ShenZhen ESP-C12F 2.4GHz Wi-Fi and BLE5.0 Combo Module User Manual
- June 15, 2024
- Shenzhen
Table of Contents
- ShenZhen ESP-C12F 2.4GHz Wi-Fi and BLE5.0 Combo Module
- ESP-C12F Product Information
- Features
- Applications
- Introduction
- Interface Definition
- Size and Layout
- Electronica Characteristics
- Power Consumption
- Bluetooth LE Radio
- Minimum User System
- Recommended Layout Design
- FCC WARNING
- Requirement per KDB996369 D03
- Frequently Asked Questions (FAQ)
- Read User Manual Online (PDF format)
- Download This Manual (PDF format)
ShenZhen ESP-C12F 2.4GHz Wi-Fi and BLE5.0 Combo Module
ESP-C12F Product Information
Specifications
- Chip: ESP32-C3
- Module Size: 16mm24mm3mm
- 4MByte embedded flash (default)
- 384KB ROM
- 400KB SRAM
- Wi-Fi Frequency Range: 2.4GHz
- Wi-Fi Bandwidth: 20 MHz, 40 MHz
- Data Rate: Up to 150 Mbps
- Bluetooth Version: Bluetooth LE 5.0
- Working Temperature: -40°C to 85°C
Features
- General Chip: ESP32-C3
- Module Size: 16mm24mm3mm
- 4MByte embedded flash (default)
- 384KB ROM
- 400KB SRAM
- Wi-Fi Features:
- IEEE 802.11 b/g/n-compliant
- Center frequency range of operating channel: 2412 ~ 2484 MHz
- Supports 20 MHz, 40 MHz bandwidth in 2.4 GHz band
- 1T1R mode with data rate up to 150 Mbps
- TX/RX A-MPDU, TX/RX A-MSDU
- Immediate Block ACK
- Fragmentation and defragmentation
- Automatic Beacon monitoring (hardware TSF)
- 4 X virtual Wi-Fi interfaces
- Simultaneous support for Infrastructure BSS in Station mode, Soft-AP mode, Station + Soft-AP mode, and promiscuous mode
- Bluetooth Features:
- Bluetooth LE: Bluetooth 5, Bluetooth mesh
- Speed: 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps
- Advertising extensions
- Multiple advertisement sets
- Channel selection algorithm #2
- Peripheral Interfaces:
- SPI
- EN
- PWM x 6
- ADC
- GPIO * 15;
- UART * 2;
- IIC ;
Applications
- Serial transparent transmission
- Wi-Fi prober
- Smart power plug/Smart LED light
- Mesh networks
- Sensor networks
- Over-the-top (OTT) devices
- Wireless location system beacon
- Industrial field bus
Module Type
- Name: ESP-C12F
- Antenna Type: PCB ANT
Name | Antenna Type |
---|---|
ESP-C12F | PCB ANT |
ESP-C12F-E | U.FL Ipex |
Module Structure
- Peripheral Interfaces: GPIO 15, UART 2, IIC
Update Record
- Date: February 20, 2023
- Version: V1.0
- Update: First released
Introduction
ESP-C12F Wi-Fi and BLE coexistence Module is a highly integrated single-chip low power 802.11bgn Wireless LAN (WLAN) network controller. It combines a RISC CPU, WLAN MAC, a 1T1R capable WLAN baseband, RF, and Bluetooth in a single chip. It also provides a bunch of configurable GPIO, which are configured as digital peripherals for different applications and control usage. ESP-C12F Module use ESP32-C3 as Wi-Fi and BLE coexistence SOC chip. ESP-C12F Module integrates internal memories for complete Wi-Fi protocol functions. The embedded memory configuration also provides convenient application developments. ESP-C12F module supports the standard IEEE802.11 b/g/n/e/i protocol and the complete TCP/IP protocol stack. User can use it to add the Wi-Fi function for the installed devices, and also can be viewed as an independent network controller. Anyway, ESP-C12F Wi-Fi module provides many probabilities with the best price.
ESP-C12F Module Structure
Technical parameters for ESP-C12F are listed as follows.
