BOSCH 3.0 Sensortec’s Sensor Prototyping Platform User Guide

3.0 Sensortec’s Sensor Prototyping Platform

Application Board 3.1 User Guide

Bosch Sensortec’s Sensor Prototyping Platform

Application Board 3.1 User Guide

Document revision Draft
Document release date
Document number
Sales Part Number
Notes

Abbreviations

ESD : Electrostatic Discharge
FCC : United States of America Federal Communications Commission
USB 2.0 : Universal Serial Bus 2.0
LED : Light Emitting Diode Li-ion : Lithium-Ion
KB : Kilobyte MB : Megabyte Gb : Gigabit
BLE : Bluetooth Low Energy MTP : Media Transfer Protocol
RGB LED : Red Green Blue Light Emitting Diode

1 About this document

This document describes the operating procedures of the Application Board 3.1 and additional details about the board itself.
To ensure that the Application Board 3.1 is working correctly, follow these instructions carefully before using it.

1.1 Definition of special notices

Warning: Indicates a hazard that could lead to minor or moderate injuries. Always follow these instructions.

Note: Points of emphasis and reminders of operational peculiarities for the device that could affect performance.
Always follow these instructions.

1.2 Definition of general notices

INFO: General information and instructions that must be followed

TIP: Practical advice

2 Safety and environment

Electrostatic Discharge Caution: ESD (electrostatic discharge) sensitive device. Improper handling may damage the Application Board 3.1 resulting in total or intermittent failures. Use the Application Board 3.1 only in an ESD protected environment and follow ESD-prevention procedures. To prevent ESD damage use an ESD wrist or ankle strap connected to an unpainted metal surface.

2.1 Radio frequency radiation exposure and further information

The radiated output power of the device is far below the FCC radio frequency exposure limits. Nevertheless, the device should be used in such a manner that the potential for human contact during normal operation is minimized.

2.2 Disposal

Disposing of this product correctly will help save valuable resources and prevent any potential negative effects on human health and the environment, which could otherwise arise from inappropriate waste handling.
Please contact your local authority for further details of your nearest designated collection point.
Penalties may be applicable for incorrect disposal of this waste, in accordance with your national legislation.

3 Introduction and intended use

The Application Board 3.1 is a versatile and sensor independent development platform, enabling a fast and easy experience with Bosch Sensortec’s sensors. A wide variety of Bosch Sensortec’s sensors can be connected to the platform as Shuttle Board 3.0s. The combination of the Application Board 3.1 and Shuttle Board 3.0 can be used to evaluate the sensors and make prototypes to test use-cases.

3.1 Intended use

The Application Board 3.1 operates according to the information provided in this document. Validation and testing of any use or operation, which requires specific requirements and standards, which are not already explicitly mentioned in this document, is under the responsibility of the user.

****Warning: For professional use only. The Application Board 3.1 shall be used by trained personnel only. Improper operation or handling may cause damage to the user or the device itself.

3.2 Scope of delivery

► Application Board 3.1
► Supporting documentation material (User Guide)

Note: Shuttle Board 3.0s are sold separately

4 Application Board 3.1

4.1 Overview

1. Micro USB connector
2. Button 1
3. Button 2
4. Button 3
5. stemma connector
6. 3.0 shuttle connectors
7. external flash
8. Microcontroller
9. SW connector

4.2 Dimensions

4.3 Device specification

38mm x 33mm x 6mm

Supply voltage| 5V DC USB
Memory capacity (user data memory)|

256 KB RAM, 1MB internal flash, 2Gb external flash

Communication| BLE 5.0 / USB 2.0
Bluetooth Low energy frequency band|

2.4GHz, 40 channels

Typical conducted output power| +0 dBm
Radiated output power (EIRP)| +2 dBm

4.4 Operating conditions

0~65 degree Celsius

Storage temperature range|

25+/-3 degree Celsius

4.5 Block Diagram

The following shows a simplified block diagram of the Application Board 3.1.

Figure 3: Block Diagram

4.5 Module descriptions

4.6.1 Programmable push buttons
Two programmable push buttons are connected to Ground individually through a 360ohm resistor. It is expected that the internal pull-ups of the microcontroller pins connected to the buttons are enabled to use the button with a falling- edge active-low configuration. The buttons are named BTN-S2 and BTN-S3. There is no predefined scenarios for S2 and S3 buttons, the final user is free to program a personal use scenarios.
One push button connected to the PMIC, can be programmed to set interrupts to the microcontroller depending on the press behavior, also to perform MCU reset. This button is the S1 button, functioning as follow:
– Short press [80ms < t < 1500ms]: Nothing happens. (User can edit and set scenario suitable for his application)
– Medium press [1500ms < t < 9000ms]: Ship mode ON => The microcontroller is powered off.
– Long press [9000ms < t]: Perform microcontroller reset.
/ ! \ Please note that the “Ship mode” is activable only if the board is powered using only battery. If the USB power is connected, the board will never go into the ship mode.

