ZEISS AURIGA Series Modular CrossBeam Workstation Instruction Manual

: June 13, 2024
: Zeiss

Table of Contents

AURIGA Series Modular CrossBeam Workstation
Product Information
Product Usage Instructions
Safety Instructions
Intended Use
Prevention of Accidents and Improper Use
Safety Summary
Safety Equipment
Handling Precursors (with GIS Upgrade Only)
Product Description
Control Elements
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AURIGA Series Modular CrossBeam Workstation

Product Information

Document Name	Instruction Manual AURIGA series
Revision	en06
Effective from	January 2015
Manufacturer	Carl Zeiss Microscopy GmbH
Address	Carl-Zeiss-Promenade 10, 07745 Jena, Germany
Email	microscopy@zeiss.com
Website	www.zeiss.com/microscopy

Product Usage Instructions

Safety Instructions

1. Read and follow the safety instructions provided in this
manual.

Intended Use

2. The AURIGA series is intended for electron and ion beam
microscopy.

Prevention of Accidents and Improper Use

3. To prevent accidents and improper use, ensure that you are
familiar with the safety guidelines outlined in this manual.

Safety Summary

4. The safety summary contains information about hazards related
to personal injury and hazards not related to personal injury.
Refer to the manual for detailed information.

Safety Equipment

5. Ensure that you have the necessary safety equipment before
operating the AURIGA series. Refer to the manual for a list of
required safety equipment.

Handling Precursors (with GIS Upgrade Only)

6. If you have the GIS upgrade, follow the safety instructions
provided for handling precursors. Refer to the manual for detailed
information.

Product Description

7. The AURIGA series consists of a basic workstation and an
upgraded workstation with additional features such as FIB upgrade
and Gas injection system (GIS) upgrade. Refer to the manual for a
detailed description.

Control Elements

8. Familiarize yourself with the control elements of the AURIGA
series before operation. Refer to the manual for a visual
representation and detailed information.

Instruction Manual

Carl Zeiss Microscopy – Electron and Ion Beam Microscopy
AURIGA® series
Modular CrossBeam® workstation
Enabling the Nano-Age World®

AURIGA® series Modular CrossBeam® Workstation
Original instructions
Carl Zeiss Microscopy GmbH Carl-Zeiss-Promenade 10 07745 Jena, Germany microscopy@zeiss.com www.zeiss.com/microscopy
Carl Zeiss Microscopy GmbH Carl-Zeiss-Straße 22 73447 Oberkochen, Germany
Document name: Instruction Manual AURIGA series Revision: en06 Effective from: January 2015
© by Carl Zeiss Microscopy GmbH
346500-8098-000
This document or any part of it must not be translated, reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying, recording, or by any information or retrieval system. Violations will be prosecuted.
The use of general descriptive names, registered names, trademarks, etc. in this document does not imply, even in the absence of a specific statement, that such names are exempt from the relevant protective laws and regulations and therefore free for general use. Software programs will fully remain the property of Carl Zeiss Microscopy. No program, documentation or subsequent upgrade thereof may be disclosed to any third party, unless prior written consent of Carl Zeiss Microscopy has been procured to do so, nor may they be copied or otherwise duplicated, even for the customer’s internal needs apart from a single backup copy for safety purposes. Due to an ongoing process of improvement Carl Zeiss Microscopy reserves the right to make modifications of this document without notice.

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Table of contents
1. About this manual ……………………………………………………………………………. 9
1.1. Safety instructions in this manual ………………………………………………………. 10 1.2. Typographical conventions ……………………………………………………………….. 11 1.3. Definition of terms …………………………………………………………………………….. 12
2. Safety ……………………………………………………………………………………………. 13
2.1. Intended use ……………………………………………………………………………………… 13 2.2. Prevention of accidents and of improper use ……………………………………… 15 2.3. Safety summary ………………………………………………………………………………… 16
2.3.1. Hazards related to personal injury ………………………………………………………………. 16 2.3.2. Hazards not related to personal injury …………………………………………………………. 19
2.4. Safety equipment ………………………………………………………………………………. 20
2.4.1. Safety devices …………………………………………………………………………………………. 20 2.4.1.1. Protective cover panels ……………………………………………………………………………………. 20 2.4.1.2. Interlock system ……………………………………………………………………………………………… 20 2.4.1.3. ON/OFF switch……………………………………………………………………………………………….. 21 2.4.1.4. EMO box with main switch (optional, but mandatory with FIB and/or GIS upgrade)….. 21 2.4.1.5. EMO button (optional, but mandatory with FIB and/or GIS upgrade)………………………. 22 2.4.1.6. Main shut-off valves ………………………………………………………………………………………… 22
2.4.2. Safety labels and labels ……………………………………………………………………………. 23 2.4.2.1. At the front of the workstation……………………………………………………………………………. 23 2.4.2.2. At the rear of the workstation ……………………………………………………………………………. 24 2.4.2.3. At the rear of the electron optical column……………………………………………………………. 25 2.4.2.4. Inside the workstation………………………………………………………………………………………. 25
2.4.3. Material Safety Data Sheets ………………………………………………………………………. 25
2.5. Safety instructions for handling precursors (with GIS upgrade only) …… 26
3. Description ……………………………………………………………………………………. 27
3.1. Overview …………………………………………………………………………………………… 27 3.2. Basic workstation ……………………………………………………………………………… 28
3.2.1. View ……………………………………………………………………………………………………….. 28
3.3. Upgraded workstation ……………………………………………………………………….. 29
3.3.1. View ……………………………………………………………………………………………………….. 29 3.3.2. FIB upgrade …………………………………………………………………………………………….. 30 3.3.3. Gas injection system (GIS) upgrade …………………………………………………………… 30
3.3.3.1. Five-channel GIS…………………………………………………………………………………………….. 30 3.3.3.2. Single GIS ……………………………………………………………………………………………………… 30 3.3.4. Charge compensation upgrade ………………………………………………………………….. 31 3.3.4.1. Charge Compensator ………………………………………………………………………………………. 31 3.3.4.2. Five-channel GIS with integrated charge compensation……………………………………….. 31
3.4. Control elements ……………………………………………………………………………….. 32
3.4.1. SmartSEM® user interface ………………………………………………………………………… 32

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3.4.2. Dual joystick ……………………………………………………………………………………………. 33 3.4.3. Optional control panel ………………………………………………………………………………. 34
3.5. Principle of operation ………………………………………………………………………….35
3.5.1. Vacuum system ……………………………………………………………………………………….. 35 3.5.2. Specimen stage ……………………………………………………………………………………….. 36 3.5.3. Electron optics (GEMINI® column) ……………………………………………………………… 37 3.5.4. Ion optics (FIB column) ……………………………………………………………………………… 39
3.5.4.1. Imaging modes……………………………………………………………………………………………….. 41 3.5.5. Signal detection ……………………………………………………………………………………….. 42
3.5.5.1. In-lens detector ………………………………………………………………………………………………. 43 3.5.5.2. SE2 detector ………………………………………………………………………………………………….. 45 3.5.5.3. EsB® detector (optional) ………………………………………………………………………………….. 46 3.5.5.4. SESI detector (optional, with FIB upgrade only) ………………………………………………….. 47
3.6. Specification ………………………………………………………………………………………48
3.6.1. Basic workstation ……………………………………………………………………………………… 48 3.6.2. Workstation with FIB upgrade ……………………………………………………………………. 50
3.7. Technical data …………………………………………………………………………………….51
3.7.1. Layout and connections …………………………………………………………………………… 51 3.7.2. System layout ………………………………………………………………………………………….. 52
3.7.2.1. AURIGA® ………………………………………………………………………………………………………. 52 3.7.2.2. AURIGA® 60 ………………………………………………………………………………………………….. 53 3.7.3. Installation requirements ………………………………………………………………………….. 55
3.8. Options ………………………………………………………………………………………………57
3.8.1. Airlock …………………………………………………………………………………………………….. 57
3.9. Customer service ………………………………………………………………………………..57
4. Transport and storage ……………………………………………………………………. 59
4.1. Transport ……………………………………………………………………………………………59 4.2. Storage ………………………………………………………………………………………………60
5. Installation ……………………………………………………………………………………… 61
6. Operation ……………………………………………………………………………………….. 63
6.1. Switching on the workstation ………………………………………………………………63 6.2. Starting the SmartSEM® user interface ………………………………………………..64 6.3. Finding your way in the SmartSEM® user interface ………………………………66
6.3.1. Showing or hiding toolbars ………………………………………………………………………… 66 6.3.2. Showing or hiding the data zone ………………………………………………………………… 67 6.3.3. Showing a full screen image ………………………………………………………………………. 67 6.3.4. Docking panels ………………………………………………………………………………………… 68 6.3.5. Opening the Panel Configuration Bar ………………………………………………………….. 70
6.4. SEM operation (basic workstation) ………………………………………………………71
6.4.1. Obtaining a first image ………………………………………………………………………………. 71 6.4.1.1. Preparing the sample holder …………………………………………………………………………….. 72

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6.4.1.2. Loading the specimen chamber via chamber door ………………………………………………. 73 6.4.1.3. Loading the specimen chamber via airlock …………………………………………………………. 77 6.4.1.4. Locating the specimen …………………………………………………………………………………….. 78 6.4.1.5. Switching on the electron gun …………………………………………………………………………… 78 6.4.1.6. Switching on the EHT………………………………………………………………………………………. 80 6.4.1.7. Generating an image……………………………………………………………………………………….. 82 6.4.1.8. Optimising the image……………………………………………………………………………………….. 84 6.4.1.9. Saving the image…………………………………………………………………………………………….. 88 6.4.1.10. Finishing the work session ……………………………………………………………………………… 90 6.4.2. Setting detection parameters …………………………………………………………………….. 91 6.4.2.1. Selecting a detector…………………………………………………………………………………………. 91 6.4.2.2. Using the SE2 detector ……………………………………………………………………………………. 92 6.4.2.3. Using the EsB® detector (optional)…………………………………………………………………….. 92
6.5. Electron beam deposition or etching (with GIS upgrade only) …………….. 93
6.5.1. Heating the reservoirs ………………………………………………………………………………. 94 6.5.2. Depositing or etching with the electron beam ………………………………………………. 95
6.6. CrossBeam® operation (with FIB upgrade only) ………………………………….. 96
6.6.1. Preparing the workstation ………………………………………………………………………….. 96 6.6.1.1. Getting started………………………………………………………………………………………………… 96 6.6.1.2. Adjusting tilt eucentricity…………………………………………………………………………………… 97 6.6.1.3. Switching on the ion beam (FIB) ……………………………………………………………………….. 98 6.6.1.4. Setting the coincidence point ………………………………………………………………………….. 103
6.6.2. Milling for depth ……………………………………………………………………………………… 104 6.6.2.1. Selecting milling conditions …………………………………………………………………………….. 104 6.6.2.2. Starting the milling procedure………………………………………………………………………….. 107
6.6.3. Recording images during milling ………………………………………………………………. 109 6.6.4. Gas assisted deposition: Platinum (with GIS upgrade only) …………………………. 110
6.6.4.1. Heating the platinum reservoir ………………………………………………………………………… 110 6.6.4.2. Outgassing the platinum reservoir (only with five-channel GIS)……………………………. 112 6.6.4.3. Selecting deposition conditions ……………………………………………………………………….. 115 6.6.4.4. Starting the deposition procedure ……………………………………………………………………. 117 6.6.5. Setting detection parameters …………………………………………………………………… 120 6.6.5.1. Using the SESI detector (optional) …………………………………………………………………… 120 6.6.6. Adjusting a FIB probe current at high kV (30 kV) ………………………………………… 122 6.6.6.1. Overview ……………………………………………………………………………………………………… 122 6.6.6.2. Adjusting a low probe current (pA) …………………………………………………………………… 125 6.6.6.3. Adjusting a high probe current (nA)………………………………………………………………….. 127 6.6.6.4. Optimising a high probe current (nA) ……………………………………………………………….. 129 6.6.6.5. Adjusting beam shift correction ……………………………………………………………………….. 132
6.7. Using the help functions ………………………………………………………………….. 135
6.7.1. Calling the SmartSEM® help ……………………………………………………………………. 135 6.7.1.1. Printing help texts………………………………………………………………………………………….. 135 6.7.1.2. Bringing help texts to the foreground ……………………………………………………………….. 135
6.7.2. Calling the context-sensitive help ……………………………………………………………… 136 6.7.3. Searching for a topic ………………………………………………………………………………. 136 6.7.4. Using the step-by-step guides ………………………………………………………………….. 137

