ANALOG DEVICES ADRF5532 Evaluation Board User Guide

ADRF5532 Evaluation Board
User Guide Evaluating the ADRF5532, 2.3 GHz to 2.7
GHz, Receiver Front End
UG-2205

FEATURES

► Full featured evaluation board for the ADRF5532
► Easy connection to test equipment
► Thru line for calibration

EQUIPMENT NEEDED

► DC power supplies
► Network analyzer

GENERAL DESCRIPTION

The ADRF5532 is an integrated RF, front-end multichip module designed for time division duplex (TDD) applications. The device operates from 2.3 GHz to 2.7 GHz. The ADRF5532 is configured with a low-noise amplifier (LNA) and a  high- power, silicon, single pole double throw (SPDT) switch.
This user guide describes the ADRF5532-EVALZ, designed to easily evaluate the features and performance of the ADRF5532.
Figure 1 shows a photograph of the ADRF5532-EVALZ.
Note that the ADRF5532 IC is populated on the ADRF5534 bare evaluation board. However, the whole assembly is the ADRF5532EVALZ Full details about the device are available in the ADRF5532 data sheet. Consult it when using the ADRF5532-EVALZ.

EVALUATION BOARD PHOTOGRAPH

EVALUATION BOARD HARDWARE

OVERVIEW
The ADRF5532-EVALZ is preinstalled with connectors (end launch subminiature version A (SMA)) and assembled with the ADRF5532 and its application circuitry. All components are placed on the primary side of the ADRF5532- EVALZ. Figure 8 shows an assembly drawing for the ADRF5532-EVALZ. Figure 9 provides an ADRF5532-EVALZ schematic.
LAYOUT
The ADRF5532-EVALZ is designed using RF circuit design techniques on an 8-layer printed circuit board (PCB). Figure 2 shows the PCB stack-up.

The outer copper layers are 2 oz (2.7 mil) thick and the inner layers are 1 oz (1.3 mil) thick. The top dielectric material is 10 mil Rogers 4350B, which provides 50 Ω controlled impedance and optimizes high-frequency performance. The  remaining six dielectric layers are FR4 based filler layers that improve the mechanical strength of the ADRF5532-EVALZ and meet the overall board thickness of 62 mil. All RF traces are routed on the top layer, and the remaining seven  layers are ground planes that provide a solid ground for RF transmission lines and help to manage thermal rise on the ADRF5532-EVALZ during high-power operations.
The RF transmission lines are designed using a coplanar waveguide (CPWG) model with a width of 18 mil and a ground spacing of 13 mil to have a characteristic impedance of 50 Ω. Ground via fences are arranged on both sides of a  CPWG to improve isolation between nearby RF lines and other signal lines.
The exposed ground pad of the ADRF5532, which is soldered on the PCB ground pad, is the main thermal conduit for heat dissipation. The PCB ground pad is densely populated with filled through vias to provide the lowest possible thermal resistance path temperature from the top to the bottom of the PCB. The connections from the package ground leads to ground are kept as short as possible.
RF INPUTS AND OUTPUTS
The ADRF5532-EVALZ has five edge-mounted SMA connectors for the RF inputs and outputs, as shown in Table 1. The SMA connectors on the thru line are not populated by default and can be connected to measure and calibrate the evaluation board loss effects. Use the thru line on THRU1 and THRU2 to calibrate the ANT, TERM, and RX evaluation board loss.
Table 1. RF Inputs and Outputs

POWER SUPPLY AND CONTROL INPUTS
The ADRF5532-EVALZ has one power-supply input, one control input, and one ground, as shown in Table 2. The DC test points are populated on the V , CTRL, and GND test points.
A single 5 V supply is connected to the DC test point on the V DD DD  test point. Ground reference can be connected to the GND test point. The typical total current consumption for the ADRF5532 is 118 mA in receive operation. The supply pin of the ADRF5532EVALZ is decoupled with 100 pF and 4.7 µF capacitors.
A single 5 V supply is connected to the DC test point on the CTRL test point. The control pin of the ADRF5532-EVALZ is decoupled with 100 pF. When no connection is made to the CTRL control input, the RF channel is in termination mode with LNA powered down.
Table 2. Test Points for Power Supply and Control Inputs

