ANALOG DEVICES MAX77720 Evaluation Kit User Manual

: June 13, 2024
: Analog Devices

Table of Contents

ANALOG DEVICES MAX77720 Evaluation Kit
General Description
Features and Benefits
EV Kit Software
Installation
MAX77720 EV Kit Schematic
MAX77720 EV Kit PCB Layout
References
Read User Manual Online (PDF format)
Download This Manual (PDF format)

ANALOG DEVICES MAX77720 Evaluation Kit

ANALOG-DEVICES-MAX77720-Evaluation-Kit-PRODUCT

General Description

The MAX77720 evaluation kit (EV kit) allows for easy experimentation with various MAX77720 features, including a dual output, DC-DC converter that generates an adjustable positive and an adjustable negative output, a nERR pin, and an I2C interface. Windows®-based software provides a user-friendly graphical interface as well as a detailed register-based interface to exercise the features of the MAX77720.
Windows-based graphical user interface (GUI) software is available for use with the EV kit and can be downloaded from the Analog Devices website at https://www.analog.com/max77720evkit. Windows 7 or newer Windows operating system is required to use the EV kit software.

Features and Benefits

Easy to Use
GUI-Driven I2C Interface
Assembled and Fully Tested
3.3V, 1.8V, 1.2VIO Compatible
On-Board Electronic Loads
Steady-state, Transient, and Random Modes

MAX77720 EV Kit Files

FILE	DESCRIPTION
MAX77720.exe	Installs EV kit files onto the computer

Quick Start
Follow this procedure to familiarize yourself with the EV kit.
Note: In the following sections, software-related items are identified by bolding. Text in bold refers to items directly from the EV kit software. Text in bold and underlined refers to items from the Windows operating system.

Required Equipment

MAX77720 EV kit
MAX77720 EV kit GUI
Windows-based PC
Power supply
Ammeter
Digital multimeters
USB Type-A to Micro-USB cable
MAXUSB_INTERFACE# for I2C serial interface

Procedure
The EV kit is fully assembled and tested. The EV kit software can be run without the hardware attached. Make sure the PC is connected to the internet throughout the process so that the USB driver can be automatically installed. Use twisted wires of appropriate gauge (20 AWG) that are as short as possible to connect the load and power sources.

Install the GUI software. Visit the product webpage at: https://www.analog.com/max77720evkit and download the latest version of the EV kit software.
Install EV kit shunts according to Table 1.
Connect the MAXUSB_INTERFACE# board to the MAX77720 EV kit through the EV kit’s MAXUSB_INTERFACE# connector (J5).
Connect a Micro-USB cable between the MAXUSB_INTERFACE# board and a Windows-based PC.
Apply a 3.6V supply (set for a 100mA current limit) through an ammeter (set for a 10mA range) across the IN and PGND terminals of the EV kit. Turn on the power supply.
Open the MAX77720 GUI and select Device → Connect in the upper-left corner. Wait for a CONNECTED DEVICE LIST window to pop up, then press the Connect button.
Confirm on the ammeter that the quiescent current is approximately 750μA. Then using the DVM, confirm that the BST voltage is outputting the set voltage through feedback resistors and the IBB is outputting the set voltage through I2C.

EV Kit Photo

Table 1. Jumper Connection Guide

REFERENCE DESIGNATOR| DEFAULT POSITION| ****

FUNCTION

---|---|---
J1| 1-2| 1-2: Connects EN to VIO (enables the IBB and BST regulators). 2-3: Connects EN to GND (disables the IBB and BST regulators).
J4| 1-2| 1-2: Connects nERR to VIO (install this jumper to regulate outputs). 2-3: Connects nERR to GND (pull low to flag an error).
J11| 1-2| 1-2: Connects the gate of the Q2 load FET to the U2 amplifier.
J10| 1-2| 1-2: Connects the gate of the Q1 load FET to the U2 amplifier.
J12| 1-2| 1-2: Connects the OUTBST to the onboard electronic load.
J13| 1-2| 1-2: Connects the OUTIBB to the onboard electronic load.

J6

| ****

1-2

| 1-2: Connects the VIO supplied by the MAXUSB_INTERFACE# board

NOTE: Connect the J5 Jumper on the MAXUSB_INTERFACE# board to the desired VIO voltage (either 3.3V or 1.8V only).

