HM581 IEEE 802.11ah Wireless LAN Module

“`html

Specifications

General

• Supports 902 ~ 928MHz frequency band

• Supports single-stream data rate up to 32.5Mbps @8MHz or 15
  Mbps @4MHz channel

• Supports channel width options of 1/2/4/8 MHz

• Supports Modulation and Coding Scheme (MCS) levels MCS 0-7 and
  MCS 10

• Modulation: BPSK & QPSK, 16-QAM & 64 QAM

• Supports for 1 MHz and 2 MHz duplicate modes

Host Interface

• SDIO 2.0 (slave) Default Speed (DS) at 25MHz
• SDIO 2.0 (slave) High Speed (HS) at 50MHz
• Supports for both 1-bit and 4-bit data mode
• Supports for SPI mode operation

Standards Supported

• IEEE Std 802.11ah-2016 compliant

Security Features

• AES encryption engine

• Hardware support for SHA1 and SHA2 hash functions (SHA-256,
  SHA-384, SHA-512)

• WPA3 including protected management frames (PMF)

• Opportunistic Wireless Encryption (OWE)

Peripheral Interfaces

• SDIO/SPI, I2C and UART
• Supports for STA and AP roles

Product Usage Instructions

Installation

1. Ensure the device is powered off before installation.

2. Insert the module into the corresponding slot on the host
   device.

3. Secure the module in place according to the host device’s
   guidelines.

4. Power on the device and follow the host device’s setup process
   for new modules.

Configuration

1. Access the host device’s settings menu.

2. Select the wireless LAN module settings option.

3. Configure the frequency band, data rate, and security settings
   as per your requirements.

4. Save the changes and restart the device if necessary.

Frequently Asked Questions (FAQ)

Q: How do I update the firmware of the wireless LAN

module?

A: To update the firmware, please refer to the official
documentation provided by the manufacturer. Typically, firmware
updates can be done through a software utility or a specific
process outlined by the manufacturer.

Q: What is the default encryption method supported by the

module?

A: The default encryption method supported is AES (Advanced
Encryption Standard).

Q: Can this module operate in both client and access point

modes simultaneously?

A: Yes, this module supports both STA (client) and AP (access
point) roles, allowing it to operate in both modes
simultaneously.

“`

AW-HM581
IEEE 802.11ah Wireless LAN Module

FORM NO.: FR2-015_ A

Datasheet
Rev. B DF
(For STD)
1 Responsible DepartmentWBU

Features

General
Support 902 ~ 928MHz frequency band Support single-stream data rate up to
32.5Mbps @8MHz or 15 Mbps @4MHz channel Support channel width options of 1/2/4/8 MHz Support Modulation and Coding Scheme (MCS) levels MCS 0-7 and MCS 10 Modulation: BPSK & QPSK, 16-QAM & 64 QAM Support for 1 MHz and 2 MHz duplicate modes
Host interface
SDIO 2.0 (slave) Default Speed (DS) at 25MHz
SDIO 2.0 (slave) High Speed (HS) at 50MHz Support for both 1-bit and 4-bit data mode Support for SPI mode operation
Standards Supported
IEEE Std 802.11ah-2016 compliant
Security Features
AES encryption engine Hardware support for SHA1 and SHA2 hash
functions (SHA-256, SHA-384, SHA-512) WPA3 including protected management

frames (PMF) Opportunistic Wireless Encryption (OWE)
Peripheral Interfaces
SDIO/SPI, I2C and UART Support for STA and AP roles

FORM NO.: FR2-015_ A

2 Responsible DepartmentWBU

Revision History

Document NO: R2-2581-DST-01

Version

Revision Date

DCN NO.