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6.7.4.1. Getting started………………………………………………………………………………………………. 137 6.7.4.2. Frequently used operation sequences ……………………………………………………………… 137 6.7.5. Calling the short cuts help ……………………………………………………………………….. 138 6.7.6. Showing information about SmartSEM® ……………………………………………………. 139 6.7.6.1. Version history ……………………………………………………………………………………………… 139 6.7.6.2. About SmartSEM® ………………………………………………………………………………………… 139
6.8. Closing the SmartSEM® user interface ………………………………………………140
6.8.1. Logging off …………………………………………………………………………………………….. 140 6.8.2. Exiting …………………………………………………………………………………………………… 140
6.9. Switching off the workstation as a matter of routine …………………………..141
6.9.1. Changing to STANDBY mode ………………………………………………………………….. 141 6.9.2. Changing to OFF mode …………………………………………………………………………… 142
6.10. Emergency off (EMO) ………………………………………………………………………143
6.10.1. With EMO box (optional, but mandatory with FIB and/or GIS upgrade) ………… 143 6.10.1.1. Switching off in an emergency ………………………………………………………………………. 143 6.10.1.2. Switching on again after an emergency off ……………………………………………………… 143
6.10.2. Without EMO box …………………………………………………………………………………. 145 6.10.2.1. Switching off in an emergency ………………………………………………………………………. 145 6.10.2.2. Switching on again after an emergency off ……………………………………………………… 145
6.11. Switching off the workstation completely …………………………………………147
7. Maintenance and repair ………………………………………………………………… 149
7.1. Maintenance work ……………………………………………………………………………..149 7.2. Maintenance intervals ……………………………………………………………………….149 7.3. Change of consumables and chemicals …………………………………………….150
8. Troubleshooting …………………………………………………………………………… 151
8.1. Overview …………………………………………………………………………………………..151 8.2. Chamber …………………………………………………………………………………………..153
8.2.1. Initialising the stage ………………………………………………………………………………… 153 8.2.2. Replacing the chamber door seal ……………………………………………………………… 153
8.3. Column …………………………………………………………………………………………….155
8.3.1. Baking ot the gun head …………………………………………………………………………… 155 8.3.2. Ion source (Workstation with FIB) …………………………………………………………….. 158
8.3.2.1. Checking the lifetime……………………………………………………………………………………… 158 8.3.2.2. Regenerating by heating ………………………………………………………………………………… 158
8.4. Power circuit …………………………………………………………………………………….161
8.4.1. Checking the circuit breakers …………………………………………………………………… 161
9. Shutdown and disposal ………………………………………………………………… 165
9.1. Putting the workstation out of operation ……………………………………………165 9.2. Disposal ……………………………………………………………………………………………165
9.2.1. Disposing of solid waste (consumables) ……………………………………………………. 165 9.2.2. Disposing of the workstation …………………………………………………………………….. 166

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10. Parts and tools …………………………………………………………………………… 167
10.1. Important consumables ………………………………………………………………….. 167 10.2. Important spare parts …………………………………………………………………….. 167 10.3. Tools and accessories ……………………………………………………………………. 168
11. Abbreviations …………………………………………………………………………….. 169 12. Glossary …………………………………………………………………………………….. 171 13. Declaration of conformity ……………………………………………………………. 173 14. Index ………………………………………………………………………………………….. 175

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1. About this manual

This instruction manual is considered to be part of the AURIGA® series workstation.
Read the instructions carefully. Keep the instruction manual nearby the workstation and hand it over to future owners of the instrument.
This instruction manual is designed for users who have been trained to operate the workstation by an authorised Carl Zeiss expert. Operators of the workstation must not deviate from the instructions provided in this document.

Reference to related documents

For detailed information regarding the operating software refer to
· Software Manual SmartSEM® for general information on FESEM operation (basic work-
station)
· Software Manual SmartSEM® XB for CrossBeam® specific topics (FIB and GIS upgrade)
For details on technical data refer to the documents Product Specification and Installation Requirements.
For details on optional components of the workstation refer to the respective manuals delivered with the workstation. You will find these manuals in the document folder.

Models

The AURIGA® series includes the following models:
· AURIGA® · AURIGA® 60

At a glance This instruction manual contains the following chapters:

1. About this manual 2. Safety 3. Description 4. Transport and storage 5. Installation 6. Operation 7. Maintenance and repair 8. Troubleshooting 9. Shutdown and disposal 10. Parts and tools 11. Abbreviations 12. Glossary 13. Declaration of conformity 14. Index

Explains function and structure of this instruction manual Summarises important safety details Describes structure and principle of operation of the workstation Gives details on transport and storage Refers to Carl Zeiss service staff Introduces fundamental operation procedures Describes preventive maintenance and repair tasks Summarises clues to solve possible problems Summarises notes on shutdown and disposal Lists consumables, spare parts, tools, and accessories Alphabetical list of abbreviations used in this instruction manual Alphabetical list of important technical terms Important declaration Alphabetical list of key words that are referred to in this instruction manual

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1.1. Safety instructions in this manual
The safety instructions in this manual follow a system of risk levels, that are defined as follows:
DANGER
This safety symbol and signal word indicates an imminently hazardous situation. Disregarding this warning WILL result in death or serious injury.
WARNING
This safety symbol and signal word indicates a potentially hazardous situation. Disregarding this warning COULD result in death or serious injury.
CAUTION
This safety symbol and signal word indicates a potentially hazardous situation. Disregarding this warning MAY result in minor or moderate injury.
CAUTION
This signal word used without a safety symbol indicates a potentially hazardous situation. Disregarding this warning MAY result in property damage.
IMPORTANT
This symbol and signal word draws your attention to important and useful information.

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1.2. Typographical conventions
For the description of software, the following typographical conventions are used:

Typography Push . Type <key1, key2> Type <Ctrl + Alt + Del>.
Click on the Magnification icon. Select File/Exit from the menu.
Enter 10 kV in the EHT target field.

Meaning Push the ENTER key on the keyboard. Type key 1 first, then type key 2 on the keyboard. Simultaneously type CTRL key, ALT key and DEL key on the keyboard. Icons, buttons, and menus are printed in bold.
Values to be selected are printed in italics.

Text Click… Right-click… Double-click….

Meaning Press the left mouse button. Press the right mouse button. Press the left mouse button twice.

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1.3. Definition of terms
The following terms are used in this instruction manual:

Workstation
AURIGA® SmartSEM® Operator
User Carl Zeiss service engineer, Carl Zeiss service staff EMO box
EMO button FIB GEMINI® column Cobra column Canion column Coincidence point GIS

The models of the AURIGA® series are CrossBeam® workstations, referred to as workstation.
Includes the models AURIGA® and AURIGA® 60
Operating software for Carl Zeiss field emission scanning electron microscopes
A trained person, who is assigned to operate the workstation. Basic operator: Person who has been trained to perform fundamental operation sequences Specially trained operator: Electrically skilled person who has been trained to perform basic maintenance tasks
A person or organisation that uses products of Carl Zeiss.
Specially trained service expert, either Carl Zeiss staff or authorised service partner of Carl Zeiss.
Emergency off box; a safety device that contains the safety related electronics to switch off the workstation (and connected options) completely in case of an emergency.
Emergency off button; to be pressed in an emergency to de-energize the workstation completely.
Focused ion beam
Electron optical column
Type of FIB column (optional)
Type of FIB column (optional)
Point where electron beam and ion beam are crossed.
Gas injection system (optional) Several different types of available

This instruction manual refers to the operating software SmartSEM® V05.04 (AURIGA®) and SmartSEM® V05.05 (AURIGA® 60).

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2. Safety
2.1. Intended use
AURIGA® series instruments are CrossBeam® workstations that allow microscopic examination and modification of suitable specimens.
The workstation has been designed in a modular manner so that it can exist in different upgrade stages. At maximum upgrade stage, the workstation allows you to perform the full range of FESEM and CrossBeam® applications, which are:
· SEM operation
A focused beam of electrons is scanned across the specimen to generate an image or to analyse the specimen. Suitable for the analysis of surface structures and near-surface structures of appropriate specimens.
· FIB Imaging (requires FIB column)
A focused beam of ions is scanned across the specimen to generate an image or to analyse the specimen.
· Milling (requires FIB column)
A focused beam of ions locally removes material from the specimen surface.
· Gas assisted etching with ion beam (requires FIB column and gas injection system)
With the help of a process gas, the focused ion beam cuts into the specimen surface.
· Gas assisted deposition with ion beam (requires FIB column and gas injection system)
With the help of a process gas, the focused ion beam deposits material onto the specimen surface.
· Gas assisted etching with electron beam (requires gas injection system)
With the help of a process gas, the electron beam cuts into the specimen surface.
· Gas assisted deposition with electron beam (requires gas injection system)
With the help of a process gas, the electron beam deposits material onto the specimen surface. For all of these applications, the specimen has to be located in the evacuated specimen chamber.
IMPORTANT
Depending on the upgrade stage of your workstation, not all of theses features may be available.
Commercial The workstation is to be used in a laboratory environment for commercial purposes only. use only
Using the workstation for any other purpose is not allowed and could be hazardous.

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Gas injection If the workstation is equipped with a gas injection system (GIS), up to five different precursors out

system

of the following can be available:

Reactive product Precursor

Used for

Tungsten
Platinum
Silicon dioxide (insulator) Carbon
Gold Fluorine
Water (reactive product) Iodine*

W(CO)6 Tungsten hexacarbonyl
C9H16Pt Methylcyclopentadienyl(trimethyl)platinum (IV)
C12H24O6Si Diacetoxydi-t-butoxysilane
C14H10 Phenanthrene
Dimethyl(acetylacetonate)gold(III)
XeF2 Xenondifluoride
MgSO4 * 7 H2O Magnesium sulphate heptahydrate
I2

Table 2.1: Overview of available precursors *Iodine is not available for the US market.

deposition
deposition
deposition
deposition
deposition gas assisted etching, selectively etches Si, SiOx gas assisted etching selectively etches hydrocarbon gas assisted etching, selectively etches aluminum/ aluminum oxide

Using the GIS for any other purpose is not allowed and could be hazardous. Likewise, it is not allowed to use the GIS in combination with any other precursor not mentioned in table 2.1.
For safety reasons, mixing of precursors is not possible due to technical measures.

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2.2. Prevention of accidents and of improper use
CAUTION
Risk of injury or damage due to improper operation of the workstation. Read the user documentation carefully. Do not operate the workstation until you have completely read and understood this instruction manual and the entire user documentation delivered with the workstation. You will find the user documentation in the document folder.

Operator training

Within the scope of initial start-up the Carl Zeiss service staff will perform a basic operator training. The basic operator training consists of fundamental operation procedures including safety instructions. Besides, an introduction to basic maintenance tasks will be given for an advanced operator, who has to be an electrically skilled person. The training performed shall be documented appropriately.
Special application trainings are offered on request.

IMPORTANT
All pursuing tasks of maintenance, service, and repair not described in this instruction manual have to be performed by authorised Carl Zeiss service staff only.

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2.3. Safety summary
Follow the safety instructions given in this instruction manual. This is essential to prevent damage and to protect yourself and others against accidents and unsafe practices. Do not deviate from the instructions provided in this instruction manual. This section summarises possible hazards and recommended safety procedures.
2.3.1. Hazards related to personal injury
Service tasks
DANGER
Danger to life: Hazardous voltage inside the workstation. Only service engineers trained and authorised by Carl Zeiss are allowed to service the workstation.

Radiation protection

X-rays are produced within the workstation during operation. This is unavoidable since accelerated electrons hit material thus generating radiation.
WARNING
Radiation hazard: X-rays are generated inside the workstation during operation.
Only authorised Carl Zeiss service engineers are allowed to service the workstation. Do not remove any parts. Do not disable any parts of the interlock system. Use genuine Carl Zeiss parts exclusively. Observe all safety and X-ray protection regulations.

In Germany, the operation of the workstation is permission-free as the following requirements are fulfilled:
· The maximum acceleration voltage is limited to 30 kV.
· The local dose rate at a distance of 0.1 m from the accessible surface of the workstation does
not exceed 1 µSv/h.
· A respective label is attached to the workstation.
Outside Germany, the user of the workstation has to comply with the local regulations of the country where the workstation is operated.
The workstation is equipped with several radiation protection devices, which ensure – under regular operation conditions – that the workstation operates in accordance with the German X-ray protection regulation (RöV) respectively the German radiation protection regulation (StrSchV) as well as with the EC Directive 96/29/EURATOM.

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Electrical connections
CAUTION
High leakage current Ensure proper grounding. Do not operate the workstation without separate ground connection.

Gases

Gaseous dry nitrogen is used to ventilate the specimen chamber during specimen exchange. Compressed air is used to operate several valves and the auto levelling system.
CAUTION
Suffocation hazard due to lack of oxygen, since the specimen chamber is ventilated with gaseous nitrogen. Inhaling nitrogen may cause unconsciousness. During specimen exchange, keep the chamber door open as short as possible. Avoid inhaling the air from within the specimen chamber. Ensure the area around the workstation is sufficiently ventilated.

IMPORTANT
Concerning the hazards of nitrogen installations and associated safety precautions refer to the current version of guideline IGC Doc 44/00/E: Hazards of inert gases, published by EIGA (European Industrial Gases Association) which can be found on the EIGA homepage www.eiga.org/Publications/Documents.

CAUTION
Risk of injury or damage due to the high internal pressure in gas cylinders (e.g. containing nitrogen or compressed air). Observe all safety labels on the gas cylinders and all safety instructions given by the gas cylinder manufacturer.