2-3: Connects the VIO to the 1.2V VIO supplied by the onboard LDO.

J7| 1-2| 1-2: Connects the IN voltage to the onboard LDO to supply a 1.2VIO.
J8| 1-2| 1-2: Connects the IN voltage to the onboard LDO to supply a 3.3V rail.

Detailed Description of Hardware

This evaluation kit should be used with the following documents:
MAX77720 IC data sheet
MAX77720 EV kit data sheet (this document)
These documents, or links to them, are included in the MAX77720 EV kit package. For the latest versions, visit the product page at: https://www.analog.com/max77720evkit.

EN Pin
The MAX77720 EV kit provides a jumper J1 to enable or disable the MAX77720. See Table 1 for J1 jumper settings.
nERR Pin
The MAX77720 EV kit provides a jumper J4 to drive the nERR pin as high or low. See Table 1 for J4 jumper settings.

Electronic Loads
The EV kit comes with an electronic load that allows the user to evaluate the boost and inverting buck-boost load current capabilities. On-board circuits set the load current through I2C (see Table 2). There are two options to exercise load transient response. In the Load Control tab, the GUI offers load transient controls. If faster rise and fall times are required, remove J11 (for IBB), or J10 (for BST) and connect a signal generator to the gate of the load MOSFET (pin 2 of the respective header). Drive the gate with a signal between 1V and 3V to apply transients to the output of the BST or IBB. Note that there is a 0.5Ω sense resistor for a 1:0.5 conversion of the load current to voltage for the BST and a 2Ω sense resistor for a 1:0.5 conversion of the load current to voltage. See the EV Kit Software section to learn how to set the load current from the GUI.

ANALOG-DEVICES-MAX77720-Evaluation-Kit-FIG-7

Table 2. Electronic Load Jumpers and Sense Points

OUTPUT	JUMPER A	JUMPER B	SENSE
BST	J10	J12	VIL_BST GNDSBST
IBB	J11	J13	VIL_IBB L_IBBS

MAXUSB_INTERFACE#

The MAXUSB_INTERFACE# along with the companion EV kit GUI software allows users to easily change the MAX77720’s register settings with a Windows-based PC. Before connecting the MAXUSB_INTERFACE# to the EV kit’s MAXUSB_INTERFACE# connector (J5), make sure the
MAXUSB_INTERFACE# is configured with the following settings:
SW1 and SW2 to ON position (This enables I2C mode on the MAXUSB_INTERFACE#.)
VL jumper (J5) to 1.8V or 3.3V depending on system requirements (This sets the MAXUSB_INTERFACE#’s VIO voltage.)
The MAXUSB_INTERFACE# also includes an onboard LDO that can supply the necessary voltage to VIO. To use the VIO supplied from the MAXUSB_INTEFACE# board, jumper J6 must be installed to position 1-2 (VCC and VIO connected).
If the user desires to use a 1.2VIO, connect jumper J6 to position 2-3 (VCC and 1.2V) and ensure jumper J7 is installed. This provides power to the onboard 1.2V LDO to provide 1.2VIO compatibility. Additionally, a level shifter is added for users to still communicate using the
MAXUSB_INTERFACE# through I2C.

External I2C Bus
If the user wishes to connect to the external I2C serial bus and not use the MAXUSB_INTERFACE#, unplug the MAXUSB_INTERFACE# from the EV kit’s MAXUSB_INTERFACE# connector (J5). Apply an external I/O supply to the VIO pin or power the VIO pin using the onboard 1.2V rail by connecting jumper J6 to the 2-3 position. Make sure the external I2C serial bus’s logic voltage level is compatible with the MAX77720’s I/O logic voltage level. Refer to the MAX77720 IC data sheet for the appropriate I/O logic voltage levels. Then connect wires to the SDA, SCL, and GND pins on the EV kit to the external I2C serial bus.
Boost Output Voltage Configuration

The boost output voltage is configured using an external resistor divider. By selecting the external resistor-divider RTOP and RBOT, the output voltage is configured to the desired value. When the output voltage is regulated, the typical voltage at the FBBST pin is 1.25V.
Calculate the value of RTOP (from VFBBST to VOUTBST) for a desired VOUTBST at startup with the following equation:

Where

VOUTBST is the desired positive output voltage.
VFBBST is the default internal reference voltage at the FBBST pin, 1.25V (typ).