A 2022/07/14 DCN026851

B 2023/04/21

Description
Initial version Add power consumption and package information

Initials Daniel Lee Daniel Lee

Approved N.C. Chen N.C. Chen

FORM NO.: FR2-015_ A

3 Responsible DepartmentWBU

Table of Contents
Features …………………………………………………………………………………………………………………………. 2 Revision History……………………………………………………………………………………………………………… 3 Table of Contents……………………………………………………………………………………………………………. 4 1. Introduction ………………………………………………………………………………………………………………… 5
1.1 Product Overview ………………………………………………………………………………………………. 5 1.2 Block Diagram …………………………………………………………………………………………………… 6 1.3 Specifications Table …………………………………………………………………………………………… 7
1.3.1 General ……………………………………………………………………………………………………………………7 1.3.2 WLAN………………………………………………………………………………………………………………………7 1.3.3 Operating Conditions …………………………………………………………………………………………………8
2. Pin Definition ………………………………………………………………………………………………………………. 9 2.1 Pin Map……………………………………………………………………………………………………………… 9
3. Electrical Characteristics …………………………………………………………………………………………… 12 3.1 Absolute Maximum Ratings………………………………………………………………………………. 12 3.2 Recommended Operating Conditions ……………………………………………………………….. 12 3.3 Timing Sequence ……………………………………………………………………………………………… 13
3.3.1 SDIO Bus Timing …………………………………………………………………………………………………… 13 3.3.2 SPI Bus ………………………………………………………………………………………………………………… 14 3.3.3 UART Bus …………………………………………………………………………………………………………….. 14 3.3.4 I2C Bus Timing ……………………………………………………………………………………………………… 15
3.4 Power Consumption…………………………………………………………………………………………. 16
3.4.1 Transmit Power Consumption………………………………………………………………………………….. 16 3.4.2 Receive Power Consumption…………………………………………………………………………………… 16
4. Mechanical Information ……………………………………………………………………………………………… 17 4.1 Mechanical Drawing …………………………………………………………………………………………. 17
5. Package information………………………………………………………………………………………………….. 18

FORM NO.: FR2-015_ A

4 Responsible DepartmentWBU

1. Introduction
1.1 Product Overview
AzureWave Technologies, Inc. introduces the pioneer of the IEEE 802.11ah WIFI LGA module — AW-HM581. The AW-HM581 is an IEEE 802.11ah Wi-Fi module designed in compliance with the IEEE 802.11ah standard, supporting data rates up to 32.5 Mbps that operates in the Sub 1GHz license-exempt band, offering longer ranger and higher data rate for internet of things (IoT) applications. The AW- HM581 enables streamlined data transfer interoperability with existing Wi-Fi networks while meeting up to 1Km long range data transfer with low power consumption requirements.
The AW-HM581 integrated IEEE 802.11ah Sub-1G 8MHz Single-chip MAC/PHY/Radio SoC Morse Micro MM6108, ultra-long-reach PA, high linearity LNA, T/R switch, 32 MHz crystal and it has been designed for a simplified Wi-Fi HaLow connection to an external host for applications in which a customer wants to merely replace their prior RF technology with a Wi-Fi HaLow connection while leveraging the latest WPA3 security protocol. AW-HM581 supports SDIO 2.0 compliant slave interface and SPI mode operation, and many peripherals such as general I2C, UART and GPIOs. In addition, its MAC supports for STA and AP roles.

FORM NO.: FR2-015_ A

5 Responsible DepartmentWBU

1.2 Block Diagram TBD

FORM NO.: FR2-015_ A

6 Responsible DepartmentWBU

1.3 Specifications Table 1.3.1 General

Features Product Description
Major Chipset Host Interface
Dimension Form Factor
Antenna Weight

Description
IEEE 802.11ah Wireless LAN Module
Morse Micro MM6108 (48-pin QFN)
SDIO/SPI 13mm x 13mm x 2.1mm (Tolerance remarked in mechanical drawing) LGA module, 44 pins For Stamp Module, “1T1R, external” ANT MainTX/RX 0.7g

