hp ZBook Fury G9 Mobile Workstation PC

Overview

HP ZBook Fury G9 Mobile Workstation PC

Right

1. Ambient Light Sensor (Optional)
2. Top Facing Microphone (2)
3. Webcam LED (Optional)
4. IR Camera (Optional)
5. HD Camera (Optional)
6. IR Camera LEDs (Optional)
7. 3-Button Touchpad
8. Power Button
9. Nano Security Lock slot
10. RJ45
11. 1 SuperSpeed USB Type-A 5Gbps signaling rate
12. 1 SuperSpeed USB Type-A 5Gbps signaling rate (charging)
13. headphone/microphone combo
14. SmartCard Reader
15. Fingerprint Sensor (Optional)

Left

1. Power Charging indicator
2. Power connector
3. (2) Thunderbolt™ 4 with USB4™ Type-C® 40Gbps signaling rate (USB Power Delivery, DisplayPort™ 1.4, HP Sleep and Charge)
4. mDP port
5. HDMI port
6. SD 7.0 Card Reader

Bottom

1. Inlet (Vents)
2. Service Door Latch

At A Glance

• Desktop Power on the Go with an Intel® 12th Gen Processor
• Work anywhere without compromising on performance or security with Windows 11 Pro, powered by HP’s collaboration and connectivity technology.
• Accelerate your workflow. Power through projects with up to 128 GB RAM ECC Memory for fast rendering, editing and visual effects performance.
• Take multitasking to the next level with the Intel® Core™ i9 processor designed to handle complex, multithreaded apps like Adobe® Premier Pro, and with fast clock speeds you can boost your speed on single threaded apps like Autodesk 3ds Max.
• Fast rendering. Desktop Class processor on a mobile form factor with NVIDIA or AMD Professional Graphics
• Easy upgrades & re-provisioning. Multiple ports for maximum productivity
• 16:10 aspect ratio (only available on 16”); Low Blue Light optional.
• HP Dreamcolor. 100% DCI-P3 1 Billion Colors, 120 Hz Refresh Rate (Low Blue Light)
• Enhanced audio, 5MP CAMERA + IR.
• HP Auto Frame to allow intelligent face tracking
• Multiple ports for maximum productivity
• Choice of touch and non-touch displays
• Keep cool under any workload with HP Vaporforce Thermals, with new curved metal blades
• Detect if someone has tried to open the back cover of your device with Tamper Lock
• Instantly protect against visual hacking with HP Sure View, and defend against firmware and malware attacks with HP Sure Start and HP Sure Sense, and have peace of mind with multi-factor authentication- including an infrared camera and fingerprint scanner.
• Enhanced transfer and upload speeds via dual Thunderbolt™ 4 ports. Get wide-ranging connectivity options to ensure maximum device interaction: USB 4.0, HDMI, mDP, SD card, Smart Card Reader and more.
• Designed for ultimate durability, this ZBook undergoes 21 MIL-STD 810H testing to help ensure this PC keeps rolling through your workday.
• Work without limits in any location with up to 128GB of DDR5 RAM and up to 12TB of local PCIe storage.

NOTE: See important legal disclosures for all listed specs in their respective features sections.

Features

OPERATING SYSTEM

Preinstalled OS

• Windows 11 Pro – HP recommends Windows 11 Pro2
• Windows 11 Home – HP recommends Windows 11 Pro2
• Windows 11 Pro (preinstalled with Windows 10 Pro Downgrade)2,3
• Ubuntu 20.044
• FreeDOS 3.0

1. Not all features are available in all editions or versions of Windows. Systems may require upgraded and/or separately purchased hardware, drivers, software or BIOS update to take full advantage of Windows functionality. Windows is automatically updated and enabled. High speed internet and Microsoft account required. ISP fees may apply and additional requirements may apply over time for updates. See http://www.windows.com.
2. This system is preinstalled with Windows 10 Pro software and also comes with a license for Windows 11 Pro software and provision for recovery software. You may only use one version of the Windows software at a time. Switching between versions will require you to uninstall one version and install the other version. You must back up all data (files, photos, etc.) before uninstalling and installing operating systems to avoid loss of your data.
3. For detailed Linux® OS/hardware support information, see: http://www.hp.com/linux_hardware_matrix.

NOTE:
Your product does not support Windows 8 or Windows 7. In accordance with Microsoft’s support policy, HP does not support the Windows® 8 or Windows 7 operating system on products configured with Intel® and AMD® 7th generation and forward processors or provide any Windows® 8 or Windows 7 drivers on http://www.support.hp.com. A full list of HP products and the Windows 10 versions tested is available on the HP support website. https://support.hp.com/us-en/document/c05195282.

PROCESSOR

• 12th Generation Intel® Core™ i9-12950HX with Intel® UHD Graphics (1.7 GHz E-core base frequency, 2.3 GHz P-core base frequency, up to 3.6 GHz E-core Max Turbo Frequency, up to 5.0 GHz P-core Max Turbo frequency, 30MB L3 cache, 8 P-cores and 8 E-cores, 24 Threads); supports Intel® vPro® Technology 1,2,3,4,5
• 12th Generation Intel® Core™ i9-12900HX with Intel® UHD Graphics (1.7 GHz E-core base frequency, 2.3 GHz P-core base frequency, up to 3.6 GHz E-core Max Turbo Frequency, up to 5.0 GHz P-core Max Turbo frequency, 30MB L3 cache, 8 P-cores and 8 E-cores, 24 Threads) 1,2,3,4
• 12th Generation Intel® Core™ i7-12850HX with Intel® UHD Graphics (1.5 GHz E-core base frequency, 2.1 GHz P-core base frequency, up to 3.4 GHz E-core Max Turbo Frequency, up to 4.8 GHz P-core Max Turbo frequency, 25MB L3 cache, 8 P-cores and 8 E-cores, 24 Threads); supports Intel® vPro® Technology 1,2,3,4,5
• 12th Generation Intel® Core™ i7-12800HX with Intel® UHD Graphics (1.5 GHz E-core base frequency, 2.0 GHz P-core base frequency, up to 3.4 GHz E-core Max Turbo Frequency, up to 4.8 GHz P-core Max Turbo frequency, 25MB L3 cache, 8 P-cores and 8 E-cores, 24 Threads) 1,2,3,4
• 12th Generation Intel® Core™ i5-12600HX with Intel® UHD Graphics (1.8 GHz E-core base frequency, 2.5 GHz P-core base frequency, up to 3.3 GHz E-core Max Turbo Frequency, up to 4.6 GHz P-core Max Turbo frequency, 18MB L3 cache, 4 P-cores and 8 E-cores, 16 Threads); supports Intel® vPro® Technology 1,2,3,4,5

1. Multicore is designed to improve the performance of certain software products. Not all customers or software applications will necessarily benefit from use of this technology. Performance and clock frequency will vary depending on the application workload and your hardware and software configurations. Intel’s numbering, branding and/or naming is not a measurement of higher performance.
2. Processor speed denotes maximum performance mode; processors will run at lower speeds in battery optimization mode. 3 Intel® Turbo Boost performance varies depending on hardware, software and overall system configuration. See www.intel.com/technology/turboboost for more information.
3. In accordance with Microsoft’s support policy, HP does not support the Windows 8 or Windows 7 operating system on products configured with Intel and AMD 7th generation and forward processors or provide any Windows 8 or Windows 7 drivers on http://www.support.hp.com.
4. Intel vPro® requires Windows 10 Pro 64 bit or higher, a vPro-supported processor, vPro-enabled chipset, vPro-enabled wired LAN and/or Wi-Fi 6E WLAN, and TPM 2.0. Some functionality requires additional 3rd party software in order to run. Features of vPro® Essentials and Enterprise vary. See http://intel.com/vpro.

CHIPSET

• Intel® WM690

INTEL® CORE™ I5 WITH VPRO®/CORE™ I7 WITH VPRO®/ CORE™ I9 WITH VPRO® TECHNOLOGY CAPABLE
Intel® Core™ i5 with vPro®, Core™ i7 with vPro®, and Core™ i9 with vPro® technology is a selectable feature that is available on units configured with select processors, a qualified Intel® WLAN module and a preinstalled Windows® operating system. It provides advances in remote manageability, security, energy-efficient performance, and wireless connectivity. Intel® Active Management Technology (iAMT) offers built-in manageability and proactive security for networked mobile workstations, even when they are powered off* or when the operating system is inoperable. It can help identify threats before they reach the network, isolate infected systems, and update regardless of their power state.1,2

1. Requires a Windows operating system, network hardware and software, connection with a power source, and a direct (non-VPN) corporate network connection which is either cable or wireless LAN.
2. Intel vPro® requires Windows 10 Pro 64 bit or higher, a vPro-supported processor, vPro-enabled chipset, vPro-enabled wired LAN and/or Wi-Fi 6E WLAN and TPM 2.0. Some functionality requires additional 3rd party software in order to run. Features of vPro® Essentials and Enterprise vary. See http://intel.com/vpro.

GRAPHICS

Integrated

• Intel® UHD Graphics 1, 2, 3, 4

Discrete 5, 6, 7, 8, 9

• NVIDIA RTX™ A1000 Laptop GPU (4GB GDDR6 dedicated)
• NVIDIA RTX™ A2000 8GB Laptop GPU (8GB GDDR6 dedicated)
• NVIDIA RTX™ A3000 12GB Laptop GPU (12GB GDDR6 dedicated)10
• NVIDIA RTX™ A4500 Laptop GPU (16GB GDDR6 dedicated)10
• NVIDIA RTX™ A5500 Laptop GPU (16GB GDDR6 dedicated)10
• AMD Radeon™ PRO 6600M Graphics (8 GB GDDR6 dedicated)

Supports
Support HD decode, DX12, HDMI 2.0b, HDCP 2.3

1. UHD content required to view UHD images.

2. Both UMA & Discrete configurations support up to 4 displays when on the HP Thunderbolt Dock G2 (sold separately) – Max. resolution = 2.5K @60Hz (DP1) & 2.5K @60Hz (DP2) & FHD (VGA) OR 4K @60Hz (one DP Port) & 4K @60Hz (Type-C® output port using a Type C®-to-DP adapter).

3. Support HD decode, DX11, DX12, HDMI 1.4, HDCP 2.3 via DP up to 4K @ 60Hz and via HDMI up to 4K @ 30Hz

4. Shared video memory (UMA) uses part of the total system memory for video performance. System memory dedicated to video performance is not available for other use by other programs.

5. Others NVIDIA dGPU: Support HD decode, DX12, HDMI 2.1, mDP 1.4, HDCP 2.3 via DP up to 5K@60Hz(W/o DSC) or 8K@60(With DSC and requires 2 display heads)

6. Discrete configurations support 4 independent displays (both Intel and NVIDIA Graphic cards, DIS mode need to close lid or only 3 displays max are supported externally. Max. resolution = 4K@60Hz (Type-C output port using a Type C-to-DP adapter), 4K@60Hz (Type-C output port using a Type C-to-DP adapter), OR 4K @60Hz (DP1) & 2.5K @60Hz (DP2) & FHD (VGA) OR 4K @60Hz (one DP Port) & 4K @60Hz (Type-C output port using a Type C-to-DP adapter).

7. GPU configurations may be limited to specific GPU/Memory Configurations

8. Intel GPU and NVIDIA® RTX A1000 Laptop GPU: Support HD decode, DX12, Multi-Function USB-C port, DP 1.4, HDCP 2.3, DP max resolution up to 5K@60Hz and 8K@60Hz (With DSC), HDMI 2.1 support up to 4K@60Hz and 8K@60Hz (with DSC and FRL)

9. MiniDP cable sold separately.

10. NOTES:
    NVIDIA Feature: Discrete Graphics (RTX A3000, A4500, A5500) can turn “ECC ON” with the VRAM

    • NV Control Panel should have the following selectable option:
    • Change ECC State
    • Native Display: There is no option to Change ECC State in NV Control Panel
    • External Display: There is an option to Change ECC State in NV Control Panel
    • Software Driver solution available in Q3 2022

DISPLAY

Non-touch

• 16.0″ diagonal, WUXGA (1920 x 1200), IPS, anti-glare, 1000 nits, 72% NTSC, HP Sure View Reflect integrated privacy screen1,3,5,6,7,8
• 16.0″ diagonal, WUXGA (1920 x 1200), IPS, narrow bezel, anti-glare, WLED+LBL, 400 nits, low power, 100% sRGB1,3,6,7,8
• 16.0″ diagonal, 4K WQUXGA (3840 x 2400), 120 Hz, IPS, UWVA, anti-glare, 500 nits, 100% DCI-P3, HP DreamColor1,3,6,7,8
• 15.6” diagonal FHD (1920×1080) Anti-Glare WLED UWVA, 45% NTSC, 250 nits eDP 1.2 w/o PSR bent Narrow Bezel1,3,5,6,7,8

Touch

• 16.0″ diagonal, 4K WQUXGA (3840 x 2400), OLED, LBL, multitouch-enabled, UWVA, BrightView, TS, Corning® Gorilla® Glass 5, 400 nits, 100% DCI-P31,3,5,6,7,8
• 16.0″ diagonal, WUXGA (1920 x 1200), touch, IPS anti-glare, micro-edge, 400 nits, sRGB 100% eDP 1.4+PSR21,3,5,6,7,8

Displays support
Supports up to 4 displays through the HP Thunderbolt 280W G4 Dock

1. HD content required to view HD images.
2. Resolutions are dependent upon monitor capability, and resolution and color depth settings. 5Actual brightness will be lower with touchscreen or Sure View.
3. UHD content required to view UHD images.
4. HP Sure View is optional and must be configured at purchase. It operates in landscape orientation. 8Display options may be limited to specific CPU / GPU Configurations.