For best accuracy, set RBOT to a value smaller than 475kΩ to ensure that the current flowing through it is significantly larger than the FBBST pin bias current. The advantage of using a higher value for RTOP is the reduction of quiescent current for achieving the highest efficiency at light load currents. However, using RTOP values that are lower increases immunity against noise injection. Additionally, using one percent tolerance resistors (or better) is recommended to maintain high output voltage accuracy.

High-Temperature Testing
The MAX77720 is rated for operation under junction temperatures up to +125°C. Note that not all components on the EV kit are rated for temperatures this high. Some ceramic capacitors experience extra leakage when put under temperatures higher than they are rated for and supply current readings for the IC might be larger than expected. The MAXUSB_INTERFACE# is also not rated for +125°C. Double-check the components on the EV kit if testing at +125°C ambient or junction temperatures. Consider replacing these components if IC operation at +125°C ambient or junction temperature is an important use case.
List of components not rated for +125°C:

C1, C3, C2 (Input Capacitors)
C4, C6 (Output Boost Capacitors)
C9, C16, C38, C15, C34, C36 (High Frequency Decoupling Capacitors)
C17, C18, C21, C22 (On-Board LDO Capacitors)

Efficiency Measurement
The MAX77720 EV kit comes with sense pins for accurately measuring input voltage (INBBS, GNDBBS), output Inverting buck-boost voltage (OUTIBBS, GNDIBBS), and output boost voltage (OUTBSTS, GNDBSTS). See Figure 3 for their locations on the EV kit. For the most accurate efficiency, load regulation, and line regulation measurements, use these sense pins to measure input and output voltages.
WARNING: These sense pins are only for measuring voltages, do not connect the input supply to input sense pins, and do not connect the electronic load to output sense pins, as these sense pins are not designed to have current running through them. Doing so damages the EV kit.
Use input supply terminals (IN, PGND) and use output terminals (OUTBST, PGNDBST, OUTIBB, and PGNDIBB) for connecting to electronic load as shown in Figure 3.
General PCB Layout Guidelines
Careful printed circuit board layout is critical to achieving low-switching power losses and a clean stable operation by increasing noise immunity.
When laying out the PCB, follow these general guidelines:

Place the inductors and output capacitors of the DC-DC converters close to the MAX77720 and keep the power loop small.
When routing the current path of the DC-DC converters, short and wide traces should be used to reduce any EMI issues radiated from the fast switching. The trace between the LX pin and the inductor is the most critical for this.
The ground loop for the input and output capacitor should be as small as possible.
For multilayer PCBs, the analog ground (AGND) should be on its own plane, and the power ground (PGND) should be on its separate plane. AGND should be directly connected to the ground plane separately, to ensure a quiet ground plane for AGND and to avoid common impedance grounding.
The feedback pins should be routed away from the LX switching node to increase noise immunity. This pin is a high-impedance input that is highly noise sensitive.
When possible, ground planes and traces should be used to help shield the feedback signal and minimize noise and magnetic interference. For multilayer PCBs, a ground plane should be in between the high current paths and any analog or digital paths.

Example PCB Layout
Figure 8 shows an example layout of the top layer with additional digital signals beneath. For the layout and PCB layout per layer, see the MAX77720 EV kit PCB Layout section.

ANALOG-DEVICES-MAX77720-Evaluation-Kit-FIG-9

EV Kit Software

The graphical user interface (GUI) software allows for a quick, easy, and thorough evaluation of the MAX77720. The GUI, along with the MAXUSB_INTERFACE# (see Figure 6), drives I2C communication with the EV kit. Every control in the GUI corresponds directly to a register within the MAX77720. Refer to the Register Map section of the MAX77720 IC data sheet for a complete description of the registers. See Figure 9 for a screenshot of the GUI upon first opening.

ANALOG-DEVICES-MAX77720-Evaluation-Kit-FIG-10

Installation

Visit the product webpage at https://www.analog.com/max77720evkit and download the latest version of the EV kit software. Save the EV kit software installation file to a temporary folder and decompress the Zip file. Run the .EXE installer and follow the on-screen instructions to complete the installation.