1.3.2 WLAN
Features WLAN Standard WLAN VID/PID WLAN SVID/SPID Frequency Rage
Modulation

IEEE 802.11ah TBD

Description

TBD USA 902 – 928 MHz
OFDM, BPSK, QPSK, 16-QAM, 64-QAM

Channel Bandwidth 1/2/4/8 MHz

Min

Typ

Max

Output Power (Board Level Limit)*

MCS0 (1/2/4/8 MHz) @EVM-5dB

21.5

MCS7 (1/2/4/8 MHz) @EVM-27dB

15.5

23

24.5

17

18.5

Unit dBm dBm

FORM NO.: FR2-015_ A

7 Responsible DepartmentWBU

Receiver Sensitivity Data Rate

Min

Typ

Max

Unit

MCS0 (1 MHz)

-100dBm -95dBm dBm

MCS0 (2 MHz)

-97dBm -92dBm dBm

MCS0 (4 MHz)

-94dBm -89dBm dBm

MCS0 (8 MHz)

-91dBm -86dBm dBm

MCS7 (1 MHz)

-82dBm -77dBm dBm

MCS7 (2 MHz)

-79dBm -74dBm dBm

MCS7 (4 MHz)

-76dBm -71dBm dBm

MCS7 (8 MHz)

-73dBm -68dBm dBm

1 MHz Bandwidth: up to 3.333Mbps 2 MHz Bandwidth: up to 7.222Mbps 4 MHz Bandwidth: up to 15Mbps 8 MHz Bandwidth: up to 32.5Mbps

AES encryption engine

Hardware support for SHA1 and SHA2 hash functions (SHA-256,

Security

SHA-384,SHA-512) WPA3 including protected management frames (PMF) Opportunistic Wireless Encryption (OWE)

• If you have any certification questions about output power please contact FAE directly.

1.3.3 Operating Conditions

Features

Description

Voltage
Operating Temperature Operating Humidity
Storage Temperature

Operating Conditions VBAT: 3.3V VDDIO: 3.3V -40~85
less than 85%R.H -40~90

Storage Humidity less than 60%R.H

ESD Protection

Human Body Model TBD

Changed Device Model TBD

FORM NO.: FR2-015_ A

8 Responsible DepartmentWBU

2. Pin Definition
2.1 Pin Map

AW-HM581 Pin Map (Top View)

FORM NO.: FR2-015_ A

9 Responsible DepartmentWBU

2.2 Pin Table

Pin No.

Definition

1 GND

2 ANT

3 GND

4 NC

5 NC

6 MM_WAKE

7 NC

8 NC

9 VBAT

10 GND

11 GND

12 MM_RESET_N

13 NC

14 MM_SD_D2

15 MM_SD_D3

16 MM_SD_CMD

17 MM_SD_CLK

18 MM_SD_D0

19 MM_SD_D1

20 GND

21 NC

22 VDDIO

23 NC

FORM NO.: FR2-015_ A

Basic Description GROUND RF IN/OUT GROUND No Connection No Connection WAKE from sleep No Connection No Connection 3.3V power supply GROUND GROUND Reset (active low) No Connection SDIO Data pin 2 SDIO Data pin 3 SDIO Command pin SDIO Clock pin (input) SDIO Data pin 0 SDIO Data pin 1 GROUND No Connection I/O supply Input No Connection
10 Responsible DepartmentWBU

Voltage Type GND I/O GND

I

3.3V

Power GND GND I/O

I/O I/O I/O
I I/O I/O GND

Power

24 NC 25 MM_GPIO6 26 MM_GPIO5 27 MM_GPIO4 28 MM_GPIO3 29 MM_GPIO2 30 MM_GPIO1 31 GND 32 MM_GPIO7 33 GND 34 MM_GPIO11 35 MM_GPIO10 36 GND 37 MM_GPIO9 38 MM_GPIO8 39 MM_JTAG_TDO 40 MM_GPIO0 41 MM_JTAG_TMS 42 MM_JTAG_TDI 43 MM_JTAG_TRST 44 MM_JTAG_TCK