DOCKING

• Docking station model #1 HP Thunderbolt 280W G4 Dock w/Combo Cable For DP1.4 Platforms

• Docking station model #1 HP Thunderbolt 280W G4 Dock w/Combo Cable For DP1.4 Platforms

• Max.resolutions supported

  • Dual 4K @30Hz or dual 4K UHD @ 60Hz is supported
  • Single 8K @30Hz (multiple tiles) for Thunderbolt hosts
  • Non-TBT hosts DP 1.4 in high-res mode (1) 8K video single cable @30Hz

• Dock Connectors 2xDP, 1xHDMI, 1xTB, 1xUSB-C Alt Mode

• Technical limitations Thunderbolt Hosts:

  • Maximum of (4) displays with a maximum resolution of 5K@ 30Hz running Thunderbolt host.

  • Max resolution possible is dual 8K displays @ 60Hz running a Thunderbolt host or running a non-Thunderbolt host in High-Resolution mode @30Hz

  • Non-Thunderbolt hosts:
    The highest resolution for dual displays running a non-Thunderbolt host in multi-function mode is (1) 5K dual cable (using both DP ports) +(1) 4K on USB-C DP port

  • Non-Thunderbolt hosts:
    support (3) displays with a max resolution of: (2) 5K single cable + (1) 4K UHD @ 60 Hz in high-resolution mode. In multi-function mode the maximum resolution for (3) displays is (2) 5K single cable @ 30Hz + (1) 4K UHD @ 30Hz.

• Docking station model #2 HP USB-C Dock G5

• Total number of supported displays (incl.the notebook) display) 3

• Max. resolutions supported Dual 5K@ 30Hz + (1) 4K UHD (multi-function mode)

• Dock Connectors 1xHDMI, 2xDP

• Technical limitations

  • Highest resolution with dual displays is two 8K@ 60Hz host in High-Resolution mode.
  • Three maximum displays supported are two 5K@ 30 Hz on DP ports plus one 4K UHD@ 30 Hz on HDMI in multi-function mode
  • The highest resolution for a non-Thunderbolt host in Multi-function mode is a single 5K dual cable (using both DP ports) + (1) 4K on HDMI port.

• Docking station model #3 HP USB-C/A Universal Dock G2

• Total number of supported displays (incl.the notebook) display) 3

• Max.resolutions supported Triple 4K UHD@ 60Hz

• Dock Connectors 1xHDMI, 2xDP

• Technical limitations The best resolution for dual or triple displays is 4K UHD@ 60Hz.

For use with the USB-A adapter that comes in the box the maximum number of displays supported is (2) 4k x 60 Hz on the Type-A Gen 1 connection from the host

**STORAGE AND DRIVES***

Maximum Storage
12 TB PCIe Gen4x4 M.2

PCIe® NVMe™ M.2 2280 Storage

• 4 TB PCIe® Gen4x4 NVMe™ M.2 SSD TLC
• 2 TB PCIe® Gen4x4 NVMe™ M.2 SSD TLC
• 2 TB PCIe® Gen4x4 NVMe™ SED SSD
• 1 TB PCIe® Gen4x4 NVMe™ M.2 SSD TLC
• 1 TB PCIe® Gen4x4 NVMe™ SED SSD
• 512 GB PCIe® Gen4x4 NVMe™ M.2 SSD TLC
• 512 GB PCIe® Gen4x4 NVMe™ SED SSD
• 256 GB PCIe® Gen4x4 NVMe™ M.2 SSD TLC
• 256 GB PCIe® Gen4x4 NVMe™ SED SSD

Storage Slots

• 4 M.2 Solid State Drive

For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 35GB of disk is reserved for system recovery software.

NOTE: SSD/SODIMM requires low to moderate technical skills required to replace

DRIVE CONTROLLERS

• M.2 Storage Bay (PCIe NVMe) PCIe® Gen4 x4 lanes NVMe™ Solid State Drive
• RAID: Supported RAID 0, RAID 1*, RAID 5 and RAID 10**
  • RAID 0, RAID 1 not supported on Opal SSD
  • RAID 5 and RAID 10 are not available out of factory but can be configured by the end-user. RAID 5, RAID 10 not supported on Opal SSD, no 4TB SSD

MEMORY

Maximum Memory

• 128 GB DDR5-4800 non-ECC SODIMM
• RAM Support – 8GB, 16GB, 32GB, 64GB, 128GB 128 GB DDR5-4800 ECC SODIMM

Memory

• 8GB (1x8GB) DDR5 4800
• 16GB (1x16GB) DDR5 4800
• 16GB (2x8GB) DDR5 4800
• 32GB (1x32GB) DDR5 4800
• 32GB (2x16GB) DDR5 4800
• 32GB (4x8GB) DDR5 4800
• 64GB (2x32GB) DDR5 4800
• 64GB (4x16GB) DDR5 4800
• 128GB (4x32GB) DDR5 4800

Memory Slots

• 4 SODIMM
• 2 DIMMs per channel; support up to 4000 MT/s
• DDR5 SODIMMS, system runs at 4000 MT/s
• Supports Dual Channel Memory

Memory Speed
Memory DDR5-4800 SODIMM. Intel® 12th Gen Core™ HX-Series Processors: Memory transfer speed will be 3600 MT/s or 4000 MTs under identical DIMM conditions.

Current identical DIMM conditions:

• 2 DIMM per Channel (with 2 Rank DDR5 module): 3600 MT/s
• 2 DIMM per Channel (with 1 Rank DDR module): 4000 MT/s
• 1 DIMM per Channel (with either 1 Rank or 2 Rank DDR module): 4000 MT/s

1. NOTE: DIMM per Channel is DPC
2. NOTE: 8GB and 16GB DIMM are 1 Rank module
3. NOTE: 32GB DIMM is 2 Rank module

2 Rank: 4000 MT/s

| 1 DPC| Configuration available from factory
√| √| | | 1 Rank: 4000 MT/s

2 Rank: 4000 MT/s

| 1 DPC| Configuration available from factory
√| √| √| | 1 Rank: 4000 MT/s

2 Rank: 3600 MT/s

| 2 DPC| Configuration not available from factory
√| √| √| √| 1 Rank: 4000 MT/s

2 Rank: 3600 MT/s

| 2 DPC| Configuration available from factory

• Mixing Memory DIMM Vendors/Suppliers
• Mixing memory DIMM supplier and/or capacity may cause a downgrade in memory speed , signal integrity or functional issues.
• Mixing memory Rank (1 Rank and 2 Rank from table above) in the same channel will cause the memory speed to drop to 2000 MHz and could encounter an unstable condition.
• Recommendation: Do not install different Rank memory modules in the same channel.

Memory Installation Sequence

• Intel® 12th Gen Core™ HX-Series Processors have specific population (installation sequence) rules. To avoid a no-boot issue, there is/are DIMM population installation sequence requirements for cases where only one DIMM is populated per channel, then the furthest memory connector from the CPU should be populated first.
• Memory installation sequence is labeled on the memory shielding cover or User Guide. Memory must be installed in correct sequence.

NOTE:

• NOTE: Due to the non-industry standard nature of some third-party memory modules, we recommend HP branded memory to ensure compatibility. If you mix memory speeds, the system will perform at the lower memory speed.
• NOTE: SSD/SODIMM requires low to moderate technical skills required to replace
• NOTE: FreeDOS is limited to 32GB MAX ex-factory. Customer can add RAM, but should not uninstall their FreeDOS rev., but can upgrade.
• NOTE: Transfer rates up to 4000 MT/s for nECC and ECC memory combinations when memory suppliers are consistent. If suppliers are not consistent, speeds may drop to 2000 MT/s for nECC and 2000 MT/s for ECC memory combinations. A custom configuration including part number AY104AV can be used to lock in a consistent vendor.
• NOTE: Intel® allows architectures designed with four DIMM slots to run at 4000 MT/s
• NOTE: Maximized dual-channel performance requires SODIMMs of the same size and speed in both memory channels.

NETWORKING/COMMUNICATIONS

LAN1

• Intel® I219-LM GbE, vPro®
• Intel® I219-V GbE, non-vPro®

1. GbE-The term “10/100/1000” or “Gigabit” Ethernet indicates compatibility with IEEE standard 802.3ab for Gigabit Ethernet, and does not connote actual operating speed of 1 Gb/s. For high-speed transmission, connection to a Gigabit Ethernet server and network infrastructure is required.

WLAN1

• Intel® Wi-Fi CERTIFIED 6E AX211 (2×2) and Bluetooth® 5.3 combo, vPro®
• Intel® Wi-Fi CERTIFIED 6E AX211 (2×2) and Bluetooth® 5.3 combo, non-vPro®

1. Wi-Fi 6E requires a Wi-Fi 6E router, sold separately, and Windows 11 to function in the 6GHz band. Availability of public wireless access points limited. Wi-Fi 6E is backwards compatible with prior 802.11 specs. And available in countries where Wi-Fi 6E is supported. Not supported with Windows 10.

WWAN1

• Intel® XMM™ 7560 LTE Advanced Pro Cat 16
• Intel® 5G Solution 5000

1. WWAN use requires separately purchased service contract. Check with service provider for coverage and availability in your area. Connection speeds will vary due to location, environment, network conditions, and other factors. 4G LTE not available on all products, and in all regions.

AUDIO/MULTIMEDIA

Audio
Audio by Bang & Olufsen, 2 speakers with discrete amplifier, 3 Internal Microphone (2 Front, 1 Back) dual array digital microphones, functions keys for volume up and down, combo microphone/headphone jack, HD audio with 200Hz Bass Roll off

Camera1, 2
5MP+IR Camera

1. HD content required to view HD images.
2. Windows Hello face authentication utilizes a camera specially configured for near infrared (IR) imaging to authenticate and unlock Windows devices as well as unlock your Microsoft Passport.

KEYBOARDS/POINTING DEVICES/BUTTONS & FUNCTION KEYS

Keyboard

• HP Premium Quiet Keyboard – spill-resistant, full-size, backlit keyboard and DuraKeys
• HP RGB Keyboard – Full-size, per-key RGB backlit keyboard
• NOTE: RGB will only function after Z Light Space Software is activated
• NOTE: Ubuntu will not function with RGB as Z Light Space is a WinApp. No Ubuntu support

Pointing Devices
Touchpad with image sensor and glass surface supporting multi-touch gestures and taps

Function Keys

• ESC: system information
• F1 – Display Switching
• F2 – Blank or Privacy
• F3 – Brightness Down
• F4 – Brightness Up
• F5 – Audio Mute
• F6 – Volume Down
• F7 – Volume Up
• F8 – Mic Mute
• F9 – Blank or Backlit Toggle
• F10 – Insert
• F11 – Airplane Mode
• F12 – HP Command Center
• Power Button (with LED) delete

Hidden Keys

• home
• end
• Fn+R – Break
• Fn+S – Sys Rq
• Fn+C – Scroll Lock
• Fn+left/right arrow
• e-shutter key

SOFTWARE AND SECURITY

Software

• HP Quick Drop18
• HP Easy Clean28
• HP PC Hardware Diagnostics Windows
• Touchpoint Customizer for Commercial myHP
• HP Smart Support19
• HP Mac Address Manager
• HP Hotkey Support
• HP Support Assistant1
• HP Notifications
• HP Privacy Settings
• HP Power Manager
• Buy Microsoft Office (Sold separately)
• Bing search for IE11
• HP Noise Cancellation Software
• HP Performance Advisor5
• Native Miracast support2
  • 17- month Adobe® free trial offer29
• HP Z Light Space
• Data Science Stack

Manageability Features

• HP Connect for Microsoft Endpoint Manager21
• HP Image Assistant Gen5 (download)
• HP Manageability Integration Kit (download)8
• HP Client Management Script Library (download)
• HP Patch Assistant (download)22
• HP Driver Packs (download)30
• HP Cloud Recovery23
• HP Client Catalog (download)

Security Management

HP Wolf Security for Business24 includes:

• HP Sure Click25
• HP Sure Sense16
• HP Sure Run Gen526
• HP Sure Recover Gen510
• HP Sure Start Gen712
• HP Tamper Lock
• HP Sure Admin14
• HP Client Security Manager Gen715
• HP Device Access Manager
• HP Power On Authentication
• Master Boot Record security
• Pre-boot authentication
• Windows Defender
• MS Bitlocker Encryption
• Nano Security Lock Slot9

BIOS

• HP BIOSphere Gen63
• HP Secure Erase13
• Absolute Persistence Module4
• HP DriveLock & Automatic DriveLock
• BIOS Update via Network
• HP Wake on WLAN
• Fingerprint Sensor (select models)27
• Secured-Core PC Enable17
• Trusted Platform Module TPM 2.0 Embedded Security Chip

BIOS Version

• ISO/IEC 19678: 2015 (formerly NIST 800-147) compliant
• UEFI version: 2.7
• UEFI Class 3

Security

TPM

• Model: Infineon SLB9672
• Version: 2.0
• Revision: 1.38
• FIPS 140-2 Compliant: Yes with Convert TPM to 2.0 (FIPS 140-2) option

Fingerprint Sensor (Optional)

• Voltage: 3.0-3.6V
• Operating temperature: -20° – 85°C
• Imaging current: 31mA
• Wake on finger current: 40 uA
• Capture rate: 30ms/frame
• ESD Resistance: IEC 6100-4-2 4B (+/-15KV)
• Detection Matrix: 363 dpi, sensing area 8×8 mm

Security Features

• HP Fingerprint Sensor (optional)27

Smartcard Reader

• Model number: Alcor AU9560
• FIPS 201 Compliant: Yes

Is the BIOS on this notebook ISO/IEC 19678:2015 (formerly NIST 800-147) compliant?: Yes

• UEFI version: 2.7
• Class: Class 3

For more information on HP Client Security Software Suite, refer tohttp://www.hp.com/go/clientsecurity.