Windows Driver
After plugging in the MAXUSB_INTERFACE# to the PC with a Micro-USB cable for the first time, wait about 30 seconds for Windows to automatically install the necessary drivers.
Connecting the GUI to the MAXUSB_INTERFACE#
After opening the GUI, click Device in the upper left corner of the GUI window. Click Connect in the drop-down menu. If there are multiple MAXUSB_INTERFACE# adapters or FTDI devices connected to the PC, the Port Synchronization menu appears (Figure 10). Select the port corresponding to the MAXUSB_INTERFACE# attached to the MAX77720 EV kit and click Connect.
The Device Synchronization menu opens (Figure 11). Once the MAX77720 IC responds, voltages on the IN and VIO pins must be valid on the MAX77720 IC for it to respond. The I2C address shown is the MAX77720 IC’s 7-bit slave address. The address shown changes depending on the OTP configuration. Click Connect and Read. The text at the bottom right of the GUI window changes from “MAXUSB is Disconnected” to “MAXUSB is Connected.”

ANALOG-DEVICES-MAX77720-Evaluation-Kit-FIG-11

MAX77720 Configuration

The MAX77720 tab (Figure 9) displays information and status of the IC on the EV kit as well as all available register settings. It is divided into different sections: OTP Revision Number, Interrupts, Interrupts Mask, Status, Error Flag, Global Configuration, Boost Configuration, and
Inverting Buck-Boost Configuration.
Click Read Once located at the top of the GUI window to obtain all setting values currently stored on all the MAX77720’s registers. After changing the settings values in the GUI software, click Write on the top of the GUI window to apply all settings to the MAX77720’s registers.
Alternatively, click Read on each setting section to obtain the setting values of that particular section currently stored on the MAX77720 registers. After changing the setting values in the GUI software, click Write in the corresponding setting section to apply the new settings for that particular section to the MAX77720 registers.
The POK Status and Fault Interrupt Source section (Figure 12) displays the power-OK status and any fault conditions detected on the MAX77720 IC, which are stored in the INT_GLBL0 register. Periodically check the POK Status and Fault Interrupt Source section during evaluation to monitor the status of the power-OK (POK), overvoltage protection (OVLO), undervoltage protection (UVLO), output hard-short (SCP), thermal shutdown (OTLO), and overcurrent protection (OCP). Click Read to obtain the latest status from the IC.

ANALOG-DEVICES-MAX77720-Evaluation-Kit-FIG-12

The POK Status and Fault Interrupt Masks section (Figure 13) configures the reflection of the bits in INT_GLBL to the POK and nIRQ pin, respectively. If a bit is masked, its status in the INT_GLBL register is not shown on the nIRQ pin. Refer to the Power-OK Monitor and Fault Interrupts section in the IC data sheet for more information about the operation of the POK and nIRQ pin, respectively. Click Read to obtain the setting stored on the IC, and click Write to apply new settings to the IC.

ANALOG-DEVICES-MAX77720-Evaluation-Kit-FIG-13

The Error Flag section (Figure 14) displays the IC protection status for the UVLO, OVLO, and OTLO conditions. These error flag conditions flag once it reaches outside the operating thresholds such as voltage or temperature. Refer to the Electrical Characteristics section of the IC data sheet for the specified values and hysteresis.

ANALOG-DEVICES-MAX77720-Evaluation-Kit-FIG-14

The Config Global section (Figure 15) configures the enabling and disabling of the MAX77720 regulators and their main bias. Refer to the Electrical Characteristics section of the IC data sheet for the difference in the quiescent current for these modes. Additionally, refer to the nERR Error Pin section for the functionality description of these bitfields.

ANALOG-DEVICES-MAX77720-Evaluation-Kit-FIG-15

The Config DCDC0 section (Figure 16) configures the inverting buck-boost and boost regulator’s programmable bitfields. The user can program the inverting buck-boost’s output voltage range, soft-start current limit, and active discharge, along with the boost’s peak current limit and active discharge. Refer to the Detailed Description section in the IC data sheet for more information about the operation of these bitfields.

ANALOG-DEVICES-MAX77720-Evaluation-Kit-FIG-16

The Config DCDC1-2 section (Figure 17) configures the operation of the inverting buck-boost target output voltage. The user can program the inverting buck-boost in two ranges: -17.01V to -24V (low range) and -10.01V to -17V (high range). Refer to the Inverting Buck-Boost Converter section in the IC data sheet for more information about the operation of the inverting-buck- boost converter.

