

| PC

Ie 3.

0

x1 6

| PC

Ie 3.

0

x1 6

| PC

Ie 3.

0

x1 6

| PC

Ie 3.

0

x1 6

| PC

Ie 3.

0

x1 6

| PC

Ie 3.

0

x1 6

| PC

Ie 3.

0

x1 6

| PC

Ie 3.

0

x1 6

| PC

Ie 4.

0

x1 6

| PC

Ie 4.

0

x1 6

| PC

Ie 4.

0

x1 6

| PC

Ie 3.

0

x1 6

Display Interface| 3 x m DP 1.4| 4

x m DP 1.4

| 4

x m DP 1.4

| 4

x DP 1.4

| 3 x m DP 1.4| 4

x m DP 1.4

| 4

x m DP 1.4

| 3 x DP 1.4

1 x Vir tu alL ink

| 4

x DP 1.4

1 x Vir tu alL ink

| 4

x DP 1.4

1 x Vir tu alL ink

| 4

x DP 1.4

1 x Vir tu alL ink

| 4

x DP 1.4

a

| 4

x DP 1.4

a

| 4

x DP 1.4

a

| 4

x DP 1.4

---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---
Graphics Chipset| Pa sc al| Pa sc al| Pa sc al| Pa sc al| Tu rin g| Tu rin g| Tu rin g| Tu rin g| Tu rin g| Tu rin g| Tu rin g| A

m pe re

| A

m pe re

| A

m pe re

| Vo lta
Memory Clock Frequency (MHz)| 1003

MHz

| 1252

MHz

| 1253

MHz

| 1251

MHz

| 1625

MHz

| 1750

MHz

| 1750

MHz

| 1750

MHz

| 2000

MHz

| 858

MHz

Memory Size| 2G B G D DR 5| 2G B G D DR 5| 4G B G D DR 5| 5G B G D DR 5X| 2G B G D DR 6| 4G B G D DR 6| 4G B G D DR 6| 8G B G D DR 6| 16

GB G D DR 6

| 24

GB G D DR 6

| 48

GB G D DR 6

| 16

GB G D DR 6

| 24

GB G D DR 6

| 48

GB G D DR 6

| 32

GB HB M2

Memory Interface| 64

–

bit

| 12

8-

bit

| 12

8-

bit

| 16

0-

bit

| 64

–

bit

| 12

8-

bit

| 12

8-

bit

| 25

6-

bit

| 25

6-

bit

| 38

4-

bit

| 38

4-

bit

| 25

6-

bit

| 38

4-

bit

| 38

4-

bit

| 40

96

–

bit

Memory Bandwidth| Up to 32 GB

/s

| Up to 80 GB

/s

| Up to 82 GB

/s

| Up to 20

0G

B/ s

| 80

GB

/s

| 16

0G

B/ s

| 16

0G

B/ s

| Up to 41

6G

B/ s

| Up to 44

8G

B/ s

| Up to 67

2G

B/ s

| Up to 67

2G

B/ s

| 44

8

GB

/s

| Up to 76

8G

B/ s

| Up to 76

8G

B/ s

| Up to 87

0G

B/ s

GPU Cores| CU D A

Co res

: 25

6

| CU D A

Co res

: 51

2

| CU D A

Co res

: 64

0

| CU D A

Co res

: 12

80

| CU D A

Co res

: 38

4

| CU D A

Co res

: 64

0

| CU D A

Co res

: 89

6

| CU D A

Co res

: 23

04

Te ns or Co res

: 28

8

RT

Co res

: 36

| CU D A

Co res

: 30

72

Te ns or Co res

: 38

4

RT

Co res

: 48

| CU D A

Co res

: 46

08

Te ns or Co res

: 57

6

RT

Co res

: 72

| CU D A

Co res

: 46

08

Te ns or Co res

: 57

6

RT

Co res

: 72

| CU D A

Co res

: 64

11

Te ns or Co res

: 19

2

RT

Co res

: 48

| CU D A

Co res

:

8,1

92

Te ns or Co res

: 25

6

RT

Co res

: 64

| CU D A

Co res

:

10,

75

2

Te ns or Co res

: 33

6

RT

Co res

: 84

| CU D A

Co res

: 51

20

Te ns or Co res

: 64

0

GPU Core Frequency (MHz)| 1228M

Hz

| 1266M

Hz

| 1266M

Hz

| 1000

MHz

| 1005

MHz

| 1620

MHz

| 1440

MHz

| 1395M

Hz

| 1132M

Hz

Maximum Power Consumption| 30

W

| 40

W

| 47

W

| 75

W

| 30

W

| 40

W

| 50

W

| To tal bo ar d po we r: 16

0

W

To

| To tal bo ar d po we r: 26

5

W

To

| To tal bo ar d po we r: 29

5

W

To

| To tal bo ar d po we r: 29

5

W

To

| 14

0

W

| 23

0

W

| 30

0

W

| 25

0

W

 |  |  |  |  |  |  |  | tal gr ap hic s po we r: 12

5

W

| tal gr ap hic s po we r: 23

0

W

| tal gr ap hic s po we r: 26

0

W

| tal gr ap hic s po we r: 26

0

W

|  |  |  |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---
Supported Resolutions and Max Refresh Rates (Hz) (Note: Analog and/or Digital)| 3 x

409

6×2

160

@ 60H

z 1 x

512

0×2

880

@ 60H

z

| 4 x

409

6×2

160

@ 60H

z 4 x

512

0×2

880

@ 60H

z

| 4 x

409

6×2

160

@ 60H

z 4 x

512

0×2

880

@ 60H

z

| 4 x

409

6×2

160

@ 120

Hz 4 x

512

0×2

880

@ 60H

z

| 4 x

384

0×2

160

@ 120

Hz 4 x

512

0×2

880

@ 60H

z 4 x

768

0×4

320

@ 60H

z

| 4 x

409

6×2

160

@ 120

Hz 4 x

512

0×2

880

@ 60H

z 2 x

768

0×4

320

@ 60H

z

| 4 x

409

6×2

160

@ 120

Hz 4 x

512

0×2

880

@ 60H

z 2 x

768

0×4

320

@ 60H

z

| 4 x

384

0 x

216

0 @

120

Hz 4 x

512

0×2

880

@ 60H

z 2 x

768

0×4

320

@ 60H

z

| 4 x

409

6×2

160

@ 120

Hz 4 x

512

0×2

880

@ 60H

z 2 x

768

0×4

320

@ 60H

z

| 4 x

409

6×2

160

@ 120

Hz 4 x

512

0×2

880

@ 60H

z 2 x

768

0×4

320

@ 60H

z

| 4 x

409

6×2

160

@ 120

Hz 4 x

512

0×2

880

@ 60H

z 2 x

768

0×4

320

@ 60H

z

| 4 x

409

6×2

160

@ 120

Hz 4 x

512

0×2

880

@ 60H

z 2 x

768

0×4

320

@ 60H

z

Thermal Solution| Ult ra- qu iet Ac tiv e Fa nsi nk| Ult ra- qu iet Ac tiv e Fa nsi nk| Ult ra- qu iet Ac tiv e Fa nsi nk| Ult ra- qu iet Ac tiv e Fa nsi nk| Ac tiv e| Ac tiv e| Ac tiv e| Ult ra- qu iet Ac tiv e Fa nsi nk| Ult ra- qu iet Ac tiv e Fa nsi nk| Ult ra- qu iet Ac tiv e Fa nsi nk| Ult ra- qu iet Ac tiv e Fa nsi nk| Ac tiv e| Ac tiv e| Ac tiv e| Ult ra- qu iet Ac tiv e Fa nsi nk
Dimension| 2.7

13” H

x 5.7

” L

Sin gle Sl ot, Lo w Pr ofil e

| 2.7

13” H

x 5.7

” L

Sin gle Sl ot, Lo w Pr ofil e

| 2.7

13” H

x 5.7

” L

Sin gle Sl ot, Lo w Pr ofil e

| 4.