TEST PROCEDURE

BIASING SEQUENCE
To bias up the ADRF5532-EVALZ, perform the following steps:

1. Ground the GND test point.
2. Bias up VDD test point.
3. Bias up the CTRL test point.
4. Apply an RF input signal.

The ADRF5532-EVALZ is shipped fully assembled and tested.
Figure 3 provides a basic test setup diagram to evaluate the s-parameters (receive gain, transmit insertion loss and isolation, and RF input and output return losses) using a network analyzer.
Note that PSU in Figure 3 means power supply unit. Perform the following steps to complete the test setup and verify the operation of the ADRF5532-EVALZ:

1. Connect the GND test point to the ground terminal of the power supply.
2. Connect the VDD test point to the voltage output terminal of the 5 V supply that sources a current of approximately 118 mA in receive operation or 15 mA for transmit operation.
3. Connect the CTRL test point to the voltage output terminal of the 5 V supply for receive operation. The ADRF5532-EVALZ can be configured in different modes by connecting the CTRL control test point to 5 V or ground, as shown  in Table 3.
4. Connect a calibrated network analyzer to the ANT, TERM, and RX SMA connectors. Sweep frequency from 1 GHz to 6 GHz and set power to −25 dBm.
5. The ADRF5532-EVALZ is expected to have a receive gain of 35.5 dB and transmit insertion loss of 0.7 dB at 2.6 GHz. See the expected results in Figure 4 to Figure 6.

Table 3. Truth Table: Signal Path Selection

Signal Path Selection
Transmit Operation (ANT to TERM)  Receive Operation (ANT to RX)

CTRL| |
---|---|---
Low| On| Off, LNA powered down
High| Off, isolation state| On

Additional test equipment is needed to fully evaluate the device functions and performance.
For noise figure evaluation, use either a noise figure analyzer or a spectrum analyzer with noise option. The use of a low excess noise ratio (ENR) noise source is recommended.
For third-order intercept point evaluation, use two signal generators and a spectrum analyzer. A high isolation power combiner is recommended.
For power compression and power handling evaluations, use a two-channel power meter and a signal generator. A power amplifier with great enough power is recommended at the input. Test accessories such as couplers and attenuators must have enough power handling.
The ADRF5532-EVALZ comes with a support plate attached to the bottom side. To ensure maximum heat dissipation and to reduce thermal rise on the ADRF5532-EVALZ during high-power evaluations, the support plate must be attached to a heatsink using thermal grease.
Note that the measurements performed at the SMA connectors of the ADRF5532-EVALZ include the losses of the SMA connectors and the PCB. The thru line must be measured to calibrate out the ADRF5532-EVALZ effects. The thru line is the summation of an RF input line and an RF output line connected to the device and equal in length.

EXPECTED RESULTS

EVALUATION BOARD ARTWORK AND SCHEMATIC

ORDERING INFORMATION

BILL OF MATERIALS

Reference Designator| Description| Manufacturer| Part Number
---|---|---|---
ANT, RX, TERM
THRU1, THRU2
C3, C6 C4 CTRL, V
, GND U1 PCB
DD| PCB mount SMA connectors
PCB mount SMA connectors, do not install (DNI)
100 pF capacitors, 50 V, 0402 package 4.7 µF capacitors, 10 V, 0402 package
Surface-mount test points 2.3 GHz to 2.7 GHz, receiver front end Printed circuit board| Johnson/Cinch Connectivity Solutions
Johnson/Cinch Connectivity Solutions
KEMET TDK
Keystone Electronics Analog Devices, Inc. Analog Devices, Inc.| 142-0701-851