1. HP Support Assistant requires Windows and Internet access.
2. Miracast is a wireless technology your PC can use to project your screen to TVs, projectors, and streaming media players that also support Miracast. You can use Miracast to share what you’re doing on your PC and present a slide show. For more information: http://windows.microsoft.com/en-us/windows-8/project-wireless-screen-miracast.
3. HP BIOSphere Gen6 features may vary depending on the platform and configurations.
4. Absolute agent is shipped turned off, and will be activated when customers activate a purchased subscription. Subscriptions can be purchased for terms ranging multiple years. Service is limited, check with Absolute for availability outside the U.S. The Absolute Recovery Guarantee is a limited warranty. Certain conditions apply. For full details visit: http://www.absolute.com/company/legal/agreements/computrace-agreement. Data Delete is an optional service provided by Absolute Software. If utilized, the Recovery Guarantee is null and void. In order to use the Data Delete service, customers must first sign a Pre-Authorization Agreement and either obtain a PIN or purchase one or more RSA SecurID tokens from Absolute Software.
5. HP Performance Advisor Software – HP Performance Advisor is ready to help you get the most out of your HP Workstation from day one—and every day after. Learn more or download at: http://hp.com/PerformanceAdvisor
6. Microsoft Defender Opt-in and an internet connection are required for updates.
7. HP Manageability Integration Kit can be downloaded from http://www8.hp.com/us/en/ads/clientmanagement/overview.html
8. The Nano Security lock slot is Lock sold separately.
9. HP Sure Recover Gen5 is available on select HP PCs and requires Windows 10 and an open network connection. You must back up important files, data, photos, videos, etc. before using HP Sure Recover to avoid loss of data. Network-based recovery using Wi-Fi is only available on PCs with Intel Wi-Fi Module
10. HP Sure Recover with Embedded Reimaging Gen3 is an optional feature that must be configured at purchase with a base unit that has the On System Recovery (OSR) module. See product specifications for availability You must back up important files, data, photos, videos, etc. before use to avoid loss of data. HP Sure Recover with Embedded Reimaging (Gen1) does not support platforms with Intel® Optane™.
11. HP Sure Start Gen 7 is available on select HP PCs and workstations. See product specifications for availability.
12. Secure Erase – For the methods outlined in the National Institute of Standards and Technology Special Publication 800-88 “Clear” sanitation method. HP Secure Erase does not support platforms with Intel® Optane.
13. HP Sure Admin requires Windows 11, HP BIOS, HP Manageability Integration Kit from http://www.hp.com/go/clientmanagement and HP Sure Admin Local Access Authenticator smartphone app from the Android or Apple store.
14. HP Client Security Manager Gen7 requires Windows and is available on select HP PCs.
15. HP Sure Sense requires Windows 11 Pro or Enterprise and supports Microsoft Internet Explorer, Google Chrome™, and Chromium™. Supported attachments include Microsoft Office (Word, Excel, PowerPoint) and PDF files in read only mode when Microsoft Office or Adobe Acrobat are installed.
16. Secured-core PC requires an Intel® vPro® or AMD Ryzen™ Pro processor. Requires 8 GB or more system memory. Secured-core PC functionality can be enabled from the factory.
17. HP Quick Drop requires Internet access and Windows 10 or higher PC preinstalled with HP QuickDrop app and either an Android device (phone or tablet) running Android 7 or higher with the Android HP QuickDrop app, and /or an iOS device (phone or tablet) running iOS 12 or higher with the iOS HP QuickDrop app.
18. HP Smart Support automatically collects the telemetry necessary upon initial boot of the product to deliver device-level configuration data and health insights and is available preinstalled on select products, thru HP Factory Configuration Services; or it can be downloaded. For more information about how to enable HP Smart Support or for download, please visit http://www.hp.com/smart-support.
19. HP Connect for Microsoft Endpoint Manager is available from the Azure Market Place for HP Pro, Elite, Z and Point-of-Sale PCs managed with Microsoft Endpoint Manager. A subscription to Microsoft Endpoint Manager is required and sold separately. Network connection required.
20. HP Patch Assistant available on select HP PCs with the HP Manageability Kit that are managed through Microsoft System Center Configuration Manager. HP Manageability Integration Kit can be downloaded from http://www8.hp.com/us/en/ads/clientmanagement/overview.html.
21. HP Cloud Recovery is available for Z by HP, HP Elite and Pro desktops and laptops PCs with Intel® or AMD processors and requires an open, wired network connection. NOTE: You must back up important files, data, photos, videos, etc. before use to avoid loss of data. Detail please refer to: https://support.hp.com/us-en/document/c05115630.
22. HP Wolf Security for Business requires Windows 10 or higher, includes various HP security features and is available on HP Pro, Elite, RPOS and Workstation products. See product details for included security features.
23. HP Sure Click requires Windows 10 Pro or higher or Enterprise. See https://bit.ly/2PrLT6A_SureClick for complete details.
24. HP Sure Run Gen5 is available Windows 10 and higher on select based HP Pro, Elite and Workstation PCs with select Intel® or AMD processors
25. HP Fingerprint Reader is an optional feature that requires Windows 10 IoT and must be configured at purchase.
26. HP Easy Clean requires Windows 10 RS3 and higher and will disable the keyboard, touchscreen, and clickpad only. Ports are not disabled. See user guide for cleaning instructions.
27. Offer available worldwide (excluding China and embargoed countries or other countries identified as restricted by applicable law or regulation) to new and existing subscribers who are 18+. Click on the Adobe icon in the start menu to redeem a 1-month free trial membership for select Adobe software. The software is tied to the device and is not transferrable. If you would like to sign up for an auto-renewing subscription, you can provide your payment method at sign-up. By adding a payment method, your subscription will automatically renew at the then current rate on your renewal date until you cancel. If you cancel before the end of the one-month free trial, you won’t be charged. You can cancel your subscription anytime via your Adobe Account page or by contacting Customer Support. Please see current prices for Adobe Spark and the remaining Adobe products available in this offer. Offer not available to Education, OEM, or volume licensing customers. Subject to availability where the recipient resides. Additional terms and conditions may apply. VOID WHERE PROHIBITED OR RESTRICTED BY LAW. 30HP Driver Packs not preinstalled, however available for download at http://www.hp.com/go/clientmanagement.

POWER

Power Supply

• HP Slim Smart 150W External Right Angle AC Power Adapter3
• HP Slim Smart 200W External Right Angle AC Power Adapter
• HP Slim Smart 230W External Right Angle AC Power Adapter

Battery
HP XL-Long Life 95Whr Polymer Fast Charge 8 cell4

Battery Recharge Time
Supports battery HP Fast Charge: approximately 50% in 30 minutes2

Battery life1
Up to 15:30 hrs (UMA)

1. Battery life will vary depending on the product model, configuration, loaded applications, features, use, wireless functionality and power management settings. The maximum capacity of the battery will naturally decrease with time and usage. See MobileMark18 battery benchmark https://bapco.com/products/mobilemark-2018/ for additional details.
2. Recharge up to 50% within 30 minutes when the system is off or in standby mode. Power adapter with a minimum capacity\ of 65 watts is required. After charging has reached 50% capacity, charging will return to normal. Charging time may vary +/- 10% due to System tolerance.
3. 150W Power Adapter is not available with NVIDIA RTX™ Graphics
4. Actual battery Watt-hours (Wh) will vary from design capacity. Battery capacity will naturally decrease with shelf life, time, usage, environment, temperature, system configuration, loaded apps, features, power management settings and other factors.

ENVIRONMENTAL

• ENERGY STAR® certified3
• EPEAT® registered where applicable. EPEAT ® registration varies by country. See www.epeat.net for registration status by country.1
• IEEE 1680.1-2018 EPEAT®
• Low halogen2

1. Based on US EPEAT® registration according to IEEE 1680.1-2018 EPEAT®. EPEAT® status varies by country. Visit www.epeat.net for more information.
2. External power supplies, power cords, cables and peripherals are not low halogen. Service parts obtained after purchase may not be low halogen.
3. Configurations of the HP Zbook Fury G9 Mobile Workstation PC that are ENERGY STAR® certied are identified as HP Zbook Fury G9 Mobile Workstation PC ENERGY STAR on HP websites and on http://www.energystar.gov.

WEIGHTS & DIMENSIONS

Dimensions (w x d x h)

• 36.3 x 25.0 x 2.86 cm (WLAN)
• 14.29 x 9.52 x 1.12 in (WLAN)
• 36.3 x 25.0 x 2.77 cm (WWAN)
• 14.29 x 9.52 x 1.09 in (WWAN)

**Weights***

• Starting at 5.273 lbs (2.394 kg) (UMA)
• Weight varies by configuration and components.

Weight will vary by configuration. Does not include power adapter.

PORTS/SLOTS
MicroSD 7.0 supports next generation secure digital and is compatible to SD, SDHC, SDXC, SDUC media

Left side

• 1 power connector
• 2 Thunderbolt™ 4 with USB4™ Type-C® 40Gbps signaling rate (USB Power Delivery, DisplayPort™ 1.4, HP Sleep and Charge)
• 1 SD 7.0 Media Card Reader
• 1 Mini DisplayPort™ 1.4 with UMA and Discrete Graphics
• 1 HDMI 2.1 (depends on graphics selection)

Right side

• 1 headphone/microphone combo
• 1 RJ-45
• 1 SuperSpeed USB Type-A 5Gbps signaling rate (charging)
• 1 SuperSpeed USB Type-A 5Gbps signaling rate
• 1 nano security lock slot
• 1 smart card reader

SERVICE AND SUPPORT

HP Services offers 3-year and 1-year warranty and 90 day software limited warranty options depending on country. Batteries have a default one year limited warranty except for HP Long Life batteries which will follow the one or three year warranty of the platform. Refer to http://www.hp.com/support/batterywarranty/ for additional battery information. On-site service and extended coverage is also available. HP Care Pack Services are optional extended service contracts that go beyond the standard limited warranties. To choose the right level of service for your HP product, use the HP Care Pack Services Lookup Tool at: http://www.hp.com/go/cpc.

1. Sold separately or as an optional feature. Service levels and response times for HP Care Packs may vary depending on your geographic location. Service starts on date of hardware purchase. Restrictions and limitations apply. HP services are governed by the applicable HP terms and conditions of service provided or indicated to Customer at the time of purchase. Customer may have additional statutory rights according to applicable local laws, and such rights are not in any way affected by the HP terms and conditions of service or the HP Limited Warranty provided with your HP Product. Consult your local HP Customer Support Center for details.

FIPS Compliant|
---|---
·         Hard Drives| No
·         FIPS Compliant TPM (FIPS 140-2)| FIPS 140-2 Level 2 Certified
---|---
·         Smart Card Reader| FIPS 201
TPM Model| SLB9672
·         Version and Revision?| VU2.0 FW15.21
Is TPM embedded security chip FIPS 140-2 certified?| Yes
UEFI BIOS Version| 2.7
UEFI Class 2 or Class 3| Class 3
What is the model and make of our SmartCard Reader?| Alcor AU9560
UL Certification| Yes
FCC Compliance| Yes
Energy Star| ENERGY STAR® certified
EPEAT| EPEAT® GOLD
Weight| Starting at 5.46 lbs (non-touch)

SYSTEM UNIT

Stand-Alone Power Requirements (AC Power)

• Nominal Operating Voltage 19.5V
• Average Operating Power(idle)
  • System in hybrid mode
  • High-end 15.0W
  • Mid-range 8.8W
• Integrated graphics CPU < 55W
• Discrete Graphics
  • Nvidia RTX A1000/A2000< 35W
  • Nvidia RTX A3000/A4000/A5000< 80W
  • AMD Radeon Pro W6600M <80W
• Max Operating Power < 230W
• Temperature
  • Operating
  • 32° to 95° F (0° to 35° C), System performance may be reduced above
  • 32°C (89.6°F). No sustained direct exposure to sunlight.
  • Non-operating -4-140°F (-20 – 60°C)
• Relative Humidity
  • Operating 10% to 90%, non-condensing
  • Non-operating 5% to 95%; 38.7C (101.6F) maximum wet bulb tempera-ture; noncondensing
• Shock
  • Operating 40 G, 2 ms, half-sine
  • Non-operating 200 G, 2 ms, half-sine
• Random Vibration
  • Operating 0.75 grms
  • Non-operating 1.50 grms
• Maximum Altitude (unpressurized)
  • Operating 3048m (10,000ft)
  • Non-operating 12192m (40,000ft)
• emperature Derating with Altitude
  • Operating 1.8°F / 1000 ft (1°C / 304.8 m)
• Planned Industry Standard Certifications
  • Regulatory Model Number
  • HSN-152C
  • UL Yes
  • CSA Yes
  • FCC Compliance Yes
  • ENERGY STAR® Selected models
  • EPEAT® EPEAT Gold in United States
  • ICES Yes
  • Australia / NZ A-Tick Compliance Yes
  • CCC Yes
  • Japan VCCI Compliance Yes
  • KCC Yes
  • BSMI Yes
  • CE Marking Compliance Yes
  • MIL STD 810H Yes
  • BNCI or BELUS Yes
  • CIT Yes
  • EAC Yes
  • Saudi Arabian
  • Compliance (ICCP) Yes
  • SABS Yes

1. Configurations of the HP Zbook Fury G9 Mobile Workstation PC that are ENERGY STAR® certified are identified as HP Zbook Fury G9 Mobile Workstation PC ENERGY STAR on HP websites and on http://www.energystar.gov.
2. Based on US EPEAT® registration according to IEEE 1680.1-2018 EPEAT®. Status varies by country. Visit www.epeat.net for more information.