4″ H

x 7.9

″ L Sin

gle Sl ot

| 2.7

″ H x 6.1

″ L Sin

gle Sl ot

| 2.7

″ H x 6.1

″ L Sin

gle Sl ot

| 2.7

″ H x 6.1

″ L Sin

gle Sl ot

| 4.

4″ H

x 9.5

″ L Sin

gle Sl ot

| 4.

4″ H

x 10.

5″ L

Du al Sl ot, Fu ll He ig ht

| 4.

4″ H

x 10.

5″ L

Du al Sl ot, Fu ll He ig ht

| 4.

4″ H

x 10.

5″ L

Du al Sl ot, Fu ll He ig ht

| 4.

4″ H

x 9.5

″ L Sin

gle Sl ot

| 4.

4″ H

x 10.

5″ L

Du al Sl ot, Fu ll He ig ht

| 4.

4″ H

x 10.

5″ L

Du al Sl ot, Fu ll He ig ht

| 4.

4″ H

x 10.

5″ L

Du al Sl ot, Fu ll He ig ht

Advanced Display| Not Avai labl e| Not Avai labl e| Not Avai labl e| Not Avai labl e| SYN C 2| SYN C 2| SYN C 2| SYN C 2| SYN C 2| SYN C 2| SYN C 2| Not Avai labl e
SLI/NVLink Support| Not Avail able| Not Avail able| Not Avail able| Not Avail able| Not Avail able| NVL

ink

| NVL

ink

| NVL

ink

| NVL

ink

| NVL

ink

| NVL

ink

Disclaimers|  |  |  |  |  |  |  |  |  |  |  |  |  |  |

Intel® Ethernet Specifications

c| Intel I210-T1

Single Port Gigabit Ethern et Adapt er (Sprin gville)

| Intel I350- T2

Dual Port Gigabit Ethern et Adapt er (Stony Lake T2)

| Intel I350- T4

Quad Port Gigabit Ethern et Adapt er (Stony Lake T4)

| Intel X540- T2

Dual Port Coppe r 10Gb Ethern et Adapt er

| Intel X710- DA2

Dual Port Fiber 10Gb

Ethern et Adapt er

| Intel Ethern et SFP+ SR

Optics Module

| Intel Dual Band Wirele ss-AC 7260 ASM| Intel Winsto rm Peak 8265

2×2

AC+BT 4.2

Vpro M.2

Combo

---|---|---|---|---|---|---|---|---
Supplier PN| I210T1, MM# 941033| I350T2 G1P20, MM# 928941| I350T4 G1P20, MM# 92894

2

| MM#9 28955| MM# 952103| MM#: 941243| 7260H MWDT X.R, MM# 936170| MM#: 94665

8

Data Rates Supported| 10/100

/1000

Mbps copper

| 10/100

/1000

Mbps (Copp er), 1000M

bps (Fiber)

| 10/100

/1000

Mbps (Copp er), 1000M

bps (Fiber)

| 100/10

00Mbp s and 10Gbp s Coppe r

| 1GbE/1

0GbE

Optical fiber 10GbE

Direct Attach (DAC)

| Not Availab le| Intel Dual Band Wirele ss-AC 7260| Intel Dual Band Wirele ss-AC 8265
Controller Details| Intel® Ethern et Contro ller I210| Intel Ethern et Contro ller I350| Intel Ethern et Contro ller I351| Intel Ethern et Contro ller X540| Intel Ethern et Contro ller X710- AM2| Not Availab le| Intel Dual Band Wirele ss-AC 7260,

Dual Band, 2×2,

WiFi+B T

| Intel Dual Band Wirele ss-AC 8265,

2×2,

WiFi+B T, MU- MIMO

Controller Bus Architecture| PCIe 2.1

(5GT/s

)

| PCIe 2.1

(5GT/s

)

| PCIe 2.1

(5GT/s

)

| PCIe 2.1

(5GT/s

)

| PCIe 3.0

(8GT/s

)

| Not Availab le| PCIe M.2| PCIe M.2
Data Transfer Mode| Ethern et| Ethern et| Ethern et| Ethern et| Ethern et| Not Availab le| WiFi (802.11

ac), 2.4GHz

, 5GHz

| WiFi (802.11

ac), 2.4GHz

, 5GHz

Power Consumption| 0.81W| Coppe r:

I350- T2 V2= 4.4W

Fiber: I350- F2= 5.5W

| Coppe r: I350T4 V2= 5W

LC-

Fiber: I350F4

= 6W

| X540- T2:

10Gps= 17.4W

1Gbps= 9.5W

100Mb

ps=6.6 W X540- T1:

10Gbp s=10.8 W

1Gbps= 7.7W

100Mb

ps= 6.4W

| Dual- port 10GBA SE- SR= 4.3W

typ/4.8 W max Dual- port 1000B ASE- SX= 4W

typ/4.3 W max Dual- port 10GBA

| Not Availab le| Not Availab le| Not Availab le
 |  |  |  |  | SE- LR= 4.5W

typ/ 5.1W

max Dual- port Direct Attach (Twina x)= 3.3W

typ/3.7 W max

|  |  |
---|---|---|---|---|---|---|---|---
IEEE Standards Compliance| IEEE 802.3/1

0BASE

-T, 100BA SE-TX, 1000B ASE-T

| IEEE 802.3/1

0BASE

-T, 100BA SE-TX, 1000B ASE-T

| IEEE 802.3/1

0BASE

-T, 100BA SE-TX, 1000B ASE-T

| IEEE 802.3

100/10

00/10

HBASE

-T

| IEEE 802.3

1/1010

GBASE

– SR/LR, SFF- 8431

10GSF P+DAC

| Not Availab le| IEEE 802.11a

bgn, 802.11a

c, 802.11d

, 802.11e,

802.11i,

802.11h

, 802.11

w

| IEEE 802.11a

bgn, 802.11a

c, 802.11d

, 802.11e,

802.11i,

802.11h

, 802.11

w, 802.11r,

802.11k,

802.11v

(pendi ng)

Boot ROM Support| PXE

boot, Intel iSCSI

Remot e Boot for Windows, Linux and Vmwar e, Intel BootA gent Softwa re via PXE or BootP, WDMS

or

UEFI

| PXE

boot, Intel iSCSI

Remot e Boot for Windows, Linux and Vmwar e, Intel BootA gent Softwa re via PXE or BootP, WDMS

or

UEFI

| PXE

boot, Intel iSCSI

Remot e Boot for Windows, Linux and Vmwar e, Intel BootA gent Softwa re via PXE or BootP, WDMS

or

UEFI

| PXE

boot, Intel iSCSI

Remot e Boot for Windows, Linux and Vmwar e, Intel BootA gent Softwa re via PXE or BootP, WDMS

or

UEFI

| PXE

boot, Intel iSCSI

Remot e Boot for Windows, Linux and Vmwar e, Intel BootA gent Softwa re via PXE or BootP, WDMS

or

UEFI

| Not Availab le| Not Availab le| Not Availab le
Network Transfer Mode (Full/Half Duplex)| Suppor ted| Suppor ted| Suppor ted| Suppor ted| Suppor ted| Not Availab le| Not Availab le| Not Availab le
Network Transfer Rate| 1,000M