ANALOG-DEVICES-MAX77720-Evaluation-Kit-FIG-17

The Config Delay0 and Config Delay1 section (Figure 18) configures the inverting buck-boost and boost regulator’s programmable startup and power-down delays. The user can program 16 different power-up and power-down delays ranging from 0.2ms to 3.2ms. Refer to the Power-Up/Power-Down Sequence section in the IC data sheet for more information about the operation of the delays.

ANALOG-DEVICES-MAX77720-Evaluation-Kit-FIG-18

Load Control Tab

The Load Control tab contains controls for load current on the regulator’s outputs. The GUI is capable of setting steady-state, transients, and random load currents. To set a load current, use the slider bar or text field to input a value (mA) and check the Enable box. Shuffle through the modes to exercise different load conditions. Note: for the onboard electronic loads to function, jumpers J11 and J13 must be connected to the IBB rail, and jumpers J10 and J12 must be connected to the BST rail.
The offset and gain values are set by Analog Devices and do not need to be altered. However, in the case that the load control seems to be inaccurate, make sure the constants match (see Figure 19 and Figure 20) for the IBB and BST load control respectively.
For the IBB load control, the electronic load is unable to load up to the maximum load capabilities that the IBB can handle. If the user wishes to add more load current, using an external electronic load or a power resistor is recommended.

ANALOG-DEVICES-MAX77720-Evaluation-Kit-FIG-19

Register Map
The Register Map tab provides an overview of all the MAX77720 registers and the values currently stored on them. Clicking on an individual bit shows the name and description of the specified bitfield. See Figure 21 for an example of the INTM_GLBL0.POK_IBB_M bitfield when selected.

ANALOG-DEVICES-MAX77720-Evaluation-Kit-FIG-20

Ordering Information

PART	TYPE
MAX77720EVKIT#	EV Kit

MAX77720 EV Kit Bill of Materials

PART| QTY| MFG PART #| MANUFACTURE R| VALUE| DESCRIPTION
---|---|---|---|---|---
AGND, GND, GND1, GND2, IN, OUTBST, OUTIBB, PGND, PGNDBST,

PGNDIBB

15

| TDK; MURATA; SAMSUNG; SAMSUNG; MURATA| 22UF| CAP; SMT (0201); 1UF; 20%; 6.3V; X5R; CERAMIC

Evaluates: MAX77720

C2| 1| GRM033R60J105ME A2;C0603X5R0J105M 030;CL03A105MQ3C

SN

| MURATA; TDK; SAMSUNG| 1UF| CAP; SMT (0805); 10UF; 10%; 35V; X6S; CERAMIC
---|---|---|---|---|---
C4, C6| 2| GRM21BC8YA106KE1 1| MURATA| 10UF| CAP; SMT (1206); 10UF; 10%; 50V; X7T; CERAMIC
C5, C7| 2| GRM31CD71H106KE 11| MURATA| 10UF| CAP; SMT (0402); 0.1UF; 10%; 16V; X5R; CERAMIC
C9, C16, C38| 3| GRM155R61C104KA8 8| MURATA| 0.1UF| CAP; SMT (7343); 100UF; 20%; 16V; TANTALUM
C10| 1| 16TQC100MYF| PANASONIC| 100UF| CAP; SMT (0402); 0.1UF; 10%; 50V; X7R; CERAMIC
C13, C14| 2| C1005X7R1H104K050 BB; GRM155R71H104KE1 4; C1005X7R1H104K050 BE;

UMK105B7104KV-FR;

04025C104KAT2A

| TDK; MURATA; TDK;

TAIYO YUDEN; AVX

| 0.1UF| CAPACITOR; SMT (0402); CERAMIC CHIP; 1UF; 6.3V; TOL=20%; MODEL=C SERIES; TG=-55 DEGC TO +85 DEGC; TC=X5R ; FORMFACTOR
C15| 1| ANY| ANY| 1UF| CAP; SMT (0603); 4.7UF; 10%; 10V; X5R; CERAMIC
C17, C18, C21, C22| 4| C0603C475K8PAC; LMK107BJ475KA; CGB3B1X5R1A475K; C1608X5R1A475K080 AC; CL10A475KP8NNN; C1608X5R1A475K080

AE

| KEMET; TAIYO YUDEN;

TDK; TDK;