Technical Specifications

DISPLAYS

16 in WQUXGA (3840 x 2400) BrightView UWVA DCI-P3 NBZ2 400 eDP 1.4+PSR 100 bent OLED Panel

• Active Area (W x H, mm) 344.448 x 215.280 (typ)
• Dimensions (W x H, mm) 348.578 x 224.310 (max)
• Diagonal Size (inch) 16
• Thickness (body/PCB, mm) 1.242 / 3.143 (max)
• Weight (g) 230 (max)
• Interface eDP1.4
• Surface Treatment Bright View
• Contrast Ratio 100,000:1 (typ)
• Refresh Rate (Hz) 60 (typ)
• Brightness (nits) 400 (typ)
• P.P.I. 283
• Pixel Resolution
  • Pitch 3840 x 2400 (WQUXGA)
  • Format RGB
• Backlight OLED
• Color Gamut Coverage DCI-P3 100%
• Color Depth 8
• Viewing Angle UWVA 85/85/85/85
• Power Consumption (W, EBL@ 150nits max /200nits max) 6.10 (max) / 7.40 (max)
• Low Blue Light Yes
• Touch Enabled Yes
• Touch Point Supported 10-point multi-touch
• Pen Enabled No

All specifications represent the typical specifications provided by HP’s component manufacturers; actual performance may vary either higher or lower.

16 in WQUXGA DreamColor (3840 x 2400) Anti-Glare UWVA LED DCI-P3 NB2Y 500 eDP1.4 w/o PSR 100 120Hz bent LCD Panel

• Active Area (W x H, mm) 344.680 x 215.420 (typ)
• Dimensions (W x H, mm) 349.980 x 225.420 (max)
• Diagonal Size (inch) 16
• Thickness (body/PCB, mm) 2.3 / 4.1(max)
• Weight (g) 300 (max)
• Interface eDP1.4
• Surface Treatment Anti-Glare
• Contrast Ratio 1200:1 (typ)
• Refresh Rate (Hz) 120 (typ)
• Brightness (nits) 500 (typ)
• P.P.I. 283
• Pixel Resolution
  • Pitch 3840 x 2400 (WQUXGA)
  • Format RGB
• Backlight WLED
• Color Gamut Coverage DCI-P3 100%
• Delta E <2
• Color Depth 8
• Viewing Angle UWVA 89/89/89/89
• Power Consumption (W, EBL@ 150nits max /200nits max)
• 4.98 (max)/ 5.84 (max)
• Low Blue Light No
• Touch Enabled No
• Touch Point Supported No
• Pen Enabled No

All specifications represent the typical specifications provided by HP’s component manufacturers; actual performance may vary either higher or lower.

16.0 in WUXGA (1920 x 1200) Anti-Glare UWVA WLED+LBL sRGB NB2Y 1000 eDP 1.3+PSR 100 Privacy G4 Plus bent LCD Panel

• Active Area (W x H, mm) 344.680 x 215.420 (typ)

• Dimensions (W x H, mm) 349.980 x 225.420 (max)

• Diagonal Size (inch) 16

• Thickness (body/PCB, mm) 2.2 / 3.9 (max)

• Weight (g) 310 (max)

• Interface eDP 1.3
  Surface Treatment Anti-Glare

• Contrast Ratio 1500:1 (typ)

• Refresh Rate (Hz) 60 (typ)

• Brightness (nits) 1000 (typ)

• P.P.I. 142

• Pixel Resolution

  • Pitch 1920 x1200 (WUXGA)
  • Format RGB

• Backlight WLED

• Color Gamut Coverage sRGB 100%

• Color Depth 8

• Viewing Angle UWVA 85/85/85/85

• Power Consumption (W, EBL@ 150nits max /200nits max)

• N/A

• Low Blue Light Yes

• Touch Enabled No

• TouchPoint Supported No

• Pen Enabled No

All specifications represent the typical specifications provided by HP’s component manufacturers; actual performance may vary either higher or lower.

16 in WUXGA (1920 x 1200) Anti-Glare UWVA WLED+LBL sRGB NB2Y 400 eDP 1.4+PSR2 Low- Power 100 bent LCD Panel

• Active Area (W x H, mm) 344.678 x 215.424 (typ)
• Dimensions (W x H, mm) 350.680 x 226.470 (max)
• Diagonal Size (inch) 16
• Thickness (body/PCB, mm) 2.6 / 4.6 (max)
• Weight (g) 330 (max)
• Interface eDP1.4
• Surface Treatment Anti-Glare
• Contrast Ratio 1000:1 (typ)
• Refresh Rate (Hz) 60 (typ)
• Brightness (nits) 400 (typ)
• P.P.I. 142
• Pixel Resolution
  • Pitch 1920 x1200 (WUXGA)
  • Format RGB
• Backlight WLED
• Color Gamut Coverage sRGB 100%
• Color Depth 8
• Viewing Angle UWVA 89/89/89/89
• Power Consumption (W, EBL@ 150nits max /200nits max)
• 1.60 (max)/ 1.95 (max)
• Low Blue Light Yes
• Touch Enabled Yes
• Touch Point Supported 10-point multi-touch
• Pen Enabled No

All specifications represent the typical specifications provided by HP’s component manufacturers; actual performance may vary either higher or lower.

16 in WUXGA (1920 x 1200) Anti-Glare UWVA WLED+LBL sRGB NB2Y 400 eDP 1.4+PSR2 Low- Power 100 bent LCD Panel

• Active Area (W x H, mm) 344.678 x 215.424 (typ)
• Dimensions (W x H, mm) 350.680 x 226.470 (max)
• Diagonal Size (inch) 16
• Thickness (body/PCB, mm) 2.6 / 4.6 (max)
• Weight (g) 330 (max)
• Interface eDP1.4
• Surface Treatment Anti-Glare
• Contrast Ratio 1000:1 (typ)
• Refresh Rate (Hz) 60 (typ)
• Brightness (nits) 400 (typ)
• P.P.I. 142
• Pixel Resolution
  • Pitch 1920 x1200 (WUXGA)
  • Format RGB
• Backlight WLED
• Color Gamut Coverage sRGB 100%
• Color Depth 8
• Viewing Angle UWVA 89/89/89/89
• Power Consumption (W, EBL@ 150nits max /200nits max)
• 1.60 (max)/ 1.95 (max)
• Low Blue Light Yes
• Touch Enabled No
• TouchPoint Supported No
• Pen Enabled No

All specifications represent the typical specifications provided by HP’s component manufacturers; actual performance may vary either higher or lower.

Panel LCD 15.6 inch FHD (1920×1080) Anti-Glare WLED UWVA 45percent cg 250nits eDP 1.2 w/o PSR bent NWBZ

• Active Area (W x H, mm) 344.16 x 193.59 mm (typ.)
• Dimensions (W x H, mm) 350.96 x 205.54 mm (max)
• Diagonal Size (inch) 15.6 inch
• Thickness (body/PCB, mm) 3.0 mm/ 5.0 mm (w/PCB) (max)
• Weight (g) 370 g (max)
• Interface eDP 1.2 (2 lane)
• Surface Treatment Anti-Glare
• Contrast Ratio 600:1 (typ.)
• Refresh Rate (Hz) 60 Hz
• Brightness (nits) 250 nits
• P.P.I. 142
• Pixel Resolution
  • Pitch 1920 x 1080 (FHD)
  • Format RGB Stripe
• Backlight LED
• Color Gamut Coverage NTSC 45%
• Color Depth 6 bits (Hi FRC supportive w/ condition to enable)
• Viewing Angle UWVA 85/85/85/85
• Power Consumption (W, EBL@ 150nits max /200nits max)
• 2.62 (max) / 3.27 (max)
• Low Blue Light No
• Touch Enabled No
• TouchPoint Supported No
• Pen Enabled No

All specifications represent the typical specifications provided by HP’s component manufacturers; actual performance may vary either higher or lower.

STORAGE AND DRIVES

4TB PCIe-4×4 2280 NVMe Three Layer Cell double-sided M.2 Solid State Drive

• Form Factor M.2 2280
• Capacity 4TB
• NAND Type TLC
• Height 0.14 in (3.6 mm)
• Width 0.87 in (22 mm)
• Weight 15g
• Interface PCIe NVMe Gen4X4
• Performance
  • Maximum Sequential Read 6400 MB/s ±20%
  • Maximum Sequential Write 5000 MB/s ±20%
• Logical Blocks 8,001,594,720
• Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
• Features Pyrite 2.0; TRIM; L1.2

NOTE:
For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 35 GB (for Windows) is reserved for system recovery software.

SSD 2TB 2280 PCIe-4×4 NVMe Three Layer Cell

• Form Factor M.2 2280
• Capacity 2 TB
• NAND Type TLC
• Height 0.09 in (2.3 mm)
• Width 0.87 in (22 mm)
• Weight 0.02 lb (10 g)
• Interface PCIe NVMe Gen4X4
• Performance
  • Maximum Sequential Read 6400 MB/s ±20%
  • Maximum Sequential Write 5000 MB/s ±20%
• Logical Blocks 4,000,797,360
• Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
• Features Pyrite 2.0; TRIM; L1.2

NOTE:
For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 35 GB (for Windows) is reserved for system recovery software.

SSD 1TB 2280 PCIe-4×4 NVMe Three Layer Cell

• Form Factor M.2 2280
• Capacity 1TB
• NAND Type TLC
• Height 0.09 in (2.3 mm)
• Width 0.87 in (22 mm)
• Weight 0.02 lb (10 g)
• Interface PCIe NVMe Gen4X4
• Performance
  • Maximum Sequential Read 6400 MB/s ±20%
  • Maximum Sequential Write 5000 MB/s ±20%
• Logical Blocks 2,000,409,264
• Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
• Features Pyrite 2.0; TRIM; L1.2

NOTE:
For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 35 GB (for Windows) is reserved for system recovery software.

SSD 512GB 2280 PCIe- 4×4 NVMe Three Layer Cell

• Form Factor M.2 2280
• Capacity 512GB
• NAND Type TLC
• Height 0.09 in (2.3 mm)
• Width 0.87 in (22 mm)
• Weight 0.02 lb (10 g)
• Interface PCIe NVMe Gen4X4
• Performance
  • Maximum Sequential Read 6400 MB/s ±20%
  • Maximum Sequential Write 3500 MB/s ±20%
• Logical Blocks 1,000,215,215
• Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
• Features Pyrite 2.0; TRIM; L1.2

NOTE:
For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 35 GB (for Windows) is reserved for system recovery software.

SSD 256GB 2280 PCIe- 4×4 NVMe Three Layer Cell

• Form Factor M.2 2280
• Capacity 256GB
• NAND Type TLC
• Height 0.09 in (2.3 mm)
• Width 0.87 in (22 mm)
• Weight 0.02 lb (10 g)
• Interface PCIe NVMe Gen4X4
• Performance
  • Maximum Sequential Read 4000 MB/s ±20%
  • Maximum Sequential Write 2000 MB/s ±20%
• Logical Blocks 500,118,192
• Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
• Features Pyrite 2.0; TRIM; L1.2

NOTE:
For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 35 GB (for Windows) is reserved for system recovery software.

2TB PCIe-4×4 2280 NVME Self-Encrypted OPAL2 Three Layer Cell Solid State Drive

• Form Factor M.2 2280
• Capacity 2TB
• NAND Type TLC
• Height 0.09 in (2.3 mm)
• Width 0.87 in (22 mm)
• Weight 0.02 lb (10 g)
• Interface PCIe NVMe Gen4X4
• Performance
  • Maximum Sequential Read 6400 MB/s ±20%
  • Maximum Sequential Write 5000 MB/s ±20%
• Logical Blocks 4,000,797,360
• Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
• Features TCG Opal 2.0; TRIM; L1.2

NOTE:
For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 35 GB (for Windows) is reserved for system recovery software.

1TB PCIe-4×4 2280 NVME Self Encrypted OPAL2 Three Layer Cell Solid State Drive

• Form Factor M.2 2280
• Capacity 1TB
• NAND Type TLC
• Height 0.09 in (2.3 mm)
• Width 0.87 in (22 mm)
• Weight 0.02 lb (10 g)
• Interface PCIe NVMe Gen4X4
• Performance
  • Maximum Sequential Read 6400 MB/s ±20%
  • Maximum Sequential Write 5000 MB/s ±20%
• Logical Blocks 2,000,409,264
• Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
• Features TCG Opal 2.0; TRIM; L1.2

NOTE:
For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 35 GB (for Windows) is reserved for system recovery software

512GB PCIe-4×4 2280 NVME Self-Encrypted OPAL2 Three Layer Cell Solid State Drive

• Form Factor M.2 2280
• Capacity 512GB
• NAND Type TLC
• Height 0.09 in (2.3 mm)
• Width 0.87 in (22 mm)
• Weight 0.02 lb (10 g)
• Interface PCIe NVMe Gen4X4
• Performance
  • Maximum Sequential Read 6400 MB/s ±20%
  • Maximum Sequential Write 3500 MB/s ±20%
• Logical Blocks 1,000,215,215
• Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
• Features TCG Opal 2.0; TRIM; L1.2

NOTE:
For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 35 GB (for Windows) is reserved for system recovery software.