No Connection General purpose I/O General purpose I/O General purpose I/O General purpose I/O General purpose I/O General purpose I/O GROUND General purpose I/O GROUND General purpose I/O General purpose I/O GROUND General purpose I/O General purpose I/O JTAG data output General purpose I/O JTAG mode selection JTAG data input JTAG reset JTAG clock

FORM NO.: FR2-015_ A

11 Responsible DepartmentWBU

I I/O I/O I/O I/O I/O I/O GND I/O GND I/O I/O GND I/O I/O O I/O
I I I I

3. Electrical Characteristics

3.1 Absolute Maximum Ratings

Symbol
VBAT VDDIO
Tstg

Parameter
3.3V power supply I/O supply Input Storage temperature

Minimum

Typical

Maximum

Unit

-0.5

–

4.3

V

-0.5

–

4.3

V

-40

–

90

3.2 Recommended Operating Conditions

Symbol
VBAT VDDIO TAMBIENT

Parameter 3.3V power supply 3.3V I/O supply Input
Ambient temperature

Minimum

Typical

Maximum

Unit

3.0

3.3

3.6

V

1.8

3.3

VBAT

V

-40

25

85

FORM NO.: FR2-015_ A

12 Responsible DepartmentWBU

3.3 Timing Sequence 3.3.1 SDIO Bus Timing
The SDIO clock rate supports up to 50MHz. The device always operates in SD high speed mode.

FORM NO.: FR2-015_ A

13 Responsible DepartmentWBU

3.3.2 SPI Bus
The SPI clock rate supports up to 50MHz. The SPI bus timing is identical to the SDIO bus timing, where MOSI and MISO are considered input and output timing, respectively, in the SDIO timing specification.
The SPI bus defaults to clock idling at logical 0 (CPOL=0), and data is launched and captured on the positive edges of the clock, as per SDIO high- speed mode. It may be configured to behave like CPHA=0 (drive output on negative edge, sample on positive edge) after being initialized.

3.3.3 UART Bus
Two universal asynchronous receiver/transmitter (UARTs) are available and provide a means for serial communication to off-chip devices. The UART cores are as-provided by the SiFive IP repository. The UART peripheral does not support hardware flow control or other modem control signals, or synchronous serial data transfers.
We will clock the UARTs with a maximum clock speed of 30MHz (TBD), meaning maximum baud of the UART will be around 30Mbaud or 30Mbits/s if a divisor of 0 is specified.

Pin Name Default Function I/O Function

32 MM_GPIO7

GPIO

UART1 Tx

25 MM_GPIO6

GPIO

UART1 Rx

28 MM_GPIO3

GPIO

UART0 Tx

29 MM_GPIO2

GPIO

UART0 Rx

FORM NO.: FR2-015_ A

14 Responsible DepartmentWBU

3.3.4 I2C Bus Timing
An I2C master interface is available. It consists of two lines, SDA and SCL, which are bidirectional, connected to a positive supply voltage via a current- source or pull-up resistor.

Pin Name Default Function I/O Function

27 MM_GPIO4

GPIO

I2C SDA

26 MM_GPIO5

GPIO

I2C SCL

Definition of timing for F/S-mode devices on the I2C-bus. All values referred to

FORM NO.: FR2-015_ A

15 Responsible DepartmentWBU

3.4 Power Consumption

3.4.1 Transmit Power Consumption

Band (MHz)

Modulation

BW (MHz)

DUT Condition

VBAT = 3.3V

VBAT (mA)

Max.

Avg.

1

305mA

301mA

MCS0

2 4

Tx @ 23 dBm

278mA 249mA

274mA 247mA

915

8 1

230mA 189mA

227mA 188mA

MCS7

2 4

Tx @ 17 dBm

151mA 143mA

150mA 141mA

8

143mA

142mA

• The power consumption is based on AzureWave test environment, these data for reference only.

3.4.2 Receive Power Consumption

Band Modulatio BW

(MHz)

n

(MHz)

DUT Condition

VBAT = 3.3V

VBAT (mA)

Max.

