TIME-IOT Tm9001 Low Power and Low Cost RF Module Owner’s Manual

June 1, 2024
TIME-IOT

TIME-IOT Tm9001 Low Power and Low Cost RF Module

DESCRIPTION

PRODUCT DESCRIPTION

Tm9001 is a low-power and low-cost RF module developed by Shanghai Gangji Electronic Technology Co., Ltd. for short-range wireless transmission. It integrates a 32-bit RISC core MCU, 2.4G radio module, 8KB ram, 16kb OTP and rich peripheral resources.

Features

  • small package, only 16*24mm
  • high power, maximum +10dBm
  • support ISM 2.4GHz
  • support 2 Mbps,1 Mbps,500Kbps,250Kbps
  • 125 channel
  • Support secondary development
  • Voltage 1.9V ~ 3.6V
  • 32-bit RISC core , support secondary development
  • On board antenna design

Appearance size&Pin define

Pin define

Table Pin define

Pin Symbol Type Description
1 S1 DI Input 1
2 S2 DI Input 2
3 BAT- Power battery power negative
4 BAT+ Power battery power positive

Pin define

Appearance size

Appearance size

ELECTRICAL PARAMETERS

Electrical characteristics

Table1 Electrical characteristics

Item| Symbol| Min| Typical| Max| Unit|
---|---|---|---|---|---|---
Power supply voltage| VDD| 1.9| 3.3| 3.6| V|
Operating temperature| TOpr| ‐40|  | 85| oC|
Operating humidity|  |  |  | 95%|  |
Transmit mode| ITx|  | 14.5|  | mA| TX@0dBm
 | 25|  | mA| TX@8dBm
Receive mode| IRx|  | 13.6|  | mA|
Suspend mode| ISusp|  | 6.8|  | uA|
Deep sleep mode| I Deep|  | 2.0|  | uA|

*Note : All test items are at (T=25℃).

RF performance

Table2 RF performance

Item| Symbol| Min| Typical| Max| Unit|
---|---|---|---|---|---|---
Frequency range| Freq| 2380|  | 2500| MHz|
Data rate|  | 0.25|  | 2| Mbps|
Receive sensitivity| Rsen|  | ‐86|  | dBm| @1Mbps
Transmit power| Pout| ‐20|  | 7| dBm|
ANT Gain| Gain|  | 1.5|  | dBi|

static electricity

Table3static electricity

Main parameters| Abbreviation| minimum| typical| max| unit|
---|---|---|---|---|---|---
VESD|  |  |  | 2000| V| HBM
VESD|  |  |  | 500| V| CDM

Design reference

Hardware design consideration

  • It is recommended to use DC regulated power supply to supply power to the module. The ripple coefficient of the power supply shall be as small as possible, and the module shall be reliably grounded::
  • If the positive and negative polarity of the power supply module is correctly connected, please note that it may cause permanent damage:
  • Please check the power supply to ensure that it is between the recommended power supply voltage. Exceeding the maximum value will cause permanent damage to the module;
  • Please check the stability of the power supply. The voltage cannot fluctuate greatly and frequently:
  • When designing the power supply circuit for the module, it is often recommended to reserve more than 30% margin, which is conducive to the long-term and stable operation of the whole machine;
  • The module shall be far away from the power supply, transformer, high-frequency wiring and other parts with large electromagnetic interference as far as possible;
  • The high-frequency digital wiring, high-frequency analog wiring and power wiring must avoid the lower part of the module. If it is really necessary to pass under the module, it is assumed that the module is welded on the top layer, and the copper is laid on the top layer of the contact part of the module (all copper is laid and well grounded). It must be close to the digital part of the module and routed in the bottom layer;
  • Assuming that the module is welded or placed in the top layer, it is also wrong to randomly route in the bottom layer or other layers, which will affect the stray and receiving sensitivity of the module to varying degrees:
  • It is assumed that there are devices with large electromagnetic interference around the module, which will also greatly affect the performance of the module. According to the intensity of interference, it is recommended to stay away from the module properly, and if the situation allows, appropriate isolation and shielding can be done。
  • It is assumed that there are wires with large electromagnetic interference around the module (high-frequency digital, high-frequency analog and power wiring) which will also greatly affect the performance of the module. According to the intensity of interference, it is recommended to stay away from the module properly, and appropriate isolation and shielding can be done if the situation allows。
  • Keep away from some physical layers as far as possible, also 2 4GHz TTL protocol, such as usb3 0;
  • The antenna installation structure has a great impact on the performance of the module. Make sure that the antenna is exposed, preferably vertically upward. When the module is installed inside the shell, the high-quality antenna extension cable can be used to extend the antenna to the outside of the shell. It must not be installed inside the metal shell。
  • Professional antenna should be used. Pay attention to the impedance matching between antenna and ant pin. Impedance mismatch will greatly weaken the signal strength

