SILICON LABS ETRX3587 Reduce IoT Development Time User Manual

SILICON LABS ETRX3587 Reduce IoT Development Time

TelegesisTM ETRX358x and ETRX358xHR

Specifications

• Product Name: TelegesisTM ETRX358x and ETRX358xHR
• Model Number: ETRX358x
• Manufacturer: Silicon Laboratories Inc.
• Wireless Protocol: IEEE 802.15.4 ZigBee
• Power Supply: DC
• Dimensions: Refer to Physical Dimensions section

Product Description:

The TelegesisTM ETRX358x and ETRX358xHR are wireless modules designed for use in applications requiring IEEE 802.15.4 ZigBee communication. The modules come with various hardware and firmware features to enable seamless integration into different systems.

Product Usage Instructions:

1. Hardware Description:
   The hardware of the ETRX358x module includes various interfaces for connectivity. Refer to the Hardware Description section in the manual for detailed information on the hardware components.

2. Firmware Description:
   The firmware of the ETRX358x module allows for token settings and supports custom firmware configurations. Follow the instructions provided in the Firmware Description section for setting up and customizing the firmware.

3. Module Pinout
   Consult the Module Pinout section to understand the pin configuration of the ETRX358x module for proper connectivity.

4. Digital I/O Specifications:
   For information on digital input/output specifications, refer to the Digital I/O Specifications section in the manual to ensure compatibility with external devices.

5. Power Settings:
   Adjust the TX power characteristics and power settings as per the Regulatory Compliance guidelines outlined in the manual to meet legal requirements.

Frequently Asked Questions (FAQ):

• Q: What are the recommended operating conditions for the ETRX358x module?
  A: The recommended operating conditions are detailed in the manual under the Absolute Maximum Ratings and Recommended Operating Conditions sections.

• Q: How can I ensure FCC compliance when using the ETRX358x module?
  A: To ensure FCC compliance, follow the FCC Labelling Requirements outlined in the Product Approvals section of the manual.

Image not shown actual size; enlarged to show detail.

The Telegesis ETRX358x and ETRX358xHR series modules are small outline, low power 2.4GHz ZigBee modules, based on the latest Silicon Labs EM358x family of single chip ZigBee® solutions.
These 4th generation modules have been designed to be integrated into any device without the need for RF experience and expertise. Utilizing the market’s premier EmberZNet ZigBee® stack, the ETRX358x series enables you to add powerful wireless networking capability to your products and quickly bring them to market.
For custom application development the ETRX358x series integrates with ease into Ember Desktop development environment.

Module Features

• Small form factor, SMT module 25mm x 19mm
• Same footprint and pin-out as ETRX357
• Side Castellations for easy soldering and optical inspection
• Two antenna options: Integrated chip antenna or U.FL coaxial connector
• Based on 32-bit ARM® Cortex-M3
• Operation at 6, 12 or 24MHz
• Industry standard JTAG Programming and real time packet tracing via the Ember Debug Port
• Up to 512kB of flash and 64kbytes of RAM
• Lowest Deep Sleep Current of 1µA with retained RAM and GPIO and multiple sleep modes
• Wide supply voltage range (2.1 to 3.6V)
• Optional 32.768kHz watch crystal can be added externally
• Can act as an End Device, Router or Coordinator
• 24 general-purpose I/O lines including analogue inputs (all GPIOs of the EM358x SoC are accessible)
• Firmware upgrades via serial port or over the air using the Ember standalone bootloader
• Hardware supported encryption (AES-128)
• CE and UKCA; FCC and IC compliance, FCC modular approval
• Operating temperature range: -40°C to +85°C
• Long range version with a link budget of up to 124dB available in the same form factor

Radio Features

• Based on the Silicon Labs EM358x family of single chip ZigBee® SoCs
• 2.4GHz ISM Band
• 250kbit/s over the air data rate
• 16 channels (IEEE802.15.4 Channel 11 to 26)
• +3dBm output power ( +8dBm in boost mode)
• High sensitivity of -100dBm (-102dBm in boost mode) typically @ 1% packet error rate
• RX Current: 27mA, TX Current: 32mA at 3dBm
• Robust Wi-Fi and Bluetooth coexistence

Suggested Applications

• ZigBee Smart Energy applications
• Wireless Alarms and Security
• Home/Building Automation
• Wireless Sensor Networks
• M2M Industrial Controls
• Lighting and ventilation control
• Remote monitoring
• Environmental monitoring and control

Development Kit

• ETRX3587 Expansion Pack for ETRX357 Development Kit
• ETRX357 Development kit containing everything required to set up a mesh network quickly and evaluate range and performance of the ETRX357 series and its long-range version.
• Custom software development available upon request.