CAUTION
Crushing hazard while load is being lowered. Maintain a safe distance. Do not walk or place your hands or feet under the load while it is being lowered. Wear safety shoes and gloves.

Operation
CAUTION
Risk of injury Fingers could be trapped in the moving specimen stage. Always close the chamber door before you move the specimen stage.

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CAUTION
If you work with aggressive or toxic chemicals there may be a risk of injury. Wear suitable protective clothing, gloves and eye/face protection. Do not eat, drink or smoke at work. Refer to local safety regulations.
CAUTION
Risk of injury due to aggressive or toxic chemicals. Risk of damage to environment. When disposing of waste that has been generated during a service operation comply with all national and local safety and environmental protection regulations.

GIS

The optional gas injection system allows injecting process gases onto the specimen surface.

During operation, the process gases are generated out of precursor substances.

CAUTION
Hazard due to irritant gases that might be released from the precursors. Gases can cause irritation to eyes, skin, and respiratory system.
Do not remove a reservoir from the workstation. Contact the Carl Zeiss service to have an empty reservoir replaced. Never try to open a reservoir.

During operation, unknown reaction products may be generated, when specimen material, reactive precursor products, electron beam and/or ion beam get in contact.
CAUTION
Hazard due to dangerous reaction products that might be present in the specimen chamber during or after operation. Wear personal protective equipment when touching the inner parts of the specimen chamber or the specimen. Do not remove a reservoir from the workstation. Contact the Carl Zeiss service to have an empty reservoir replaced. Never try to open a reservoir.

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Maintenance Baking out the gun head has to be performed as a regular maintenance procedure. procedures Only advanced operators are allowed to perform the bakeout procedure.
CAUTION
Burn hazard Some parts inside the workstation will get hot during the bakeout procedure. Do not place any combustible objects on the grids of the electron optical column.
2.3.2. Hazards not related to personal injury
CAUTION
Risk of property damage when opening the chamber door. Workstation or specimen could be damaged if specimen stage is at short working distance. Always move specimen stage to long working distance before opening the chamber door.
CAUTION
Risk of property damage Connect Carl Zeiss approved equipment only. Ensure the total load connected to the workstation does not exceed 10 A.
IMPORTANT
Fingerprints can cause virtual vacuum leaks. Always wear lint-free gloves when touching the specimen or inner parts of the specimen chamber.

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2.4. Safety equipment
2.4.1. Safety devices
In order to prevent any risk of hazard to human health or of property damage, the workstation is equipped with several safety and protective devices.
2.4.1.1. Protective cover panels
Plinth, electron optical column and specimen chamber are secured with protective cover panels.
WARNING
Hazardous voltage inside the workstation. Contact may cause burn or electric shock. X-rays are generated inside the workstation during operation. Do not remove any parts. The workstation must not be operated with removed protective cover panels.
2.4.1.2. Interlock system
The interlock system includes several functions.
Chamber door interlock The chamber door interlock is located at the inner bottom front side of the specimen chamber. It ensures that the door of the specimen chamber is closed properly. When this interlock is activated (i.e. no electrical contact) ‘EHT Vac ready = no’ is indicated in the SmartSEM® user interface. EHT and detector voltages are blocked.
Gun head interlock The gun head interlock is located at the top of the electron optical column. It ensures that the high voltage interlock circuit is cut off when the gun head is opened. When this interlock is activated (i.e. no electrical contact), gun and EHT cannot be switched on. All high voltages are blocked.

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Vacuum interlock
The vacuum interlock is an internal interlock.
It ensures that Gun vacuum and System vacuum are better than the required thresholds.
If this interlock is activated gun respectively EHT cannot be switched on.

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2.4.1.3. ON/OFF switch
The ON/OFF SWITCH is located at the rear of the plinth. It cuts off the mains power from the FESEM. Without optional EMO box: The ON/OFF switch has the function of a main switch.
With optional EMO box: The FESEM is switched off. Other devices connected to the EMO box remain turned on.

2.4.1.4. EMO box with main switch (optional, but mandatory with FIB and/or GIS upgrade)

The MAIN switch (1) is located at the front panel of the EMO box.

It cuts off all devices connected to the EMO box from the mains power supply. The main switch

can be secured against re-activation.

The main switch guarantees an ampere interrupting capacity (AIC) of at least 10000 A rms.

The START button (2) is located underneath the MAIN switch.

IMPORTANT
The EMO box with MAIN switch has an emergency off function.
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2.4.1.5. EMO button (optional, but mandatory with FIB and/or GIS upgrade)
The emergency off button (EMO button) is located on the plinth. The EMO button is to be pressed in an emergency to cut off power to all devices connected to the EMO box. It must always be readily accessible and operable.
2.4.1.6. Main shut-off valves
The user is responsible for the installation of main shut-off valves at the site of installation. The following main shut-off valves are required:
· water supply · water runback · nitrogen supply · compressed air supply
The main shut-off valves have to be easily accessible. They must close off the connections to the corresponding media when needed. The main shut-off valves have to be lockable in their OFF position in order to prevent accidental re- activation. As the user is responsible for installing the main shut-off valves, he/she should also provide instructions how to operate the main shut- off valves properly.

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2.4.2. Safety labels and labels
Appropriate safety labels on the workstation warn users of possible hazards. Each safety label is affixed close to the point where a particular hazard exists. Moreover, you will find several labels which provide legal information.
2.4.2.1. At the front of the workstation

A
B Shown on AURIGA® (AURIGA® 60 has a larger specimen chamber)

Position A

Subject
Safety information

Label

Safety

information

Safety information

WARNING
Risk of injury Fingers could be trapped. Always close the chamber door before you move the stage.
CAUTION
Risk of damage FESEM or specimen stage could be damaged if the specimen stage is at short working distance. Move specimen stage to longer working distance before opening the chamber door.
CAUTION
Avoid injury Read and understand the instruction manual before operating this product.

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2.4.2.2. At the rear of the workstation

Subject Type plate

Label

Safety information Legal information

Shown on AURIGA®.
CAUTION
Radiation hazard X-rays are generated inside the electron microscope during operation. Do not remove any parts. Use genuine Carl Zeiss parts exclusively. Observe local safety and X-ray protection regulations.

Safety information Safety information

CAUTION
High leakage current Ensure proper grounding. Do not operate the electron microscope without separate ground connection.
CAUTION
Suffocation hazard Specimen chamber is ventilated with gaseous nitrogen. Ensure the area around the electron microscope is sufficiently ventilated.

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2.4.2.3. At the rear of the electron optical column

Subject
Safety information

Label

Safety information

WARNING
Hazardous voltage inside Contact may cause burn or electric shock. Only authorised service staff is allowed to service the equipment. Disconnect power before opening.
CAUTION
Burn hazard Hot surfaces inside during bakeout procedure. Do not place any combustible objects on the grids of the electron optical column. Only authorised service staff is allowed to service the equipment. Disconnect power and let surfaces cool before opening.

2.4.2.4. Inside the workstation
Underneath the cover panels of workstation there are some more safety labels, which are addressed to authorised Carl Zeiss service engineers. These safety labels are described in the documents for Carl Zeiss service staff.

2.4.3. Material Safety Data Sheets
Material safety data sheets (MSDS) of chemicals used in combination with the workstation are contained in the document folder delivered with the workstation.

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2.5. Safety instructions for handling precursors (with GIS upgrade only)
WARNING
Hazard due to irritating and toxic gases. Gases can cause irritation to eyes, skin, and respiratory system. High concentrations may cause central nervous disorders. Do not remove a reservoir from the workstation. Contact the Carl Zeiss service to have the empty reservoir replaced. Never try to open a reservoir.
For more information refer to the instruction manual of the GIS and the Material Safety Data Sheets (MSDS).

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3. Description
3.1. Overview
AURIGA® series instruments are modular workstations. The basic workstation consists of a field emission scanning electron microscope with GEMINI® column. The following upgrade stages are possible:

FIB column –

–

Basic

workstation

with GEMINI®

column

Upgrades

GIS

Charge compensation (CC)

Possible applications

–

SEM operation

+2 +2 / 4 +2
+2 / 4

+3 +3 / 4 –
+3 / 4

SEM operation Imaging of non-conductive specimens
SEM operation Electron beam etching Electron beam deposition
SEM operation Electron beam etching Electron beam deposition Imaging of non- conductive specimens
SEM operation, FIB imaging Milling
SEM operation, FIB imaging Milling Gas assisted etching Gas assisted deposition Electron beam deposition Electron beam etching
SEM operation, FIB imaging Imaging of non-conductive specimens Milling Gas assisted etching Gas assisted deposition Electron beam deposition Electron beam etching

+1 Canion column or Cobra column +2 Five-channel GIS or Single GIS +3 Charge Compensator +4 Five-channel GIS with integrated charge compensation (CC)

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3.2. Basic workstation
3.2.1. View
2 1

3 4

1 Specimen chamber 2 Electron optical column, GEMINI® column 3 Monitors 4 Control panel (optional)

5 Personal computer (PC) 6 ON/STANDBY/OFF button 7 Plinth

Fig. 3.1: View of AURIGA® basic workstation The AURIGA® 60 basic workstation has a larger specimen chamber.

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3.3. Upgraded workstation
3.3.1. View

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3 4

7 1

1 Specimen chamber 2 FIB column 3 Electron optical column, GEMINI® column 4 Detector 5 Airlock

6 Monitors 7 Control panel (optional) 8 Personal computer (PC) 9 ON/OFF/STANDBY button 10 Plinth

Fig. 3.2: View of AURIGA® upgraded workstation The AURIGA® 60 upgraded workstation has a larger specimen chamber.

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3.3.2. FIB upgrade
Two types of FIB columns are available:
· Canion column · Cobra column
3.3.3. Gas injection system (GIS) upgrade
A gas injection system allows the injection of one or more process gases to the specimen surface.
3.3.3.1. Five-channel GIS
The five-channel GIS allows you to inject up to five different precursor gases. For details refer to the respective Instruction Manual.
3.3.3.2. Single GIS
The one-channel GIS allows you to inject one precursor gas. For details refer to the respective Instruction Manual.

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3.3.4. Charge compensation upgrade
Charge compensation is a method to inhibit charging of non-conducting specimens by injecting a local flow of gaseous nitrogen onto the area of interest.
3.3.4.1. Charge Compensator
The Charge Compensator inhibits charging of non-conducting specimens by emitting a local flow of gaseous nitrogen onto the area of interest. The pneumatic retraction mechanism allows you to quickly toggle between charge compensation mode and high vacuum mode. For details refer to the respective Instruction Manual.
3.3.4.2. Five-channel GIS with integrated charge compensation
Alternatively, a five-channel GIS with integrated charge compensation function is available. For details refer to the respective Instruction Manual.

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3.4. Control elements
3.4.1. SmartSEM® user interface
The workstation is controlled by the SmartSEM® software. The software is operated via a graphical user interface.

caption bar

menu bar

toolbar

icon

FIB toolbar (FIB upgrade only)
FIB mode selection (FIB upgrade only)

annotation bar data zone

panel configuration bar

status bar

image area

mouse assignment

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3.4.2. Dual joystick
The dual joystick is used for stage control and specimen navigation.
The big joystick on the right is used to drive X- and Y-axis. The stage rotation is controlled by turning the upper knob to the left or to the right. The small joystick on the left is used to control the Z axis and the stage tilt (T).
The Break push button is an emergency stop for the stage.
All axes are deflection-compensated: When the joystick is only moved slightly, the respective axis will move slowly. However, major movements of the joystick will result in a faster movement of the stage.
Two M push buttons allow control of a second Z-axis (M) on super-eucentric stages to set the eucentric point of the specimen tilt on these stages.
The X-, Y-, Z- and M-axes are magnification-compensated. When working at a low magnification, the stage moves relatively fast. At higher magnifications the stage movement is slower. The different axes can also be moved simultaneously.

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3.4.3. Optional control panel
The control panel is optionally available. It integrates a full sized keyboard and allows direct access to 14 of the most frequently used functions on the workstation. The following functions are available through:

Encoders
· Magnification · Stigmator X · Stigmator Y · Aperture X · Aperture Y · Scan Rotate · Shift X · Shift Y · Brightness · Contrast · Focus

Push buttons
· Reduced · Wobble · Freeze · Exchange · Resume · Camera · Scan Speed + · Scan Speed –

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3.5. Principle of operation
3.5.1. Vacuum system
For operation of the workstation, gun head (10), column and specimen chamber have to be evacuated. The vacuum is essential to operate the gun and to prevent collision of electrons and/or ions with gas molecules.

10 9 8

1 2

7 6

3 4
5

1 Gun with filament 2 Ion getter pumps (IGP) 3 Specimen chamber 4 Penning gauge 5 Pre-vacuum pump
Fig. 3.3: Schematics of the vacuum system

6 Turbo pump 7 Vent valve 8 Column chamber valve 9 Multihole aperture 10 Gun head

System vacuum

Pre-vacuum pump (5) and turbo pump (6) evacuate the specimen chamber. The vacuum in the specimen chamber is measured by a Penning gauge (4). The detected vacuum values are shown as ‘System vacuum’ in the SmartSEM® user interface. As long as the detected pressure in the specimen chamber is not ready for operation, the column chamber valve (8) is closed in order to separate the specimen chamber from the column.