ESP-C12F Parameters
Type | Item | Parameter |
---|---|---|
Hardware | CPU | 32-bit RISC CPU |
Interface | UART/SDIO/SPI/I2C/GPIO/PWM | |
Working voltage | 3.0V ~ 3.6V | |
Working temperature | -40°C ~ 85°C | |
Environment temperature | -40°C ~ 1 05°C | |
Shape | 16mm x 24mm x 3mm | |
Software | Wi-Fi working mode | STA, Soft-AP and sniffer modes |
Security mode | WPS / WEP / WPA / WPA2 / WPA3 | |
Update firmware | UART Download | |
Software develop | SDK | |
Network protocol | IPv4, TCP/UDP/HTTP/FTP/MQTT |
Interface Definition
ESP-C12F Wi-Fi & BLE module interface definition is shown **below:**
ESP-C12F Pins Definition
Working modes and pins function are shown in the table below:
Pin Name | Type | Function |
---|---|---|
IO0 | I/O | GPIO0, ADC1_CH1, XTAL_32K_P |
IO1 | I/O | GPIO1, ADC1_CH1, XTAL_32K_N |
EN | I/O | Chip enable; Internal Pull-up. HIGH: enable the chip |
IO2 | I/O | GPIO2, ADC1_CH2, FSPIQ, Internal Pull-up |
Working Mode
Mode | IO9 Voltage Level |
---|---|
UART Download Mode | LOW |
Flash Boot Mode | HIGH (Default) |
Pins Function Definition
Num. | Pin Name | Type | Function |
---|---|---|---|
1 | IO0 | I/O | GPIO0,ADC1_CH1,XTAL_32K_P |
2 | IO1 | I/O | GPIO1,ADC1_CH1, XTAL_32K_N |
3 | EN | I/O | Chip enable; Internal Pull-up. HIGH: enable the chip |
4 | IO2 | I/O | GPIO2, ADC1_CH2, FSPIQ, Internal Pull-up |
5 | IO3 | I/O | GPIO3, ADC1_CH3 |
--- | --- | --- | --- |
6 | IO4 | I/O | GPIO4, ADC1_CH4, MTMS, FSPIHD |
7 | IO5 | I/O | GPIO5, ADC2_CH0, MTDI, FSPIWP |
8 | VCC | P | Power, 3.3V/500mA Recommended |
9~11 | NC | – | Not Connected |
12 | IO6 | I/O | GPIO6,FSPICLK,MTCK |
13 | IO7 | I/O | GPIO7,FSPID,MTDO |
14 | NC | – | Not Connected |
15 | GND | P | Power, 3.3V/500mA Recommended |
16 | IO8 | I/O | GPIO8 |
17 | IO10 | I/O | GPIO10, FSPICS0. When the value of eFuse bit |
EFUSE_JTAG_SEL_ENABLE is 0, JTAG signals cannot be used. 1, if IO10 is 0, JTAG
signals come from chip pins; if IO10 is 1, JTAG signals cannot be used
18| IO9| I/O| GPIO9
19| IO18| I/O| GPIO18,USB-D-
20| IO19| I/O| GPIO19,USB-D+
21| RX0| I/O| GPIO20,U0RXD
22| TX0| I/O| GPIO21,U0TXD
Size and Layout
Size for ESP-C12F can be shown as follows.