SAMSUNG ELECTRONICS; TDK

| 4.7UF| CAP; SMT (0402); 0.01UF; 10%; 50V; X7R; CERAMIC
C19, C20, C35, C37| 4| C0402C103K5RAC; GRM155R71H103KA 88; C1005X7R1H103K050 BE; CL05B103KB5NNN;

UMK105B7103KV

| KEMET; MURATA; TDK; SAMSUNG ELECTRONIC; TAIYO YUDEN| 0.01UF| CAPACITOR; SMT (0402); CERAMIC CHIP; 0.1UF; 25V; TOL=10%; MODEL=C SERIES; TG=-55 DEGC TO +125 DEGC; TC=X7R; FORMFACTOR
C23-C25| 3| ANY| ANY| 0.1UF| CAP; SMT (0402); 4700PF; 5%; 50V; X7R; CERAMIC
C26, C27| 2| C0402C472J5RAC| KEMET| 4700PF| CAPACITOR; SMT (0402); CERAMIC CHIP; 0.01UF; 10V; TOL=10%; MODEL=C0402C SERIES; TG=-55 DEGC TO +125

DEGC; TC=X7R

C28, C29| 2| ANY| ANY| 0.01UF| CAP; SMT (0402); 1000PF; 5%; 50V; X7R; CERAMIC
C30-C33| 4| GRM155R71H102JA0 1; GCM155R71H102JA3

7

BC

| TDK| 1UF| CAP; SMT (0402); 0.1UF; 10%;

25V; X7R; CERAMIC

C39| 1| GRM155R71E104KE1 4;| MURATA; TDK;

TAIYO YUDEN;

| 0.1UF| DIODE; SCH; SMT (PMDE); PIV=60V; IF=2A
| | C1005X7R1E104K050 BB; TMK105B7104KVH; CGJ2B3X7R1E104K05

0BB

| TDK| |
---|---|---|---|---|---
D1| 1| RB068VWM-60| ROHM SEMICONDUCT OR| RB068VWM- 60| TEST POINT; PIN DIA=0.1IN; TOTAL LENGTH=0.3IN; BOARD HOLE=0.04IN; WHITE; PHOSPHOR BRONZE WIRE

SILVER;

EN, NERR, NIRQ, POK, SCL, SDA| 6| 5002| KEYSTONE| N/A| TEST POINT; PIN DIA=0.1IN; TOTAL LENGTH=0.3IN; BOARD HOLE=0.04IN; BLACK; PHOSPHOR BRONZE WIRE

SILVER PLATE FINISH;

GNDBBS, GNDBSTS, GNDIBBS, GNDSBST,

INGNDS

| 5| 5001| KEYSTONE| N/A| TEST POINT; PIN DIA=0.1IN; TOTAL LENGTH=0.3IN; BOARD HOLE=0.04IN; RED; PHOSPHOR BRONZE WIRE SILVER PLATE

FINISH;

INBBS, INBSTS, L_IBBS, OUTBSTS, OUTIBBS, VIL_BST, VIL_IBB, VIO,

V_3P3

+105 DEGC

5PINS-4PINS

MISC1| 1| AK67421-2| ASSMANN| AK67421-2| TRAN; N-CHANNEL POWER MOSFET; NCH; TO-252AA; PD-

(50W); I-(15A); V-(100V)

Q1| 1| TSM900N10CP ROG| TAIWAN

SEMICONDUCT OR

| TSM900N10C P ROG| TRAN; P-CHANNEL MOSFET;

PCH; TO-252AA; PD-(75W); I-(- 45A); V-(-30V)

Q2| 1| MCU45P03A| MICRO

COMMERCIAL COMPONENTS

| MCU45P03A| RES; SMT (0603); 909K; 1%; +/- 100PPM/DEGK; 0.1000W
---|---|---|---|---|---
R1| 1| CRCW0603909KFK| VISHAY DALE| 909K| RES; SMT (0603); 130K; 0.50%;

+/-25PPM/DEGC; 0.0630W

R2| 1| RR0816P-134-D| SUSUMU CO LTD.| 130K| RESISTOR; 0402; 0 OHM; 1%; 100PPM; 0.0625W; THICK FILM; FORMFACTOR
R3, R9, R11-R18,

R26, R28

| 12| ANY| ANY| 0| RESISTOR; 0402; 100K; 1%; 100PPM; 0.0625W; THICK FILM;