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Gun vacuum

In the gun head is a ultra high vacuum, which is maintained by two ion getter pumps (2). The vacuum in the gun head is called ‘Gun vacuum’. It should be well below 1 x 10-8 mbar.
The specimen is located in the evacuated specimen chamber (3). To open the specimen chamber for specimen exchange, you have to break the vacuum in a controlled manner. This is done by the Vent command via the SmartSEM® user interface or by pressing the Exchange push button on the optional control panel.

Ventilating

When receiving the Vent command, the column chamber valve closes and gaseous nitrogen flows into the specimen chamber via the vent valve (7). As soon as the pressure equilibrium is obtained, the chamber door can be opened to change the specimen.

Evacuating

In order to continue operation, the Pump command makes pre-vacuum pump and turbo pump evacuate the specimen chamber.
As soon as the vacuum in the specimen chamber is ready for operation, the column chamber valve opens and the ‘EHT Vac ready’ message appears in the SmartSEM® user interface. Gun and EHT can be switched on.

Quiet Mode

The automatically controlled Quiet Mode is optionally available. This option allows switching off the pre-vacuum pump after specimen exchange when the vacuum threshold is achieved.

3.5.2. Specimen stage
Standard specimen stage is a 6-axes motorised super-eucentric stage that is controlled by the SmartSEM® software. The stage can be operated by the dual joystick controller or by using the soft joystick in the SmartSEM® user interface. The axes are called:

X-axis

Y-axis

Height

Height (eucentric)

Rotation

Tilt

The stage is an eucentric one, which means that all rotation axes intersect in the same point. The specimen surface is located in the eucentric point, where the tilt axis meets the beam axis. This guarantees that the focus is maintained when the specimen is tilted at a certain working distance.
When moving a tilted specimen, the specimen is also moved unintentionally in Z direction. The selected feature moves out of view. The so-called super- eucentric stage is equipped with the Maxis, which allows you to move the specimen surface into the tilting plane with the result that a selected feature stays in view and in focus when the stage is tilted at various working distances.

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3.5.3. Electron optics (GEMINI® column)
The patented GEMINI® column is the area of the FESEM, where electrons are emitted, accelerated, bundled, focused, and deflected. Main characteristics of the GEMINI® optics are the socalled beam booster and an objective lens that consists of a combined electrostatic/electromagnetic lens doublet.

Gun

A Schottky field emitter serves as gun (1). The filament is heated by applying the filament current.

Electrons are emitted from the heated filament while an electrical field, called extractor (UExt) voltage, is applied.

To suppress unwanted thermoionic emission from the shank of the Schottky field emitter, a suppressor voltage (USup) is applied as well.

1
2 3
4 5

USup

UExt

UEHT

7 8 9

1 Gun 2 Extractor 3 Anode 4 Multihole aperture 5 EsB® detector
Fig. 3.4: Schematics of the electron optics

6 In-lens detector 7 Objective lens 8 Scanning coils 9 Specimen

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EHT Apertures Stigmator

The emitted electrons are accelerated by the acceleration voltage (UEHT). The beam booster (UB, booster voltage), which is always at a high potential when the acceleration voltage is at most 20 kV, is integrated directly after the anode. This guarantees that the energy of the electrons in the entire beam path is always much higher than the set acceleration voltage. This considerably reduces the sensitivity of the electron beam to magnetic stray fields and minimises the beam broadening.
The electron beam passes through the anode aperture (3) first, afterwards through the multihole aperture (4). Standard aperture is the 30 µm aperture hole that is the central aperture. The aperture size is decisive for the probe current. Other aperture sizes are selectable to meet the requirements of a wide range of applications.
The stigmator compensates for astigmatism, so that the electron beam becomes rotationally symmetrical. The electron beam is focused onto the specimen while being deflected in a point-by-point scan over the specimen surface.
Before the electron beam exits the objective lens (7), the electrostatic lens creates an opposing field which reduces the potential of the electrons by + 8 kV. The energy of the electrons reaching
the specimen surface (9) therefore corresponds to the set acceleration voltage (EHT).

Signal detec- When the primary electron beam hits the specimen, certain interaction products are released,

tion

which can be recorded by specific detectors.

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3.5.4. Ion optics (FIB column)

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2 3 4 5

1 Ion source (Ga+) 2 Variable apertures 3 Ion beam Fig. 3.5: Schematics of the ion optics

4 Objective lens 5 Specimen

Ion source

The focused ion beam (FIB) column is the part of the CrossBeam® workstation, where ions are emitted, accelerated, focused and deflected. The FIB column is tilted by 54°.
Two types of FIB columns available:
· Canion column
7 mechanical aperture positions, 7 nm resolution
· Cobra column
14 mechanical aperture positions, 2.5 nm resolution
A liquid metal ion source of gallium (Ga+) serves as ion source (1). Gallium ions (Ga+) are extracted from a liquid metal ion source. The ions are accelerated by the acceleration voltage to an energy of maximum 30 keV. The ion emission is regulated by the extractor and stabilised by the suppressor.
Gallium is used up during operation. Therefore, the gallium emitter cartridge is a consumable. Moreover, the gallium emitter has to be regenerated by heating from time to time; the heating procedure removes the gallium oxide, which has been created during operation.

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Condenser

The electrostatic condenser collimates and focuses the ion beam depending on the operating mode.

Probe currents After passing the condenser, the beam current is defined by a set of software-controlled mechanical apertures. By using the different apertures in combination with the different condenser settings, the probe current can be continuously adjusted in the range between 1 pA and 50 nA. Among other things, the probe current depends on aperture size and condenser settings.

The objective lens is designed as an electrostatic einzel-lens system. It focuses the beam onto the specimen surface.

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3.5.4.1. Imaging modes
Provided the optional FIB column is installed, the following imaging modes are available:

Imaging mode FIB Mode.. Characteristics

SEM imaging

SEM

Electron beam is active, ion beam is blanked.

The SE signal is synchronised to the SEM scan.

Typical application High resolution FESEM

FIB imaging

FIB

Electron beam is blanked, ion beam is active. The SE signal is synchronised to the FIB scan.

Channelling contrast imaging, voltage contrast imaging. Defining milling patterns on the specimen surface

Grain analysis

CrossBeam® operation

SEM + FIB
Mill Mill + SEM

Image is composed of SEM and FIB components.

Setting the coincidence point.

With the optional dual scan both beams are scanned completely independently from each other.
No image Mills with the milling parameters set (milling current).
Mills and generates a SEM image.

Only deposition by ion beam. No deposition by electron beam.
SEM real-time imaging of the ion milling or deposition.

SEM imaging Fig. 3.6: Imaging modes

FIB imaging

CrossBeam operation

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3.5.5. Signal detection
The interaction products most frequently used for the generation of images in scanning electron microscopy are secondary electrons (SEs) and backscattered electrons (BSEs). For the separation and detection of SEs and BSEs one has to consider two parameters: Energy and angle distribution. For that purpose an Energy selective Backscattered electron detector (EsB®) has been developed.

Detector type
In-lens detector (annular SE detector) SE2 detector (Everhart-Thornley type) EsB® detector with filtering grid (in-column detector) SESI detector
Further detectors on request.

Detected signals
SE

Availability Standard

SE2

Standard

BSE

Option

SE, SI, (BSE)

Option; requires FIB

Typical application Surface structure Topography Pure material contrast

Reference See section 3.5.5.1. See section 3.5.5.2. See section 3.5.5.3.

Topography, material con- See section 3.5.5.4. trast

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3.5.5.1. In-lens detector
The In-lens detector (1) is a high efficiency detector for high resolution SE imaging. It is located above the objective lens (3) and detects directly in the beam path (2). The detection efficiency of this detector results from its geometric position in the beam path and from the combination with the electrostatic/electromagnetic lens.
1 2
3

1 In-lens detector 2 Beam path Fig. 3.7: Schematics of In-lens detector

3 Objective lens 4 Specimen

At an acceleration voltage of maximum 20 kV, the electrons of the primary electron beam are additionally accelerated by 8 kV, the so-called beam booster voltage. To ensure that the electrons reach the specimen surface (4) with the energy set as acceleration voltage, an electrostatic field is generated at the end of the objective lens by 8 kV. This electrostatic field acts as acceleration field to the SE generated on the specimen surface.

At the In-lens detector, the electrons hit a scintillator generating flashlight that is guided out of the beam path by means of a light guide. The light information is multiplied in a photomultiplier and output as a signal which can be electronically processed and displayed on the monitor.

IMPORTANT
The In-lens detector can be used up to an acceleration voltage of 20 kV. At higher acceleration voltages the beam booster and thus the field of the electrostatic lens are switched off. Therefore, the efficiency of the In-lens detector will be markedly reduced.

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The efficiency of the In-lens detector is mainly determined by the electric field of the electrostatic lens, which is decreasing exponentially with the distance. Thus, the working distance (WD) is one of the most important factors affecting the signal-to-noise ratio of the In-lens detector. As the tilt angle of the specimen surface affects the emission angle of the electrons, you should avoid strong specimen tilting.

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3.5.5.2. SE2 detector
The SE2 detector (3) is a Everhart-Thornley type detector. It detects SEs as well as BSEs. Electrons moving to the detector are attracted by the collector grid (2) and directed to the scintillator. The collector voltage can be varied in the range between -250 V and + 400 V. This collector voltage generates an electrical field in front of the detector thus directing the low energy SEs towards the scintillator. For all standard applications the collector voltage should be set to +300 V.

3 1
2

1 Specimen 2 Collector grid

3 SE2 detector 4 Objective lens

Fig. 3.8: Schematics of the SE2 detector

Negative collector voltage

Selecting a negative collector voltage generates a field deflecting the low energy SEs so that they cannot reach the scintillator and do not contribute to the signal. Only high-energy BSEs reach the scintillator contributing to the image generation.
This produces a so-called pseudo-backscattered image, which shows pronounced topography, but largely cancels surface properties (edge contrast).

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3.5.5.3. EsB® detector (optional)
The Energy selective Backscattered (EsB®) detector (1) is suitable for clear compositional contrast. It is an annular shaped in-column detector that is located above the In-lens detector (3). The EsB® detector detects BSEs and SEs.
The SEs and BSEs generated at the impact point of the primary electron beam are intercepted by the low electrical field of the GEMINI® column. These electrons are accelerated by the field of the electrostatic lens.

Filtering grid

A small amount of SEs pass through the hole of the In-lens detector and would be observed by the EsB® detector. To prevent detection of these SEs, a filtering grid (2) is installed in front of the EsB® detector. By switching on the filtering grid voltage, the SEs will be rejected and only BSEs will be detected. Below a landing energy of 1.5 kV the filtering grid has the additional function of selecting the desired energy of the BSEs. The operator can select the threshold energy of inelastically scattered BSEs to enhance contrast and resolution.

The combination of In-lens detector and EsB® detector allows simultaneous imaging and mixing of a high contrast topography (SE) and a compositional contrast (BSE).

SE detection via In-lens detector

BSE detection via EsB® detector
1
2

1 EsB® detector

3 In-lens detector

2 Filtering grid

Fig. 3.9: Schematics of the EsB® detector

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3.5.5.4. SESI detector (optional, with FIB upgrade only) The Secondary Electrons Secondary Ions detector (SESI detector) (3) is suitable to detect sec-
ondary electrons as well as secondary ions. The SESI detector replaces the SE2 detector.
2

1 FIB column 2 GEMINI® column 3 SESI detector

4 Collector grid 5 Specimen

Fig. 3.10: Schematics of the SESI detector

3
4 5

Depending on the polarity of the collector voltage either electrons or ions scattered from the specimen (5) are attracted by a collector grid (4) and accelerated to the converter. In the converter, both electrons and ions are converted into secondary electrons which are used to generate an image.
The SESI detector can be operated in two modes: SE mode and Ion mode.