256GB PCIe-4×4 2280 NVME Self-Encrypted OPAL2 Three Layer Cell Solid State Drive

• Form Factor M.2 2280
• Capacity 256GB
• NAND Type TLC
• Height 0.09 in (2.3 mm)
• Width 0.87 in (22 mm)
• Weight 0.02 lb (10 g)
• Interface PCIe NVMe Gen4X4
• Performance
  • Maximum Sequential Read 4000 MB/s ±20%
  • Maximum Sequential Write 2000 MB/s ±20%
• Logical Blocks 500,118,192
• Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
• Features TCG Opal 2.0; TRIM; L1.2

NOTE:
For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 35 GB (for Windows) is reserved for system recovery software.

NETWORKING/COMMUNICATION

Intel AX211 Wi-Fi 6E +BT 5.3 M.2 160MHz CNVi WLAN vPro®

• Wireless LAN Standards
  • IEEE 802.11a
  • IEEE 802.11b
  • IEEE 802.11g
  • IEEE 802.11n
  • IEEE 802.11ac
  • IEEE 802.11ax
  • IEEE 802.11d
  • IEEE 802.11e
  • IEEE 802.11h
  • IEEE 802.11i
  • IEEE 802.11k
  • IEEE 802.11r
  • IEEE 802.11v
• Interoperability Wi-Fi certified
• Frequency Band 802.11b/g/n/ax
  • 2.402 – 2.482 GHz 802.11a/n/ac/ax
  • 4.9 – 4.95 GHz (Japan)
  • 5.15 – 5.25 GHz
  • 5.25 – 5.35 GHz
  • 5.47 – 5.725 GHz
  • 5.825 – 5.850 GHz
  • 5.955 – 6.415 GHz
  • 6.435 – 6.515 GHz
  • 6.535 – 6.875 GHz
  • 6.895 – 7.115 GHz
• Data Rates
  • 802.11b: 1, 2, 5.5, 11 Mbps
  • 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
  • 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
  • 802.11n: max 300Mbps
  • 802.11ac : 1733Mbps
  • 802.11ax : max 2.4Gbps
• Modulation Direct Sequence Spread Spectrum OFDM, BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM, 1024QAM
• Security1
  • IEEE and WiFi compliant 64 / 128 bit WEP encryption for a/b/g mode only
  • AES-CCMP: 128 bit in hardware
  • 802.1x authentication
  • WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
  • WPA2 certification
  • WPA3 certification
  • IEEE 802.11i
  • WAPI
• Network Architecture Models
  • Ad-hoc (Peer to Peer)
  • Infrastructure (Access Point Required)
• Roaming IEEE 802.11 compliant roaming between access points
• Output Power2
  • 802.11b : +17dBm minimum
  • 802.11g : +16dBm minimum
  • 802.11a : +17dBm minimum
  • 802.11n HT20(2.4GHz) : +14dBm minimum
  • 802.11n HT40(2.4GHz) : +13dBm minimum
  • 802.11n HT20(5GHz) : +14dBm minimum
  • 802.11n HT40(5GHz) : +13dBm minimum
  • 802.11ac VHT80(5GHz) : +10dBm minimum
  • 802.11ac VHT160(5GHz) : +10dBm minimum
  • 802.11ax HE40(2.4GHz) : +12dBm minimum
  • 802.11ax HE80(5GHz) : +10dBm minimum
  • 802.11ax HE160(5GHz) : +10dBm minimum
• Power Consumption
  • Transmit mode 2.0 W
  • Receive mode 1.6 W
  • Idle mode (PSP) 180 mW (WLAN Associated)
  • Idle mode 50 mW (WLAN unassociated)
  • Connected Standby 10mW
  • Radio disabled 8 mW
• Power Management
  • ACPI and PCI Express compliant power management
  • 802.11 compliant power saving mode
• Receiver Sensitivity3
  • 802.11b, 1Mbps : -93.5dBm maximum
  • 802.11b, 11Mbps : -84dBm maximum
  • 802.11a/g, 6Mbps : -86dBm maximum
  • 802.11a/g, 54Mbps : -72dBm maximum
  • 802.11n, MCS07 : -67dBm maximum
  • 802.11n, MCS15 : -64dBm maximum
  • 802.11ac, MCS0(VHT80) : -84dBm maximum
  • 802.11ac, MCS9(VHT80) : -59dBm maximum
  • 802.11ac, MCS9(VHT160) : -58.5dBm maximum
  • 802.11ax, MCS11(HE40): -57dBm maximum
  • 802.11ax, MCS11(HE80): -54dBm maximum
  • 802.11ax, MCS11(HE160): -53.5dBm maximum
• Antenna Type
  • High efficiency antenna with spatial diversity, mounted in the display enclosure
  • Two embedded dual band 2.4/5 GHz antennas are provided to the card to support WLAN MIMO communications and Bluetooth communications
• Form Factor PCI-Express M.2 MiniCard
• Dimensions

1. Type 2230 : 2.3 x 22.0 x 30.0 mm
2. Type 1216: 1.67 x 12.0 x 16.0 mm

• Weight
  1. Type 2230 : 2.8g
  2. Type 1216: 1.3g
• Operating Voltage 3.3v +/- 9%
• Temperature
  • Operating Non-operating
  • 14° to 158° F (-10° to 70° C)
  • -40° to 176° F (-40° to 80° C)
• Humidity
  • Operating Non-operating
  • 10% to 90% (non-condensing)
  • 5% to 95% (non-condensing)
• Altitude
  • Operating Nonoperating
  • 0 to 10,000 ft (3,048 m)
  • 0 to 50,000 ft (15,240 m)
• LED Activity LED Amber – Radio Off; LED Off – Radio ON

HP Integrated Module with Bluetooth 4.0/4.1/4.2/5.0/5.1/5.2/5.3 Wireless Technology

• Frequency Band 2402 to 2480 MHz
• Number of Available Channels
  • Legacy: 0~79 (1 MHz/CH)
  • BLE: 0~39 (2 MHz/CH)
• Data Rates and Throughput
  • Legacy: 3 Mbps data rate; throughput up to 2.17 Mbps
  • BLE: 1 Mbps data rate; throughput up to 0.2 Mbps
  • Legacy: Synchronous Connection Oriented links up to 3, 64 kbps, voice channels
  • Legacy: Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric (3-DH5) or 864 kbps symmetric (3-EV5)
• Transmit Power The Bluetooth component shall operate as a Class II Bluetooth device with a maximum transmit power of + 9.5 dBm for BR and EDR.
• Power Consumption
  • Peak (Tx): 330 mW
  • Peak (Rx): 230 mW
  • Selective Suspend: 17 mW
• Bluetooth Software Supported Link Topology Microsoft Windows Bluetooth Software
• Power Management Microsoft Windows ACPI, and USB Bus Support
• Certifications FCC (47 CFR) Part 15C, Section 15.247 & 15.249
• Power Management Certifications
  • ETS 300 328, ETS 300 826
  • Low Voltage Directive IEC950
  • UL, CSA, and CE Mark
• Bluetooth Profiles Supported
  • BT4.1-ESR 5/6/7 Compliance
  • LE Link Layer Ping
  • LE Dual Mode
  • LE Link Layer
  • LE Low Duty Cycle Directed Advertising
  • LE L2CAP Connection Oriented Channels
  • Train Nudging & Interlaced Scan
  • BT4.2 ESR08 Compliance
  • LE Secure Connection- Basic/Full
  • LE Privacy 1.2 –Link Layer Privacy
  • LE Privacy 1.2 –Extended Scanner Filter Policies
  • LE Data Packet Length Extension
  • FAX Profile (FAX)
  • Basic Imaging Profile (BIP)2
  • Headset Profile (HSP)
  • Hands Free Profile (HFP)
  • Advanced Audio Distribution Profile (A2DP)
  • BT5.2
  • ESR9/10 Compliance
  • LE Advertisement Extensions
  • Channel Selection Algo
  • Limited High Duty Cycle Non-Connectable Advertising
  • 2Mbps LE
  • LE Long Range

Wi-Fi 6E requires a Wi-Fi 6E router, sold separately, and Windows 11 to function in the 6GHz band. Availability of public wireless access points limited. Wi-Fi 6E is backwards compatible with prior 802.11 specs. And available in countries where Wi-Fi 6E is supported. Not supported with Windows 10.

Intel AX211 Wi-Fi 6E +BT 5.3 M.2 160MHz CNVi WLAN non-vPro®

• Wireless LAN Standards
  • IEEE 802.11a
  • IEEE 802.11b
  • IEEE 802.11g
  • IEEE 802.11n
  • IEEE 802.11ac
  • IEEE 802.11ax
  • IEEE 802.11d
  • IEEE 802.11e
  • IEEE 802.11h
  • IEEE 802.11i
  • IEEE 802.11k
  • IEEE 802.11r
  • IEEE 802.11v
• Interoperability Wi-Fi certified
• Frequency Band
  • 802.11b/g/n/ax
  • 2.402 – 2.482 GHz 802.11a/n/ac/ax
  • 4.9 – 4.95 GHz (Japan)
  • 5.15 – 5.25 GHz
  • 5.25 – 5.35 GHz
  • 5.47 – 5.725 GHz
  • 5.825 – 5.850 GHz
  • 5.955 – 6.415 GHz
  • 6.435 – 6.515 GHz
  • 6.535 – 6.875 GHz
  • 6.895 – 7.115 GHz
• Data Rates
  • 802.11b: 1, 2, 5.5, 11 Mbps
  • 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
  • 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
  • 802.11n: max 300Mbps
  • 802.11ac : 1733Mbps
  • 802.11ax : max 2.4Gbps
• Modulation
  • Direct Sequence Spread Spectrum
  • OFDM, BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM, 1024QAM
• Security1
  • IEEE and WiFi compliant 64 / 128 bit WEP encryption for a/b/g mode only
  • AES-CCMP: 128 bit in hardware
  • 802.1x authentication
  • WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
  • WPA2 certification
  • WPA3 certification
  • IEEE 802.11i
  • WAPI
• Network Architecture Models
  • Ad-hoc (Peer to Peer)
  • Infrastructure (Access Point Required)
• Roaming IEEE 802.11 compliant roaming between access points
• Output Power2
  • 802.11b: +17dBm minimum
  • 802.11g: +16dBm minimum
  • 802.11a: +17dBm minimum
  • 802.11n HT20(2.4GHz) : +14dBm minimum
  • 802.11n HT40(2.4GHz) : +13dBm minimum
  • 802.11n HT20(5GHz) : +14dBm minimum
  • 802.11n HT40(5GHz) : +13dBm minimum
  • 802.11ac VHT80(5GHz) : +10dBm minimum
  • 802.11ac VHT160(5GHz) : +10dBm minimum
  • 802.11ax HE40(2.4GHz) : +12dBm minimum
  • 802.11ax HE80(5GHz) : +10dBm minimum
  • 802.11ax HE160(5GHz) : +10dBm minimum
• Power Consumption
  • Transmit mode 2.0 W
  • Receive mode 1.6 W
  • Idle mode (PSP) 180 mW (WLAN Associated)
  • Idle mode 50 mW (WLAN unassociated)
  • Connected Standby 10mW
  • Radio disabled 8 mW
• Power Management
  • ACPI and PCI Express compliant power management
  • 802.11 compliant power saving mode
• Receiver Sensitivity3
  • 802.11b, 1Mbps : -93.5dBm maximum
  • 802.11b, 11Mbps : -84dBm maximum
  • 802.11a/g, 6Mbps : -86dBm maximum
  • 802.11a/g, 54Mbps : -72dBm maximum
  • 802.11n, MCS07 : -67dBm maximum
  • 802.11n, MCS15 : -64dBm maximum
  • 802.11ac, MCS0(VHT80) : -84dBm maximum
  • 802.11ac, MCS9(VHT80) : -59dBm maximum
  • 802.11ac, MCS9(VHT160) : -58.5dBm maximum
  • 802.11ax, MCS11(HE40): -57dBm maximum
  • 02.11ax, MCS11(HE80): -54dBm maximum
  • 802.11ax, MCS11(HE160): -53.5dBm maximum
• Antenna Type
  • High efficiency antenna with spatial diversity, mounted in the display enclosure
  • Two embedded dual band 2.4/5 GHz antennas are provided to the card to support WLAN MIMO communications and Bluetooth communications
• Form Factor PCI-Express M.2 MiniCard
• Dimensions

1. Type 2230 : 2.3 x 22.0 x 30.0 mm
2. Type 1216: 1.67 x 12.0 x 16.0 mm

• Weight

1. Type 2230 : 2.8g
2. Type 1216: 1.3g

• Operating Voltage 3.3v +/- 9%
• Temperature
  • Operating Non-operating
  • 14° to 158° F (-10° to 70° C)
  • -40° to 176° F (-40° to 80° C)
• Humidity Operating Non-operating
  • 10% to 90% (non-condensing)
  • 5% to 95% (non-condensing)
• Altitude Operating Nonoperating
  • 0 to 10,000 ft (3,048 m)
  • 0 to 50,000 ft (15,240 m)
• LED Activity LED Amber – Radio OFF; LED White – Radio ON