4.6.2 Debugger connector
This connector helps with recovery of a board with a corrupted nRF52840 while loading custom applications or similar. Debugging is possible with the connection of a Serial-Wire-Debug interface connector.

4.6.3.1 Overview

An ARM Cortex-M4 compatible debugger can be connected using the standard ARM Cortex 10-pin, 2 row, 1.27mm pitch connector.

Figure 4: Debugger connector

4.6.3.2 Pin description

Table 1 Shuttle pin description

Active low hardware Reset

4.6.3 Shuttle Board 3.0 connector
The Shuttle Board 3.0 connector allows for the connection of a Shuttle Board 3.0 to be able to prototype one or more sensors (depending on the Shuttle Board 3.0). Details of the Shuttle Board 3.0 connector can be found under 5.

4.6.4 Temperature sensor
A digital temperature sensor, the Texas Instruments TMP112 is used to be able to measure the temperature of the board. The sensor can be accessed with the I2C-TEMP bus. Details on how to operate the sensor can be found in the datasheet.

4.6.5 Microcontroller
The Application Board 3.1 uses the uBlox NINA-B306 Bluetooth low energy module based on the nRF52840 chipset from Nordic Semiconductor. The nRF52840 among other features supports USB2.0 and Bluetooth Low Energy 5.0 Details about the module and the chipset can be found in the NINA-B306 datasheet and nRF52840 product specification respectively.

4.6.6 External flash
A Winbond W25N02KWZEIR 2Gbit NAND Flash is connected to the Microcontroller using SPI. The external flash is used primarily for storing files, particularly sensor data log files. The files can be accessed from a host by switching the device to the pre-loaded MTP firmware mode and connecting via USB.

4.6.7 LEDs
The microcontroller controls the RGB LED. Details on the LED is controlled is found in Table 2 Application Board 3.1 pin description under the LED-CTRL bus.

4.6.8 PMIC
The BQ25120 is responsible for powering the different board components also provides support for a single cell 3.7V LiPo/Li-ion battery pack connected to the Application board 3.1, allowing the use of the board as a wireless sensor network. The battery charging current is set to 150mA with a termination current of 16mA (around 10%) also can be changed and configured by the final user.

