HOPERF DG_N32WB03x Design Guide For Hardware Of CMT453x Series Chips Instruction Manual

HOPERF DG_N32WB03x Design Guide For Hardware Of CMT453x Series Chips

Product Information

Product Name: CMT453x Series Bluetooth Chips
Version: Rev 1.4
Design Guide: Design Guide for Hardware of CMT453x Series Chips
Manufacturer: Hoperf
Website: www.hoperf.com

Overview
The Design Guide for Hardware of CMT453x Series Chips provides detailed specifications for chip hardware design, selection of important components, and cautions for PCB Layout.

Contents

1. Schematic Design Guide
2. Notice

Schematic Design Guide

Power Supply

1. When the external power supply voltage is between 1.8V and 3.6V, it can be directly connected to the chip VCC.
2. VCCRF, which has a maximum supply of 3.6V, is recommended to be connected to the VCC pin in parallel.
3. Ensure that the chip GND pin is connected to the square bonding pad at the bottom of the chip to establish a GND network. Refer to Chapter 3.3 for more details.

Differences between Two Power Supply Modes

Mode| Parameters| BOM Difference| Active Power Consumption| Power Consumption in Sleep Mode| RFTX Power Consumption| RFRX Power Consumption| RFRX Sensitivity| RFRX Maximum Power
---|---|---|---|---|---|---|---|---
DCDC Power Supply Mode| –| 4.7uH inductor required| 1.8 mA| 1.6 uA| 4 mA| 3.8 mA| -96 dBm| +6 dBm
LDO Power Supply Mode| –| 4.7uH inductor not required| 3.8 mA| 1.6 uA| 8 mA| 7.8 mA| -96 dBm| +6 dBm

Reference Schematic Design for DCDC Power Supply Mode
Reference Schematic Design for LDO Power Supply Mode
Reference Minimum System BOM Table

Reference Schematic Design for External Crystal
Reference Schematic Design for Reset Circuit
Reference Schematic Design for Microphone Circuit
Reference Schematic Design for Infrared Transmitter Circuit

Product Usage Instructions

To use the CMT453x Series Bluetooth Chips, follow the steps below:

1. Ensure that the external power supply voltage is between 1.8V and 3.6V.
2. If using the DCDC power supply mode, refer to Figure 1-1 for the reference schematic design.
3. If using the LDO power supply mode, refer to Figure 1-2 for the reference schematic design.
4. Refer to the minimum system BOM table (Table 1-1) for the required components.
5. If using an external crystal, refer to Figure 1-3 for the reference schematic design.
6. If a reset circuit is needed, refer to Figure 1-4 for the reference schematic design.
7. If a microphone circuit is needed, refer to Figure 1-5 for the reference schematic design.
8. If an infrared transmitter circuit is needed, follow the instructions provided in the manual.

Overview

This document is the summary of hardware design experiences of CMT45 3x series Bluetooth chips It is the detailed specifications for chip hardware design, selection of some important components and cautions for PCB Layout.

Schematic design guide

Overview

1. When the external power supply voltage is 1.8V1.8V～3.6V, it can be directly connected to chip VCC.
2. VCCRF, from which the maximum supply is 3. 6V , is recommended to be connected to VCC pin in parallel.
3. Note the chip GND pin is at the bottom of the chip, and be sure to connect the square bonding pad at the bottom of the chip to GND network. See Chapter 3.3 for det ails.
   Differences between two power supply modes

Two power supply modes are available for chips, and the main differences between the two modes are below:

Mode

Parameters

|

DCDC power supply mode

|

LDO power supply mode

---|---|---
BOM difference| 4.7uh inductor required| 4.7uh inductor not required
Active power consumption| 1.8 mA| 3.8 mA
Power consumption in Sleep mode| 1.6 uA| 1.6 uA
RFTX power consumption| 4 mA| 8 mA
RFRX power consumption| 3.8 mA| 7.8 mA
RFRX sensitivity| -96 dBm| -96 dBm
RFRX maximum power| +6 dBm| +6 dBm

Reference schematic design for DCDC power supply mode

Reference schematic design for LDO power supply mode

Reference minimum system BOM table

Item| Part Name| Description| REV| QTY| Reference
---|---|---|---|---|---
0001| CAP0402,105| CAP,CER,16V,1UF,X7R,10%,0402| | 4| C4,C20,C23,C30

