Shenzhen Chuanghongxin Intelligent Technology PTR9813 Bluetooth 5.2 Ready Multi-Protocol Module User Manual

Shenzhen Chuanghongxin Intelligent Technology PTR9813 Bluetooth 5.2 Ready

Multi-Protocol Module

The PTR9813 ultra-low power Bluetooth 5 ready multiprotocol System on Module based on the nRF52833 from Nordic Semiconductor. The module can support Bluetooth 5.2 by upgrading the protocol stack. The module with an ARM® Cortex™ M4F 32 bit processor, 512KB Flash/128KB RAM, Bluetooth 5.1 Direct Finding AOA/AOD support， provide a complete solution with no additional RF design, Bluetooth 5, allowing faster time to market, while simplifying designs, reducing BOM costs, also reduce the burden of Regulatory approvals to enter the world market. Making you more quickly into the Bluetooth smart application and remove the worries.

Features

• Nordic nRF52833 with ARM Cortex M4F
• Multiprotocol support :Bluetooth 5.1
• Bluetooth 5.1 Direction Finding AOA/AOD
• Bluetooth 5: 2 /1Mbps, 500 kbps, 125 kbps
• Integrated DC-DC converter
• Serial Wire Debug (SWD)
• Nordic SoftDevice Ready
• Over-the-Air (OTA) firmware update
• Flash/RAM: 512KB/128KB.
• 40 General purpose I/O pins
• 15 level low-power comparator with wake-up from System OFF mode
• Two 2-wire Master/Slave (I2C compatible)
• I2S audio interface
• 12 bit/200KSPS ADC
• High-speed 32 MHz SPI
• 4 SPI Master/ 3 SPI Slave)
• 2 UART (with CTS/RTS and DMA)
• 4x 4-channel PWM unit with EasyDMA
• USB 2.0 full speed (12 Mbps) controller
• 20 channel CPU independent Programmable Peripheral Interconnect (PPI).
• Quadrature Demodulator (QDEC)
• 128-bit AES HW encryption
• 5 x 32 bits timers, 3 xReal Time Counters (RTC)
• NFC-A tag interface for OOB pairing
• PCB antenna
• Sizes: 24.3×17.5 x1.8mm
• DC/DC on board
• No external components required
• Operation voltage: 1.7V to 5.5V

Typical Applications:

• 2.4 GHz Bluetooth low energy systems
• Proprietary 2.4 GHz systems
• Sports and leisure equipment
• Mobile phone accessories, Connected Appliances
• Health Care and Medical
• Consumer Electronics, Game pads
• Human Interface Devices, Remote control
• Building environment control / monitoring
• RFID, Security Applications，Low-Power Sensors
• Bluetooth Low Energy GateWay
• iBeacons™, Eddystone™, Indoor navigation
• Lighting Products
• Fitness devices, Wearables

Quick Specifications:

Multi-protocol

Version| Bluetooth 5.1
Security| AES-128
Radio
Frequency| 2.402GHz to 2.480GHz
Modulations| GFSK at 2/1 Mbps, Long range 125/500kbps
 |
Receiver sensitivity| -103dBm@BLE 125kbps(long range), -96dBm@BLE 1M
Antenna| Integrated PCB Antenna
Current Consumption
TX only @ +8 dBm, @ 3V, DC/DC enabled| 14.2 mA
TX only @ 0 dBm,    @ 3V, DC/DC enabled| 4.9 mA
RX only @ 1 Mbps @ 3V, DC/DC enabled| 4.8 mA
CPU @ 64MHz from flash @ 3V, DC/DC| 3.3 mA
System On| 1.5 μA
System Off| 0.6μA
Operating conditions
Power supply| 1.7~5.5V
Operating temperature| -25~+85 °C

Block diagram:

Pin Description of Module（Top View:

A BLUE TECHNOLOGY

I/O
Pin28| P0.29/AIN5| Digital I/O/Analog input 5| Standard drive, low frequency I/O
Pin29| P0.02/AIN0| Digital I/O/Analog input 0| Standard drive, low frequency I/O
Pin30| P0.19| Digital I/O| Standard drive, low frequency I/O
Pin31| P1.05| Digital I/O| Standard drive, low frequency I/O
Pin32| P0.25| Digital I/O| Standard drive, low frequency I/O
Pin33| P0.03/AIN1| Digital I/O/Analog input 1| Standard drive, low frequency I/O
Pin34| VDD| Power Supply|
Pin35| P1.03| Digital I/O| Standard drive, low frequency I/O
Pin36| GND| Ground|
Pin37| P1.07| Digital I/O| Standard drive, low frequency I/O
Pin38| P1.06| Digital I/O| Standard drive, low frequency I/O
Pin39| P1.04| Digital I/O| Standard drive, low frequency I/O
Pin40| NC| NC|
Pin41| NC| NC|
Pin42| P1.01| Digital I/O| Standard drive, low frequency I/O
Pin43| VBUS| Power| 5 V input for USB 3.3 V regulator

I/O
Pin54| P0.28/AIN4| Digital I/O/Analog input 4| Standard drive, low frequency I/O
Pin55| NC| NC|
Pin56| P0.23| Digital I/O| Standard drive, low frequency I/O

Low frequency I/O is signals with a frequency up to 10 kHz

Note: An internal 4.7μF bulk capacitor has been included on the module. For those application that with heavy GPIO usage and/or current draw, it is good design practice to add additional bulk capacitance as required for your application.

General Purpose I/O:

Each GPIO can be accessed individually with the following user configurable features:

• Input/output direction
• Output drive strength
• Internal pull-up and pull-down resistors
• Wake-up from high or low level triggers on all pins
• Trigger interrupt on all pins
• All pins can be used by the PPI task/event system; the maximum number of pins that can be interfaced through the PPI at the same time is limited by the number of GPIOTE channels
• All pins can be individually configured to carry serial interface or quadrature demodulator signals

Hardware RESET:
There is on-chip power-on reset circuitry, But can still be used in external reset mode, in this case, GPIO pin P0.18 as an external hardware reset pin. In order to utilize P0.18 as a hardware reset, the UICR registers PSELRESET[0] and PSELRESET[1] must be set alike, to the value of 0x7FFFFF12. When P0.18 is programmed as RESET, the internal pull-up is automatically enabled.

HW debug and flash programming of Module :
The Module support the two pin Serial Wire Debug (SWD) interface and offers flexible and powerful mechanism for non-intrusive debugging of program code. Breakpoints, single stepping, and instruction trace capture of code execution flow are part of this support.

This is the hardware debug and flash programming of module, J-Link Lite support, please refer www.segger.com.

Power and Configuration:
The module has two internal regulator stages. REG1 regulator stage has the regulator type options of Low-dropout regulator (LDO) and Buck regulator (DC/DC). REG0 regulator stage has only the option of Low-dropout regulator (LDO). The first regulator, REG0, is fed by the VDDH pin and can accept a source voltage of 2.5 V to 5.5 V. The output of REG0 is connected to the VDD pin and the input of the second regulator stage REG1. REG1 supplies power to the module core and can accept an input source voltage of 1.7V to 3.6V. Depending on how the VDD and VDDH pins are connected, the module will operate in one of two modes: Normal/Low Voltage (LV) or High Voltage (HV). The voltage present on the VDD pin is always the GPIO high logic level voltage, regardless of power mode.

To enter LV Mode, the same source voltage is applied to both the VDD and VDDH pins causing REG0 to automatically shut down leaving only the REG1 stage active. To enter HV, the source voltage is only applied to VDDH causing the VDD pin to become an output source supplied by REG0.

Mode| Pin of

Module

| Name| Power Connection
---|---|---|---
Normal/Low Voltage

(LV)

| Pin 34| VDD| 1.7V to 3.6V source in
Pin 46| VDDH| Same source as VDD
High Voltage (HV)| Pin 34| VDD| 1.8V to 3.3V supply out
Pin 46| VDDH| 2.5V to 5.5V source in

Important: In both LV and HV modes, the GPIO logic level voltage is determined by the VDD pin. In HV mode, all external devices that are connected to the Module’s GPIO must either be powered by the module (from VDD) or use level translation.