bps Full Duplex

| 1,000M

bps Full Duplex

| 1,000M

bps Full Duplex

| 1,000M

bps Full Duplex

| 1,000M

bps Full Duplex

| Not Availab le| 300/8

67Mbp s

| 867Mb

ps

Operating System Driver Support| Windo was 7/8/10,

Linux, Free BSD, XEN,V

VMware

| Windo was 7/8/10,

Linux, Free BSD, XEN,V

VMware

| Windo was 7/8/10,

Linux, Free BSD, XEN,V

VMware

| Windo ws 7/8/10,

Windo ws Server Linux,

| Windo ws 2008,

2012; RHEL 6.5/7.0,

FreeBSD D 9/10,

| Not Availab le| Windows 10, 32-bit*, Windows 10,

64-

bit*, Windo

| Windo ws 10,

64-

bit*, Windo ws 8.1,

64-

bit*,

 |  |  |  | FreeBSD D| Vmwar e ESXi 5.x|  | ws 8.1, 32-bit*, Windows 8.1,

64-

bit, Windows 8, 32-bit, Windows 8,

64-

bit, Windows 7, 32-bit, Windows 7,

64-

bit, Linux

| Windows 7, 32-bit*, Windows 7,

64-

bit, Linux

---|---|---|---|---|---|---|---|---
Manageability| Suppor ted| Suppor ted| Suppor ted| Suppor ted| Suppor ted| Not Availab le| Not Availab le| Not Availab le
Manageability Capabilities Alerting| Suppor ted| Suppor ted| Suppor ted| Suppor ted| Suppor ted| Not Availab le| Not Availab le| Not Availab le
TDP| Firmw are Based Therm al Management| Firmw are Based Therm al Management| Firmw are Based Therm al Management| Firmw are Based Therm al Management| Not Availab le| Not Availab le| Not Availab le| Not Availab le
Operating Temperature Range| 0°C to 55°C (32°F

to 131°F)

| 0°C to 55°C (32°F

to 131°F)

| 0°C to 55°C (32°F

to 131°F)

| 0°C to 55°C (32°F

to 131°F)

| 0°C to 55°C (32°F

to 131°F)

| Not Availab le| 0°C to 80°C (32°F

to 176°F)

| 0°C to 80°C (32°F

to 176°F)

of Ports| 1| 2| 4| 2| 2| Not Availab le| Not Availab le| Not Availab le

Data Rate Per Port| 10/100

/1000

Mbps (coppe r)

| 10/100

/1000

Mbps (coppe r), 1000M

bps (fiber)

| 10/100

/1000

Mbps (coppe r), 1000M

bps (fiber)

| 100/1,0

00Mbp s, 10Gbp s

| 1Gbps, 10Gbp s| Not Availab le| Not Availab le| Not Availab le
System Interface Type| PCIe

Gen 2.1

| PCIe

Gen 2.1

| PCIe

Gen 2.1

| PCIe

Gen 2.1

| PCIe 3.0| Not Availab le| PCIe M.2| PCIe M.2
NC Sideband Interface| Not Availab le| Not Availab le| Not Availab le| Not Availab le| Yes| Not Availab le| Not Availab le| Not Availab le
Jumbo Frames Supported| Yes| Yes| Yes| Yes| Yes| Not Availab le| Not Availab le| Not Availab le
1000Base-T| Yes| Yes| Yes| Yes| Not Available le| Not Available le| Not Availab le| Not Availab le
IEEE 1588| Suppor ted| Suppor ted| Suppor ted| Not Available| Suppor ted| Not Availab| Not Available| Not Available
 |  |  |  | le|  | le| le| le
---|---|---|---|---|---|---|---|---
Supported Under vPro| Not Availab le| Not Availab le| Not Availab le| Not Availab le| Not Availab le| Not Availab le| Suppor ted| Suppor ted
Disclaimers|  |  |  |  |  |  |  |

Ethernet

Model| i210-T1| Dual Port Copper

= I350- T2V2

Dual Port LC- Fiber= I350-F2

| Dual Port Copper

= I350- T4 V2

Dual Port LC- Fiber= I350-F4

| Dual Port Copper

= X540- T2

| X710- DA2| AC 7260 NGW| AC 8265 NGW
---|---|---|---|---|---|---|---
Connector| RJ-45

Copper

| 2 x Ports RJ-45

Copper or 2 x Ports

LC-Fiber

| 4 x Ports RJ-45

Copper or 4 x Ports

LC-Fiber

| 2 x Ports RJ-45

Copper

| 2 x SFPs Recepta ble| 2 x Antenna s| 2 x Antenna s
Website| i210 T1| i350 T2/F2| i350 T4/F4| x540 T2| x710 DA2| 7260