Operating mode FIB mode Detected signals Typical application

SE mode (typical collector voltage +400 V)

SEM FIB

Secondary electrons Topography

Ion mode

–

(typical collector

voltage -4 kV)

FIB

Secondary ions

Crystal orientation contrast, material contrast e.g. imaging of corrosion/oxidation processes in metals

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3.6. Specification
3.6.1. Basic workstation

Performance Resolution
Acceleration voltage Probe current Magnification

1.0 nm at 15 kV at optimum working distance (WD) 1.9 nm at 1 kV at optimum working distance (WD) 0.1 V – 30 kV 4 pA – 20 nA with integrated High Current – Depth of Field module 12 – 1.000.000 x

Electron optics (GEMINI® column)

Electron source Lens control
Stigmator Apertures Beam shift

Schottky field emitter
Patented GEMINI® electromagnetic/electrostatic objective lens system (68° conical final-lens) with water cooling for best thermal stability and reproducibility
Eight pole electromagnetic
Seven apertures with electromagnetic selection.
Width: max. 15 µm depending on EHT and WD

Extended beam shift width: ±100 µm depending on EHT and WD

Specimen chamber and stage Specimen chamber Dimensions

Accessory ports Specimen stage

Type

Specimen weight Movement

AURIGA®

AURIGA® 60

330 mm inner diameter 270 mm height

520 mm inner diameter 300 mm height

6-axes motorised super eucentric, controlled via SmartSEM® software

Up to 0.5 kg

X = 100 mm Y = 100 mm Z = 55 mm M = 10 mm T = -10° to 60° R = 360° continuous

X = 150 mm Y = 150 mm Z = 43 mm M = 10 mm T = -10° to 60° R = 360° continuous

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Standard detectors In-lens detector SE2 detector Chamber viewing

High efficiency annular scintillator detector mounted in GEMINI® column with optically coupled photomultiplier.
Everhart-Thornley type with optically coupled photomultiplier. Collector bias adjustable from -250V to +400 V.
a) Infrared CCD camera b) 2nd infrared CCD camera

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3.6.2. Workstation with FIB upgrade
Two types of FIB column are available:
· Canion column · Cobra column

Performance Resolution
Acceleration voltage Probe current Magnification range

Canion column Cobra column 1 – 30 kV < 5 kV as an option 1 pA – 50 nA 300 x – 500,000 x

< 7.0 nm at 30 kV < 2.5 nm at 30 kV

Ion optics Ion source Lenses Stigmator Apertures
Beam shift

Gallium liquid metal ion source

Two electrostatic lenses

Eight pole electrostatic

Canion column

7 apertures, motorized

Cobra column

14 apertures, motorized

±7 µm

Optional detector

SESI detector

Scintillator photomultiplier based system; easy change between secondary ion and secondary electron mode, alternative to SE2 detector

Other optional detectors on request.

IMPORTANT
For more details refer to the document Product Specification AURIGA® / AURIGA® 60.

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3.7. Technical data
3.7.1. Layout and connections

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1 Equipotential bonding bar

9 Pressure reducers for water, nitrogen, and compressed air

2 Mains power supply 208…230V / 22A 1/N(L2)/ 10 Main shut-off valves for water, nitrogen,

and compressed air

3 EMO box (optional, but mandatory with FIB and/ 11 Water supply or GIS upgrade)

4 Static vibration damper

12 Water runback

5 Quiet mode reservoir (optional)

13 Nitrogen supply

6 Pre-vacuum pump

14 Compressed air supply

7 With optional airlock: Static vibration damper

15 Exhaust line

8 Pre-pump for optional 200-mm airlock

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3.7.2. System layout
3.7.2.1. AURIGA®

2
6 1

Description

Size (mm) approx.

Weight (kg) Distribution

approx.

of load

1 Plinth + column (without airlock)

822 x 980 x 1851

860

2 Table + Monitor + PC

1150 x 980 x 1350

104

3 Static damping block

180 x 180 x 160

4 Pre-vacuum pump

427 x 250 x 290

Upgrades

1 Plinth + column + FIB column + GIS 962 x 980 x 1851

972

5 EMO box (with FIB or GIS upgrade) 380 x 400 x 850

6 FIB/GIS electronics rack (with FIB 550 x 780 x 1025

120

or GIS upgrade)

4 x 215 kg 4 x 26 kg 1 x 37 kg 1 x 26 kg
4 x 243 kg 4 x 8,75 kg 4 x 30 kg

Footprints
4 x Ø 100 mm 4 x Ø 50 mm
–
4 x Ø 100 mm –

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3.7.2.2. AURIGA® 60

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5 10
1
6

4 3

9 1
10

78 5

2 2

Shown with 200 mm airlock (80 mm airlock has no second table (5))

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Description

Size (mm) approx.

Weight (kg) Distribution

approx.

of load

1 Plinth + column (without airlock)

822 x 975 x 2000

2 Table + Monitor + PC

1150 x 980 x 1350

3 Static damping block

180 x 180 x 160

4 Pre-vacuum pump

427 x 250 x 290

With 200 mm airlock

1 Plinth + column

1700 x 975 x 2000

5 Second table

1150 x 980

6 Static damper

Ø 80

7 Airlock pump

410 x 390 x 400

8 Airlock controller

200 x 460 x 470

Upgrades

1 Plinth + column + FIB column + GIS 822 x 975 x 2000 (without airlock)

9 EMO box (with FIB or GIS upgrade) 380 x 400 x 850

10 FIB/GIS electronics rack (with FIB or GIS upgrade)

550 x 780 x 1033

970 104 37 26
1005 85 16 26 14
1020
35 120

4 x 242,5 kg 4 x 26 kg 1 x 37 kg 1 x 26 kg
4 x 251,25 kg 4 x 21,25 kg
1 x 16 kg 4 x 6,5 kg 4 x 3,5 kg
4 x 255 kg
4 x 8,75 kg 4 x 30 kg

Footprints 4 x Ø 100 mm 4 x Ø 50 mm
–
4 x Ø 100 mm 4 x Ø 50 mm
–
4 x Ø 100 mm
–

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3.7.3. Installation requirements
Location requirements Installation site Room size
Service area Installation category Exhaust line

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Exclusively inside buildings AURIGA®: Min 3.5 m x 5.0 m x 2.3 m (W x D x H) AURIGA® 60: Min 4.0 m x 6.0 m x 2.3 m (W x D x H) Min 1 m at each side II An exhaust line is required to remove the wate gas of the pre-vacuum pump and to transmit it to the outside.

Electrical supplies Nominal AC voltage Protection class Nominal frequency Power consumption Current input Circuit breaker
Ampere interrupting capacity AIC Protective ground
Cross section Ground resistance

208 V – 230 V (±10%), 1/N (L2) / PE I 50 – 60 Hz Max. 3.5 kVA, dependent on upgrade stage and installed options Max. 16 A 25 A, switch off behaviour K on installation site

A special emergency-off circuit is available (part no. 340002-0167). The EMO box is mandatory for the upgrade of FIB and/or GIS. The EMO box should be mounted close to the system. Wiring that runs outside the workstation should be laid and protected in appropriate cable ducts or trays. Moreover, it is recommended to protect the complete room by installing a power switch next to the door of the room.

With EMO box

At least 10000 A rms

The workstation must be connected via a separate protective ground. An exclusive grounding connection to earth must be provided, i. e. the grounding terminal must not be common to other electrical equipment. A grounding wire AWG10 (5 m long) is delivered with the workstation.

4 mm2
< 0.1

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Cooling water supply Water flow rate Input pressure Water temperature Stability

75 – 85 l/h 0.2 – 0.3 MPa (2 – 3 bar) 20 – 22°C 0.5°C/10 min

Gas supplies Nitrogen Quality
Flow rate
Pressure
Compressed air Flow rate Pressure Quality

4.6 with nitrogen content <99.996 %
Approx. 40 l/min for ventilation of specimen chamber with chamber door open 0.30 – 0.35 MPa (3.0 – 3.5 bar)
Less than 1l/min 0.6 – 0.8 MPa (6 – 8 bar) Oil-free

Environmental requirements

Ambient Temperature
Relative humidity Altitude Pollution degree

Approx. 21°C ±4°C

Stability

0.5°C/h

Less than 65 %

To guarantee an undisturbed operation, do not operate the workstation at sites higher than 2000 m above sea level.

2 According to EN 61010-1: Safety requirements for electrical equipment for measurement, control, and laboratory use. Part 1: General requirements.

IMPORTANT
Also refer to the documents Product Specification AURIGA® / AURIGA® 60 and Installation Requirements AURIGA® / AURIGA® 60.

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3.8. Options
There is a variety of further options available. For details please contact your local Carl Zeiss service engineer or sales representative.
3.8.1. Airlock
An airlock allows you to quickly transfer the specimen into the specimen chamber without breaking the system vacuum. Moreover, the use of an airlock minimises possible contamination of the specimen chamber and reduces pumping times thus speeding up the specimen exchange procedure.

Workstation AURIGA®
AURIGA® 60

Airlock 80-mm 100-mm 80-mm 200-mm

Configuration One of these airlocks can be chosen.
One of these airlocks has to be chosen.

For details on operation refer to the respective instruction manual.

3.9. Customer service
For customer service please contact your local Carl Zeiss service engineer. A list of Carl Zeiss locations and authorised service partners can be found at: http://www.zeiss.com/microscopy
In case of questions regarding radiation protection please contact the Carl Zeiss Radiation Safety Officer Dr. Wolfgang Sold, Carl Zeiss AG, 73447 Oberkochen, Germany phone: +49 (0) 7364 202951 e-mail: sold@zeiss.de
IMPORTANT
To maintain best possible performance of the workstation it is essential to perform preventive maintenance on a regular base. Moreover, it is recommended that you conclude a service contract with your local Carl Zeiss service organisation or representative. This will ensure a continuous trouble-free operation of the workstation.

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4. Transport and storage
4.1. Transport

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CAUTION
Crushing hazard while load is being lowered. Maintain a safe distance. Do not walk or place your hands or feet under the load while it is being lowered. Wear safety shoes and gloves.

CAUTION
Risk of damaging the workstation. The workstation may only be transported in air-suspended vehicles. Moving parts must be secured during transport to prevent them from slipping or tipping over. Avoid rocking the crates back and forth. Devices for transporting the workstation must be rated to handle its full weight and dimensions. Note the weight information on the package and on the shipping document.

In order to avoid damage of the workstation by shock, the workstation has to be exclusively transported in air-suspended vehicles. Temperature during transport has to be between +10° C and +70° C.
The workstation is delivered in two crates:

Microscope plinth
Microscope console and accessories FIB

Wrapped with recyclable polyethylene-foil and shipped in a reusable box
Dimensions and weight of box: AURIGA® 1310 x 1060 x 2020 mm³ (W x D x H), appr. 1150 kg AURIGA® 60 1422 x 1300 x 2390 mm³ (W x D x H), appr. 1450 kg
Console, valve, damper, monitors, cables, pipes etc. are wrapped with recyclable polyethylene-foil or packed in separate cartons and shipped in a reusable box.
Dimensions and weight of box: 1450 x 1360 x 1180 mm³ (W x D x H), appr. 400 kg
Dimensions and weight of box: 960 x 720 x 1100 mm³ (W x D x H), appr. 180 kg

If required there are additional boxes for optional equipment. Check that none of the items has been damaged during shipment.

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4.2. Storage
The packed workstation has to be stored in a dry place. Temperature during storage has to be between +10° C and +70° C.

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5. Installation
Unpacking, installation and first start-up are carried out by authorised Carl Zeiss service staff.

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6. Operation
At a glance This chapter contains information about:
· Switching on the workstation · Starting the SmartSEM® user interface · Finding your way in the SmartSEM® user interface · SEM operation (basic workstation) · Electron beam deposition or etching (with GIS upgrade only) · CrossBeam® operation (with FIB upgrade only) · Using the help functions · Closing the SmartSEM® user interface · Switching off the workstation as a matter of routine · Emergency off · Switching off the workstation completely
6.1. Switching on the workstation
Preconditions:
· Workstation is in STANDBY mode
1 Press the green ON button (1) that is located at the front of the plinth.
1

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6.2. Starting the SmartSEM® user interface
Preconditions:
· The workstation is switched on. · The Windows® operating system has been loaded.
IMPORTANT
To receive the Windows® login data contact your Carl Zeiss service engineer.
1 Double-click on the Carl Zeiss SmartSEM icon. Alternatively, select Start/Programs/SmartSEM/SmartSEM User Interface.
The EM Server opens, loading various drivers. The function of the EM Server is to implement the internal communication between the SmartSEM® software and the hardware of the workstation.

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The EM Server Log On dialogue appears. 2 Enter your user name and password. 3 Confirm by clicking on OK.
The SmartSEM® user interface opens.

The EM Server is minimised to a small element (icon) on the right side of the Windows® task bar. The SmartSEM® software is ready to operate the workstation.

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6.3. Finding your way in the SmartSEM® user interface
6.3.1. Showing or hiding toolbars
Several toolbars such as user toolbar, status bar, and annotation bar are available for easy access to the SmartSEM® functions. 1 Select View/Toolbars.
Alternatively, type <Ctrl+B>. The Toolbar Views panel is shown.
2 If you wish to show a toolbar, tick the respective checkbox. 3 To change the tooltip features of the user toolbar, select the respective radio button on the
right hand side of the panel. 4 Confirm by clicking on OK.

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6.3.2. Showing or hiding the data zone
The data zone is a special group of annotation objects which are used to display current parameters. You can also include a µ-marker to show the base magnification. 1 Select View/Data Zone/Show Data Zone from the menu.
A tick is shown to indicate that the function is activated. Alternatively, type <Ctrl+D> to toggle the data zone.
6.3.3. Showing a full screen image
To take advantage of the full monitor size to display the microscopic image, show a full screen image. 1 Select View/Toggle Full Screen Image from the menu.
Alternatively, type <Shift + F3>. To undo the function, type <Shift + F3>.