REG0 can supply a maximum current of 25mA for the module and external circuits in System On Mode and 1 mA in System Off Mode. External circuits powered from VDD in HV mode should be limited to no more than 5 mA to ensure stability at all radio transmit power levels.
USB Power: The USB interface on the Module can be used when the module is in either Normal /Low Voltage (LV) or High Voltage (HV) mode. The Module USB PHY is powered by a dedicated, internal LDO regulator that is fed by the VBUS pin (Pin43). This means that applying power to only the VBUS pin will not power the rest of the module. In order for the USB PHY to operate, VBUS must be externally powered.

Reference circuitry:
In this section there are 5 reference circuits to show how to design an application circuit with this module.

Reference Circuit configuration 1

Explanation of symbols in reference circuit 1 schematic

VEXT

| Voltage output on VDD when supplied from internal regulator (REG0). VDDH is the input to REG0.|

1.8

|  |

3.3

|

V

Configurations summary for reference circuit 2

Explanation of symbols in reference circuit 2 schematic

VEXT

| Voltage output on VDD when supplied from internal regulator (REG0). VDDH is the input to REG0.|

1.8

|  |

3.3

|

V

Configurations summary for reference circuit 3

Explanation of symbols in reference circuit 3 schematic

Configurations summary for reference circuit 4

Explanation of symbols in reference circuit 4 schematic

Configurations summary for reference circuit 5

Explanation of symbols in reference circuit 5 schematic

VEXT

| Voltage output on VDD when supplied from internal regulator (REG0). VBUS is the input to REG0.|

1.8

|  |

3.3

|

V

Some general guidance is summarized here:

• Main supply voltage is connected to VDD/VDDH. The system will enter one of two supply voltage modes, normal or high voltage mode, depending on how the supply voltage is connected to these pins. Normal voltage mode is entered when the supply voltage is connected to both the VDD and VDDH pins (so that VDD equals VDDH).High voltage mode is entered when the supply voltage is only connected to the VDDH pin and the VDD pin is not connected to any voltage supply.
• By default, the LDO regulators in the chip are enabled and the DC/DC regulator of REG1 stage is disabled. Register DCDCEN is used to enable the DC/DC regulator for REG1 stage. External LC filters has been connected in the Module for DC/DC regulators being used.
• The GPIO high reference voltage always equals the level on the VDD pin. In normal voltage mode, the GPIO high level equals the voltage supplied to the VDD pin, and in high voltage mode it equals the level specified in the register REGOUT0 UICR registers.
• When the power is supplied to VDDH, the output from the VDD pin could be used to supply external circuitry. The feature must be configured in the EXTSUPLLY and REGOUT0 UICR registers. In the reference circuitry, External supply is annotated with the VEXT net name.
• When using the USB peripheral, a 5V USB supply needs to be provided on the VBUS pin.

Recommended RF Layout & Ground Plane:
The module integrated antenna requires a suitable ground plane to radiate effectively. The area under and extending out from the antenna portion of the module should be kept clear of copper and other metal. The module should be placed at the edge of the PCB with the antenna edge facing out. Reducing the ground plane will reduce the effective radiated power. Please add as more as possible via holes on the mother board near the GND pin of module, this will be good for the RF performance of system board.

PCB Footprint （Top View):

Specifications:

Radio current consumption (transmitter):

Radio current consumption (Receiver):

Operating Conditions:

Absolute Maximum Ratings:

Note: Exceeding one or more of the limiting values may cause permanent damage to the module.

Notes and Cautions:

Design Notes

1. It is critical to following the recommendations of this document to ensure the module meets the specifications.
2. Power supply must be free of AC ripple voltage. If such noise is present, it is critical to provide proper filtering and decoupling.
3. The module should not be stressed mechanically after installation.
4. Exposing the module to significant temperatures will result in degradation and decreased lifetime.
5. Keep module away from other high frequency devices which may interfere with operation such as other transmitters and devices generating high frequencies.
6. Avoid static electricity, ESD and high voltage as these may damage the module.