0002

| ****

CAP0402,104

| ****

CAP,CER,16V,0.1UF,X7R,10%,0402

| | ****

1

| ****

C19

0003| CAP0603,2.2uF| CAP,CER,10V,2.2UF,X7R,10%,0603| | 1| C9
0004| CAP0603,10uF| CAP,CER,10V,10UF,X7R,10%,0603| | 1| C18
0005| CAP0402,1.2PF| CAP,CER,50V,1.2PF,COG,5%,0402| | 1| C32
0006| CAP0402,12PF| CAP,CER,50V,12PF,COG,5%,0402| | 2| C28,C29
0007| CAP0402,100PF| CAP,CER,50V,100PF,COG,5%,0402| | 1| C33
008| CMT4531_QFN32| IC,CMT4531,QFN32,32PIN| | 1| U1

009

| ****

XTAL_32MHz

| XTAL,32MHz,8PF,10PPM,SMD_1612,4PIN,-40℃～85℃(NDK, NX1612A-32MHz-STD-CIS-3)| |

1

| ****

Y2

0010

| ****

INDUCTOR_2.2UH

| INDUCTOR, 2.2UH,±20%, power inductor, RDC(direct-current

resistance) 250mΩ, Heat Rating Current 800mA, 0805, (MPH201210S4R7MT, Sunlord)

| | ****

1

| ****

L3

---|---|---|---|---|---

0011

| ****

INDUCTOR_1.3nH

| INDUCTOR, 1.3nH,±0.3nH, high-frequency inductor, RDC(direct-current resistance) 100mΩ, Rated Current 300mA,

0402, (SDCL1005C1N3STDF, Sunlord)

| | ****

1

| ****

L6

0012

| ****

INDUCTOR_1nH

| INDUCTOR, 1nH,±0.3nH, high-frequency inductor, RDC(direct-current resistance) 100mΩ, Rated Current 300mA,

0402, (SDCL1005C1N0STDF, Sunlord)

| | ****

1

| ****

L8

0013

| ****

ESD Protection

| IEC61000-4-2 (ESD) ±20kV (air)， ±20kV (contact) Working voltage: 5V ；Ultra Low Capacitance：0.3pF

XE2XUC5VB DFN1006-2L

| | ****

2

| ****

TVS1 TVS2

Reference schematic design for external crystal

Reference schematic design for reset circuit

Reference schematic design for microphone circuit

Reference Schematic design for Infrared Transmitter Circuit

Reference Design for Conduction/ Radiation Certification (CE/FCC) test
The circuit below has a better harmonic suppression performance compare with the default design introduced in section 1.3 and 1.4.

Specifications on chip pins in the schematic

Power supply pins
PIN24(VDCDC) is the power supply pin receiving internal DCDC generated voltage, its typical voltage is 1. 15V , it needs to be connected with 1uF decoupling capacitor, and 2 2 uH power inductor ne eds to be provided in series between PIN24(VDCDC) pin and PIN23 ( PIN27(VDCDCRF) is the internal RF power supply pin receiving internal DCDC generated voltage, can be directly connected to PIN24(VDCDC), its typical voltage is 1. 15V and it needs to be connected with 1uF decoupling capacitor.

PIN28(VCCRF) is external power supply pin, needs to be connected with 1uF decoupling capacitor, and its external voltage range is 1.8V1.8V～3.6 V .
PIN22(V CC) is external power supply pin, needs to be connected with 0. 1uF and 10 uF decoupling capacitors, and its external voltage range is 1.8V1.8V～3.6V 。PIN8(VDD_FLASH) is the internal FLASH power supply pin, needs to be connected only with 2. 2 uF decoupling capacitors without external power supply.

RF pins
PIN 25(RFIOP) is RF pin.
PIIN26(VDD_PA) receives the bias voltage with a range of 0. 9V9V～1.7V generated by internal RF_PA , depending on the internal register configuration, the transmit power is different, and the bias voltage generated is different
Crystal oscillator pins PIN29(XO32MM) and PIN30(XO32MP) are Bluetooth reference clock pins and need to be connected with 32MH z crystals. As the Bluetooth requirement for frequency deviation is high, the frequency deviation of the crystal oscillators should be ≤≤±10ppm . Note that external 32MH z crystals must be provided for using the Bluetooth function.
PIN9(XO32KP_IN) and PIN10(XO 32KM_OUT) are low frequency reference clock pins, can also be used as general purpose IO interfaces and need to be connected with 32.768KH z crystals when they are used as clock pins.

Debug pins
PIN5(PA4/SWDCLK) and PIN6(PA5/SWDIO) are SWD pins and can also be used as general purpose IO interfaces. When they are used as SWD pins, they can be used to download applications.
PIN 16(PB6/TX) and PIN17(PB7/RX) are U ART serial port pins, and can also be used as general purpose IO interfaces. They can be used for pri nt when being used as serial port pins.