Shape for ESP-C12F (-E)
(a) Vertical View
(b) Side View
Size for ESP-C12F
PCB Layout for ESP-C12F
Electronica Characteristics
Parameter | Condition | Min | Classical | Max | Unit |
---|---|---|---|---|---|
Store Temperature | – | -40 | Normal | 150 | ℃ |
Sold Temperature | IPC/JEDEC J-STD-020 | – | – | 260 | ℃ |
Working Voltage | – | 3.0 | 3.3 | 3.6 | V |
I/O | VIL | – | -0.3 | – | 0.25*VDD |
VIH | – | 0.75*VDD | – | VDD+0.3 | |
VOL | – | – | – | 0.1*VDD | |
VOH | – | 0.8*VDD | – | – | |
Electrostatic Release Quantity (Human model) | TAMB=25℃ | – | – | 2 | KV |
Electrostatic Release Quantity (Machine model) | TAMB=25℃ | – | – | 0.5 |
KV
---|---|---|---|---|---
Power Consumption
Parameter | Min | Classical | Max | Unit |
---|---|---|---|---|
RX 11b /g/n, HT20 | – | – | 82 | mA |
RX 11n, HT40 | – | 84 | mA | |
TX 11b, 1Mbps @21dBm | – | 350 | mA | |
TX 11g, 54Mbps @19dBm | – | – | 295 | mA |
TX 11n, HT20, MCS7, @18.5dBm | – | – | 290 | mA |
TX 11n, HT40, MCS7, @18.5dBm | – | – | 290 | mA |
Modem-sleep, CPU is powered on @80MHz | – | 15 | – | mA |
Light-sleep | – | 130 | – | uA |
Deep-sleep, RTC timer + RTC memory | – | 5 | – | uA |
Power off, CHIP_PU is set to low level | – | 1 | 0 | uA |
The peak current consumption of ESP-C12F exceed 400mA when the module start work (RF calibration work consumes maximum current). Therefore, the recommended power supply is no less than 500mA.
Note:
- Active Mode: CPU and RF are all turned on.
- Modem-sleep Mode: CPU is turned on. RF and baseband are turned off, but the communication is still connected.
- Light-sleep Mode: CPU is turned off. RTC/external interrupt/MAC can wake up the chip. The communication is still connected.
- Deep-sleep Mode: Only RTC is turned on.
Wi-Fi RF Characteristics
The data in the following table is gotten when voltage is 3.3V in the indoor
temperature environment.
Wi-Fi TX Characteristics
Parameter | Min | Classical | Max | Unit |
---|---|---|---|---|
Input frequency | 2412 | – | 2484 | MHz |
802.11b @1Mbps,11Mbps | – | 20.5 | – | dBm |
802.11g @6Mbps | – | 20.0 | – | dBm |
802.11g @54Mbps | – | 18.0 | – | dBm |
802.11n,HT20 MCS0 | – | 19.0 | – | dBm |
802.11n,HT40 MCS0 | – | 18.5 | – | dBm |
EVM @11b,1Mbps@20dBm | – | -24.5 | – | dBm |
EVM @11g,54Mbps@19dBm | – | -28 | – | dBm |
EVM @11n,MCS7@18.5dBm | – | -30 | – | dBm |
EVM @11n, HT40, MCS7@18.5dBm | – | -30.5 | – | dBm |
Wi-Fi RX Sensitivity
Parameter | Min | Classical | Max | Unit |
---|---|---|---|---|
802.11b,1Mbps | – | -98 | – | dBm |
802.11b,11Mbps | – | -88 | – | dBm |
802.11g,6Mbps | – | -92 | – | dBm |
802.11g,54Mbps | – | -76 | – | dBm |
802.11n,HT20,MCS0 | – | -92 | – | dBm |
802.11n,HT20,MCS3 | – | -85 | – | dBm |
802.11n,HT20,MCS7 | – | -74 | – | dBm |
802.11n,HT40,MCS0 | – | -90 | – | dBm |
802.11n,HT40,MCS3 | – | -81 | – | dBm |
802.11n,HT40,MCS7 | – | -71 | – | dBm |
Wi-Fi RX Characteristics
Parameter | Min | Classical | Max | Unit |
---|---|---|---|---|
MAX RX Level @11b,1Mbps | – | 5 | – | dBm |
MAX RX Level @11b,11Mbps | – | 5 | – | dBm |
MAX RX Level @11g,6Mbps | – | 5 | – | dBm |
MAX RX Level @11g,54Mbps | – | 0 | – | dBm |
MAX RX Level @11n,HT20,MCS0 | – | 5 | – | dBm |
--- | --- | --- | --- | --- |
MAX RX Level @11n,HT20,MCS7 | – | 0 | – | dBm |
MAX RX Level @11n,HT40,MCS0 | – | 5 | – | dBm |
MAX RX Level @11n,HT40,MCS7 | – | 0 | – | dBm |