142-0701-851
C0402C101J5GACTU
C1005X5R1A475K050BC

5016
ADRF5532
08-070678B

ESD Caution
ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can discharge without detection. Although this product features patented or proprietary protection circuitry, damage may occur on devices subjected to  high energy ESD. Therefore, proper ESD precautions should be taken to avoid performance degradation or loss of functionality.
Legal Terms and Conditions
By using the evaluation board discussed herein (together with any tools, components documentation or support materials, the “Evaluation Board”), you are agreeing to be bound by the terms and conditions set forth below (“Agreement”) unless you have purchased the Evaluation Board, in which case the Analog Devices Standard Terms and Conditions of Sale shall govern. Do not use the Evaluation Board until you have read and agreed to the Agreement. Your use of the Evaluation Board shall signify your acceptance of the Agreement. This Agreement is made by and between you (“Customer”) and Analog Devices, Inc. (“ADI”), with its principal place of business at Subject to the terms and conditions of the Agreement, ADI hereby grants to Customer a free, limited, personal, temporary, non-exclusive, non-sublicensable, non-transferable license to use the Evaluation Board FOR EVALUATION PURPOSES ONLY. Customer understands and agrees that the Evaluation Board is provided for the sole and exclusive purpose referenced above, and agrees not to use the Evaluation Board for any other purpose. Furthermore, the license granted is expressly made subject to the following additional limitations: Customer shall not (i) rent, lease, display, sell, transfer, assign, sublicense, or distribute the Evaluation Board; and (ii) permit any Third Party to access the Evaluation Board. As used herein, the term “Third Party” includes any entity other than ADI, Customer, their employees, affiliates and in-house consultants. The Evaluation Board is NOT sold to Customer; all rights not expressly granted herein, including ownership of the Evaluation Board, are reserved by ADI. CONFIDENTIALITY. This Agreement and the Evaluation Board shall all be considered the confidential and proprietary information of ADI. Customer may not disclose or transfer any portion of the Evaluation Board to any other party for any reason. Upon discontinuation of use of the Evaluation Board or termination of this Agreement, Customer agrees to promptly return the Evaluation Board to ADI. ADDITIONAL RESTRICTIONS. Customer may not disassemble, decompile or reverse engineer chips on the Evaluation Board. Customer shall inform ADI of any occurred damages or any modifications or alterations it makes to the Evaluation Board, including but not limited to soldering or any other activity that affects the material content of the Evaluation Board. Modifications to the Evaluation Board must comply with applicable law, including but not limited to the RoHS Directive. TERMINATION. ADI may terminate this Agreement at any time upon giving written notice to Customer. Customer agrees to return to ADI the Evaluation Board at that time. LIMITATION OF LIABILITY. THE EVALUATION BOARD PROVIDED HEREUNDER IS PROVIDED “AS IS” AND ADI MAKES NO WARRANTIES OR REPRESENTATIONS OF ANY KIND WITH RESPECT TO IT. ADI SPECIFICALLY DISCLAIMS ANY REPRESENTATIONS, ENDORSEMENTS, GUARANTEES, OR WARRANTIES, EXPRESS OR IMPLIED, RELATED TO THE EVALUATION BOARD INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, TITLE, FITNESS FOR A PARTICULAR PURPOSE OR NONINFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS. IN NO EVENT WILL ADI AND ITS LICENSORS BE LIABLE FOR ANY INCIDENTAL, SPECIAL, INDIRECT, OR CONSEQUENTIAL DAMAGES RESULTING FROM CUSTOMER’S POSSESSION OR USE OF THE EVALUATION BOARD, INCLUDING BUT NOT LIMITED TO LOST PROFITS, DELAY COSTS, LABOR COSTS OR LOSS OF GOODWILL. ADI’S TOTAL LIABILITY FROM ANY AND ALL CAUSES SHALL BE LIMITED TO THE AMOUNT OF ONE HUNDRED US DOLLARS ($100.00). EXPORT. Customer agrees that it will not directly or indirectly export the Evaluation Board to another country, and that it will comply with all applicable United States federal laws and regulations relating to exports. GOVERNING LAW. This Agreement shall be governed by and construed in accordance with the substantive laws of the Commonwealth of Massachusetts (excluding conflict of law rules). Any legal action regarding this Agreement will be heard in the state or federal courts having jurisdiction in Suffolk County, Massachusetts, and Customer hereby submits to the personal jurisdiction and venue of such courts. The United Nations Convention on Contracts for the International Sale of Goods shall not apply to this Agreement and is expressly disclaimed.

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