NATIONAL INSTRUMENTS sbRIO-9638 Thermal Kit for Compact RIO Single Board Controller Instruction Manual

Bridging the gap between the manufacturer and your legacy test system.

sbRIO-9638 Thermal Kit for Compact RIO Single Board Controller

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INSTALLATION MANUAL
Thermal Kit for CompactRIO Single Board Controller with DAQmMXx
The Thermal Kit for CompactRIO Single Board Controller with DAQm is a heat spreader accessory used to improve the thermal performance of your sbRIO system by removing heat from the components that may limit the maximum operating temperature of the device.

Table 1. Thermal Kit Compatability

Figure 1. Thermal Kit Contents

1. Heat spreader (x1)
2. M3x8 mm pan head screw (x7)
3. M3x18 mm standoff, 4.5 mm hex (x2)
4. M3x16 mm standoff, 4.5 mm hex (x5)
5. Main thermal pad (x1)
6. Supplemental FPGA thermal pad

Mounting Guidelines

Determine the mounting configuration based on the cooling requirements for your sbRIO system.

Thermal Conduction Path
Mount the system with the flat face against a base mounting surface.
Thermal Convection Path
Mount the system with the flat face exposed to air. Add a heat sink for increased convection.

Consider the following factors when designing a thermal solution for your SbRIO system:

• Base mounting material
• System enclosure material
• Interactions with other heat sources in the system
• Size constraints
• Air flow availability

Note For information and examples on environmental and design factors that can impact the thermal performance of an NI sbRIO system, o to ni.com/r/sbriocooling.

Physical Characteristics

Placing the Main Thermal Pad on the sbRIO Model

What to Use

• Main thermal pad, included in kit
• sbRIO model

What to Do
The thermal pad included in this kit provides a thermal interface material between the heat spreader and the sbRIO device components.
Note You must apply the thermal pad to the sbRIO model before you assemble the heat spreader.

Figure 2. Side View and Layers of Thermal Pad

1. Peel off clear, plastic liner
   Figure 3. Thermal Pad Placement on the Board Surface

1. Remove the liners from the thermal pad.
2. Apply the main thermal pad to the board surface. Use the silkscreen outline on the board to align the main thermal pad.

Placing the Supplemental FPGA Thermal Pad on the Heat Spreader

Notice The 75T and 100T FPGAs are shorter in height than the 200T FPGA. NI provides a supplemental FPGA thermal pad for use with 75T and 100T FPGAs to accommodate the difference in component height. Only use the supplemental FPGA pad if your SbRIO model has a 75T or 100T FPGA. Do not use the supplemental pad with a 200T FPGA, as it will result in high strain on the board components.

Table 2. Supplemental FPGA Thermal Pad Compatability

sbRIO-9638

What to Use

• Supplemental FPGA thermal pad, included in kit
• Heat spreader

What to Do
The thermal pad included in this kit provides a thermal interface material between the heat spreader and the sbRIO model components.
Note You must apply the thermal pad to the heat spreader before you assemble the SHRIO system.

Figure 4. Side View and Layers of Thermal Pad

1. Peel off clear, plastic liner
   Figure 5. Thermal Pad Placement on the Heat Spreader

1. Remove the liners from the thermal pad.
2. Apply the thermal pad to the FPGA pedestal of the heat spreader, marked with a + symbol.

Mounting the sbRIO Model with a Thermal Conduction Path

What to Use

• Socket driver, 4.5 mm
• Screwdriver, Phillips #1

What to Do
Figure 6. Thermal Conduction Mounting Configuration

1. Standoff, 16.00 mm (0.63in.)
2. Standoff, 18.00 mm (0.71 in.)

1. Fasten the heat spreader to the mounting surface with the provided 16 mm standoffs and tighten completely.
   Note (Optional) You can use thermal interface material between the heat spreader and mounting surface. Note that thermal interface material may affect system stack height and levelness.

2. When mounting the NI sbRIO-9628/9629/9638, fasten the provided 18 mm standoffs to the mounting surface in the SRIO footprint holes not used to fasten the heat spreader.
   Tighten completely.

3. Align the sbRIO model with the standoff holes and fasten using provided screws.
     Note Tighten the screws to 0.56 N- m (5.0 Ib- in) of torque.
   Notice Use caution when aligning the sbRIO model. Once it has been fastened, separating the heat spreader and sbRIO device will be difficult and could potentially damage components.
   Notice The thermal pad is a viscoelastic material and compressing it too quickly places a large amount of stress on board components. NI recommends fastening the screws by hand. If you must use an automatic screwdriver, fasten the screws at a rate less than 4.23 mus (10 in./min.) to prevent damage during assembly.

Mounting the sbRIO Model with a Thermal Convection Path

What to Use

• Socket driver, 4.5 mm
• Screwdriver, Phillips #1

What to Do

Figure 7. Thermal Conduction Mounting Configuration

1. Standoff, 16.00 mm (0.63in.)
2. Standoff (not provided)

1. Fasten the standoffs (not provided) to the mounting surface and tighten completely.

2. Align the sbRIO model on standoffs and fasten using provided 16 mm standoffs.

3. When mounting the NI sbRIO-9628/9629/9638, fasten the last two holes with provided screws.
   Note Tighten the screws to 0.56 N- m (5.0 Ib – in) of torque.

4. Align the heat spreader with the standoff holes and fasten using provided screws.

Note Tighten the screws to 0.56 N- m (5.0 1b – in) of torque.
Notice Use caution when aligning the heat sp reader. Once it has been fastened, separating the heat spreader and sbRIO device will be difficult and could potentially damage components.
Notice The thermal pad is a viscoelastic material and compressing it too quickly places a large amount of stress on board components. NI recommends fastening the screws by hand. If you must use an automatic screwdriver, fasten the screws at a rate less than 4.23 mmv’s (10 in./min.) to prevent damage during assembly.