Avg.

1

Continuous Rx @ -95 dBm

32.3mA

32.3mA

MCS0

2

Continuous Rx @ -92 dBm

4

Continuous Rx @ -89 dBm

34.3mA 43.0mA

34.2mA 42.8mA

915

8

Continuous Rx @ -86 dBm

1

Continuous Rx @ -77 dBm

55.8mA 32.8mA

55.5mA 32.7mA

MCS7

2

Continuous Rx @ -74 dBm

4

Continuous Rx @ -71 dBm

36.3mA 43.1mA

36.2mA 43mA

8

Continuous Rx @ -68 dBm

52.8mA

52.6mA

• The power consumption is based on AzureWave test environment, these data for reference only.

FORM NO.: FR2-015_ A

16 Responsible DepartmentWBU

4. Mechanical Information
4.1 Mechanical Drawing

FORM NO.: FR2-015_ A

17 Responsible DepartmentWBU

5. Package information
1. One reel can pack 1000pcs 2. One production label is pasted on the reel, one desiccant and one humidity indicator card are
put on the reel
One desiccant One production label One humidity indicator card 3. One reel is put into the anti-static moisture barrier bag, and then one label is pasted on the bag
One production label
4. A bag is put into the anti-static pink bubble wrap

FORM NO.: FR2-015_ A

One anti-static pink bubble wrap
18 Responsible DepartmentWBU

5. A bubble wrap is put into the inner box and then one label is pasted on the inner box
One production label 6. 5 inner boxes could be put into one carton
Production 7. Sealing the carton by AzureWave tape

FORM NO.: FR2-015_ A

19 Responsible DepartmentWBU

8. One carton label and one box label are pasted on the carton. If one carton is not full, one balance label pasted on the carton

One carton label One box label Example of carton label

One production label AW-HM581

Example of box label

FORM NO.: FR2-015_ A

20 Responsible DepartmentWBU

Example of production label

AW-HM581

Example of balance label

FORM NO.: FR2-015_ A

21 Responsible DepartmentWBU

AW-HM581
IEEE 802.11ah Wireless LAN Module Layout Guide
Rev. 0.1
(For Standard)

FORM NO.: FR2-015_ A

22 Responsible DepartmentWBU

Revision History

Document NO:

Version

Revision Date

0.1

2022/9/27

DCN NO.

Description
Initial Version

Initials
Daniel Lee

Approved
NC Chen

FORM NO.: FR2-015_ A

23 Responsible DepartmentWBU

Table of Contents

Revision History 23

Table of Contents 24

1 Overview 25

1.1 Device supported 25

2 GENERAL RF GUIDELINES 26

3 Ground Layout 27

4 Power Layout

27

5 Digital Interface 27

6 RF Trace 27

7 Antenna 28

8 Antenna Matching 28

9 SHIELDING CASE 30

10 GENERAL LAYOUT GUIDELINES 30

11 The other layout guide Information 30

12 LGA module layout footprint recommend 32

12.1 LGA Module stencil and Pad opening Suggestion 32

FORM NO.: FR2-015_ A

24 Responsible DepartmentWBU

1 Overview
1.1 Device supported
This document provides key guidelines and recommendations to be followed when creating AW-HM581 (13 x 13 mm LGA Module) layout. It is strongly recommended that layouts be reviewed by the AzureWave engineering team before being released for fabrication. The following is a summary of the major items that are covered in detail in this application note. Each of these areas of the layout should be carefully reviewed against the provided recommendations before the PCB goes to fabrication.