Introduction

This document describes the Telegesis ETRX358x and ETRX358xHR family of ZigBee modules which have been designed to be easily integrated into another device and to provide a fast, simple and low cost wireless mesh networking interface.
The Telegesis ETRX3 series modules are based on the Silicon Labs ZigBee compliant platform consisting of the single chip family of EM358x SoCs combined with the ZigBee PRO compliant EmberZNet meshing stack. The ETRX358x and ETRX358xHR modules represent an ideal platform for custom firmware development in conjunction with the Silicon Labs ZigBee development kits.
No RF experience or expertise is required to add this powerful wireless networking capability to your products. The ETRX358x and ETRX358xHR series of modules offer fast integration opportunities and the shortest possible time to market for your product.

Hardware Description
The main building blocks of the ETRX358x and ETRX358xHR modules are the single chip EM358x SoC from Silicon Labs, a 24MHz reference crystal and RF front-end circuitry optimized for best RF performance. The modules are available with on-board antenna or alternatively a U.FL coaxial connector for attaching external antennae. Modules with the U.FL connector are identified by the “HR” suffix.
The integrated antenna is an Antenova Rufa, and details of the radiation pattern are available from the Antenova website [5].

Table 1: Module Variants

The ETRX358x and ETRX358xHR are used for ZigBee (www.zigbee.org) applications. In case it is desired to develop custom firmware, the Silicon Labs toolchain, consisting of Ember Desktop together with a comprehensive integrated development environment (IDE), is required.

Product Approvals

The ETRX358x and ETRX358xHR have been designed to meet all national regulations for world-wide use. In particular the following certifications have been obtained:

FCC Approvals
The Telegesis ETRX358x family integrated Antenna as well as the ETRX358xHR family including the antennas listed in Table 2 and the power levels listed in section 10.2 have been tested to comply with FCC CFR Part 15 (USA) The devices meet the requirements for modular transmitter approval as detailed in the FCC public notice DA00.1407.transmitter.

FCC statement:
This device complies with Part 15 of the FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

FCC ID : S4GEM358X
This module is approved for use in both portable and mobile applications. The module and associated antenna must be installed to provide a separation distance of at least 0.75cm from all persons and must not transmit simultaneously with any other antenna or transmitter.

Item| Part No.| Manufacturer| Type| Impedance| Gain
---|---|---|---|---|---
1| BT-Stubby (straight)| EAD Ltd. [6]| ¼ Wave| 50Ω| 0dBi
2| BT-Stubby (right- angle)| EAD Ltd. [6]| ¼ Wave| 50Ω| 0dBi
3| CJ-2400-6603| Chang Jia| ½ Wave| 50 Ω| 2.0dBi
4| Rufa (on board)| Antenova| Chip| 50Ω| 2.1dBi (peak)

Table 2: Approved Antennae

While the applicant for a device into which the ETRX358x or ETRX358xHR with an antenna listed in Table 2 is installed is not required to obtain a new authorization for the module, this does not preclude the possibility that some other form of authorization or testing may be required for the end product depending upon local territorial regulations.
The FCC requires the user to be notified that any changes or modifications made to this device that are not expressly approved by Telegesis (UK) Ltd. may void the user’s authority to operate the equipment.
When using the ETRX358xHR family with approved antennae, it is required to prevent end-users from replacing them with non-approved ones.

• FCC Labelling Requirements
  When integrating the ETRX358x or ETRX358xHR families into a product it must be ensured that the FCC labelling requirements are met. This includes a clearly visible label on the outside of the finished product specifying the Telegesis FCC identifier (FCC ID: S4GEM358X) as well as the FCC notice shown on the previous page. This exterior label can use wording such as “Contains Transmitter Module FCC ID: S4GEM358X” or “Contains FCC ID: S4GEM358X” although any similar wording that expresses the same meaning may be used.

• IC (Industry Canada) Approvals
  The Telegesis ETRX358x family with integrated Antenna as well as the ETRX358xHR family have been approved by Industry Canada to operate with the antenna types listed in Table 2 with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.

IC-ID : 8735A-EM358X

• This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.
• Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted for successful communication.
• and must not be co-located or operating in conjunction with any other antenna or transmitterThis device has been designed to operate with the power levels shown in section 10.2 with the antennas listed in Table 2, and having a maximum gain of 2.1 dBi. Antennas not included in this list or having a gain greater than 2.1 dBi are strictly prohibited for use with this device. The required antenna impedance is 50 ohms.