Mounting the sbRIO Model with a RIO Mezzanine Card (RMC)

What to Use

• Socket driver, 4.5 mm
• Screwdriver, Phillips #1

What to Do

Figure 8. RMC Mounting Configuration

1. Standoffs, 16.00 mm (0.63in.)
2. Standoffs (not provided)
3. Standoffs, 18.00 mm (0.71in.)

Note You can use an RMC with the heat spreader in either mounting orientation.
However, the standoffs used to separate the SbRIO and the RMC are not provided in this kit.

1. Fasten the heat spreader to the mounting surface with the provided 16 mm standoffs and tighten completely.
   Note (Optional) You can use thermal interface material between the heat spreader and mounting surface. Note that thermal interface material may affect system stack height and levelness.

2. When mounting the NI sbRIO-9628/9629/9638, fasten the provided 18 mm standoffs to ‘mounting surface in the sbRIO footprint holes not used to fasten the heat spreader.
   Tighten completely.

3.  Aliga the sbRIO model to standoff holes and fasten using standoffs of the appropriate height.
   Notice Use caution when aligning the sbRIO model. Once it has been fastened, separating the heat spreader and sbRIO device will be difficult and could potentially damage components.
   Notice The thermal pad is a viscoelastic material and compressing it too quickly places a large amount of stress on board components. If you must use an automatic screwdriver, fasten these screws at a rate less than 4.23 mm/s (10 in/min.) to prevent damage during assembly.

4. Align the RMC to the standoff holes and mate the RMC connectors. Fasten using the provided screws.
     Note Tighten the screws to 0.56 N – m (5.0 Ib – in) of torque.

Environmental Guidelines

Systems that use the heat spreader included in this kit must validate the SbRIO model before deployment. Refer to the Hardware Installation Manual on ni.com/manuals for more information about validating your system.
Verify that the CPU/FPGA, primaty, and secondary reported onboard temperature sensors do 1ot exceed the maximum temperature in the device specifications on ni.com/manuals.
Note For information and examples on environmental and design factors that can impact the thermal performance of an NI sbRIO system, o to ni.com/r/sbriocooling.

Environmental Management

NI is committed to designing and manufacturing products in an environmentally responsible ‘manner. NI recognizes that eliminating certain hazardous substances from our products is beneficial to the environment and to NI customers.
For additional environmental information, refer to the Commitment to the Environment web page at ni.com/environment. This page contains the environmental regulations and directives with which NI complies, as well as other environmental information not included in this document.

Waste Electrical and Electronic Equipment (WEEE)
EU Customers At the end of the product life cycle, all NI products must be disposed of according to local laws and regulations. For more information about how to recycle NI products in your region, visit ni.com/environment/weee.

Worldwide Support and Services
The NI website is your complete resource for technical support. At ni.com/support, you have access to everything from troubleshooting and application development self-help resources to email and phone assistance from NI Application Engineers.
Visit ni.com/services for information about the services NI offers. Visit ni.com/register to register your NI product. Product registration facilitates technical support and ensures that you receive important information updates from NI.
NI corporate headquarters is located at 11500 North Mopac Expressway, Austin, Texas, 78759-3504. NI also has offices located around the world. For support in the United States, create your service request at ni.com/support or dial 1 866 ASK MYNI (275 6964). For support outside the United States, visit the Worldwide Offices section of ni.con/niglobal to access the branch office websites, which provide up-to-date contact information.

CompactRIO Single Board Controller with DAQmx Thermal Kit Installation Manual | © National Instruments Iformation is subject to change without nofice. Refer to the NI Trademarks and Logo Guidelines at ns . com/ crademarks for information on NI tradermarks. Other product and compary names mertioned herein are trademarks o rade names of teir respective companies. For patents covering NI productstechnology. refer to the appropriate location: Help» Patents in your software, the pazents. c< file on your media, o the National Instruments Patent Notice at ri. . con/ patents. You can find information about end-user icense agreernents (EULAS) and third-party legal notices in the readme file for your NI product. Refer to the Export Compliance Informationat r:. . com/ Legal/export~corpL: ance for the NI global trade compliance policy and how o obtain relevant HTS codes, ECCN, and other importexport data. NI MAKES NO EXPRESS OR IMPLIED WARRANTIES AS TO THE AGCURAGY OF THE INFORMATION CONTAINED HEREIN AND SHALL NOT BE LIABLE FOR ANY ERRORS. USS. Government Custorers: The data contained inthis manual was developed at private expense andis subject to the applicable limited rights and restricted data rights as set forth in FAR 52.227-14, DFAR 252.227-7014, and DFAR 252.227-7015.

©2019 National Instruments. Al rights reserved.
378151A-01 August 19, 2019

References

• Test and Measurement Systems, a part of Emerson - NI
• Engineering a Healthy Planet - NI
• Product Take-Back Program and Recycling - NI
• Product Documentation - NI
• Contact Us - NI
• Cooling NI Single-Board RIO Systems - NI
• Log In - National Instruments
• NI Services - NI
• Support - NI
• NI Trademarks and Logo Guidelines - NI
• Product Take-Back Program and Recycling - NI
• Engineering a Healthy Planet - NI
• Contact Us - NI
• Cooling NI Single-Board RIO Systems - NI
• Log In - National Instruments
• NI Services - NI
• Support - NI
• sbRIO-9603 National Instruments CompactRIO Single-Board Controller | Apex Waves

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