HP Integrated Module with Bluetooth 4.0/4.1/4.2/5.0/5.1/5.2/5.3 Wireless Technology

• Frequency Band 2402 to 2480 MHz
• Number of Available Channels
  • Legacy: 0~79 (1 MHz/CH)
  • BLE: 0~39 (2 MHz/CH)
• Data Rates and Throughput
  • Legacy: 3 Mbps data rate; throughput up to 2.17 Mbps
  • BLE: 1 Mbps data rate; throughput up to 0.2 Mbps
  • Legacy: Synchronous Connection Oriented links up to 3, 64 kbps, voice channels
  • Legacy: Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric (3-DH5) or 864 kbps symmetric (3-EV5)
• Transmit Power The Bluetooth component shall operate as a Class II Bluetooth device with a maximum transmit power of + 9.5 dBm for BR and EDR.
• Power Consumption
  • Peak (Tx): 330 mW
  • Peak (Rx): 230 mW
  • Selective Suspend: 17 mW
• Power Consumption Peak (Tx): 330 mW Peak (Rx): 230 mW Selective Suspend: 17 mW
• Power Management Microsoft Windows ACPI, and USB Bus Support
• Certifications FCC (47 CFR) Part 15C, Section 15.247 & 15.249
• Power Management Certifications ETS 300 328, ETS 300 826 Low Voltage Directive IEC950 UL, CSA, and CE Mark
• Bluetooth Profiles Supported
  • BT4.1-ESR 5/6/7 Compliance
  • LE Link Layer Ping
  • LE Dual Mode
  • LE Link Layer
  • LE Low Duty Cycle Directed Advertising
  • LE L2CAP Connection-Oriented Channels
  • Train Nudging & Interlaced Scan
  • BT4.2 ESR08 Compliance
  • LE Secure Connection- Basic/Full
  • LE Privacy 1.2 –Link Layer Privacy
  • LE Privacy 1.2 –Extended Scanner Filter Policies
  • LE Data Packet Length Extension
  • FAX Profile (FAX)
  • Basic Imaging Profile (BIP)2
  • Headset Profile (HSP)
  • Hands Free Profile (HFP)
  • Advanced Audio Distribution Profile (A2DP)
  • BT5.2
  • ESR9/10 Compliance
  • LE Advertisement Extensions
  • Channel Selection Algo
  • Limited High Duty Cycle Non-Connectable Advertising
  • 2Mbps LE
  • LE Long Range
• Security & Manageability Intel® vPro® support with appropriate Intel® chipset components

Wi-Fi 6E requires a Wi-Fi 6E router, sold separately, and Windows 11 to function in the 6GHz band. Availability of public wireless access points limited. Wi-Fi 6E is backwards compatible with prior 802.11 specs. And available in countries where Wi-Fi 6E is supported. Not supported with Windows 10.

• Intel® 5G Solution 5000 Technology/Operating bands
  WCDMA/HSPA+ operating bands:

  • Band 1: 1920 to 1980 MHz (UL), 2110 to 2170 MHz (DL)

  • Band 2: 1850 to 1910 MHz (UL), 1930 to 1990 MHz (DL)

  • Band 4: 1710 to 1755 MHz (UL), 2110 to 2155 MHz (DL)

  • Band 5: 824 to 849 MHz (UL), 869 to 894 MHz (DL)

  • Band 8: 880 to 915 MHz (UL), 925 to 960 MHz (DL)
    LTE FDD/TDD operating bands:

  • Band 1: 1920 to 1980 MHz (UL), 2110 to 2170 MHz (DL)

  • Band 2: 1850 to 1910 MHz (UL), 1930 to 1990 MHz (DL)

  • Band 3: 1710 to 1785 MHz (UL), 1805 to 1880 MHz (DL)

  • Band 4: 1710 to 1755 MHz (UL), 2110 to 2155 MHz (DL)

  • Band 5: 824 to 849 MHz (UL), 869 to 894 MHz (DL)

  • Band 7: 2500 to 2570 MHz (UL), 2620 to 2690 MHz (DL)

  • Band 8: 880 to 915 MHz (UL), 925 to 960 MHz (DL)

  • Band 12: 699 to 716 MHz (UL), 729 to 746 MHz (DL)

  • Band 13: 777 to 787 MHz (UL), 746 to 756 MHz (DL)

  • Band 14: 788 to 798 MHz (UL), 758 to 768 MHz (DL)

  • Band 17: 704 to 716 MHz (UL), 734 to 746 MHz (DL)

  • Band 18: 815 to 830 MHz (UL), 860 to 875 MHz (DL)

  • Band 19: 830 to 845 MHz (UL), 875 to 890 MHz (DL)

  • Band 20: 832 to 862 MHz (UL), 791 to 821 MHz (DL)

  • Band 25: 1850 to 1915 MHz (UL), 1930 to 1995 MHz (DL)

  • Band 26: 814 to 849 MHz (UL), 859 to 894 MHz (DL)

  • Band 28: 703 to 748 MHz (UL), 758 to 803 MHz (DL)

  • Band 29: 717 to 728 MHz (DL)

  • Band 30: 2305 to 2315 MHz (UL) 2350 to 2360 MHz (DL)

  • Band 32: 1452 to 1496 MHz (DL)

  • Band 34: 2010 to 2025 MHz (UL/DL)

  • Band 38: 2570 to 2620 MHz (UL/DL)

  • Band 39: 1880 to 1920 MHz (UL/DL)

  • Band 40: 2300 to 2400 MHz (UL/DL)

  • Band 41: 2496 to 2690 MHz (UL/DL)

  • Band 42: 3400 to 3600 MHZ (UL/DL)

  • Band 43: 3400 to 3800 MHZ (UL/DL)

  • Band 46: 5150 to 5925 MHZ (DL)

  • Band 48: 3550 to 3700 MHZ (UL/DL)

  • Band 66: 1710 to 1800 MHz (UL), 2110 to 2200 MHz (DL)

  • Band 71: 663 to 698 MHz (UL), 617 to 652 MHz (DL) 5GNR Sub 6GHZ

  • n1: 1920 to 1980 MHz (UL), 2110 to 2170 MHz (DL)

  • n2: 1850 to 1910 MHz (UL), 1930 to 1990 MHz (DL)

  • n3: 1710 to 1785 MHz (UL), 1805 to 1880 MHz (DL)

  • n5: 824 to 849 MHz (UL), 869 to 894 MHz (DL)

  • n7: 2500 to 2570 MHz (UL), 2620 to 2690 MHz (DL)

  • n8: 880 to 915 MHz (UL), 925 to 960 MHz (DL)

  • n20: 832 to 862 MHz (UL), 791 to 821 MHz (DL)

  • n25: 1850 to 1915 MHz (UL), 1930 to 1995 MHz (DL)

  • n28: 703 to 748 MHz (UL), 758 to 803 MHz (DL)

  • n38: 2570 to 2620 MHz (UL/DL)

  • n40: 2300 to 2400 MHz (UL/DL)

  • n41: 2496 to 2690 MHz (UL/DL)

  • n48: 3550 to 3700 MHZ (UL/DL)

  • n66: 1710 to 1800 MHz (UL), 2110 to 2200 MHz (DL)

  • n71: 663 to 698 MHz (UL), 617 to 652 MHz (DL)

  • n77: 3300 to 4200 MHz (UL/DL)

  • n78: 3300 to 3800 MHz (UL/DL)

  • n79: 4400 to 5000 MHz (UL/DL)

• Wireless protocol standards

  • 5GNR Air Interface
  • 3GPP Rel15 5G NR sub-6 LTE Rel14
  • 20 layers and 2 Gbps downlink (DL) throughput – 4 × 4 MIMO across 5x CA
  • 200 Mbps/uplink (UL) throughput – 40 MHz ULCA and 256 QAM
  • WCDMA R99, 3GPP Release 5, 6, 7 and 8 UMTS Specification

• GPS Standalone, A-GPS (MS-A, MS-B)

• GPS Bands

  • GPS: L1 (1575.42MHz)
  • GLONASS: L1 (1602MHz)
  • BeidouB1(1561.098MHz)
  • Galileo E1 (1575.42)
  • QZSS(1575.42 MHz)

• Maximum Data Rates

  • SA 5G/NR sub-6 Peak: DL4.67Gbps/ UL 1.25Gbps
  • 5G NSA sub 6G : DL: 3.8 Gbps/UL 700Mbps
  • LTE: ue-CategoryDL 19, (DL : 1.6 Gbps ) ue-CategoryUL 13 , (UL: 150Mbps)
  • DC-HSPA+: 42 Mbps (Download), 11.5 Mbps (Upload)

• Maximum Output Power

  • LTE: 23 dBm in all band except B41
  • LTE B41 HPUE = 26dBm
  • NR: 23 dBm in all band except n41, n77, n78 and n79
  • LTE n41, n77, n78 and n79 HPUE = 26dBm
  • HSPA+: 23.5 dBm

• Maximum Power Consumption

  • 5G Sub 6: 2500 mA
  • LTE: 1,300 mA (peak) ; 1100 mA (average)
  • HSPA+: 1,100 mA (peak) ; 800 mA (average)

• Form Factor M.2, 3042-S3 Key B

• Weight 8 g

• Dimensions (Length x Width x Thickness) 52 mm × 30 mm × 2.6 mm

Intel® 5G module is optional and must be configured at the factory. Module designed for 5G NR NSA (non-standalone) networks as carriers deploy Evolved- Universal Terrestrial Radio Access New Radio Dual Connectivity (ENDC) with both 100Mhz of 5G NR and LTE channel bandwidth, using 256QAM 4×4 as defined by 3GPP. Module requires activation and separately purchased service contract. Check with service provider for coverage and availability in your area. Data connection, upload and download speeds will vary due to network, location, environment, network conditions, and other factors. Backwards compatible to 4G LTE and 3G HSPA technologies. 5G module planned to be available in select platforms and select countries, where carrier supported.

Intel® XMM™ 7560 R+ LTE-Advanced Pro

• Technology/Operating bands
  • FDD LTE: 2100 (Band 1), 1900 (Band 2), 1800 (Band 3), 1700/2100 (Band 4), 850 (Band 5), 2600 (Band 7), 900 (Band 8), 700 (Band 12 lower), 700 (Band 13 upper), 700 (Band 14 upper), 700 (Band 17 lower), 850 (Band 18 lower), 850 (Band 19 upper), 800 (Band 20), 1900 (Band 25), 850 (Band 26), 700 (Band 28), 700 (Band 29 RX only), 2300 (Band 30), 1700/2100 (Band 66), 600 (band 71).
  • TDD LTE: 2100 (Band 34), 2600 (Band 38), 1900 (Band 39), 2400 (Band 40), 2500 (Band 41), 3500 (Band 42), 3700 (Band 43), 3700 (band 48), 5200 (Band 46 RX only) MHz;
  • HSPA+: 2100 (Band 1), 1900 (Band 2), 1700/2100 (Band 4), 850 (Band 5), 900 (Band 8) MHz
• Wireless protocol standards
  • 3GPP Release 12 LTE Specification DL-CAT.16, DL 100MHz BW throughput up to 978Mbps; UL-CAT.13 40MHz throughput up to 150Mbps WCDMA R99, 3GPP Release 5, 6, 7 and 8 UMTS Specification
• GPS Standalone GPS/Beidou/Glonass, A-GPS (MS-A, MS-B)
• GPS Bands 1575.42 MHz ± 1.023 MHz, GLONASS 1596-1607MHz, Beidou 1561.098 MHz
• Maximum Data Rates
  • LTE: 978 Mbps (Download), 150 Mbps (Upload)
  • DC-HSPA+: 42 Mbps (Download), 5.76 Mbps (Upload)
  • HSPA+: 21Mbps (Download), 5.76 Mbps (Upload)
• Maximum Output Power
  • LTE: 23 dBm in all band except B41
  • LTE B41 HPUE = 26dBm
  • HSPA+: 23.5 dBm
• Maximum Power Consumption
  • LTE: 1,200 mA (peak) ; 900 mA (average)
  • HSPA+: 1,100 mA (peak) ; 800 mA (average)
• Form Factor M.2, 3042-S3 Key B
• Weight 6 g
• Dimensions (Length x Width x Thickness) 42 x 30 x 2.3 mm

4G LTE module is optional, must be configured at the factory, requires activation and separately purchased service contract. Check with service provider for coverage and availability in your area. Connection, upload and download speeds will vary due to network, location, environment, network conditions, and other factors. 4G LTE not available on all products, in all regions.