OEM Responsibilities
The ETRX358x and ETRX358x families of module have been certified for integration into products only by OEM integrators under the following condition:

1. The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter.

As long as the condition above is met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.).

IMPORTANT NOTE : In the event that these conditions can not be met (for certain configurations or co-location with another transmitter), then Industry Canada certification is no longer considered valid and the IC Certification Number can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate Industry Canada authorization. IC Labelling Requirements
The ETRX358x and ETRX358xHR family modules are labelled with its own IC Certification Number. If the IC Certification Number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labelled in a visible area with the following:
“Contains Transmitter Module IC: 8735A-EM358X“
or
“Contains IC: 8735A-EM358X“
The OEM of the ETRX358x and ETRX358xHR family modules must only use the approved antenna(s) listed above, which have been certified with this module.

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user’s manual of the end product.
The user’s manual for the end product must include the following information in a prominent location:
“To comply with Industry Canada RF radiation exposure limits for general population, the transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.”

CE (EU) and UKCA (UK) Compliance
The modules in the ETRX358x and ETRX358xHR families conform with the essential requirements and other relevant requirements of the EU’s Radio Equipment Directive (RED) (2014/53/EU) and the UK’s Radio Equipment Regulations (RER) (S.I. 2017/1206). Compliance is demonstrated by verification against the applicable standards, including the following:

• Radio: EN 300 328 v2.2.2
• EMC : EN 301 489-1 v2.1.1, EN 301 489-17 v3.1.1
• Safety : EN62368-1:2020+A11:2020

All tests have been conducted with the antennae listed in Table 2.
When a module is incorporated into an OEM product, the OEM product manufacturer must ensure compliance of the final product to the European harmonised EMC and low voltage/safety standards. Additionally, the specific product assembly may have an impact on the RF radiated characteristics, and manufacturers should also carefully consider RF radiated testing of their end- products to confirm compliance. The final product should not deviate from the max power ratings, antenna specifications, and installation requirements as specified in this user manual; otherwise, compliance re-testing against all the applicable standards becomes necessary, and a Notified Body evaluation strongly recommended.
The modules are entitled to carry the CE and UKCA compliance marks, and the formal Declarations of Conformity (DoC) are available at the product web page, which is reachable starting from www.silabs.com.
OEM product manufacturers must also consider applying the compliance marks to a visible location on their products. Customers assume full responsibility for learning and meeting the required guidelines for each country in their distribution market.

IEEE 802.15.4
IEEE 802.15.4 is a standard for low data-rate, wireless networks (raw bit-rate within a radio packet of 250kbps @2.4GHz) which focuses on low cost, low duty cycle, long primary battery life applications as well as mains-powered applications. It is the basis for the open ZigBee Protocol.

The ZigBee Protocol
The ZigBee Protocol is a set of standards for wireless connectivity for use between any devices over short to medium distances. The specification was originally ratified in December 2004, paving the way for companies to start making low-power networks a reality.
ZigBee uses the IEEE 802.15.4 radio specification running on the 2.4GHz band, plus three additional layers for networking, security and applications. What makes the specification unique is its use of a mesh network architecture which, in bucket chain style, passes data from one node to the next until it lands at its destination. The network is self-healing and adapts its routing as link quality changes or nodes move. Furthermore, nodes can be defined as End Devices which do not act as routers, but can therefore be put into a low- power sleep state.
The enhanced version of the ZigBee standard (or ZigBee 2006) was released in December 2006, adding new features and improvements to the only global wireless communication standard enabling the development of easily deployable low-cost, low-power, monitoring and control products for homes, commercial buildings and industrial plant monitoring. In 2007 the ZigBee Alliance introduced the PRO featureset which offers advantages over earlier versions, including

• Truly self-healing mesh networking
• Messages can now travel up to 30 hops
• Source-Routing for improved point to multipoint message transmission
• Improved security including Trust-Centre link keys
• New message types and options

Module Pinout

Figure 1: ETRX3 series Module Pinout (top view)
The table below gives details about the pin assignment for direct SMD soldering of the ETRX3 series modules to the application board. For more information on the alternate functions please refer to [2].
All GND pads are connected within the module, but for best RF performance all of them should be grounded externally ideally to a ground plane.
“Important Note: If designers would like to keep open the option of using either standard or long range modules in the same product please note the following. The ETRX358x series and the ETRX358x-LRS series of modules are footprint compatible, but on the ETRX358x-LRS series pins PB0 and PC5 of the EM358x are used internally to control the front-end module and are not available to the user.”