4.7 Pin descriptions

Table 2 Application Board 3.1 pin description

Bus name

|

Pin name

|

NINA-B306 pin

|

nRF52840 pin

|

Description

---|---|---|---|---

SHUTTLE-GPIO

|

GPIO0

|

GPIO_2

|

P0.14

|

Shuttle pin 4

GPIO1

|

GPIO_1

|

P0.13

|

Shuttle pin 5

GPIO2/INT1

|

GPIO_35

|

P1.01

|

Shuttle pin 6

GPIO3/INT2

|

GPIO_34

|

P1.08

|

Shuttle pin 7

CS

|

GPIO_5

|

P0.24

|

Shuttle pin 8

SCK/SCL

|

GPIO_4

|

P0.16

|

Shuttle pin 9

SDO

|

GPIO_3

|

P0.15

|

Shuttle pin 10

|

SDI/SDA

|

GPIO_43

|

P0.06

|

Shuttle pin 11

---|---|---|---|---

|

GPIO4

|

GPIO_37

|

P1.03

|

Shuttle pin 12

|

GPIO5

|

GPIO_36

|

P1.02

|

Shuttle pin 13

|

GPIO6

|

GPIO_39

|

P1.11

|

Shuttle pin 14

|

GPIO7

|

GPIO_38

|

P1.10

|

Shuttle pin 15

|

PROM-RW

|

GPIO_27

|

P0.05

|

Shuttle pin 16, 470ohm pull-up resistor

SPI

|

SPI-FLASH-MISO

|

GPIO_48

|

P0.21

|

SPI-FLASH-MOSI

|

GPIO_50

|

P0.20

|

SPI-FLASH-SCK

|

GPIO_52

|

P0.19

|

SPI-FLASH-CS

|

GPIO_51

|

P0.17

|

I2C

|

I2C-TEMP-SDA

|

GPIO_23

|

P0.29

|

4.7kohm pull-up

I2C-TEMP-SCL

|

GPIO_42

|

P0.26

|

4.7kohm pull-up

BTN-CTRL

|

BTN-S2

|

GPIO_7

|

P0.25

|

Active low. When activated, connected to ground through a 360ohm resistor

BTN-S3

|

GPIO_33

|

P1.09

|

Active low. When activated, connected to ground through a 360ohm resistor

LED-CTRL

|

LED-RED

|

GPIO_45

|

P0.07

|

Active high. Connected to PMID through a 2200ohm resistor

LED-BLUE

|

GPIO_46

|

P0.12

|

Active high. Connected to PMID through a 2200ohm resistor

LED-GREEN

|

GPIO_32

|

P0.11

|

Active high. Connected to PMID through a 2200ohm resistor

PWR-CTRL

|

VDD-EN

|

GPIO_21

|

P1.12

|

Routes selected Vdd voltage to the Shuttle’s Vdd pin when high and routes Ground when low

VDDIO-EN

|

GPIO_18

|

P0.02

|

Routes selected Vddio voltage to the  Shuttle’s VddIO pin when high and routes Ground whenlow

Modifications reserved | Data subject to change without notice Document number: BST-DHW-AN008-00

Bosch Sensortec | Application Board 3.1 User Guide 13 | 24

5 Shuttle Board 3.0

5.1 Dimensions

The following figure describes the typical dimensions of the Shuttle Board 3.0 for standard shuttles.

Figure 5: Standard Shuttle Board 3.0 dimensions

The following figure describes the typical dimensions of the Shuttle Board 3.0 for multi-sensor shuttles. Modifications reserved | Data subject to change without notice Document number: BST-DHW-AN008-00

Bosch Sensortec | Application Board 3.1 User Guide 14 | 24

 Figure 6: Multi-sensor Shuttle Board 3.0 dimensions

Pin descriptions

Table 3 Shuttle Board 3.0 pin description

Shuttle Row 1

pin index

|

Function

|

Shuttle Row 2 pin index

|

Function

---|---|---|---

(1) Vdd

|

Powers the sensor. Enabled by

VDD-EN and provide a programmable  range of 0,8V to 3,3V from PMIC.

|

(1) CS

|

Typically used as the Chip Select for the  SPI bus.

(2) VddIO

|

Provide reference IO voltage to some  sensors and a power domain to other. When VDDIO-EN is enabled, the pinis connected to VDDIO (Microcontroller power supply) and programmable with 1,8V to 3,3V range from the PMIC.

|

(2) SCK/SCL

|

Typically used as the Clock for the SPI  or I2C buses.

(3) Gnd

|

Ground

|

(3) SDO

|

Typically used as the Data-out line of the sensor.

(4) GPIO0

|

Assigned depending on Shuttle design.

|

(4) SDI/SDA

|

Typically used as the Data-in line of the sensor.

(5) GPIO1

|

Assigned depending on Shuttle design.

|

(5) GPIO4/OCSB

|

Assigned depending on Shuttle design.  Typically reserved as the Chip Select for  the Optical Image

Stabilization (OIS) interface.

(6) GPIO2/INT1

|

Assigned depending on Shuttle design.  Typically reserved for Interrupt 1.

|

(6) GPIO5/ASCx

|

Assigned depending on Shuttle design.  Typically reserved as the

Clock for the

OpticalImage Stabilization (OIS)  interface or Auxiliary I2C interface.

(7) GPIO3/INT2

|

Assigned depending on Shuttle design.  Typically reserved for Interrupt 2.

|

(7) GPIO6/OSDO

|

Assigned depending on Shuttle design.  Typically reserved as the sensor Data out for the Optical

Image Stabilization (OIS) interface.

|

(8) GPIO7/ASDx

|

Assigned depending on Shuttle design.  Typically reserved as the Data-in for the Optical Image Stabilization (OIS)  interface or Data

for the Auxiliary I2C interface.

|

(9) PROM-RW

|

This pin is used to connect to the 1- Wire EEPROM to identify the Shuttle Board 3.0 connected.

Modifications reserved | Data subject to change without notice Document number: BST-DHW-AN008-00

Bosch Sensortec | Application Board 3.1 User Guide 15 | 24

6 Software description

6.1 Overview

Brief description of the memory layout for the Application Board 3.1

Nordic Semiconductor’s SoftDevice S140

Feature-rich Bluetooth Low Energy protocol  stack

160kB reserved space

Key features

Bluetooth 5.0.

USB MTP Firmware

Media Transfer Protocol over USB enables the  transfer of files to and from the device  removing the need of any additional hardware  for data transfer

32kB reserved space

Default Application / User Application

The Default Application enables the use of the  board as a USB to SPI/I2C/GPIO bridge with  some specialized features for event- based data  captures from the sensor.