NGW

| 8265

NGW

Auto-Negotiation| IEEE 802.3

Auto- negotiat on

| IEEE 802.3

Auto- negotiate on

| IEEE 802.3

Auto- negotiat on

| IEEE 802.3

Auto- negotiate on

| IEEE 802.3

Auto- negotiate on

| Not Availabl e| Not Availabl e
Intel® vPro™| Not Availabl e| Not Availabl e| Not Availabl e| Not Availabl e| Not Availabl e| Support ed| Support ed
Intel® Standard Manageablity| Support ed| Support ed| Support ed| Support ed| Support ed| Not Availabl e| Not Availabl e
Power Optimizer Platform Low-power Management Systems| Support ed| Support ed| Support ed| Support ed| Support ed| Support ed| Support ed
Energy Efficient Ethernet| Support ed| Support ed| Support ed| Not Availabl e| Support ed| Not Availabl e| Not Availabl e
TCP/UDP Checksum and Segmentation Offload (IPv4 and IPv6)| Support ed| Support ed| Support ed| Support ed| Support ed| Not Availabl e| Not Availabl e
Receive Side Scaling| Support ed| Support ed| Support ed| Support ed| Support ed| Not Availabl e| Not Availabl e
Dual Tx and Rx Queues| Yes| Yes| Yes| Yes| Yes| Not Availabl e| Not Availabl e
Jumbo Frames (up to 9KB)| Support ed| Support ed| Support ed| Not Available e| Support ed| Not Available e| Not Availabl e
Teaming| Support ed| Support ed| Support ed| Support ed| Support ed| Not Availabl| Not Availabl

2012,

2019

Linux (RHEL/ SLES),

Free BSD,

Xen, Vmware

| Windows Server 2008,

2012,

2019

Linux (RHEL/ SLES),

Free BSD,

Xen, Vmware

| Windows Server 2008,

2012,

2019

Linux (RHEL/ SLES),

Free BSD,

Xen, Vmware

| Windows Server 2003,

2008;

RHEL 4,

Linux/S LES 11,

Vmware

| Window s 2008,

2012; RHEL 6.5/7.0,

FreeBSD D 9/10,

Vmware ESXi 5.x

| Not Available e| Not Available e
Network Proxy/ARP Support| Support ed| Support ed| Support ed| Support ed| Support ed| Not Available e| Not Available e
Disclaimers|  |  |  |  |  |  |
Media Card Reader|
Description| 9-in-1 (USB 2.0)
Disclaimers|

SECTION IV:BIOS/Certifications/Standards/Environmental

BIOS Specifications

WMI Support| Compliant With Microsoft WBEM and the DMTF Common Information Model
---|---
ROM-Based Setup Utility (F1)| System Configuration Setup Program (text only interface) Available at Power-on With F1 Key
Bootblock Recovery| Recovers System BIOS if the Flash ROM Becomes Corrupted
Replicated Setup| Saves System Configuration Settings to a File That Can Then be Used to Replicate the Settings to Other Systems
Boot Control| Boot Control Available Through ROM-based Setup Utility or With F12 Key at Power-on
Memory Change Alert| Power-on Error Message in the Event of a Decrease in System Memory
Thermal Alert| Power-on Error message in the Event of a Fan Failure
Asset Tag| Supports Ability to Set SMBIOS Type 2 Baseboard Asset Tag Field
System/Emergency ROM Flash Recovery With Video| Supports Process to Recover the System BIOS if the Flash ROM Becomes Corrupted

Remote Wakeup/Remote Shutdown| System Admin Can Power On/Off a Client Computer from a Remote Location to Provide Maintenance
---|---
Quick Resume Time| Supports Low Power S3 (suspend to RAM) and Prompt Resume Times
ROM Revision Level| System UEFI (BIOS) Version Reported in SMBIOS Type 0 Structure and in BIOS Setup
Keyboard-less Operation| System Can be Booted Without a Keyboard
Per-port Control| Allows I/O Ports to be Individually Enabled/Disabled Through ROM- based Setup or WMI Interface
Adaptive Cooling| Offers Multiple Settings for Fan Control Ranging Between Better Performance and Better Acoustics
Security| User and Administrator Passwords Can Protect Boot and ROM-based Setup