FORMFACTOR

R4, R7,

R8, R10, R25, R27

| 6| ANY| ANY| 100K| RES; SMT (0402); 2.2K; 1%; +/- 100PPM/DEGC; 0.0630W
R5, R6| 2| RC0402FR-072K2L| YAGEO| 2.2K| RES; SMT (0402); 20K; 1%; +/- 100PPM/DEGC; 0.0630W
R19, R20| 2| CRCW040220K0FK| VISHAY DALE| 20K| RES; SMT (0402); 680; 1%; +/- 100PPM/DEGC; 0.0630W
R21, R22| 2| RC0402FR-07680RL| YAGEO| 680| RES; SMT (0402); 100; 1%; +/- 100PPM/DEGC; 0.0630W
R23, R24| 2| 9C04021A1000FL; RC0402FR-07100RL| PANASONIC; YAGEO PHYCOMP| 100| RES; SMT (0402); 10; 1%; +/- 200PPM/DEGC; 0.0630W
R29, R30| 2| RC0402FR-0710RL| YAGEO PHYCOMP| 10| RES; SMT (0402); 10K; 5%; +/- 200PPM/DEGC; 0.0630W
R31, R33| 2| CR0402-JW-103GLF| BOURNS| 10K| RES; SMT (0402); 2K; 0.10%; +/- 25PPM/DEGC; 0.0630W
R32, R34| 2| ERA-2AEB202| PANASONIC| 2K| RES; SMT (0402); 470K; 1%; +/- 100PPM/DEGC; 0.0630W
R35, R36| 2| ERJ-2RKF4703| PANASONIC| 470K| RES; SMT (0402); 649K; 1%; +/- 100PPM/DEGC; 0.0630W
R37, R39| 2| CRCW0402649KFK| VISHAY DALE| 649K| RESISTOR; 0402; 1K; 1%; 100PPM; 0.0625W; THICK FILM;

FORMFACTOR

R38, R40,

R42, R43

| 4| ANY| ANY| 1K| RES; SMT (0402); 1M; 1%; +/-

100PPM/DEGC; 0.0630W

R41, R45| 2| CRCW04021M00FK| VISHAY DALE| 1M| RES; SMT (2512); 0.5; 1%; +/-

100PPM/DEGC; 2W

R44| 1| LRC-LR2512LF-01-

R500-F

| TT

ELECTRONICS

| 0.5| RES; SMT (2512); 4.7; 5%;

JUMPER; 1.0000W

R46| 1| CR2512-J/-4R7ELF| BOURNS| 4.7| RES; SMT (0402); 0; JUMPER;

JUMPER; 0.1000W

R47-R50| 4| ERJ-2GE0R00| PANASONIC| 0| RES; SMT (0603); 0; 5%;

JUMPER; 0.1000W

R51| 1| RC1608J000CS; CR0603-J/-000ELF; RC0603JR-070RL| SAMSUNG ELECTRONICS; BOURNS;

YAGEO PH

AMPLIFIERS; TSSOP14

REFERENCE AND I2C INTERFACE; TSSOP14

---|---|---|---|---|---
U3| 1| MAX5815BAUD+| MAXIM| MAX5815BAU D+| IC; TRANS; QUAD BIDIRECTIONAL LOW- VOLTAGE LOGIC LEVEL TRANSLATOR;

TDFN14-EP

MILLIAMPERE LDO LINEAR REGULATOR; TDFN8-EP

JUMPER; STRAIGHT; 2PINS

EV_KIT_B OX1| 9| NPC02SXON-RC| SULLINS

ELECTRONICS CORP.

| | CAPACITOR; SMT (0805); OPEN; FORMFACTOR
C11, C12| 0| N/A| N/A| OPEN| CAPACITOR; SMT (0402); OPEN; FORMFACTOR
C8| 0| N/A| N/A| OPEN| CAP; SMT (0603); 22UF; 20%; 10V; X5R; CERAMIC

MAX77720 EV Kit Schematic

ANALOG-DEVICES-MAX77720-Evaluation-Kit-fig-35

MAX77720 EV Kit PCB Layout

ANALOG-DEVICES-MAX77720-Evaluation-Kit-FIG-21

Revision History

REVISION

NUMBER

| REVISION

DATE

| DESCRIPTION| PAGES

CHANGED

---|---|---|---
0| 8/23| Initial release| —

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