FORM NO.: FR2-015_ A

25 Responsible DepartmentWBU

2 GENERAL RF GUIDELINES
Follow these steps for optimal WLAN performance. 1. Control WLAN 50 ohm RF traces by doing the following:
· Route traces on the top layer as much as possible and use a continuous reference ground plane underneath them. · Verify trace distance from ground flooding. At a minimum, there should be a gap equal to the width of one trace between the trace and ground flooding. Also keep RF signal lines away from metal shields. This will ensure that the shield does not detune the signals or allow for spurious signals to be coupled in. · Keep all trace routing inside the ground plane area by at least the width of a trace. · Check for RF trace stubs, particularly when bypassing a circuit.
2. Keep RF traces properly isolated by doing the following: · Do not route any digital or analog signal traces between the RF traces and the reference ground. · Keep the pins and traces associated with RF inputs away from RF outputs. If two RF traces are close each other, then make sure there is enough room between them to provide isolation with ground fill. · Verify that there are plenty of ground vias in the shield attachment area. Also verify that there are no non-ground vias in the shield attachment area. Avoid traces crossing into the shield area on the shield layer.
3. Consider the following RF design practices: · Verify that the RF path is short, smooth, and neat. Use curved traces for all turns; never use 90degree turns. Avoid width discontinuities over pads. If trace widths differ significantly from component pad widths, then the width change should be mitered. Verify there are no stubs. · Do not use thermals on RF traces because of their high loss. · The RF traces between AW-HM581 RF_ANT pin and antenna must be made using 50 controlled-impedance transmission line.

FORM NO.: FR2-015_ A

26 Responsible DepartmentWBU

3 Ground Layout
Please follow general ground layout guidelines. Here are some general rules for customers’ reference. ·The layer 2 of PCB should be a complete ground plane. The rule has to be obeyed strictly in the RF section while RF traces are on the top layer. ·Each ground pad of components on top layer should have via drilled to PCB layer 2 and via should be as close to pad as possible. A bulk decoupling capacitor needs two or more. ·Don’t place ground plane and route signal trace below printed antenna or chip antenna to avoid destroying its electromagnetic field, and there is no organic coating on printed antenna. Check antenna chip vendor for the layout guideline and clearance. ·Move GND vias close to the pads.
4 Power Layout
Please follow general power layout guidelines. Here are some general rules for customers’ reference. ·A 10uF capacitor is used to decouple high frequency noise at digital and RF power terminals. This capacitor should be placed as close to power terminals as possible. ·In order to reduce PCB’s parasitic effects, placing more via on ground plane is better.
5 Digital Interface
Please follow power and ground layout guidelines. Here are some general rules for customers’ reference. ·The digital interface to the module must be routed using good engineering practices to minimize coupling to power planes and other digital signals. ·The digital interface must be isolated from RF trace.
6 RF Trace
The RF trace is the critical to route. Here are some general rules for customers’ reference. ·The RF trace impedance should be 50 between ANT port and antenna matching network. ·The length of the RF trace should be minimized. ·To reduce the signal loss, RF trace should laid on the top of PCB and avoid any via on it. ·The CPW (coplanar waveguide) design and the microstrip line are both recommended; the customers can choose either one depending on the PCB stack of their products. ·The RF trace must be isolated with aground beneath it. Other signal traces should be isolated from the RF trace either by ground plane or ground vias to avoid coupling. ·To minimize the parasitic capacitance related to the corner of the RF trace, the right angle corner is not recommended.
If the customers have any problem in calculation of trace impedance, please contact AzureWave.

FORM NO.: FR2-015_ A

27 Responsible DepartmentWBU

Correct RF trace

Right-angled corner

Incorrect RF trace

Via on RF trace

7 Antenna
All the high-speed traces should be moved far away from the antenna. For the best radiation performance, check antenna chip vendor for the layout guideline and clearance.

8 Antenna Matching

PCB designer should reserve an antenna matching network for post tuning to ensure the antenna performance in

FORM NO.: FR2-015_ A

28 Responsible DepartmentWBU

different environments. Matching components should be close to each other. Stubs should also be avoided to reduce parasitic while no shunt component is necessary after tuning.