A custom User Application using the COINES SDK  can be loaded onto the board for custom tests,  prototypes or demos.

768kB reserved space

USB DFU Bootloader

The bootloader supports the Device Firmware  Upgrade standard with the additional ability for  wireless firmware upgrade using Nordic Semiconductor’s DFU over Bluetooth LE.

64kB reserved space

NRF52840‘s 1MB memory space

Modifications reserved | Data subject to change without notice Document number: BST-DHW-AN008-00

Bosch Sensortec | Application Board 3.1 User Guide 16 | 24

7 Getting started

7.1 Setup overview

It is recommended to use an ESD safe environment to operate the Application Board 3.1 as depicted in the image.

Figure 7: Application Board 3.1 setup

7.2 Connecting a Shuttle Board 3.0 board

Make sure that the pins are aligned correctly to avoid damaging the connector or bending the pins.

Figure 8: Aligning the pins of the Shuttle Board 3.0 board

Modifications reserved | Data subject to change without notice Document number: BST-DHW-AN008-00

Bosch Sensortec | Application Board 3.1 User Guide 17 | 24

Once aligned, press down on the board with both thumbs to fit the Shuttle Board 3.0 onto the Application Board 3.1.

Figure 9: Connecting the Shuttle Board 3.0

7.3 Connecting to the Application Board 3.1 using USB

When connecting the USB cable, the board will be powered on directly.

Figure 10: Connecting the USB cable

Modifications reserved | Data subject to change without notice Document number: BST-DHW-AN008-00

Bosch Sensortec | Application Board 3.1 User Guide 18 | 24

7.4 Removing the Shuttle Board 3.0

Tug the Shuttle Board 3.0 back and forth to remove the Application Board 3.1. Avoid twisting and turning as this may dislodge the  connector from the Application Board 3.1.

Figure 11: Removing the Shuttle Board 3.0

Modifications reserved | Data subject to change without notice Document number: BST-DHW-AN008-00

Bosch Sensortec | Application Board 3.1 User Guide 19 | 24

8 Maintenance

Warning: Damage to materials can cause risk of fire!

Liquid entering the device can cause short circuits and damage the device. This could cause fire, data loss and  incorrect measurements.

Modifications reserved | Data subject to change without notice Document number: BST-DHW-AN008-00

Bosch Sensortec | Application Board 3.1 User Guide 20 | 24

9 Further Product Related Information

Please find all product related documents and user guides on our website: https://www.bosch-sensortec.com/

Modifications reserved | Data subject to change without notice Document number: BST-DHW-AN008-00

Bosch Sensortec | Application Board 3.1 User Guide 21 | 24

10 Regulatory and legal information about the Application Board3.1

10.1 European Union notices

European Union notices Radio Equipment Directive

Hereby, Bosch Sensortec GmbH declares that the radio equipment type “Application Board 3.1” is in compliance with Directive 2014/53/EU (Radio Equipment Directive). The full text of the EU declaration of conformity is available at the Bosch Sensortec internet address.

Conformity).

RoHS

The Application Board 3.1 meetsthe requirements of the Directive 2011/65/EU on the restriction of the use of certain  hazardous substances in electrical and electronic equipment (RoHSDirective).

Name and content of hazardous substances in products

Hazardous substance

Component nameLead (Pb) Mercury Cadmium Hexavalent Polybrominated Polybrominated

chromium biphenyls diphenyl ethers

(Cr(VI)) (PBB) (PBDE)

Diode X O O O O O

This table was developed according to the provisions of SJ/T 11364.

O: The content of such hazardous substance in all homogeneous materials of such component is below the limit required by GB/T 26572.

X: The content of such hazardous substance in a certain homogeneous material of such component is beyond the limit required  by GB/T 26572. No mature alternative solution in the industry, complying with EU RoHS.

• The use conditions of products environment-friendly use period are specified in the product manual.

The certification for the European Union only applies to Application Board 3.0 devices with CE printed on the housing. The user shall  verify before using the Application Board 3.1 in the European Union.

USA: FCC notices

FCC has issued an EQUIPMENT AUTHORIZATION to Bosch Sensortec GmbH for Application Board 3.1 according to FCC rule parts 15 C  with the FCC ID: 2AO4I-APP31.

Note: Changes or modifications not expressly approved by Bosch Sensortec GmbH could void the FCC certificate and therefore  user’s authority to operate the equipment.”

The radiated output power of the device is far below the FCC radio frequency exposure limits. Nevertheless, the device shall be  used in such a manner that the potential for human contact during normal operation is minimized.