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6.3.4. Docking panels
It is possible to dock various panels onto the main window. The purpose of the docking panel is to keep the area of the image completely clear, as the docking panel is outside the main window. 1 To show the docking panel select View/Tool-
bars from the menu. 2 Tick the Docking Panel checkbox.
The docking panel is shown on the right hand side of the image area.

3 To move the docking panel to the left hand side, pick up the panel by clicking on the title bar and drag it to the other side of image area.

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4 To stick a control panel to the docking panel, click on the title bar of the control panel and drag it to the docking panel.
The panel becomes integrated into the docking panel.

You can stick several control panels to the docking panel. 5 To minimise a panel, click on the arrow
button (1) in the title bar.
1

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6 To hide the docking panel untick the Docking Panel checkbox. The docking panel is hidden.

6.3.5. Opening the Panel Configuration Bar
1 Select Tools/Goto Panel from the menu.
Alternatively, click on the arrow button at the side of the image area.
The Panel Configuration Bar opens showing an alphabetical list of functions. 2 To select a function, double-click on it.

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6.4. SEM operation (basic workstation)
6.4.1. Obtaining a first image
The following section summarises basic sequences to quickly obtain an image using the SE2 detector. To simplify the procedure, the method described mainly uses SEM Control panel and status bar functions.

Preconditions:
· SmartSEM® has been started and is ready to control the workstation.

Parts required

No.

Allen wrench, 1.5 mm Stub Tweezers for specimen Specimen holder If necessary: carbon tape, conductive carbon, adhesive metal tape or similar Appropriate specimen (with conducting properties e.g. gold on carbon) Lint-free gloves

delivered with the workstation delivered with the workstation delivered with the workstation delivered with the workstation –
–
–

At a glance

The complete sequence includes:
· Preparing the sample holder · Loading the specimen chamber via chamber door
Alternatively: Loading the specimen chamber via airlock (optional)
· Locating the specimen · Switching on the gun · Switching on the EHT · Generating an image · Optimising the image · Saving the image

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6.4.1.1. Preparing the sample holder IMPORTANT
Contamination caused by fingerprints can lead to vacuum deterioration or prolonged pumping times. Always wear lint-free gloves when touching specimen, sample holder or stage. 1 Attach the specimen to the stub by using con-
ductive carbon, adhesive metal or carbon tape etc. Ensure that the specimen area to be analysed is in proper contact with the stub.
2 Use the tweezers to insert the stub into the sample holder.
3 Properly fix the stub to the sample holder. Use the Allen wrench to tighten the location screw.

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6.4.1.2. Loading the specimen chamber via chamber door
1 Click on the ChamberScope icon in the toolbar.
A TV view inside the specimen chamber is shown.

CAUTION
Risk of damaging the objective lens and/or your specimen Ensure not to hit the objective lens while driving the stage. Change to TV mode to observe the moving stage.
2 Select Tools/Goto Control Panel from the menu. The SEM Control panel opens.

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3 Go to the Vacuum tab. 4 Click on the Vent button to ventilate the
specimen chamber.

A message appears asking: ‘Are you sure you want to vent?’. 5 Confirm by clicking on Yes.
The specimen chamber is filled with gaseous nitrogen.
CAUTION
Suffocation hazard due to lack of oxygen, since the specimen chamber is ventilated with nitrogen. After the specimen exchange, keep the chamber door open as short as possible. Avoid inhaling the air from within the specimen chamber. Ensure the area around the workstation is sufficiently ventilated.

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6 Slowly open the chamber door.

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IMPORTANT
Contamination caused by fingerprints can lead to vacuum deterioration or prolonged pumping times. Always wear lint-free gloves when touching specimen, sample holder or stage. Keep the chamber door open as short as possible.
All sample holders are equipped with a dovetail so that the position of the sample holder is exactly defined.
7 Mount the sample holder: a Ensure that you place the dovetail in the correct orientation onto the holding device on the specimen stage. b Make sure that the flat side of the dovetail of the sample holder is flush with the milled edge of the stage.
8 Look into the specimen chamber to ensure that the specimen cannot hit any components when it is introduced into the specimen chamber.
CAUTION
Pinch hazard when closing the chamber door. Ensure not to get your fingers caught in the chamber door gap.

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9 Carefully close the chamber door.
10 Click on the Pump button in the SEM Control panel.
The vacuum status messages show the current vacuum levels achieved.

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6.4.1.3. Loading the specimen chamber via airlock
An airlock is
· optional with AURIGA® · standard with AURIGA® 60
Several airlocks are available. For details on the operation of the airlock refer to the respective instruction manual.

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6.4.1.4. Locating the specimen
1 In TV mode (ChamberScope), look into the specimen chamber.

CAUTION
Risk of damaging the objective lens and/or your specimen. Ensure not to hit the objective lens while driving the stage. Change to TV mode to observe the moving stage.
2 Move the specimen by using the dual joystick (optional) or by calling the Soft Joystick via Tools/Goto Panel/Soft Joystick.
3 Carefully move the specimen closer to the objective lens. The distance between objective lens and specimen surface should be less than about 10 mm.

6.4.1.5. Switching on the electron gun

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SK=léÉê~íáçå pbj=çéÉê~íáçå=EÄ~ëáÅ=ïçêâëí~íáçåF 1 In the Vacuum tab: Check that EHT Vac ready=Yes is indicated.
2 Click on the Gun button in the status bar. 3 Select Gun On from the pop-up menu. The gun is being run up.

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6.4.1.6. Switching on the EHT
‘EHT’ stands for acceleration voltage. This voltage has to be applied to the gun in order to make it emit electrons.
1 Watch the vacuum status messages on the Vacuum tab of the SEM Control panel.
When the required vacuum has been reached you will see the message ‘Vac Status = Ready’.

2 Go to the Gun tab. 3 Set the acceleration voltage:
a Double-click in the EHT= field.
b Enter the desired acceleration voltage in the EHT Target field, e.g. 10 kV.
c Confirm by clicking on OK.

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4 Switch on the EHT: a Click on the EHT button in the status bar. b Select EHT On from the pop-up menu.
The EHT is running up to 10 kV.
The status bar buttons are merged, and the All: button appears. Now, the electron beam is on.

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6.4.1.7. Generating an image
1 Go to the Detectors tab. 2 Select SE2 from the Detectors drop-down list.
It is recommended that you select the SE2 detector to obtain the first image, as this detector provides a good signal-to-noise ratio even at large working distances.
3 Go to the Scanning tab. Select a fast scan speed, e.g. Scan Speed = 1 from the drop-down list. The lower the scan speed number, the faster the scan of the specimen by the electron beam. Scan Speed = 1 allows you to get an image quickly.

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4 Set a low magnification e.g. Mag = 500 x: a Click on the Magnification/Focus icon in the toolbar.
b Press the left mouse button and drag the mouse to adjust the magnification of 500 x.
The current magnification is indicated in the status bar.
5 Set the focus: a Press the middle mouse button and drag the mouse to focus.
The current working distance (WD) is indicated in the status bar.
6 Adjust contrast and brightness. a Go to the Detectors tab. b Use the Brightness and Contrast sliders.
7 Select a detail on the specimen surface. 8 Focus the detail. 9 Adjust contrast and brightness again.

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6.4.1.8. Optimising the image
1 Set Coarse by toggling the Coarse/Fine button in the status bar.
2 Step by step, set a high magnification, e.g. Mag 50.000 x. Focus in between.
When selecting high magnifications it is recommended that you move the specimen by using the beamshift function instead of driving the stage.
3 Use the Beam shift function: a Go to the Apertures tab. b Click on the Beam Shift button. c Use the slider or the red marker to shift the beam.
4 Click on the Reduced Raster icon.

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A small scan frame is shown. The image outside the scan frame is frozen. Size and position of the scan frame can be changed by dragging and dropping.

5 Focus the image in the reduced raster.
6 Align the aperture: a In the Apertures tab, tick the Focus Wobble checkbox.
The Focus Wobble is a function that sweeps the focus of the objective lens backwards and forwards through the focus on the specimen plane. If the aperture is slightly misaligned, a lateral shift can be observed.
Intensity of wobble can be adjusted by using the Wobble Amplitude scroll bar. Wobble speed can be accelerated by ticking the Wobble Fast checkbox.
b Click on the Aperture Align button. Use the left and right slider of the Aperture Align box until there is no movement of the detail in X- and Y- direction. The specimen detail should just be pulsating without shifting.
c Untick the Focus Wobble checkbox.
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7 In the Scanning tab, set Scan Speed = 7.
8 Bring the image into focus. 9 Toggle to Fine in the status bar.
Use Coarse and Fine mode of adjustment where appropriate.
10 Correct astigmatism: a Select a detail (e.g. a mark or an edge) on the specimen surface. b Click on the Reduced Raster icon. Ensure the selected detail is in the raster.

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SK=léÉê~íáçå pbj=çéÉê~íáçå=EÄ~ëáÅ=ïçêâëí~íáçåF c In the Apertures tab: Click on the Stigmation button.
d In the Stigmation box, use the arrow buttons or the left and right slider to obtain the sharpest possible image.
11 Deactivate the reduced raster. 12 In order to reduce image noise, select a
slower scan speed, e.g. scan speed 6 to 8.

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6.4.1.9. Saving the image
1 Stop the scan: a Go to the Scanning tab.
b In the Noise Reduction section, select Freeze on = End Frame from the dropdown menu.
c Click on the Freeze button.
A red dot at the right bottom of the image area indicates that the image is frozen. 2 Select File/Save Image from the menu.

3 Enter a path and a file name. 4 Confirm by clicking on the Save….tif button.

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SK=léÉê~íáçå pbj=çéÉê~íáçå=EÄ~ëáÅ=ïçêâëí~íáçåF To continue imaging, unfreeze the image by selecting Image/Unfreeze from the menu.
Alternatively, you can click on the Unfreeze button in the Scanning tab.

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6.4.1.10. Finishing the work session
To finish your work session, switch off the EHT: a Click on the All: button in the status bar. b Select EHT Off from the pop-up menu.
It is recommended that you leave the gun on during the working week. This should help to optimise lifetime of the cathode.

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6.4.2. Setting detection parameters
6.4.2.1. Selecting a detector
1 Go to the Detectors tab of the SEM Control panel.
2 Select the detector from the Detectors dropdown menu.

The following table should serve as a help to find the required settings for your application.

Detectors

EHT

In-lens

3 kV – 20 kV 100 V – 3 kV 100 V

Typical WD
3 – 6 mm 2 – 3 mm max. 4 mm

None

Detector settings

Remarks

SE2

1 – 30 kV

min. 4 mm Collector voltage (= bias) adjustable

Select the settings as

1 kV – 5 kV

4 – 6 mm

from -250 V to + 400 V

described in section 6.4.2.2.

5 kV – 30 kV

min. 6 mm

Standard applications: +300 V Pseudo BSE image: -150 to 0 V

EsB®

1 kV – 5 kV 100 V – 1 kV

max. 4 mm 1-2 mm

EsB grid adjustable from 0 to +1500 V
Value depends on type of electrons to be detected: less than approx. 800 V: SE

BSE more than approx. 800 V: BSE

Select the settings as described in section 6.4.2.3.

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6.4.2.2. Using the SE2 detector
1 Select the SE2 detector. 2 Set the collector bias (voltage) in the Detec-
tors tab of the SEM Control panel.
6.4.2.3. Using the EsB® detector (optional)
1 Select the EsB® detector. 2 Set the EsB Grid voltage in the Detectors tab
of the SEM Control panel.

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6.5. Electron beam deposition or etching (with GIS upgrade only)
Requires a gas injection system (GIS). Depositing and etching with the electron is a suitable method for materials that cannot be processed with the focused ion beam, e.g. quartz masks. Another advantage is, that there is no impairment of surfaces (i.e. no generation of amorphous layers).

Precursor/gas
Insulator, SiO2 Platinum, Pt Water (reactive products) Fluorine, XeF2 Tungsten, W

Application Deposition Deposition Etching of material that contains carbon e.g. diamond like carbon layers (DLC)
Etching of Si-containing materials Deposition

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6.5.1. Heating the reservoirs
The reservoirs – except for the fluorine precursor (XeF2) – are heated in order to liberate the process gases from the precursor substances and to improve their reactivity. The fluorine precursor (XeF2) is never heated, but cooled, because this substance is volatile at room temperature.
Procedure: 1 Open the Panel Configuration Bar. 2 Double-click on Gas Injection System. The Gas Injection System panel opens.

3 Click on the Reservoir checkbox of the precursor you wish to work with. The Capillary checkbox is ticked automatically.
It is recommended that the heating remains switched on all the time to ensure stable conditions, because it can last some time until the optimum working temperature is achieved. The temperature should be adjusted in a way, that – when opening the respective reservoir valve – the system vacuum is about 1 – 2 x 10-5 mbar.

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6.5.2. Depositing or etching with the electron beam
CAUTION
Danger of damaging GIS micro stage or specimen. Make sure to position the specimen surface at a safe working distance.
Procedure 1 Open the Panel Configuration Bar. 2 Double-click on E-Beam Deposition and Etch. The E-Beam Deposition and Etch panel opens. A deposition object is shown in the image area.
3 Resize the deposition object to the appropriate size.
4 Select the required precursor.
5 Set a Gas Wait Time. 6 Set a Total Duration Time. 7 Set a Scan Rate. 8 Click on Start.