FORM NO.: FR2-015_ A

29 Responsible DepartmentWBU

9 SHIELDING CASE
Magnetic shielding, ferrite drum shielding, or magnetic-resin coated shielding is highly recommended to prevent EMI issues.
10 GENERAL LAYOUT GUIDELINES
Follow these guidelines to obtain good signal integrity and avoid EMI: 1. Place components and route signals using the following design practices:
· Keep analog and digital circuits in separate areas. · Orient adjacent-layer traces so that they are perpendicular to one another to reduce crosstalk. · Keep critical traces on internal layers, where possible, to reduce emissions and improve immunity to external
noise. However, RF traces should be routed on outside layers to avoid the use of vias on these traces. · Keep all trace lengths to a practical minimum. Keep traces, especially RF traces, straight wherever possible. Where turns are necessary, use curved traces or two 45-degree turns. Never use 90-degree turns. 2. Consider the following with respect to ground and power supply planes: · Route all supply voltages to minimize capacitive coupling to other supplies. Capacitive coupling can occur if supply traces on adjacent layers overlap. Supplies should be separated from each other in the stack-up by a ground plane, or they should be coplanar (routed on different areas of the same layer). · Provide an effective ground plane. Keep ground impedance as low as possible. Provide as much ground plane as possible and avoid discontinuities. Use as many ground vias as possible to connect all ground layers together. · Maximize the width of power traces. Verify that they are wide enough to support target currents, and that they can do so with margin. Verify that there are enough vias if the traces need to change layers. 3. Consider these power supply decoupling practices: · Place decoupling capacitors near target power pins. If possible, keep them on the same side as the IC they decouple to avoid vias that add inductance. · Use appropriate capacitance values for the target circuit.

11 The other layout guide Information

· High speed interface (i.e. UART/SPI) shall have equal electrical length. Keep them away from noise sensitive blocks. · Good power integrity of VDDIO will improve the signal integrity of digital interfaces. · Good return path and well shielded signal can reduce crosstalk, EMI emission and improve signal integrity. · RF IO is around 50 ohms, reserve Pi or T matching network to have better signal transition from

FORM NO.: FR2-015_ A

30 Responsible DepartmentWBU

port to port. · Smooth RF trace help to reduce insertion loss. Do not use 90 degrees turn (use two 45 degrees turns or one miter bend instead). · Discuss with AzureWave Engineer after you finish schematic and layout job.

FORM NO.: FR2-015_ A

31 Responsible DepartmentWBU

12 LGA module layout footprint recommend
12.1 LGA Module stencil and Pad opening Suggestion
Stencil thickness0.08~0.1mm Function Pad opening size suggestion: Max. 1:1
PS: This opening suggestion just for customer reference, please discuss with AzureWave’s Engineer before you start SMT.
Solder Paste: Need to use type 5 paste (powder 5). 13 x 13 mm Solder Printer Opening Reference:

FORM NO.: FR2-015_ A

32 Responsible DepartmentWBU

IF Cu Pad size : 0.85mm
Pad opening suggestion: 0.75mm

FORM NO.: FR2-015_ A

33 Responsible DepartmentWBU

FCC Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help.

The OEM or integrator is obligated to adhere to these requirements and restrictions as a condition for using the module’s certification. The OEM or integrator is responsible to perform the required additional host regulatory testing and/or obtaining the required host approvals for compliance. Per KDB 996369 D03 v01r01 OEM Manual, this module is intended for OEM integrators under the following conditions: Ensure that the end-user has no manual instructions to remove or install module. 2.2 List of applicable FCC and ISED rules This module is certified pursuant to Part 15 rule section 15.247 and RSS-247.

2.3 Summarize the specific operational use conditions

This module has been approved to operate with the antenna types listed below,

with the maximum permissible gain indicated.

Frequency Band

Model Number

Antenna Type

902-928MHz

AN0915-5001BSM

Diople

Gain(dBi) 2

2.4 Limited module procedures Not applicable.

2.6 RF exposure considerations
This module is restricted to installation in products for use only in mobile and fixed applications.
The host product manufacturer must provide following statement in end-product manuals. FCC Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This
equipment should be installed and operated with minimum distance 20cm between the radiator & your body.

