samtec MB1-130-01-F-S-01-SL Mini Edge Card Socket with Guides Instructions
- June 12, 2024
- samtec
Table of Contents
samtec MB1-130-01-F-S-01-SL Mini Edge Card Socket with Guides
Product Information
- Product: F-221 SUPPLEMENT
- Series: MB1
- Type : Mini Edge Card Socket with Guides
- Plating Option: S (Gold flash on contact, Matte Tin on tail)
- Number of Pins : 01
- Card Slot: SL (Specify CARD SLOT from the chart)
- Mates with PCB Thicknesses: (0.80 mm) .031 and (1.60 mm) .062
- Pitch: (1.00 mm) .03937
- SMT Lead Coplanarity: (0.10 mm) .004 max (20-30), (0.15 mm) .006 max (40-50)*
- Choice of two card thicknesses: (5.44 mm) .214
- Other Options: Guides (A)
- Recognitions: For the complete scope of recognitions see www.samtec.com/quality
- File No.: E111594
- Also Available: (3.81) .150
Product Usage Instructions
- Ensure that the PCB has a thickness of either (0.80 mm) .031 or (1.60 mm) .062.
- If required, specify the CARD SLOT from the provided chart.
- For proper mating, align the Mini Edge Card Socket with the PCB and insert the card into the slot.
- Verify that the number of pins on the Mini Edge Card Socket matches the requirements of your application (in this case, 01).
- If using the Guides option, ensure they are properly installed for alignment purposes.
- Check the SMT Lead Coplanarity, which should be within the specified range (0.10 mm) .004 max (20-30) or (0.15 mm) .006 max (40-50)*.
- Consider using Gold plated pads on the mating board for optimal performance (recommended by Samtec).
- Refer to the product’s Recognition on www.samtec.com/quality for further information.
- For any non-standard or non-returnable sizes, styles, or options, contact Samtec directly.
SPECIFICATIONS
- For complete specifications and recommended PCB layouts see www.samtec.com?MB1
- Insulator Material: Black LCP
- Contact Material: BeCu
- Plating: Sn or Au over 50 µ” (1.27 µm) Ni
- Current Rating: 2.2 A per pin (6 pins powered)
- Operating Temp Range: -55 °C to +125 °C
- Insertion Depth: (5.26 mm) .207″ to (6.10 mm) .240″
- RoHS Compliant: Yes
Mates with:
- (0.80 mm) .031″ PCB,
- (1.60 mm) .062″ PCB
PROCESSING
- Lead–Free Solderable: Yes
- SMT Lead Coplanarity: (0.10 mm) .004″ max (20-30)
- (0.15 mm) .006″ max (40-50)*
- (.004″ stencil solution
- may be available; contact IPG @samtec.com)
RECOGNITIONS
For the complete scope of recognitions see www.samtec.com/quality
- ALSO AVAILABLE (MOQ Required)
- Other platings
- Note: Some sizes, styles, and options are non-standard, non-returnable
OVERVIEW
Dimension
- Important Note: Samtec recommends that pads on the mating board be Gold plated.
- Unless otherwise approved in writing by Samtec, all parts, and components are designed and built according to Samtec’s specifications which are subject to change without notice.
- Downloaded fromArrow.com.
- www.samtec.com
Documents / Resources
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samtec MB1-130-01-F-S-01-SL Mini Edge Card Socket with
Guides
[pdf] Instructions
MB1 130 01 F S 01 SL, MB1 130 01 F S 01 SL N, MB1 130 01 F S 01 SL Mini Edge
Card Socket with Guides, MB1 130 01 F S 01 SL, Mini Edge Card Socket with
Guides, Mini Edge Card Socket, Edge Card Socket, Card Socket, Socket
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Read User Manual Online (PDF format)
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