The device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

1. The device may not cause harmful interferences, and

2. This device must accept any interferences received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC

Modifications reserved | Data subject to change without notice Document number: BST-DHW-AN008-00

Bosch Sensortec | Application Board 3.1 User Guide 22 | 24

Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This  equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the  instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be  determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the  following measures:

▶ Reorient or relocate the receiving antenna.

▶ Increase the separation between the equipment and receiver.

▶ Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

▶ Consult the dealer or an experienced radio/TV technician for help.

Use of the Application Board 3.1 is subject to validation and observation of local legal regulation by the customer. For  information on other certifications – which gradually may be issued over time – please, contact our Application Board 3.1 support  at contact@bosch-sensortec.com.

FCC RF exposure statement

This equipment complies with radio frequency exposure limits set forth by the FCC for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 1.5 cm between the device and the user or bystanders. This device must not be co-located or operating in conjunction with any other antenna or transmitter.

Modifications reserved | Data subject to change without notice Document number: BST-DHW-AN008-00

Bosch Sensortec | Application Board 3.1 User Guide 23 | 24

Canada: ISED license exemption

This device contains license-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development  Canada’s licence-exempt RSS(s). Operation is subject to the following two conditions:

(1) This device may not cause interference; and

(2) This device must accept any interference, including interference that may cause undesired operation of the device. Additional information:

CAN ICES-003(B)/NMB-003(B)

 IC:26413-APP31

Canada ISED RF exposure statement

This equipment complies with radio frequency exposure limits set forth by the Innovation, Science and Economic Development Canada  for an uncontrolled environment.

This equipment should be installed and operated with a minimum distance of 1.5 cm between the device and the user or bystanders. This device must not be co- located or operating in conjunction with any other antenna or transmitter.

Bluetooth

The Application Board 3.1 supports Bluetooth 5.0.

Disposal

The unit, accessories and packaging should be sorted for environmental- friendly recycling. Do not dispose of the device  into household and industrial waste!

According to the European Guideline 2012/19/EU, electric and electronic devices that are no longer usable must be collected  separately and disposed of in an environmentally correct manner.

Restrictions of use

The Application Board 3.1 application board is developed for professional use only.

Bosch Sensortec products are developed for the consumer goods industry. They may only be used within the parameters of this product data sheet. They are not fitfor use in life-sustaining or safety-critical systems. Safety-critical systems are those for which a  malfunction is expected to lead to bodily harm, death or severe property damage. In addition, they shall not be used directly or  indirectly for military purposes (including but not limited to nuclear, chemical or biological proliferation ofweaponsordevelopment ofmissile technology), nuclear power, deep seaorspace applications(including but not limited to satellite technology).

Bosch Sensortec products are released on the basis of the legal and normative requirements relevant to the Bosch Sensortec  product for use in the following geographical target market: BE, BG, DK, DE, EE, FI, FR, GR, IE, IT, HR, LV, LT,LU, MT,NL,AT,PL, PT,RO, SE, SK, SI, ES, CZ, HU, CY,US, CN, JP, KR, TW. If you need further information

Modifications reserved | Data subject to change without notice Document number: BST-DHW-AN008-00

Bosch Sensortec | Application Board 3.1 User Guide 24 | 24

or have further requirements, please contact your local sales contact.

The use of Bosch Sensortec products at the user’s own risk and responsibility.

 Application examples and hints

With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the  application of the device, Bosch Sensortec hereby disclaims any and all warranties and liabilities of any kind, including without  limitation warranties of non-infringement of intellectual property rights or copyrights of any third party. The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. They are provided for illustrative purposes only and no evaluation regarding infringement of intellectual property rights or copyrights or regarding functionality,  performance or error has been made.

11 Document history and modification

Rev. No

|

Chapter

|

Description of

modification/changes

|

Date

---|---|---|---

|

|

|

|

|

|

|

|

|

Modifications reserved | Data subject to change without notice Document number: BST-DHW-AN008-00

Bosch Sensortec“| Click or tap here toenter text. 22 | 22

Bosch Sensortec GmbH

Gerhard-Kindler-Strasse 9

72770 Reutlingen / Germany

contact@bosch-sensortec.com

www.bosch-sensortec.com

Modifications reserved

Preliminary – specifications subject to change without notice

Document number: BST-DHW-AN008-00

Modifications reserved | Data subject to change without notice Document number: BST-DHW-AN008-00

References

• Sensortec AS
• Bosch MEMS Technology | Bosch Sensortec
• Bosch MEMS Technology | Bosch Sensortec
• Nordic Semiconductor Infocenter
• NINA-B30 series (open CPU) | u-blox

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