ETRX358x Pad| Name| EM358x Pin| Default use| Alternate Functions
---|---|---|---|---
1| GND| GND| GND|
2| PC5 {1}| 11| | TX_ACTIVE
3| PC6| 13| I/O| OSC32B, nTX_ACTIVE
4| PC7| 14| I/O| OSC32A, OSC32_EXT
5| PA7 {4}| 18| I/O| TIM1C4
6| PB3 {2}| 19| I/O, CTS| SC1nCTS, SC1SCLK, TIM2C3
7| nReset {5}| 12| nReset|
8| PB4 {2}| 20| I/O, RTS| TIM2C4, SC1nRTS, SC1nSSEL
9| PA0| 21| I/O| TIM2C1, SC2MOSI, USBDM{6]
10| PA1| 22| I/O| TIM2C3, SC2SDA, SC2MISO, USBDP{6}
11| PA2| 24| I/O| TIM2C4, SC2SCL, SC2SCLK
12| PA3| 25| I/O| SC2nSSEL, TIM2C2
13| GND| GND| GND|
14| PA4| 26| I/O| ADC4, PTI_EN, TRACEDATA2
15| PA5 {3}| 27| I/O| ADC5, PTI_DATA, nBOOTMODE, TRACEDATA3
16| PA6 {4}| 29| I/O| TIM1C3
17| PB1| 30| TXD| SC1MISO, SC1MOSI, SC1SDA, SC1TXD, TIM2C1
18| PB2| 31| RXD| SC1MISO, SC1MOSI, SC1SCL, SC1RXD, TIM2C2
19| GND| GND| GND|
20| GND| GND| GND|
21| JTCK| 32| | SWCLK
22| PC2| 33| I/O| JTDO, SWO, TRACEDATA0
23| PC3| 34| I/O| JTDI, TRACECLK
24| PC4| 35| I/O| JTMS, SWDIO
25| PB0| 36| I/O, IRQ| VREF, IRQA, TRACEDATA2, TIM1CLK, TIM2MSK
26| PC1| 38| I/O| ADC3, TRACEDATA3
27| PC0 {4}| 40| I/O| JRST, IRQD, TRACEDATA1
28| PB7 {4}| 41| I/O| ADC2, IRQC, TIM1C2
29| PB6 {4}| 42| I/O| ADC1, IRQB, TIM1C1
30| PB5| 43| I/O| ADC0, TIM2CLK, TIM1MSK
31| GND| GND| GND|
32| Vcc| Vcc| Vcc|

Table 3: Pin Information

Notes:

1. When the alternate function is selected, TX_ACTIVE becomes an output that indicates that the EM358x radio circuit is in transmit mode. PC5 is not usable on the long range version of the ETRX358x as this GPIO is used internally as TX_ACTIVE to control the external RF frontend.
2. The serial UART connections TXD, RXD, CTS and RTS are PB1, PB2, PB3 and PB4 respectively
3. If PA5 is driven low at power-up or reset the module will boot up in the bootloader
4. PA6, PA7, PB6, PB7 and PC0 can drive high current (see section 8)
5. nRESET is level-sensitive, not edge-sensitive. The module is held in the reset state while nRESET is low.
6. ETRX3588, ETRX3586, ETRX3582 and ETRX3588HR, ETRX3586HR, ETRX3582HR variants only.

See also the table “Module pads and functions” in the ETRX357 Development Kit Product Manual. Refer to the Silicon Labs EM358x manual for details of the alternate functions and pin names.

Hardware Description

The ETRX358x and ETRX358xHR families are based on the Silicon Labs EM358x family of ZigBee SoCs. The EM358x and EM358xHR are fully integrated 2.4GHz ZigBee transceivers with a 32-bit ARM® Cortex M3TM microprocessor, flash and RAM memory, and peripherals.
The industry standard serial wire and JTAG programming and debugging interfaces together with the standard ARM system debug components help to streamline any custom software development.
In addition to this a number of MAC functions are also implemented in hardware to help maintaining the strict timing requirements imposed by the ZigBee and IEEE802.15.4 standards.
The new advanced power management features allow faster wakeup from sleep and new power down modes allowing this 4th generation module to offer a longer battery life than any 1st and 2nd generation modules on the market.
The EM358x modules have fully integrated voltage regulators for both required 1.8V and 1.25V supply voltages. The voltages are monitored (brown-out detection) and the built in power-on-reset circuit eliminates the need for any external monitoring circuitry. An optional 32.768 kHz watch crystal can be connected externally to pads 3 and 4 in case more accurate timing is required. To utilize the external watch crystal custom firmware is required.