NFC Mirage module (NXP NPC300 I2C 10mmx17mm)

• Dimensions (L x W x H) Module 25 mm by 10 mm by 2.0 mm
• Chipset NPC300
• System interface I2C
• NFC RF standards
  • ISO/IEC 14443 A
  • ISO/IEC 14443 B
  • ISO/IEC 15693
  • ISO/IEC 18092
  • ECMA-340 NFCIP-1 Target and Initiator
  • ECMA-320 NFCIP-2
  • NFC Forum Support Tag Type 1, Type 2, Type3 and Type 4, NFCIP-1 and NFCIP-2
• Reader (PCD-VCD) Mode(1)
  • ISO/IEC 14443 A
  • ISO/IEC 14443 B
  • ISO/IEC 15693
  • MIFARE 1K
  • MIFARE 4K
  • MIFARE DESFire
  • FeliCa
  • Jewel and Topaz cards
• Card Emulation (PICCVICC) Mode(1)
  • ISO/IEC 14443 A
  • ISO/IEC 14443 B and B’
  • MIFARE
  • FeliCa
• Frequency 13.56 MHz
• NFC Modes Supported Reader/Writer, Peer-to-Peer
• Raw RF Data Rates 106, 212, 424, 848 kbps
• Operating temperature 0°C to 70°C
• Storage temperature -20°C to 125°C
• Humidity
  • 10-90% operating
  • 5-95% non-operating
• Supply Operating voltage 4.35 to 5.25 Volts
• I/O Voltage 1.8V or 3.3V
• Power Consumption
  • Booster enable, VBAT= 3.3V, VCC_BOOST = 5V) Mode Power Consumption, Typical Polling 7.3 mA
  • Detected Test
  • Tag Type 1
  • Total 283.8 mA
  • Net Module 236.8 mA
  • Detected Test
  • Tag Type 2
  • Total 288.8 mA
  • Net Module 241.8 mA
  • Detected Test
  • Tag Type 3
  • Total 287.7 mA
  • Net Module 240.7 mA
  • Detected Test
  • Tag Type 4
  • Total 282.3 mA
  • Net Module 235.3 mA
• Antenna Antenna connector, 0.5mm pitch, 7 connector FPC. Antenna matching is external to module.
• Intel® I219-LM 1 Gigabit Network Connection LOM (vPro®)
  • Connector RJ-45
  • System Interface PCI(Intel proprietary) + SMBus
  • Data rates supported
  • 10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-14)
  • 100 Mbit/s operation (100BASE-TX; IEEE 802.3u; IEEE 802.3 clauses 21-30)
  • 1000 Mbit/s operation (1000BASE-T; IEEE 802.3ab; IEEE 8023 clauses 40)
  • Auto-Negotiation (Automatic Speed Selection)
  • Full Duplex Operation at all Speeds, Half Duplex operation at 10 and 100 Mbit/s
  • IEEE Compliance
  • IEEE 802.1p QoS (Quality of Service) Support
  • IEEE 802.1q VLAN support
  • IEEE 802.3x Flow Control (IEEE 802.3 clauses 31-32; configurable)
  • IEEE 802.3az EEE (Energy Efficient Ethernet)
  • Performance
  • TCP/IP/UDP Checksum Offload (configurable)
  • Protocol Offload (ARP & NS)
  • Large send offload and Giant send offload
  • Receiving Side Scaling(Hash Mode only)
  • Jumbo Frame 9K
  • Power consumption
  • Cable Disconnection: 25mW
  • 100Mbps Full Run: 450mW
  • 1000bp Full Run: 1000mW
  • WoL Enable(S3/S4/S5): 50mW
  • WoL Disable(S3/S4/S5): 25mW
  • Power Management
  • ACPI compliant – multiple power modes
  • Situation-sensitive features reduce power consumption
  • Advanced link down power saving for reducing link down power consumption
  • Management Interface Auto MDI/MDIX Crossover cable detection
  • IT Manageability
  • Wake-on-LAN from modern standby or sleep state (Magic Packet and
  • Microsoft Wake-Up Frame); Wake-on-LAN from off (Magic Packet only)
  • PXE 2.1 Remote Boot
  • Statistics Gathering (SNMP MIB II, Ethernet-like MIB, Ethernet MIB (802.3x, clause 30))
  • Comprehensive diagnostic and configuration software suite
  • Virtual Cable Doctor for Ethernet cable status
  • Security & Manageability Intel® vPro® support with appropriate Intel® chipset components
• Intel® I219v 1 Gigabit Network Connection LOM (non-vPro®)
  • Connector RJ-45
  • System Interface PCI(Intel proprietary) + SMBus
  • Data rates supported
  1. 10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-14)
  2. 100 Mbit/s operation (100BASE-TX; IEEE 802.3u; IEEE 802.3 clauses 21- 30)
  3. 1000 Mbit/s operation (1000BASE-T; IEEE 802.3ab; IEEE 802.3 clauses 40)
  4. Auto-Negotiation (Automatic Speed Selection) Full Duplex Operation at all Speeds, Half Duplex operation at 10, 100 & 1000 Mbit/s
  • IEEE Compliance
  • IEEE 802.1p QoS (Quality of Service) Support
  • IEEE 802.1q VLAN support
  • IEEE 802.3x Flow Control (IEEE 802.3 clauses 31-32; configurable)
  • IEEE 802.3az EEE (Energy Efficient Ethernet)
  • IEEE 802.3i 10BASE-T
  • IEEE 802.3u 100BASE-TX
  • IEEE 802.3ab 1000BAE-T
  • IEEE 802.3bz 2.5GBASE-T
  • Performance
  • TCP/IP/UDP Checksum Offload (configurable)
  • Protocol Offload (ARP & NS)
  • Large send offload and Giant send offload
  • Receiving Side Scaling(Hash Mode only)
  • Jumbo Frame 9K
  • Power consumption
  • Cable Disconnection: 25mW
  • 100Mbps Full Run: 450mW
  • 1000bp Full Run: 1000mW
  • WoL Enable(S3/S4/S5): 50mW
  • WoL Disable(S3/S4/S5): 25mW
  • Power Management
  • ACPI compliant – multiple power modes
  • Situation-sensitive features reduce power consumption
  • Advanced link-down power saving for reducing link-down power consumption
  • Management Interface Auto MDI/MDIX Crossover cable detection
  • IT Manageability
  • Wake-on-LAN from modern standby or sleep state (Magic Packet and
  • Microsoft Wake-Up Frame); Wake-on-LAN from off (Magic Packet only)
  • PXE 2.1 Remote Boot
  • Statistics Gathering (SNMP MIB II, Ethernet-like MIB, Ethernet MIB (802.3x, clause 30))
  • Comprehensive diagnostic and configuration software suite
  • Virtual Cable Doctor for Ethernet cable status
  • Security & Manageability Intel® non-vPro® support with appropriate Intel® chipset components

AUDIO

• HD Stereo Codec Realtek ALC3315
• Audio I/O Ports Headset: CTIA only and Headphone-out
• Internal Speaker Amplifier Cirrus Logic High-Efficiency Boosted Class D Amplifier
• Multi-streaming Capable Playback multi-streaming can be enabled in the audio control panel to allow independent audio. Following MSFT Behaviour
• Sampling
  • DAC: 44.1k/48kHz
  • ADC: 48kHz
• Wavetable Syntheses Analog Audio Support 3.5mm Headset: CTIA only and Headphone-out

• of Channels on Line- Out Internal Speaker Yes

FINGERPRINT SENSOR

• Sensor vendor Synaptics FS7604
• Sensor type Capacitive
• DPI resolution 363DPI
• Scan area 7.4x6mm sensor area
• False Rejection Rate <1%
• False Acceptance Rate 1:50K FAR
• Mobile Voltage Operation Mobile Voltage Operation: 3.0V to 3.6V
• Operating Temperature Operating Temperature: 0~60°C
• Current Consumption Image Current Consumption Image : 100mA Max
• Low Latency Wait For Finger Low Latency Wait For Finger: 260 uA
• Capture Rate Capture Rate: <30msec per image
• ESD Resistance ESD Resistance: IEC 61000-4-2 4B (+/-15KV)
• Detection Matrix Detection Matrix: 363 dpi / 7.4x6mm sensor area

POWER

HP 150W Slim 4.5 mm PFC Right Angle Smart (3-pin) AC Power Adapter

• Dimensions 138x66x22mm
• Weight unit: 325g +/- 10g
• Input
  • Input Efficiency 88% at 115 Vac and 89% at 230Vac
  • Input frequency range 47 ~ 63 Hz
  • Input AC current 2.7 A at 90 Vac and Maximum Load
• Output
  • Output power 150W
  • DC output 19.5V
  • Hold-up time 5ms at 115 Vac input
  • Output current limit <16.0A
  • DC Plug 4.5mm Barrel Type
• Connector C6
• Environmental Design
  • Operating temperature 32° to 95° F (0° to 35° C)
  • Non-operating (storage) temperature -4° to 185° F (-20° to 85° C)
  • Altitude 0 to 16,400 ft (0 to 5000m)
  • Humidity 5% to 95%
  • Storage Humidity 5% to 95%
• EMI and Safety Certifications Eg:
  • CE Mark – full compliance with LVD and EMC directives
  • Worldwide safety standards – IEC60950-1 and/or IEC62368-1, EN60950- 1 and/or EN62368-1, UL60950-1 and/or UL62368-1 , Class1, SELV; Agency approvals – C-UL-US, NORDICS, DENAN, EN55032 Class B, FCC Class B, CISPR32 Class B, CCC, NOM-001 NYCE.
  • MTBF – over 200,000 hours at 25°C ambient condition.

Power

HP 200W Slim 4.5 mm PFC Right Angle Smart (3-pin) AC Power Adapter

• Dimensions 152x73x23.5mm
• Weight unit: 510g +/- 10g
• Input
  • Input Efficiency 88% at 115 Vac and 89% at 230Vac
  • Input frequency range 47 ~ 63 Hz
  • Input AC current 2.7 A at 90 Vac and Maximum Load
• Output
  • Output power 200W
  • DC output 19.5V
  • Hold-up time 5ms at 115 Vac input
  • Output current limit <21.0A
  • DC Plug 4.5mm Barrel Type
• Connector C14
• Environmental Design
  • Operating temperature 32° to 95° F (0° to 35° C)
  • Non-operating (storage) temperature -4° to 185° F (-20° to 85° C)
  • Altitude 0 to 16,400 ft (0 to 5000m)
  • Humidity 5% to 95%
  • Storage Humidity 5% to 95%
• EMI and Safety Certifications Eg:
  • CE Mark – full compliance with LVD and EMC directives
  • Worldwide safety standards – IEC60950-1 and/or IEC62368-1, EN60950- 1 and/or EN62368-1, UL60950-1 and/or UL62368-1 , Class1, SELV; Agency approvals – C-UL-US, NORDICS, DENAN, EN55032 Class B, FCC Class B, CISPR32 Class B, CCC, NOM-001 NYCE.
  • MTBF – over 200,000 hours at 25°C ambient condition.

HP 230W Slim 4.5 mm PFC Right Angle Smart (3-pin) AC Power Adapter

• Dimensions 180x88x25.4mm
• Weight unit: 650g +/- 10g
• Input
  • Input Efficiency 88% at 115 Vac and 89% at 230Vac
  • Input frequency range 47 ~ 63 Hz
  • Input AC current 3.5 A at 90 Vac and Maximum Load
• Output
  • Output power 230W
  • DC output 19.5V
  • Hold-up time 5ms at 115 Vac input
  • Output current limit <25.0A
  • DC Plug 4.5mm Barrel Type
  • Connector C14
• Environmental Design
  • Operating temperature 32° to 95° F (0° to 35° C)
  • Non-operating (storage) temperature -4° to 185° F (-20° to 85° C)
  • Altitude 0 to 16,400 ft (0 to 5000m)
  • Humidity 5% to 95%
  • Storage Humidity 5% to 95%
• EMI and Safety Certifications Eg:
  • CE Mark – full compliance with LVD and EMC directives
  • Worldwide safety standards – IEC60950-1 and/or IEC62368-1, EN60950- 1 and/or EN62368-1, UL60950-1 and/or UL62368-1 , Class1, SELV; Agency approvals – C-UL-US, NORDICS, DENAN, EN55032 Class B, FCC Class B, CISPR32 Class B, CCC, NOM-001 NYCE.
  • MTBF – over 200,000 hours at 25°C ambient condition.

95Whr XL-Long Life Polymer Fast Charge 8 cell Battery

• Dimensions (H x W x L) 314.2×59.4×16.91 mm (12.37×2.34×0.67 inch)
• Weight 0.396kg +/-0.010kg (0.875lb +/-0.02lb)
• Cells/Type 8-cell Lithium-Ion Polymer cell / 624266
• Energy
  • Voltage 15.44V/ 17.72V
  • Amp-hour capacity 5.907Ah /6.154Ah
  • Watt-hour capacity 95Wh
• Temperature
  • Operating (Charging) 32˚ to 113˚ F (0˚ to 45˚ C)
  • Operating (Discharging) 14˚ to 140˚ F (-10˚ to 60˚ C)
• Fuel Gauge LED NA
• Warranty Refer to product warranty
• Optional Travel Battery Available No

Actual battery Watt-hours (Wh) will vary from design capacity. Battery capacity will naturally decrease with shelf life, time, usage, environment, temperature, system configuration, loaded apps, features, power management settings and other factors.

Refer to http://www.hp.com/support/batterywarranty/ for battery warranty information.

NOTE: batteries are not customer-replaceable.

ENVIRONMENTAL DATA

• Eco-Label Certifications & declarations
  This product has received or is in the process of being certified to the following approvals and may be labeled with one or more of these marks:

  • IT ECO declaration
  • US ENERGY STAR®️
  • Based on US EPEAT® Gold registration according to IEEE 1680.1-2018 EPEAT®. EPEAT® status varies by country. Visit www.epeat.net for more information

• Sustainable Impact Specifications

  • 35% post-consumer recycled plastic2
  • External Power Supply 90% Efficiency
  • Low halogen3
  • Outside Box and corrugated cushions are 100% sustainably sourced and recyclable4
  • Molded Paper Pulp Cushion inside box is 100% sustainably sourced and recyclable5
  • Bulk packaging available

• System Configuration The configuration used for the Energy Consumption and Declared Noise Emissions data for the Notebook model is based on a “Typically Configured Notebook”.