2.7 Antennas

This module has been approved to operate with the antenna types listed below, with the maximum permissible gain

indicated.

Frequency Band

Model Number

Antenna Type

Gain(dBi)

902-928MHz

AN0915-5001BSM

Diople

2

FORM NO.: FR2-015_ A

34 Responsible DepartmentWBU

2.8 Label and compliance information
Label of the end product:
FCC:
The host product must be labeled in a visible area with the following ” Contains FCC ID: TLZ-HM581″. The end product shall bear the following 15.19 statement: This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. ISED: This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: “Contains transmitter module IC: 6100A-HM581” or “Contains IC: 6100A-HM581” Contient le module d’émission IC: 6100A-HM581 The Host Model Number (HMN) must be indicated at any location on the exterior of the end product or product packaging or product literature which shall be available with the end product or online.

2.9 Information on test modes and additional testing requirements This module has been approved under stand-alone configuration. The separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093/RSS-102 and different antenna configurations. The information on how to configure test modes for host product evaluation for different operational conditions for a stand-alone modular transmitter in a host, versus with multiple, simultaneously transmitting modules or other transmitters in a host can be found at KDB Publication 996369 D04.

OEM integrator is still responsible for testing their end product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). IMPORTANT NOTE: In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC/ISED authorization is no longer considered valid and the FCC/IC No. cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for reevaluating the end product (including the transmitter) and obtaining a separate FCC/ISED authorization.

2.10 Additional testing, Part 15 Subpart B and ICES-003 disclaimer Appropriate measurements (e.g. Part 15 Subpart B compliance) and if applicable additional equipment authorizations (e.g. SDoC) of the host product to be addressed by the integrator/manufacturer. This module is only FCC/ISED authorized for the specific rule parts 15.247, RSS-247 listed on the grant, and the host product manufacturer is responsible for compliance to any other FCC/ISED rules that apply to the host product as being Part 15 Subpart B/ICES-003 compliant.

2.11 Note EMI Considerations Note that a host manufacture is recommended to use D04 Module Integration Guide recommending as “best practice” RF design engineering testing and evaluation in case non-linear interactions generate additional noncompliant limits due to module placement to host components or properties For standalone mode, reference the guidance in D04 Module Integration Guide and for simultaneous mode; see D02 Module Q&A Question 12, which permits the host manufacturer to confirm compliance.

2.12 How to make changes If any changes or modifications need to be made to the integrated product, such as adding or adjusting the antenna or cable, follow the guidelines provided by Grantee. For further assistance, please contact: patrick.lin@azurewave.com

The user manual of the end product should include (information for OEMs):

FORM NO.: FR2-015_ A

35 Responsible DepartmentWBU

The module must be installed and used in strict accordance with the manufacturer’s instructions as described in the user documentation that comes with the product. Information To Be Supplied to the End User by the OEM or Integrator FCC: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. The antenna(s) used for this transmitter must not transmit simultaneously with any other antenna or transmitter.
ISED:
This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canada’s licence-exempt RSS(s). Operation is subject to the following two conditions: 1. This device may not cause interference. 2. This device must accept any interference, including interference that may cause undesired operation of the device. L’émetteur/récepteur exempt de licence contenu dans le présent appareil est conforme aux CNR d’Innovation, Sciences et Développement économique Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes : 1. L’appareil ne doit pas produire de brouillage; 2. L’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement.
ISED Radiation Exposure Statement: This equipment complies with IC RSS-102 radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. Cet équipement est conforme aux limites d’exposition aux rayonnements IC établies pour un environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20cm de distance entre la source de rayonnement et votre corps.
The transmitter module may not be co-located with any other transmitter or antenna. Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne.
The end user manual shall include all required regulatory information/warning as shown in this document.

FORM NO.: FR2-015_ A

36 Responsible DepartmentWBU

Read User Manual Online (PDF format)

Read User Manual Online (PDF format)  >>

Download This Manual (PDF format)

Download this manual  >>