Antenna clearance area

  • When using PCB antenna on Bluetooth module, it is necessary to ensure that the distance between mainboard PCB and other metal devices is at least 15mm. The marked area in the black box in the figure below needs to be far away from metal devices, sensors, interference sources and other materials that may cause signal interference.
    Antenna clearance area

problem

Short distance

  • When there is a straight-line communication obstacle, the communication distance will be attenuated accordingly:
  • Temperature, humidity and co frequency interference will increase the packet loss rate of communication:
  • The ground absorbs and reflects radio waves, and the test effect near the ground is poor;
  • Seawater has a strong ability to absorb radio waves, so the seaside test effect is poor:
  • If there are metal objects near the antenna or placed in a metal shell, the signal attenuation will be very serious:
  • At room temperature, the low voltage of the power supply is lower than the recommended value. The lower the voltage, the smaller the power:
  • Antenna impedance mismatch:

module is easily damaged

  • Please check the power supply to ensure that it is between the recommended power supply voltage. Exceeding the maximum value will cause permanent damage to the module:
  • Please check the stability of the power supply. The voltage cannot fluctuate too much:
  • Please ensure anti-static operation during installation and use, and high-frequency devices are sensitive to static electricity:
  • Please ensure that the humidity should not be too high during installation and use, and some components are humidity sensitive devices:
  • If there are no special requirements, it is not recommended to use it at too high or too low temperature.

Production operation instruction

Preservation and baking of modules

  • The modules delivered by our company are packaged in disk and vacuum electrostatic bag
  • It shall be stored in an environment with temperature < 30 C and humidity < 85% RH
  • For modules exposed to air for more than 24 hours or in high humidity environment, baking operation shall be carried out before production
    • Bake temperature:125℃±5℃:
    • Alarm temperature:130℃:
    • SMT patch can be carried out after cooling to 36 ℃ under natural conditions:
    • Drying times:≤1:
    • If it is not used for more than 12 hours after baking, please bake again:
  • The module shall be used as soon as possible after unpacking. If the unpacking time is more than 3 months, please do not use SMT process to weld this batch of modules. Due to the PCB gold deposition process, the pad oxidation is serious after more than 3 months, and the SMT patch is likely to lead to false soldering and missing soldering. Our company will not bear the corresponding responsibility for the problems caused by this.

Attention

  • In the whole process of production, the operators of each station must wear electrostaticgloves:
  • The baking time shall not exceed the baking time:
  • It is forbidden to add explosive, combustible and corrosive substances during baking:
  • When baking, the module shall be put into the oven with a high-temperature tray to maintain air circulation between each module and avoid direct connection between the module and the inner wall of the oven when baking, please close the oven door to ensure that the oven is closed to prevent temperature leakage and affect the baking effect:
  • Try not to open the oven door when the oven is running. If it must be opened, try to shorten the opening time:
  • After baking, the module shall be cooled to < 36 ℃ naturally before being taken out with electrostatic gloves to avoid scalding:
  • During operation, the bottom surface of the module shall be strictly prevented from being contaminated with water or dirt:

SMT temperature

SMT temperature

SMT temperature curve

SMT temperature curve

3D VIEW

3D VIEW

Appendix: declaration

FCC warning:

Any Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.

Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the equipment and receiver.
  • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body.
The OEM must comply with the FCC labeling requirements. If the module’s label is not visible when installed, then an additional permanent label must be applied on the outside of the finished product which states: “Contains transmitter module FCC ID: 2BCN8-Z01
This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.
The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.
The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.
The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2BCN8-Z01. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2BCN8-Z01.
This device is intended only for OEM integrators under the following conditions: The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.
As long as the 2 conditions above are met, further transmitter tests will not be required.
However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed

IC warning

This device complies with Industry Canada licence-exempt RSS standard(s).
Operation is subject to the following two conditions: (1) This device may not cause interference, and (2) This device must accept any interference, including interference that may cause undesired operation of the device.

  1. The module is limited to OEM installation ONLY
  2. The OEM integrators is responsible for ensuring that the end‐user has no manual instructions to remove or install module.
  3. That module is limited to installation in mobile or fixed applications, according to Part 2.1091(b).
  4. That separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different antenna configurations.

Revise

version| modification|  | edit time|
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V1.10| Modify document format| Bob. xu| 20230202|
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CUSTOMER SUPPORT

Ningbo Fotile Kitchen Ware Co., Ltd
Add: No.218 Binhai 2 Rd, Hangzhou Bay New District, NINGBO Zhejiang
Tel: 86-574-2345 6314 Fax: 86-574-2345 6317Logo

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