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6.6. CrossBeam® operation (with FIB upgrade only)
Requires FIB column. It is assumed that the operator is already familiar with general functions of SmartSEM® and the operation of the FESEM.
IMPORTANT
For general information about SmartSEM® refer to the Software Manual SmartSEM®.

6.6.1. Preparing the workstation
Before you can make use of the CrossBeam® functions, you have to prepare the workstation.

At a glance

The complete sequence includes:
· Getting started · Adjusting tilt eucentricity · Switching on the ion beam (FIB) · Setting the coincidence point

How to continue

6.6.1.1. Getting started
1 Switch on the workstation. 2 Start the SmartSEM® user interface and log in. 3 Initialise the specimen stage. 4 Load the specimen chamber with an appropriate specimen. 5 Evacuate the specimen chamber. 6 Switch on the SEM:
a Switch on the gun. b Switch on the EHT. 7 Ensure the Specimen Current Monitor is switched off: a Select Tools/Goto Panel from the menu. b Double- click on Specimen Current
Monitor. c Untick the SCM On checkbox.
This ensures that the touch alarm function is active. 8 Bring the image into focus.
Continue with adjusting the tilt eucentricity.

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6.6.1.2. Adjusting tilt eucentricity
Before you can start imaging or milling, it might be necessary to adjust tilt eucentricity. By adjusting the eucentricity, the specimen surface is moved into the tilting plane of the super-eucentric stage. That is why the image does not shift out of the screen when the stage is tilted.
CAUTION
Danger of damaging objective lens or specimen if the specimen is too close to the objective lens. Since the eucentricity is adjusted by using the M-axis, the working distance will be changed during the eucentricity setup. Ensure the working distance is 10 mm or more.
1 Open the Panel Configuration Bar. 2 Double-click on FIB Daily Adjust. The FIB Daily Adjust panel opens.
3 Tick the Crosshairs checkbox to show the crosshairs.
4 Center a characteristic feature in the middle of the screen (i.e. in the middle of the crosshairs).
5 Click on Eucentric Axis. 6 Click on Start. 7 Follow the instructions in the wizard.
To re-centre the feature, use the Centre feature function (<Ctrl+Tab>) or change X/Y.
To change the tilt degree of the stage: a Go to the Stage tab of the SEM Control panel. b In the Go To T(ilt) field, enter the required degree.

How to continue

Continue with switching on the ion beam (FIB).

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6.6.1.3. Switching on the ion beam (FIB)
1 Go to the FIB tab of the FIB Control panel. 2 Ensure the FIB Gun Pressure is better than
5 x 10-7 mbar.
CAUTION
Danger of arcing. Danger of damaging the ion source. Before switching on the ion beam, ensure the FIB gun pressure is better than 5×10-7 mbar.
3 Check the current status of the system vacuum. To be able to switch on the ion beam, the system vacuum has to be 5 x 10-5 mbar or better.
4 Click on the FIB icon.

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The FIB tab of the FIB Control panel opens.

IMPORTANT
Do not change the FIB Extr. Target value. Changing this value would require a complete adjustment of the FIB probe currents.
5 Ensure the Regulate checkbox is ticked.
This guarantees a stable emission current. The emission is automatically regulated by changing the FIB Suppressor Target which can have values between -2000 V and 0 V.

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IMPORTANT
From time to time, the gallium emitter has to be regenerated by heating. The heating procedure removes the gallium oxide which has been created during operation or during longer breaks.

In general, it is recommended that you activate the automatic heating function. This will ensure that the ion source is heated automatically if required.

Heating automatically

6 Regenerate the ion source: a Tick the FIB Auto Heating checkbox.

CAUTION
Risk of instabilizing the ion source due to incessant automatic heating. To ensure optimum operation, the ion source must be heated manually at regular intervals.

Heating manually

The manual heating will be required after having performed the Auto Heating for about 5 times, i.e. about every 2 – 3 weeks. However, this interval is dependend on the usage of the workstation. All Auto Heating cycles are listed in the log file of the EM Server.
a Check the number of Auto Heating cycles in the EM Server.
b After every fifth Auto Heating cycle heat manually. Refer to section 8.3.2.2. regenerating the ion source by heating manually.

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SK=léÉê~íáçå `êçëëÉ~ã® çéÉê~íáçå=EïáíÜ=cf=ìéÖê~ÇÉ=çåäóF 7 Initialise the FIB apertures: Click on Init Aperture. The aperture initialisation may require several seconds.
8 To switch on the ion beam, click on On.
The FIB Gun is ramping up. The gun valve is opened automatically.

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Below the Off button, the emission current is shown. The emission current should be about 2 µA.
The background of the button can have several colours. Green background: The emission current equals the target (+/- 0.1 µA). Yellow background: The emission current differs from the target by more than 0.1 µA. Red background: The suppressor voltage has almost reached its limit.

IMPORTANT
If you intend to deposit platinum with the optional GIS, you should start heating the platinum precursor now. Refer to section 6.6.4.1.

How to continue

Continue with setting the coincidence point.

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6.6.1.4. Setting the coincidence point
Before you can start imaging or milling, you have to align the specimen to the coincidence point. The coincidence point is the crossing point of electron beam and ion beam. Only if a specimen feature is located in the coincidence point, it can be imaged simultaneously as well in SEM mode as in FIB mode.
1 Position the feature of interest under the SEM. 2 Make sure the eucentricity is setup. 3 Set a WD of 5 mm. 4 Go to SEM view. 5 In SEM view, centre the feature. 6 Open the Panel Configuation Bar. 7 Double-click on FIB Daily Adjust. 8 Tilt the stage to 54°. The FIB Daily Adjust panel opens.
9 Click on Coincidence. 10 Follow the instructions in the wizard.
11 Click on Start. 12 Centre the feature by using the centre point
function (<Ctrl + Tab>). 13 Move Z. 14 Repeat the procedure until the Finish button is
shown.

Now, the workstation is ready to apply the CrossBeam® functions.
IMPORTANT
In general, the magnifications of SEM image and FIB image are not identical. If you wish both magnifications to be the same, you have to couple them together.

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6.6.2. Milling for depth
Milling stands for the local removal of surface material by means of the focused ion beam. Milling for depth is a milling mode, which allows removing a given depth.

At a glance

The complete sequence includes:
· Selecting milling conditions · Starting the milling procedure

Preconditions:
· Electron beam has been switched on · Ion beam has been switched on · Tilt eucentricity has been adjusted · Specimen has been moved to the coincidence point

6.6.2.1. Selecting milling conditions
1 Select FIB mode from the drop-down list.

2 Select a milling object from the drop-down menu, e.g. Fine Rectangle.

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3 Click into the image area, where you wish to place the milling object. Hold the left mouse button and drag.
The milling object is displayed on the screen. The green side of the milling object opposite the red side accentuates the side, where the process will start. The red side accentuates the side, where the process will end.
The Shape tab opens. 4 Enter the required parameters:
a Select Mill For Depth.
b Set the size of the milling object: Enter values for Width and Height. Alternatively, click on the markers of the milling object and drag.
c Set the position of the milling object: Enter values for CentreX and CentreY.
Alternatively, select the milling object. Click on the line between the markers and displace the milling object.
d Define the step size between each milling element: In the Inc Style drop- down list, select Auto. This setting is suitable for most applications.

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e Set the geometrical slope to be milled: At Slope (Degrees) enter 0.
f Set the Depth in µm. This defines how deep the milling should go at the lamella edges.
g Set the Number of Layers. The number of layers determines how often a milling element is milled.
h Select material data from the Material dropdown list. The material data can be edited via the FIB Materials Editor.
i Select the Angle 0.

Examples

j Set the Milling Current depending on your application and the size of your milling object:

Application Coarse milling
Medium polish Fine polish Lithography

Size large e.g. 10 x 10 µm2, 8 µm deep medium e.g. 5 x 5 µm2, 3 µm deep –

Recommended milling current 5 – 10 nA 2 nA 100 – 500 pA 10 – 50 pA 1 – 20 pA

k In the Track WD drop-down list, select Yes or No. If you select Yes, the working distance and the beam shift will be tracked while milling into the depth.

IMPORTANT
Track WD is only useful if the stage is tilted to 54°.

How to continue

Continue with starting the milling procedure.

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6.6.2.2. Starting the milling procedure
1 Click on Clear List. All previous milling objects are deleted from the milling list.
2 Click on Add. The current milling object is – together with the selected milling conditions – added to the milling list.
The time needed to process the object is shown under the Add button.
3 Go to the Options tab. 4 Tick the When milling switch to Mill+SEM
mode… checkbox.

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5 To start the milling, go to the Shape tab and click on Mill.

The milling process starts. The progress marker is shown.
The Mill tab opens, which allows you to directly control the milling progress.

The milling process ends automatically.
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6.6.3. Recording images during milling
When selecting the imaging mode Mill+SEM, images can be saved any time during milling. However, the images may be interfered by the ion beam. To avoid any interferences, you can pause the milling while you are taking an image.
1 To record a FIB image, click on Grab FIB Frame. Grabbing a FIB image provides an orthogonal view onto the specimen surface.
2 To record a SEM image, click on Grab SEM Frame. Grabbing a SEM image provides a sharp image, since the milling is paused.
When clicking one of the Grab…Frame buttons, the milling is stopped, while the image is recorded. After having finished the grabbing, the milling continues, but the image remains frozen.
To continue imaging, go to the Scanning tab of the SEM Control panel and click on Unfreeze.

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6.6.4. Gas assisted deposition: Platinum (with GIS upgrade only)
Requires FIB column and GIS. A common ion-beam induced deposition is the deposition of platinum, which serves e.g. as a surface protection layer. This section summarizes the procedure for the platinum depsition as a model.
IMPORTANT
For details on the deposition of other materials, refer to the Software Manual SmartSEM® XB.

At a glance

The complete sequence includes:
· Heating the platinum precursor · Outgassing the platinum precursor · Selecting deposition conditions · Starting the deposition procedure

Preconditions:
· Workstation has been prepared · Stage is tilted to 54°

6.6.4.1. Heating the platinum reservoir
1 Heat the precursor: a Go to the GIS tab of the FIB Control panel. b Tick the Reservoir checkbox of Platinum. The Capillary checkbox is ticked automatically.
There is a temperature gradient between reservoir (lowest temperature), capillary and nozzle (highest temperature). This will guarantee that substances will not have the chance to condense in any part of the gas line.

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IMPORTANT
It is recommended that you switch on the precursor heating at least two hours before you start the deposition procedure.
2 If required, initialise the GIS micro stage: a Go to the GIS tab. a Click on Stage Initialise.

How to continue

Continue with outgassing the platinum precursor.

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6.6.4.2. Outgassing the platinum reservoir (only with five-channel GIS)
Outgassing is required to remove excess gas from the reservoir. If a channel is not used daily, the gas pressure in the reservoir is built up. Therefore, outgassing is necessary to avoid that the FIB vacuum level exceeds and decreases abruptly when the reservoir valve is opened. Outgassing basically consists of a series of open and close cycles to let small amounts of gas out of the reservoir.
Procedure: 1 Switch off the SEM EHT. 2 Switch off the FIB EHT. 3 Open the Panel Configuration Bar. 4 Double-click on Gas Injection System. The Gas Injection System panel opens.

5 Ensure that the Temperature Control checkboxes for Reservoir and Capillary of Platinum are ticked.

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6 In the Platinum row, click on Outgas.

The Outgassing panel opens.
7 In the SEM Column Valve field: Click on Close.
The column chamber calve in the SEM is closed. The FIB gun valve is closed simultaneously.
8 Click on the Open Time field and enter 2 seconds.
9 Click on the Close Time field and enter a value of about 5 to 10 seconds.
10 Click on the Number of Loops field and enter 5.
CAUTION
Danger of damaging electron source and ion source Before starting the outgassing procedure: Ensure that EHT and FIB EHT are switched off. Ensure that “SEM Column Valve” and “FIB Gun Valve” are closed.

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11 To start the outgassing procedure, click on Go.

12 Monitor the system vacuum by observing the System Vacuum value in the Outgassing panel. If, after the 5th loop, the vacuum has not reached 2 x 10-5 mbar or better, which is the pressure necessary for deposition, repeat the procedure. In this case, you should increase the number of loops in future outgassing procedures.
The outgassing procedure ends automatically. If you wish to stop the procedure prematurely, click on Stop.

How to continue

Continue with selecting deposition conditions.

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6.6.4.3. Selecting deposition conditions
Preconditions:
· Specimen has been moved to the coincidence point · The platinum precursor has been heated and outgassed
Procedure: 1 Switch on the electron beam:
a Switch on the gun. b Switch on the EHT.
2 Go to the FIB tab of the FIB Control panel. 3 Ensure the FIB Gun Pressure is better than
5 x 10-7 mbar.
CAUTION
Danger of arcing. Danger of damaging the ion source. Before switching on the ion beam, ensure the FIB gun pressure is better than 5 x 10-7 mbar.
4 Switch on the ion beam: a Go to the FIB tab of the FIB Control panel. b Click on On.
5 Select FIB mode from the drop-down menu.