RX Adjacent Channel Rejection@11b,1Mbps | – | 35 | – | dB |
RX Adjacent Channel Rejection@11b,11Mbps | – | 35 | – | dB |
RX Adjacent Channel Rejection@11g,6Mbps | – | 31 | – | dB |
RX Adjacent Channel Rejection@11g,54Mbps | – | 14 | – | dB |
RX Adjacent Channel Rejection@11n,HT20,MCS0 | – | 31 | – | dB |
RX Adjacent Channel Rejection@11n,HT20,MCS7 | – | 13 | – | dB |
RX Adjacent Channel Rejection@11n,HT40,MCS0 | – | 19 | – | dB |
Bluetooth LE Radio
TX Transmitter General Characteristics
Parameter | Min | Classical | Max | Unit |
---|---|---|---|---|
Gain control power | – | 3 | – | dBm |
RF power control range | -27 | – | 18 | dBm |
In-band emissions @F-F0±3MHz, LE 1M | – | -41.95 | – | dBm |
In-band emissions @F-F0±>3MHz, LE 1M | – | -44.48 | – | dBm |
Modulation characteristics @ △f1avg, LE 1M | – | 245 | – | kHz |
Modulation characteristics @△f2max, LE 1M | – | 208 | – | kHz |
Carrier frequency offset, LE 1M | – | -9 | – | kHz |
In-band emissions @F-F0±5MHz, LE 2M | – | -45.26 | – | dBm |
In-band emissions @F-F0±>5MHz, LE 2M | – | -47 | – | dBm |
Modulation characteristics @ △f1avg, LE 2M | – | 497 | – | kHz |
Modulation characteristics @△f2max, LE 2M | – | 398 | – | kHz |
Carrier frequency offset, LE 2M | – | -9 | – | kHz |
In-band emissions @F-F0±3MHz, LE 500K | – | -41.3 | – | dBm |
In-band emissions @F-F0±>3MHz, LE 500K | – | -42.8 | – | dBm |
Modulation characteristics @ △f1avg, LE 500K | – | 220 | – | kHz |
Modulation characteristics @△f2max, LE 500K | – | 205 | – | kHz |
--- | --- | --- | --- | --- |
Carrier frequency offset, LE 500K | – | -11.9 | – | kHz |
Maximum received signal @30.8% PER | – | 10 | – | dBm |
RX Transmitter General Characteristics
Parameter | Min | Classical | Max | Unit |
---|
1
M| Sensitivity @30.8% PER| –| -96| –| dBm
Maximum received signal @30.8% PER| –| 10| –| dBm
Co-channel C/I| –| 8| –| dB
Image frequency| –| -29| –| dB
Adjacent channel to image frequency @F =Fimage+1| –| -38| –| dB
Adjacent channel to image frequency @F =Fimage-1| –| -34| –| dB
Adjacent channel selectivity @ F =F0+1| –| -4| –| dB
Adjacent channel selectivity @ F =F0-1| –| -3| –| dB
Adjacent channel selectivity @ F ≥F0+3| –| –| –| dB
Adjacent channel selectivity @ F ≤F0-3| –| -39| –| dB
2
M| Sensitivity @30.8% PER| –| -93| –| dBm
Maximum received signal @30.8% PER| –| 0| –| dBm
Co-channel C/I| –| 10| –| dB
Image frequency| –| -27| –| dB
Adjacent channel to image frequency @F =Fimage+2| –| -39| –| dB
Adjacent channel to image frequency @F =Fimage-2| –| –| –| dB
Adjacent channel selectivity @ F =F0+2| –| -7| –| dB
Adjacent channel selectivity @ F =F0-2| –| -7| –| dB
Adjacent channel selectivity @ F ≥F0+6| –| -39| –| dB
Adjacent channel selectivity @ F ≤F0-6| –| -39| –| dB
1
2
5
K| Sensitivity @30.8% PER| –| -104| –| dBm
Maximum received signal @30.8% PER| –| 10| –| dBm
Co-channel C/I| –| 2| –| dB
Image frequency| –| -34| –| dB
Adjacent channel to image frequency @F =Fimage+1| –| -44| –| dB
| Adjacent channel to image frequency @F =Fimage-1| –| -37| –| dB
---|---|---|---|---|---
Adjacent channel selectivity @ F =F0+2| –| -40| –| dB
Adjacent channel selectivity @ F =F0-2| –| -42| –| dB
Adjacent channel selectivity @ F ≥F0+3| –| –| –| dB
Adjacent channel selectivity @ F ≤F0-3| –| -46| –| dB
Recommended Sold Temperature Curve
- Reflow Times <= 2 times (Max.)