Energy Consumption (in accordance with US ENERGY STAR® test method)

• Normal Operation (Short idle)
• Normal Operation (Long idle)
• Sleep
• Off

115VAC, 60Hz

• 11.66 W
• 5.28 W
• 1.04 W
• 0.41 W

230VAC, 50Hz

• 11.81 W
• 5.33 W
• 1.08 W
• 0.42 W

100VAC, 50Hz

• 11.85 W
• 5.4 W
• 1.1 W
• 0.4 W

NOTE:
Energy efficiency data listed is for an ENERGY STAR® compliant product if offered within the model family. HP computers marked with the ENERGY STAR® Logo are compliant with the applicable U.S. Environmental Protection Agency (EPA) ENERGY STAR® specifications for computers. If a model family does not offer ENERGY STAR® compliant configurations, then energy efficiency data listed is for a typically configured PC featuring a hard disk drive, a high efficiency power supply, and a Microsoft Windows® operating system.

Heat **Dissipation*| 115VAC, 60Hz| 230VAC, 50Hz| 100VAC, 50Hz**
---|---|---|---
Normal Operation (Short idle)| 39.9 BTU/hr| 40.4 BTU/hr| 40.5 BTU/hr
Normal Operation (Long idle)| 18.1 BTU/hr| 18.2 BTU/hr| 18.5 BTU/hr
Sleep| 3.6 BTU/hr| 3.7 BTU/hr| 3.8 BTU/hr
Off| 1.4 BTU/hr| 1.4 BTU/hr| 1.4 BTU/hr

NOTE: Heat dissipation is calculated based on the measured watts, assuming the service level is attained for one hour.

ISO 7779 and ISO 9296)

Typically Configured – Idle

|

2.9

|

20.8

Fixed Disk – Random writes| 2.9| 21.0
Optical Drive – Sequential reads| 2.9| 21.0

• Longevity and Upgrading

  • This product can be upgraded, possibly extending its useful life by several years. Upgradeable features and/or components contained in the
  • Spare parts are available throughout the warranty period and or for up to “5” years after the end of production.

• Additional Information

  • This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive – 2011/65/EC.
  • This HP product is designed to comply with the Waste Electrical and Electronic Equipment (WEEE) Directive – 2002/96/EC.
  • This product is in compliance with California Proposition 65 (State of California; Safe Drinking Water and Toxic Enforcement Act of 1986).
  • This product is in compliance with the IEEE 1680 (EPEAT) standard at the Gold level, see www.epeat.net
  • Plastics parts weighing over 25 grams used in the product are marked per ISO11469 and ISO1043.
  • This product is 93.3% recycleable when properly disposed of at end of life.

• Packaging Materials

  • External:
  • PAPER/Corrugated 363 g
  • PAPER/Molded Pulp 160 g
  • PAPER/Paper 3 g
  • Internal: PLASTIC/Polyethylene low density – LDPE
  • The plastic packaging material contains at least 100% recycled content.
  • The corrugated paper packaging materials contains at least 35.6% recycled content.

• RoHS Compliance

  • HP Inc. complies fully with materials regulations. We were among the first companies to extend the restrictions in the European Union (EU) Restriction of Hazardous Substances (RoHS) Directive to our products worldwide through the HP GSE. HP has contributed to the development of related legislation in Europe, as well as China, India, and Vietnam.
  • We believe the RoHS directive and similar laws play an important role in promoting industry-wide elimination of substances of concern. We have supported the inclusion of additional substances—including PVC, BFRs, and certain phthalates—in future RoHS legislation that pertains to electrical and electronics products.
  • We met our voluntary objective to achieve worldwide compliance with the new EU RoHS requirements for virtually all relevant products by July 2013, and we will continue to extend the scope of the commitment to include further restricted substances as regulations continue to evolve.
  • To obtain a copy of the HP RoHS Compliance Statement, see HP RoHS position statement.

• Material Usage
  This product does not contain any of the following substances in excess of regulatory limits (refer to the HP General Specification for the Environment at
  http://www.hp.com/hpinfo/globalcitizenship/environment/supplychain/gen_specifications.html):

  • Asbestos
  • Certain Azo Colorants
  • Certain Brominated Flame Retardants – may not be used as flame retardants in plastics
  • Cadmium
  • Chlorinated Hydrocarbons
  • Chlorinated Paraffins
  • Bis(2-Ethylhexyl) phthalate (DEHP)
  • Benzyl butyl phthalate (BBP)
  • Dibutyl phthalate (DBP)
  • Diisobutyl phthalate (DIBP)
  • Formaldehyde
  • Halogenated Diphenyl Methanes
  • Lead carbonates and sulfates
  • Lead and Lead compounds
  • Mercuric Oxide Batteries
  • Nickel – finishes must not be used on the external surface designed to be frequently handled or carried by the user.
  • Ozone Depleting Substances
  • Polybrominated Biphenyls (PBBs)
  • Polybrominated Biphenyl Ethers (PBBEs)
  • Polybrominated Biphenyl Oxides (PBBOs)
  • Polychlorinated Biphenyl (PCB)
  • Polychlorinated Terphenyls (PCT)
  • Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail packaging has been voluntarily removed from most applications.
  • Radioactive Substances
  • Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)

• Packaging Usage HP follows these guidelines to decrease the environmental impact of product packaging:

  • Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in packaging materials.
  • Eliminate the use of ozone-depleting substances (ODS) in packaging materials.
  • Design packaging materials for ease of disassembly.
  • Maximize the use of post-consumer recycled content materials in packaging materials.
  • Use readily recyclable packaging materials such as paper and corrugated materials.
  • Reduce size and weight of packages to improve transportation fuel efficiency.
  • Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.

• End-of-life Management and Recycling

  • HP offers end-of-life HP product return and recycling programs in many geographic areas. To recycle your product, please go to: http://www.hp.com/go/reuse-recycle or contact your nearest HP sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible manner.
  • The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information for each product type for use by treatment facilities. This information (product disassembly instructions) is posted on the Hewlett Packard website at: http://www.hp.com/go/recyclers. These instructions may be used by recyclers and other WEEE treatment facilities as well as HP OEM customers who integrate and re-sell HP equipment.

• HP Inc. Corporate Environmental Information
  For more information about HP’s commitment to the environment:

  • Global Citizenship Report
    http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html

  • Eco-label certifications
    http://www8.hp.com/us/en/hp-information/environment/ecolabels.html

  • ISO 14001 certificates:

  • http://h20195.www2.hp.com/V2/GetDocument.aspx?docname=c04755842 and

  • http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf.

• Footnotes

  • Recycled plastic content percentage is based on the definition set in the IEEE 1680.1-2018 standard.
  • External power supplies, WWAN modules, power cords, cables and peripherals excluded.
  • 100% outer box packaging and corrugated cushions made from sustainably sourced certified and recycled fibers.
  • Fiber cushions made from 100% recycled wood fiber and organic materials.

Options and Accessories

Options and Accessories (sold separately and availability may vary by country)

Type| Description

HP Prelude Pro Recycle Backpack HP Prelude Pro Recycle Top Load HP Executive 17.3 Backpack

HP Executive 15.6 Top Load HP Executive 15.6 Backpack HP Executive 17.3 Top Load

HP Executive 15.6 Leather Top Load HP Prelude 15.6 Top Load

HP Prelude 15.6 Top Load HP Prelude 15.6 Top Load HP Prelude 15.6 Backpack HP Prelude 15.6 Backpack HP Prelude 15.6 Backpack

HP Renew Business 17.3 Laptop Backpack HP Renew Business 17.3 Laptop Bag

HP Renew Business 15.6 Laptop Bag

| Part #

1X644AA

1X645AA

6KD05AA

6KD06AA

6KD07AA

6KD08AA

6KD09AA

1E7D7AA

2Z8P4AA

50P31AA

1E7D6AA

2Z8P3AA

50P32AA

3E2U5AA

3E2U6AA

3E5F8AA

---|---|---
Docking| HP USB-C Dock G5 HP USB-C Dock G5

HP Thunderbolt Dock Audio Module HP 120W Thunderbolt Dock

HP 120W Thunderbolt Dock HP Thunderbolt Dock 230W G2

HP TB Dock G2 w/ Combo Cable HP USB-C/A Universal Dock G2 HP TB Dock G2 Combo Cable

HP USB-C/A Universal Dock G2 TAA HP Thunderbolt 120W G4 Dock

HP Thunderbolt 280W G4 Dock w/Combo Cable

| 26D32AA

5TW10AA

3AQ21AA

2UK37AA

6HP48AA

2UK38AA

3TR87AA

5TW13AA

3XB96AA

7UP88AA

4J0A2AA

4J0G4AA

Input/Output| HP HDMI to VGA Adapter HP HDMI to DVI Adapter

HP USB-C to USB 3.0 Adapter

HP USB-C to DisplayPort Adapter HP USB-C to VGA Adapter

HP USB-C to VGA Adapter

HP USB-C to HDMI 2.0 Adapter HP 7.4 mm to 4.5 DC dongle

HP Single miniDP-to-DP Adapter Cable

| H4F02AA F5A28AA N2Z63AA N9K78AA N9K76AA P7Z54AA 2PC54AA K0Q39AA 2MY05AA
Keyboard/Mouse| HP 320K Wired Keyboard HP 125 Wired Keyboard

HP 975 USB+BT Dual-Mode Wireless Keyboard

| 9SR37AA

266C9AA

3Z726AA

 | HP 455 Programmable Wireless Keyboard

HP Wireless Rechargeable 950MK Mouse and Keyboard HP Wired Desktop 320MK Mouse and Keyboard

HP 235 Wireless Mouse and Keyboard Combo HP 225 Wired Mouse and Keyboard Combo HP 655 Wireless Keyboard and Mouse Combo HP Wired 320M Mouse

HP Premium Wireless Mouse HP Travel Bluetooth Mouse

HP Multi-Device 635 Black Wireless Mouse HP Creator 935 Black Wireless Mouse

HP 128 LSR Wired Mouse HP 125 Wired Mouse

HP 435 Multi-Device Wireless Mouse

| 4R177AA

3M165AA

9SR36AA

1Y4D0AA

286J4AA

4R009AA

9VA80AA

1JR31AA

6SP30AA

1D0K2AA

1D0K8AA

265D9AA

265A9AA

3B4Q5AA

---|---|---
Hub| HP USB-C Mini Dock

HP USB-C Travel Hub G2 HP USB-C to USB-A Hub

HP Universal USB-C Multiport Hub HP Universal USB-C Multiport Hub

| 1PM64AA

7PJ38AA Z6A00AA 50H55AA

50H98AA

Audio| HP USB G2 Stereo Headset HP USB G2 Stereo Headset HP 3.5mm G2 Stereo Headset HP 3.5mm G2 Stereo Headset| 428H5AA

428K6AA

428H6AA

428K7AA

Power| HP Zbook 200W Slim Smart 4.5mm AC Adapter| 491C7AA
Storage| HP USB External DVDRW Drive HP USB External DVDRW Drive| F2B56AA Y3T76AA
Security| HP Nano Keyed Cable Lock

HP Nano Master Keyed Cable Lock HP Sure Key Cable Lock

| 1AJ39AA

1AJ40AA

6UW42AA

Copyright © 2022 HP Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products are set forth in the express limited warranty statements accompanying such products. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.

Intel, Core, and Celeron, Thunderbolt and vPro are registered trademarks or trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other countries. Bluetooth is a registered trademark of its proprietor used by HP Inc. under license. AMD, FirePro, and Enduro are trademarks of Advanced Micro Devices, Inc. Adobe is a trademark of Adobe Systems Incorporated. Microsoft and Windows are U.S. registered trademarks of Microsoft Corporation in the United States and/or other countries. Qualcomm and Snapdragon are trademarks of Qualcomm, Inc. SD, SDHC, and SDXC are trademarks or registered trademarks of SD-3C in the United States, other countries or both. USB Type-C and USB-C are trademarks of USB Implementers Forum. ENERGY STAR® is a registered trademark mark of the U.S. Environmental Protection Agency.

Date of change:| Version History:|  | Description of change:
---|---|---|---
May 31, 2022| From v1 to v2| Changed| Format
June 17, 2022| From v2 to v3| Changed| POWER and WEIGHTS & DIMENSIONS sections
June 23, 2022| From v3 to v4| Changed| NETWORKING/COMMUNICATIONS section
June 29, 2022| From v4 to v5| Changed| POWER section
July 8, 2022| From v5 to v6| Changed| WEIGHTS & DIMENSIONS, NETWORKING/COMMUNICATIONS and

PROCESSOR sections

Removed| HP RGB Z Command Keyboard reference
July 11, 2022| From v6 to v7| Changed| PORTS/SLOTS section
September 15, 2022| From v7 to v8| Removed| Tile App for Software
December 1, 2022| From v8 to v9| Changed| DRIVE CONTROLLERS section
December 7, 2022| From v9 to v10| Changed| Format
December 14, 2022| From v10 to v11| Changed| DISPLAY section

www.support.hp.com.

c08160125 — DA – 17018 —Worldwide — Version 11 — December 14, 2022.

References

• Fix connections to wireless displays or docks in Windows - Microsoft Support
• Homepage | ENERGY STAR
• Homepage | ENERGY STAR
• HP | Care Pack Central
• hp.com/support/batterywarranty/
• support.hp.com
• support.hp.com/
• Experience the Power of Windows 11 OS, Computers & Apps | Microsoft
• Experience the Power of Windows 11 OS, Computers, & Apps | Microsoft
• support.hp.com/us-
• support.hp.com/us-en/document/c05195282

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