–  Support Electronic Lock

–  Chassis Intrusion Detection

–  UEFI Secure Boot Support

–  HDD Password Can Protect HDD Data

–  Windows UEFI Firmware Update Support

–  Device Guard Support

–  Optional Access Panel Lock, Kensington Lock, and Pad Lock

Intel(R) AMT (includes ASF 2.0)| Allows System to be Supported from a Remote Location
Intel(R) TXT| Intel(R) Trusted Execution Technology Provides a Security Foundation to Build Protections Against Software Based Attacks
Memory Modes| Supports Mirroring, Lock Step, and Sparing Memory Modes
Windows 10 Ready| Supports Windows 10 Requirements for Secure Flash, UEFI v 2.6 Device Guard Support Spec

Industry Standard Specification Support

Configuration and Power Interface v6.1
ASF 2.0| DMTF Alert Standard Format Specification v2.0
ATA (IDE)| AT Attachment 6 with Packet Interface (ATA/ATAPI-6)
CD Boot| El Torito Bootable CD-Rom Format Specification, v1.0
EHCI| Enhanced Host Controller Interface for Universal Serial Bus, Revision v1.0
PCI| NA (No PCI slot)
PCI Express| PCI Express Base Specification v3.0
SATA| Serial ATA Revision 3.0 Specification
TPM| Trusted Computing Group TPM Specification v2.0
UHCI| Universal Host Controller Interface Design Guide, Revision v1.1
USB| Universal Serial Bus Revision v1.1 Universal Serial Bus v2.0 Universal Serial Bus v3.0
SMBIOS| DMTF System Management Spec v3.2.1
XHCI| XHCI SPEC Revision v1.2

Social and Environmental Responsibility

Quality Control| Lenovo is a member of an eco declaration system that enforces regular independent quality control
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Hazardous Substances and Preparation| • Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenyl ethers (PBDE). (See legal reference and Note B1)

• Products do not contain Asbestos

• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1- trichloroethane, methyl bromide

• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation

• Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP

• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm²/week

REACH Article 33 information about substances in articles is available at:

http: /www.lenovo.com/social_responsibility/us/en/ThinkGreen_produc ts.html#environment

Batteries| Not Available
Safety, EMC Connection to the Telephone Network and Labeling| Not Applicable, no Connection to a Telephone Network

Acoustic Noise Emissions Declaration
Safety, EMC Connection to the Telephone Networkand Labeling

System Software Manager| Lenovo ThinkStation Supports Software Management Tools by Lenovo Vantage
---|---

Regulations & Standards

EMC & Safety| FCC DoC for North America VCCI Certification for Japan BSMI Certification for Taiwan EU/EFTA CE Mark & DoC

UL/CUL(P920,P720,P520,P520c), cTUVus(P330) UL-GS(P920,P720,P520,P520c), TUV- GS(P330)

IEC60950-1 CB Report/Certificate Saudi Arabia SASO

Kuwait KUCAS China CCC Mark

Hong Kong SAR (CB report) Singapore PSB

South Africa SABS Russia-EAC

|  | Morocco-CM Mexico-NOM Kazakhstan-EAC Belarus-EAC Serbia KVALITET Ukraine UKrCEPRO India-BIS

USA Chemical Emission Test

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Environmentals

cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenol ethers (PBDE)

• Products do not contain Asbestos

• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1- trichloroethane, methyl bromide

• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation

• Products do not contain more than 0.1% short-chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP

• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm_/week

TCO Certification| 9.0
Disclaimers| EPEAT registered where applicable. EPEAT registration varies by country. See www.epeat.net for registration status by country.

References

• lenovo.com/social_responsibility/us/en/ThinkGreen_produc
• workstations :: thinkstation p series workstations :: thinkstation p5contentdetail - Lenovo Support US

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