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6 Select Fine Rectangle from the drop-down menu.
7 Click into the image area, where you wish to place the milling object. Hold the left mouse button and drag.
The milling object is displayed on the screen.
The Shape tab opens. 8 Enter the required parameters:
a Milling Mode: Deposition Mode b Width: 10 µm c Height: 2 µm d Time: 300 sec e FrequencyX: 20,000 f FrequencyY: 1 g Milling Current: 30 kV; 200 pA h Gas ID: Platinum i Gas Wait Time (s): 5 sec

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6.6.4.4. Starting the deposition procedure
1 Click on Clear List. All previous milling objects are deleted from the milling list.
2 Click on Add. The current milling object is – together with the selected milling conditions – added to the milling list.
The time needed to process the object is shown under the Add button.
3 Go to the Options tab.
4 Tick the When milling switch to Mill+SEM mode… checkbox.

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5 To start the deposition, go to the Shape tab and click on Mill.
The GIS micro stage is moved automatically to the pre-defined position, which has been assigned to Platinum. The deposition process starts. The Mill tab opens, which allows you to directly control the deposition process.

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The deposition process ends automatically.
6 Move the GIS micro stage to the park position: a Go to the GIS tab. b Click on Parked.
The GIS micro stage is driven to the safe park position.

IMPORTANT
If you tick the GIS Auto Park checkbox in the Options tab before starting the deposition (step 5), the GIS micro stage is automatically driven to the safe park position.

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6.6.5. Setting detection parameters
6.6.5.1. Using the SESI detector (optional)
The SESI detector allows the acquisition of FIB secondary ion images and electron images.
The following table should serve as a help to find the required settings for your application.

Operating Detected

mode

signals

SE mode

Secondary electrons

FIB mode SEM
FIB

EHT

Typical WD

Detector settings

100 V to 30 kV

max. 5 mm

Collector voltage: 0 V to + 1500 V Best detection: +300 V to + 400 V

2 kV to 30 kV coincidence point Collector voltage: 0 V to + 1500 V

Best detection: +300 V to + 400 V

Ion mode

Secondary

FIB

ions

2 kV to 30 kV coincidence point Collector voltage: – 5 kV to 0 kV Best detection: around – 4 kV

Preconditions:
· Gun and EHT are on · Suitable specimen is located
Procedure: 1 Select an imaging mode, e.g. FIB mode SEM.
2 Go to the Detectors tab of the SEM Control panel.
3 Select SESI from the drop-down menu.
The SESI detector is operated in SE mode.

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4 In order to toggle between SE Mode and Ion mode, tick/untick the ION Mode checkbox.
5 Set the Collector Voltage.

SESI Control panel

Alternatively: 1 Open the Panel Configuration Bar. 2 Double-click on SESI Control.
The SESI Control panel opens.

3 Select the desired settings.

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6.6.6. Adjusting a FIB probe current at high kV (30 kV)
6.6.6.1. Overview
The FIB probe current is defined by emission current, condenser voltage and aperture diameter.

Canion FIB

Range Low probe currents

FIB probe currents
1, 2, 5 pA 5, 10, 20 pA 20, 50, 100, 200 pA 200, 500 pA 1 nA

Aperture diameter 10 µm 20 µm 50 µm 100 µm

Aperture No. 1 2 3, 4 5

High probe currents 1, 2, 5 nA

200 µm

5, 10, 20, 50 nA

400 µm

Table 6.1: Canion FIB: FIB probe currents and aperture numbering

IMPORTANT
The probe current of 50 pA is used as reference for the Canion FIB column. The other probe currents are dependent on this reference. If you change the reference values, all other probe currents will be changed as well.

IMPORTANT
Depending on special customer requirements, size and numbering of the apertures may be slightly different.

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Cobra FIB

Range

FIB probe currents

Low probe currents

Currently not in use 1, 2 pA Currently not in use 10 pA Currently not in use 20 pA 50 pA 80, 140 pA 275 pA 600

Aperture diameter 10 µm 10 µm 20 µm 30 µm 50 µm 50 µm 80 µm 100 µm 150 µm 200 µm

Aperture No. 14 13 12 11 10 9 8 7 1 6

High probe currents 1 nA

200 µm

2 nA

300 µm

4 nA, 8 nA, 12 nA

400 µm

16 nA

500 µm

30 nA

800 µm

Table 6.2: Cobra FIB: FIB probe currents and aperture numbering

IMPORTANT
The probe current of 50 pA is used as reference for the Cobra FIB column. The other probe currents are dependent on this reference. If you change the reference values, all other probe currents will be changed as well.
You can see that you have selected the reference probe current when the message ,,You cannot delete the reference probe entry.” is displayed in the FIB Probe Table.

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Preparing the adjustment

The extraction current should be kept constant while the other parameters can be changed in the FIB Alignment panel.
Possible reasons:
· After having changed the FIB Extractor Target

Depending on the operator’s experience it may take up to a few hours to run through this procedure thoroughly.

Parts/special tools required NTS part no.

Faraday cup Piece of silicon wafer (bulk)

348342-8055-000 –

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6.6.6.2. Adjusting a low probe current (pA)
Procedure: 1 Load the Faraday cup. 2 Go to the coincidence point at 54°. 3 Ensure that the emission of the ion beam is stable. 4 Go to FIB Control/Align and select a probe cur-
rent.
5 Start measuring the specimen current by using the Specimen Current Monitor (Panel Configuration Bar/Specimen Current Monitor).
6 Tick the SCM On and the Spot checkbox.
7 Go to FIB Control/Align. 8 Tick the Modify Condenser checkbox.

9 Adjust the FIB Condenser until the desired probe current is measured by the Specimen Current Monitor. The condenser value is automatically adopted to the FIB Probe Table.
10 Focus the specimen surface: Use Focus and Stigmation.
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11 Wobble the aperture: a Select ON Focus from the drop-down menu. b Move the aperture: Use the buttons in the Aperture Steps field. Use only Medium or Fine.
The aperture has been aligned correctly when the image does not shift any more during the focus/unfocus cycle.
12 Re-focus the image: Use Focus and Stigmation.
13 If the results are not satisfying, repeat step 9 with a higher magnification.
14 Repeat the procedure for all other probe currents.
15 In the Align tab, untick the Modify Condenser checkbox.

How to continue

Adjust the Beam shift correction (refer to section 6.6.6.5.).

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6.6.6.3. Adjusting a high probe current (nA)
For the higher currents (nA range) usually the largest apertures need to be selected. It is very difficult to achieve a circular beam profile without halo by using the Focus wobble procedure.
Precondition:
· Piece of silicon is loaded · Probe currents have been adjusted roughly as described for pA probe currents (see previous
section).
Procedure: 1 Burn a spot into the specimen for about 5 s:
Use the Spot mode.
2 Check the halo. 3 If the spot is not round, move the aperture one
step in one direction. 4 Burn a new spot.
5 If the halo is reduced, continue moving the aperture in this direction. If the halo is increased, move the aperture in the opposite direction.
6 Repeat steps 4 to 5 until the burned spot is round.

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7 In the Align tab of the FIB Control panel: Click on Backlash Correction.
8 Check the spot shape. 9 Click on Save.

10 Repeat the procedure for all other nA probe currents.
11 If necessary optimise the probe current with the Defocus option (refer to section 6.6.6.4.).

How to continue

Adjust Beam shift correction (refer to section 6.6.6.5.).

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6.6.6.4. Optimising a high probe current (nA)
A probe current can have a halo round the center which significantly decreases the performance in terms of sputter rate and steepness of the side walls of a cross section.
If you cannot remove the halo by standard aperture alignment, use the defocus option.

Image

Comment
The ion beam is focussed, resulting in – an optimum imaging resolution but – the sputter rate is low due to the large halo.

The focus voltage is reduced by -60 V resulting in – poor image quality, but – the sputter rate is increased due to the elimination of the halo and – high current density.
The focus voltage is reduced by -120 V, both imaging and milling are of poor quality.
Table 6.3: Spot files
Procedure: 1 Adjust the probe current as described in section 6.6.6.3. 2 Go to FIB Control/Align 3 Set the defocus value:
a Double-click in the Mill Defocus = field.

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IMPORTANT
The defocus value is different for each current.
b Enter a defocus value, e.g. 20V in the Mill Defocus window
4 Tick the Force Defocus checkbox. The Defocus value is now applied when using spot mode.

5 Burn a spot into the specimen for about 5 s to evaluate the spot quality: Use the Spot mode.
6 Check the halo. 7 Slowly increase the defocus value in 10 V
steps.

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9 If the correct defocus voltage is reached, click on Save.
10 Untick the Force Defocus checkbox. Now, the adjustment is complete.

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6.6.6.5. Adjusting beam shift correction
The beam shift correction is used to correct the different beam positions of the different probe current settings. Because of the different condenser settings the beam path through the column can be slightly different. Therefore, the beam hits the sample at different locations. This can be corrected by using a part of the beam shift (called beamshift correction). The 30kV:50 pA probe current is the reference current where no correction is applied.
IMPORTANT The 50 pA probe current is the reference probe current. All focus values and the beam shift correction are stored in reference to the 50 pA probe current. Therefore, this probe current must be adjusted first.
IMPORTANT The Beamshift correction has only a limited range.
Procedure: 1 Select MAG 2000 (referred to Polaroid). 2 Go to FIB Control/Align and select the
30kV:50 pA reference current from the dropdown menu.
3 Select View/Movable Crosshairs from the menu bar.

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Crosshairs are displayed in the image area. 4 Move the crosshairs to a selected position. To move the crosshairs, click on the square in the
centre and drag.

5 In the FIB Control/Align tab, select the next smaller probe current from the drop-down menu.
The crosshairs are shifted to another position 6 Move the crosshairs to the original position by
using the beamshift correction. a Click on Beam Shift Cor. b Move the crosshairs with the sliders or the
red dot.
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7 Click on Save to save the adjustments.
8 Repeat steps 5 to 7 with the next smaller probe current.
9 Adjust all smaller probe currents with this procedure.
10 Select the 30kV:50 pA reference current to check the original position of the crosshairs. If necessary move the crosshairs to the original position.

CAUTION
Danger of damaging the specimen Ensure not to damage the specimen while working with high currents.
11 Repeat steps 6 to 7 with the next higher probe current.
12 Adjust all higher probe currents with this procedure.

Now, the adjustment is complete.
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6.7. Using the help functions
The SmartSEM® user interface offers a multitude of help texts containing information on the operation of the workstation, the optimization of the images and the handling of accessory options.
6.7.1. Calling the SmartSEM® help
1 Press . Alternatively, select Help/SmartSEM help from the menu.
The SmartSEM® help start window opens. If menus are opened in the SmartSEM® user interface, pressing will open the help text for the respective menu. This allows explaining the menu while the workstation is being operated.

6.7.1.1. Printing help texts
1 Click on the printer icon in the help window. If a printer is installed, the help text is printed.
6.7.1.2. Bringing help texts to the foreground
1 Select Help/Help Always On Top from the menu. The displayed help texts remain in the foreground.
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6.7.2. Calling the context-sensitive help
1 Press <SHIFT+F1>. Alternatively, select Help/What’s This from the menu.
The mouse cursor is equipped with a question mark. 2 Move the cursor to the area of interest on the
screen. 3 Click on the left mouse button. The help text is shown. 4 To disable the context-sensitive help, press

. 6.7.3. Searching for a topic 1 Select Help/Search from the menu. 2 Click on the Search tab. 3 Search for the desired topic.

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6.7.4. Using the step-by-step guides
The step-by-step guides provide quick information on important operation sequences.
6.7.4.1. Getting started
1 Select Help/Getting started from the menu. 2 Click on the topic of interest.
6.7.4.2. Frequently used operation sequences
1 Select Help/How To from the menu. 2 Click on the topic of interest.

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6.7.5. Calling the short cuts help
Many functions and menus which are often used in the SmartSEM® user interface can also be opened using the keyboard. A list of short cuts (key combinations) can be displayed in the SmartSEM® help. 1 Press < F9>.
Alternatively, select Help/Keys help from the menu.

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6.7.6. Showing information about SmartSEM®
6.7.6.1. Version history
The Release Notes summarise important information about the software version history. New functions, bug fixes and special features of the different versions are explained. 1 Select Help/Release Notes from the menu.

6.7.6.2. About SmartSEM®
1 Select Help/About SmartSEM from the menu.

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6.8. Closing the SmartSEM® user interface
6.8.1. Logging off
1 Select File/Log Off from the menu. A window appears asking for confirmation to close the session.
2 Confirm by clicking on the Yes button. The electron-optical parameters are filed in a macro in the individual user directory.
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ZEISS AURIGA Series Modular CrossBeam Workstation Instruction Manual

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Intended Use

Prevention of Accidents and Improper Use

Safety Summary

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Handling Precursors (with GIS Upgrade Only)

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