Handling and Storage

1. Keep module away from other high frequency devices which may interfere with operation such as other transmitters and devices generating high frequencies.
2. Do not expose the module to the following conditions: Corrosive gasses such as Cl2, H2S, NH3, SO2, or NOX Extreme humidity or salty air Prolonged exposure to direct Sunlight Temperatures beyond those specified for storage.
3. Do not apply mechanical stress.
4. Do not drop or shock the module.
5. Avoid static electricity, ESD and high voltage as these may damage the module.

Moisture Sensitivity
All plastic packages absorb moisture. During typical solder reflow operations when SMDs are mounted onto a PCB, the entire PCB and device population are exposed to a rapid change in ambient temperature. Any absorbed moisture is quickly turned into superheated steam. This sudden change in vapor pressure can cause the package to swell. If the pressure exerted exceeds the flexural strength of the plastic mold compound, then it is possible to crack the package. Even if the package does not crack, interfacial delamination can occur.
Since the device package is sensitive to moisture absorption, it is recommended to bake the product before assembly.

Solder Reflow Temperature-Time Profile

Life Support Applications
Products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Customers using or selling these products for use in such applications do so at their own risk.

Additional Customization
We provide extensive customization, design and manufacturing services to ensure the perfect fit for your product. Our wide selection of modules allows developers to create any number of products. Should you need more information and assistance in integrating this module or developing your product, please contact us.

• Custom Hardware design including Modules, RF and Antenna Design
• Bluetooth Low Energy and Firmware Development
• Mobile Apps for iOS and Android
• Cloud Platform

Trademarks
The Bluetooth® word mark and logos are registered trademarks owned by Bluetooth SIG, Inc., Other trademarks and tradenames are those of their respective owners. ”

Right and Statements

• Reserves the right to make corrections, modifications, and/or improvements to the product and/or its specifications at any time without notice.
• Assumes no liability for the user’s product and/or applications.
• We have a strict and careful check and collation, but can not guarantee this manual without any errors and omissions.
• The contents of this manual by copyright protection laws and regulations, without our prior written authorization of any person shall, in any way to copy the copy or manual, this manual will all or any part of any form in any cable or wireless network transmission, or be compiled and translated into any other format, text or code.
• This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
  1. This device may not use harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
     Any Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.

Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.

Ordering Information:

module to SMA type Antenna.

PTR9813-EVB| Evaluation boards for module，with key, LED, I/O extend

FCC Statement

FCC standards: FCC CFR Title 47 Part 15 Subpart C Section 15.247
Integral antenna with antenna gain 0 dBi
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Any Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.
Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

FCC Radiation Exposure Statement
This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
If the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This
exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: 2AWMN-PTR9813 Or Contains FCC ID: 2AWMN-PTR9813”
When the module is installed inside another device, the user manual of the host must contain below warning statements;

1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
2. This device may not cause harmful interference.
3. This device must accept any interference received, including interference that may cause undesired operation. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
   However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off
   and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  * Reorient or relocate the receiving antenna.
  * Increase the separation between the equipment and receiver.
  * Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
  * Consult the dealer or an experienced radio/TV technician for help.

2. Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.
   The devices must be installed and used in strict accordance with the manufacturer’s instructions as described in the user documentation that comes with the product.
   Any company of the host device which install this modular with limit modular approval should perform the test of radiated & conducted emission and spurious emission,etc. according to FCC part 15C : 15.247 and 15.209 & 15.207 ,15B Class B requirement, Only if the test result comply with FCC part 15C : 15.247 and 15.209 & 15.207 ,15B Class B requirement，then the host can be sold legally.

References

• 创鸿新智能-深圳市创鸿新智能科技有限公司
• Software Development Tools by SEGGER – The Embedded Experts

Read User Manual Online (PDF format)

Read User Manual Online (PDF format)  >>

Download This Manual (PDF format)

Download this manual  >>