- Max Rising Slope: 3℃/sec
- Max Falling Slope: -3℃/sec
- Over 217℃ Time: 60~120sec
- Peak Temp:240℃~250℃
Recommended Reflow Profile
Minimum User System
This module can work just at 3.3V voltage condition:
Minimum System
Note:
- The working voltage for module is DC 3.3V;
- The max current from IO of this module is 40mA;
- Wi-Fi module is at download mode: IO9 is LOW level, then module reset to power;
- Wi-Fi module is connected to RXD of the other MCU, and TXD is connected to RXD of the other MCU.
Recommended Layout Design
ESP-C12F module can be sold on PCB board directly. For the high RF performance
for the device, please notice the placement of the module. There are three
ways to use the module for Wi-Fi Module with PCB antenna.
Solution 1: optical solution. The Wi-Fi module is placed on the side of
the board, and the antennas are all exposed, and there is no metal material
around the antenna, including wires, metal casings, weight plates, and the
like.
Solution 2: sub-optical solution. The Wi-Fi module is placed on the side
of the board, and the antenna below is hollowed out. There is a gap of not
less than 5 mm reserved with the PCB, and there is no metal material around
the antenna, including wires, metal casings, weight plates, and the like.
Solution 3: The Wi-Fi module is placed on the side of the board, and the
PCB area under the antenna is empty, and copper cannot be laid.
Solution 1
Solution 2
Solution 3
Peripheral Design Suggestion
Wi-Fi module is already integrated into high-speed GPIO and Peripheral
interface, which may be generated the switch noise. If there is a high request
for the power consumption and EMI characteristics, it is suggested to connect
a serial 10~100 ohm resistance, which can suppress overshoot when switching
power supply, and can smooth signal. At the same time, it also can prevent
electrostatic discharge (ESD).
Product Handling
Storage Conditions
The products sealed in moisture barrier bags (MBB) should be stored in a non-
condensing atmospheric environment of < 40 °C and 90%RH. The module is rated
at the moisture sensitivity level (MSL) of 3. After unpacking, the module must
be soldered within 168 hours with the factory conditions 25±5 °C and 60%RH. If
the above conditions are not met, the module needs to be baked.
Electrostatic Discharge (ESD)
- Human body model (HBM): ±2000 V
- Charged-device model (CDM): ±500 V
U.FL RF Connector
ESP-C12F module use U.FL type RF connector for external antenna connection.
(IPEX V1.0).
U.FL RF Connector
Packing Instruction
The product is packed in a tray, as shown in the following figure. The size of
the single box is: 340 x 360 x 60mm, and 800 pieces module is in the box. And
the outer box size is 355 x 375 x 325mm, including 5 single box which include
4000 pieces module.
Module Package
FCC WARNING
FCC Caution: Any changes or modifications not expressly
Approved by the party responsible for compliance could void the user’s
authority to operate this equipment. This device complies with Part 15 of the
FCC Rules.
Operation is subject to the following two conditions:
- This device may not cause harmful interference, and
- this device must accept any interference received, including interference that may cause undesired operation.
This device and its antenna(s) must not be co-located or operating in
conjunction with any other antenna or transmitter. 15.105 Information to the
user. For a Class B digital device or peripheral, the instructions furnished
the user shall include the following or similar statement, placed in a
prominent location in the text of the manual:
Note: This equipment has been tested and found to comply with the limits
for a Class B digital device, pursuant to part 15 of the FCC Rules. These
limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses and
can radiate radio frequency energy and, if not installed and used in
accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not
occur in a particular installation. If this equipment does cause harmful
interference to radio or television reception, which can be determined by
turning the equipment off and on, the user is encouraged to try to correct the
interference by one or more of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator and your body.
Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an
uncontrolled environment. This transmitter must not be co-located or operating
in conjunction with any other antenna or transmitter. The availability of some
specific channels and/or operational frequency bands are country dependent and
are firmware programmed at the factory to match the intended destination. The
firmware setting is not accessible by the end user. The final end product must
be labelled in a visible area with the following: “Contains Transmitter Module
“FCC ID:2AL3B-ESP-C12F”
Requirement per KDB996369 D03
List of applicable FCC rules
List the FCC rules that are applicable to the modular transmitter. These are
the rules that specifically establish the bands of operation, the power,
spurious emissions, and operating fundamental frequencies. DO NOT list
compliance to unintentional-radiator rules (Part 15 Subpart B) since that is
not a condition of a module grant that is extended to a host manufacturer. See
also Section 2.10 below concerning the need to notify host manufacturers that
further testing is required.3
Explanation: This module meets the requirements of FCC part 15C
(15.247).it Specifically identified AC Power Line Conducted Emission, Radiated
Spurious emissions, Band edge and RF Conducted Spurious Emissions, Conducted
Peak Output Power, Bandwidth, Power Spectral Density, Antenna Requirement.
Summarize the specific operational use conditions
Describe use conditions that are applicable to the modular transmitter,
including for example any limits on antennas, etc. For example, if point-to-
point antennas are used that require reduction in power or compensation for
cable loss, then this information must be in the instructions. If the use
condition limitations extend to professional users, then instructions must
state that this information also extends to the host manufacturer’s
instruction manual. In addition, certain information may also be needed, such
as peak gain per frequency band and minimum gain, specifically for master
devices in 5 GHz DFS bands.
Explanation: The product antenna uses an irreplaceable antenna with a
gain of BT ANT:-1.08dBi, WIFI ANT:-1.18dBi
Single Modular
If a modular transmitter is approved as a “Single Modular ,” then the module
manufacturer is responsible for approving the host environment that the Single
Modular is used with. The manufacturer of a Single Modular must describe, both
in the filing and in the installation instructions, the alternative means that
the Single Modular manufacturer uses to verify that the host meets the
necessary requirements to satisfy the module limiting conditions. A Single
Modular manufacturer has the flexibility to define its alternative method to
address the conditions that limit the initial approval, such as: shielding,
minimum signaling amplitude, buffered modulation/data inputs, or power supply
regulation. The alternative method could include that the limited module
manufacturer reviews detailed test data or host designs prior to giving the
host manufacturer approval. This Single Modular procedure is also applicable
for RF exposure evaluation when it is necessary to demonstrate compliance in a
specific host. The module manufacturer must state how control of the product
into which the modular transmitter will be installed will be maintained such
that full compliance of the product is always ensured. For additional hosts
other than the specific host originally granted with a limited module, a Class
II permissive change is required on the module grant to register the
additional host as a specific host also approved with the module. Explanation:
The module is a single module.
Trace antenna designs
For a modular transmitter with trace antenna designs, see the guidance in
Question 11 of KDB Publication 996369 D02 FAQ – Modules for Micro-Strip
Antennas and traces. The integration information shall include for the TCB
review the integration instructions for the following aspects: layout of trace
design, parts list (BOM), antenna, connectors, and isolation requirements.
- Information that includes permitted variances (e.g., trace boundary limits, thickness, length, width, shape(s), dielectric constant, and impedance as applicable for each type of antenna);
- Each design shall be considered a different type (e.g., antenna length in multiple(s) of frequency, the wavelength, and antenna shape (traces in phase) can affect antenna gain and must be considered);
- The parameters shall be provided in a manner permitting host manufacturers to design the printed circuit (PC) board layout;
- Appropriate parts by manufacturer and specifications;
- Test procedures for design verification; and
- Production test procedures for ensuring compliance
The module grantee shall provide a notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify the module grantee that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the grantee, or the host manufacturer can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application
RF exposure considerations
It is essential for module grantees to clearly and explicitly state the RF
exposure conditions that permit a host product manufacturer to use the module.
