samtec MB1-130-01-F-S-01-SL Mini Edge Card Socket with Guides Instructions

samtec MB1-130-01-F-S-01-SL Mini Edge Card Socket with Guides

Product Information

• Product: F-221 SUPPLEMENT
• Series: MB1
• Type : Mini Edge Card Socket with Guides
• Plating Option: S (Gold flash on contact, Matte Tin on tail)
• Number of Pins : 01
• Card Slot: SL (Specify CARD SLOT from the chart)
• Mates with PCB Thicknesses: (0.80 mm) .031 and (1.60 mm) .062
• Pitch: (1.00 mm) .03937
• SMT Lead Coplanarity: (0.10 mm) .004 max (20-30), (0.15 mm) .006 max (40-50)*
• Choice of two card thicknesses: (5.44 mm) .214
• Other Options: Guides (A)
• Recognitions: For the complete scope of recognitions see www.samtec.com/quality
• File No.: E111594
• Also Available: (3.81) .150

Product Usage Instructions

1. Ensure that the PCB has a thickness of either (0.80 mm) .031 or (1.60 mm) .062.
2. If required, specify the CARD SLOT from the provided chart.
3. For proper mating, align the Mini Edge Card Socket with the PCB and insert the card into the slot.
4. Verify that the number of pins on the Mini Edge Card Socket matches the requirements of your application (in this case, 01).
5. If using the Guides option, ensure they are properly installed for alignment purposes.
6. Check the SMT Lead Coplanarity, which should be within the specified range (0.10 mm) .004 max (20-30) or (0.15 mm) .006 max (40-50)*.
7. Consider using Gold plated pads on the mating board for optimal performance (recommended by Samtec).
8. Refer to the product’s Recognition on www.samtec.com/quality for further information.
9. For any non-standard or non-returnable sizes, styles, or options, contact Samtec directly.

SPECIFICATIONS

• For complete specifications and recommended PCB layouts see www.samtec.com?MB1
• Insulator Material: Black LCP
• Contact Material: BeCu
• Plating: Sn or Au over 50 µ” (1.27 µm) Ni
• Current Rating: 2.2 A per pin (6 pins powered)
• Operating Temp Range: -55 °C to +125 °C
• Insertion Depth: (5.26 mm) .207″ to (6.10 mm) .240″
• RoHS Compliant: Yes

Mates with:

• (0.80 mm) .031″ PCB,
• (1.60 mm) .062″ PCB

PROCESSING

• Lead–Free Solderable: Yes
• SMT Lead Coplanarity: (0.10 mm) .004″ max (20-30)
  • (0.15 mm) .006″ max (40-50)*
  • (.004″ stencil solution
• may be available; contact IPG @samtec.com)

RECOGNITIONS

For the complete scope of recognitions see www.samtec.com/quality

• ALSO AVAILABLE (MOQ Required)
• Other platings
• Note: Some sizes, styles, and options are non-standard, non-returnable

OVERVIEW

Dimension

• Important Note: Samtec recommends that pads on the mating board be Gold plated.
• Unless otherwise approved in writing by Samtec, all parts, and components are designed and built according to Samtec’s specifications which are subject to change without notice.
• Downloaded fromArrow.com.
• www.samtec.com

Documents / Resources

| samtec MB1-130-01-F-S-01-SL Mini Edge Card Socket with Guides [pdf] Instructions
MB1 130 01 F S 01 SL, MB1 130 01 F S 01 SL N, MB1 130 01 F S 01 SL Mini Edge Card Socket with Guides, MB1 130 01 F S 01 SL, Mini Edge Card Socket with Guides, Mini Edge Card Socket, Edge Card Socket, Card Socket, Socket
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