AMIC audio pins
PIN20(PB11/AMIC_N) and PIN21(PB13/AMIC_P) are MIC input pins supporting single ended input and differential input with adjustable gain.
PIN19(P B12/AMIC_BIAS) is the pin for outputting MIC bias volta ge, it outputs adjustable MICBIAS voltage w ith a range of 1.61.6～2.3V and a typical voltage of 2 V IO interface
For the specific definition of IO interface, see CMT453x Datasheet

Design specifications on PCB Layout

Requirements for RFIOP wiring design
In order to ensure minimum loss, RF routing should be as short as possible, components should be as compact as possible, and RF routing should be as straight as possible and should not be right angle The routing width and the space between the route and the peripheral GND equivalent to the recommended value 0. 5mm . As PCB material influence s the RF routing impedance, the routing width and the space between the route and the peripheral GND can be adjusted properly to ensure RF routing impedanc e is 50 Ω
The wires around RF should ideally be filled with GND metal and the resulting section on the top and bottom layers should be connected with as many vias as possible.
The zone around antenna front and back must be separated from other routes, to ensure the space between
GND and the antenna is 3mm or above and no metal component is in the space.
Normally, the antenna length is about 30mm, equivalent to 1/4 of the Bluetooth signal wavelength.
In order to enhance ESD protection capacity, b e sure to coat the antenna surface with a solder mask rather than exposing it to the outside It’s better to add another silk screen layer on the top of the antenna.
Considering that the ESD in the production line of the PCB is not well controlled during t he production period, it is required to add a TVS component to the antenna port for protection the value of the TVS diode capacitance should be as low as possible . For products within a distance of 10m, the TVS component can be replaced with a 0 ohm resistor to improve ESD protection capability. The position of the TVS component or 0 ohm resistance is shown in the figure below.

Requirements for routing of 32 MH z crystal oscillator
The two crystal oscillator routes should be as short as possible and as equivalent in length as possible, with the areas around them be filled with GND metal.
Try not to route wires under the crystal oscillator, especially the VDCDCRF wires cannot be route d from below, as the DC voltage generated by Bluetooth broadcast affects the stability of the crystal oscillator frequency.

Requirements for routing of chip grounding
The 32 pins of this chip do not have GND, and its GND is at the bottom of the chip.
The chip packaging center is required to be cladded by a square copper sheet. The space between the copper sheet and the chip pin should be 0. 3mm and 0.5mm0.5mm，connect the copper sheet with GND via 9 holes The hole may be 0.5mm/0.3mm. The holes should not be too large to avoid tin leaking and consequent insufficient solder.

Requirements for power supply routing
The power supply wire for the chip should be as thick and short as possible, with the decoupling capacitor as close as possible to the chip.
If two decoupling capacitors with difference capacity are used, the smaller one should be closer to the chip than the larger one.

Requirements for AMIC audio routing

• PB11/AMIC_N and PB13/AMIC_P support single ended input and differential input, and their routes should be differential type. The differential wires should be as short and equivalent in spacing as possible, with proper shielding by ground wire for avoiding other signal interference.
• The inside of their audio module should be grounded first and then they are connected with the peripheral ground to avoid the interference from ground wire.

Version history

and update the BOM table in section 1.5.

Notice

Liability Disclaimer

Shenzhen Hope Microelectronics Co., Ltd
reserves the right to make changes without further notice to the product to improve reliability, function or design. Shenzhen Hope Microelectronics Co., Ltd does not assume any liability arising out of the application or use of any product or circuits des cribed herein.

Life Support Applications
Shenzhen Hope Microelectronics Co., Ltd’s products are not designed for use in life support appliances,devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Shenzhen Hope Microelectronics Co., Ltd customers using or selling these produ cts for use in such applications do so at their own risk and agree to fully indemnify Shenzhen Hope Microelectronics Co., Ltd for any damages resulting from such improper use or sale.

Contact Information

Shenzhen Hope Microelectronics Co., Ltd.
Address: 30th floor of 8th Building, C Zone, Vanke Cloud City, Xili Sub- district, Nanshan, Shenzhen, GD, P.R.
China
Tel: +86-755-82973805
Post Code: 518055
Email: sales@hoperf.com
Website: www.hoperf.com
www.hoperf.com

References

• HOPERF - Reliable original manufacturer of IoT key components
• HOPERF - Reliable original manufacturer of IoT key components

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