Two types of instructions are required for RF exposure information: (1) to the
host product manufacturer, to define the application conditions (mobile,
portable – xx cm from a person’s body); and (2) additional text needed for the
host product manufacturer to provide to end users in their end-product
manuals. If RF exposure statements and use conditions are not provided, then
the host product manufacturer is required to take responsibility of the module
through a change in FCC ID (new application).
Explanation: The module complies with FCC radiofrequency radiation
exposure limits for uncontrolled environments. The device is installed and
operated with a distance of more than 20 cm between the radiator and your
body.” This module follows FCC statement design, FCC ID :2AL3B-ESP-C12F
Antennas
A list of antennas included in the application for certification must be
provided in the instructions. For modular transmitters approved as limited
modules, all applicable professional installer instructions must be included
as part of the information to the host product manufacturer. The antenna list
shall also identify the antenna types (monopole, PIFA, dipole, etc. (note that
for example an “omni-directional antenna” is not considered to be a specific
“antenna type”). For situations where the host product manufacturer is
responsible for an external connector, for example with an RF pin and antenna
trace design, the integration instructions shall inform the installer that
unique antenna connector must be used on the Part 15 authorized transmitters
used in the host product. The module manufacturers shall provide a list of
acceptable unique connectors.
Explanation: The product antenna uses an irreplaceable antenna with a
gain of BT ANT:-1.08dBi, WIFI ANT:-1.18dBi
Label and compliance information
Grantees are responsible for the continued compliance of their modules to the
FCC rules. This includes advising host product manufacturers that they need to
provide a physical or e-label stating “Contains FCC ID” with their finished
product. See Guidelines for Labeling and User Information for RF Devices – KDB
Publication 784748.
Explanation: The host system using this module, should have label in a
visible area indicated the following texts: “Contains FCC ID: 2AL3B-ESP-C12F
Information on test modes and additional testing requirements5
Additional guidance for testing host products is given in KDB Publication
996369 D04 Module Integration Guide. Test modes should take into consideration
different operational conditions for a stand-alone modular transmitter in a
host, as well as for multiple simultaneously transmitting modules or other
transmitters in a host product. The grantee should provide information on how
to configure test modes for host product evaluation for different operational
conditions for a stand-alone modular transmitter in a host, versus with
multiple, simultaneously transmitting modules or other transmitters in a host.
Grantees can increase the utility of their modular transmitters by providing
special means, modes, or instructions that simulates or characterizes a
connection by enabling a transmitter. This can greatly simplify a host
manufacturer’s determination that a module as installed in a host complies
with FCC requirements.
Explanation: ShenZhen Doctors of Intelligence & Technology Co.,Ltd. can
increase the utility of our modular transmitters by providing instructions
that simulates or characterizes a connection by enabling a transmitter.
Additional testing, Part 15 Subpart B disclaimer
The grantee should include a statement that the modular transmitter is only
FCC authorized for the specific rule parts (i.e., FCC transmitter rules)
listed on the grant, and that the host product manufacturer is responsible for
compliance to any other FCC rules that apply to the host not covered by the
modular transmitter grant of certification. If the grantee markets their
product as being Part 15 Subpart B compliant (when it also contains
unintentional-radiator digital circuity), then the grantee shall provide a
notice stating that the final host product still requires Part 15 Subpart B
compliance testing with the modular transmitter installed.
Explanation: The module without unintentional-radiator digital circuity,
so the module does not require an evaluation by FCC Part 15 Subpart B. The
host shoule be evaluated by the FCC Subpart B.
Frequently Asked Questions (FAQ)
-
What is the working temperature range for ESP-C12F?
The working temperature range for ESP-C12F is -40°C to 85°C. -
What is the Wi-Fi bandwidth supported by ESP-C12F?
ESP-C12F supports 20 MHz and 40 MHz bandwidth in the 2.4 GHz band.