Hardware Interface
All GPIO pins of the EM358x chips are accessible on the module’s pads. Whether signals are used as general purpose I/Os, or assigned to a peripheral function like ADC is set by the firmware. When developing custom firmware please refer to the EM358x datasheet [2].

Firmware Description

• By default, the modules will be pre-loaded with a standalone bootloader which supports over-the-air bootloading as well as serial bootloading of new firmware.
• In order to enter the standalone bootloader using a hardware trigger pull PA5 to ground and power-cycle or reset the module. To avoid entering the standalone bootloader unintentionally make sure not to pull this pin down during boot-up unless the resistance to ground is >10kΩ. (A pull-up is not required).
• Each module comes with a unique 64-bit 802.15.4 identifier which is stored in non-volatile memory. A router is typically a mains powered device whilst a sleepy end device (SED) can be battery powered.
• The module is also able to act as a coordinator and Trust Centre through external host control.

Token Settings
The ETRX358x Series Modules’ manufacturing tokens will be pre-programmed with the settings shown in the table below.

Table 4. Manufacturing tokens

Custom Firmware
The ETRX358x series of modules is an ideal platform for developing custom firmware. In order to develop custom firmware the Silicon Labs Ember toolchain is required.

Absolute Maximum Ratings

Table 5: Absolute Maximum Ratings
The absolute maximum ratings given above should under no circumstances be violated. Exceeding one or more of the limiting values may cause permanent damage to the device.

Caution! ESD sensitive device. Precautions should be used when handling the device in order to prevent permanent damage.

Environmental Characteristics

description

| VTHHBM| ±2| kV
2| ESD on non-RF pads according to Charged Device Model (CDM) circuit

description

| VTHCDM| ±400| V
**** 3| ESD on RF terminal according to Charged Device Model (CDM) circuit

description

| VTHCDM| ±225|

V

4| Moisture Sensitivity Level| MSL| MSL3, per J-STD-033|

Table 6: Absolute Maximum Ratings

Recommended Operating Conditions

No.| Item| Condition / Remark| Symbol| Value| Unit
---|---|---|---|---|---
Min| Typ| Max
1| Supply voltage| | VCC| 2.1| | 3.6| Vdc
2| RF Input Frequency| | fC| 2405| | 2480| MHz
3| RF Input Power| | pIN| | | 0| dBm
4| Operating temperature range| | Top| -40| | +85| °C

Table 7: Recommended Operating Conditions

DC Electrical Characteristics

VCC = 3.0V, TAMB = 25°C, NORMAL MODE (non-Boost) unless otherwise stated

No.| Item| Condition / Remark| Symbol| Value| Unit
---|---|---|---|---|---
Min| Typ| Max
1| Module supply voltage| | VCC| 2.1| | 3.6| Vdc
Deep Sleep Current

2

| Quiescent current, internal RC oscillator disabled,| 4kB RAM

retained

|

ISLEEP

| |

1.0

| |

µA

3

| Quiescent current,

internal RC oscillator enabled

| 4kB RAM

retained

|

ISLEEP

| |

1.25

| |

µA

4

| Quiescent current, including

32.768kHz oscillator

| 4kB RAM

retained

|

ISLEEP

| |

1.6

| |

µA

5

| Quiescent current including internal RC oscillator and 32.768kHz

oscillator

|

4kB RAM

retained

|

ISLEEP

| |

1.9

| |

µA

6

| Additional current per

4kB block of RAM retained

| |

IRAMSLEEP

| |

0,067

| |

µA

Reset Current
7| Quiescent current nReset asserted| | IRESET| | 2| 3| mA
Processor and Peripheral Currents
8| ARM® CortexTM M3, RAM and flash memory| 25°C, 12MHz

Core clock

| IMCU| | 7.5| | mA
9| ARM® CortexTM M3, RAM and flash memory| 25°C, 24MHz

Core clock

| IMCU| | 8.5| | mA

10

| ARM® CortexTM M3,

RAM and flash memory sleep current

| 25°C, 12MHz

Core clock

|

IMCU

| |

4.0

| |

mA

11

| ARM® CortexTM M3,

RAM and flash memory sleep current

| 25°C, 6MHz Core clock|

IMCU

| |

2.5

| |

mA

12

|

Serial controller current

| Per serial

controller at max. clock rate

|

ISC

| |

0.2

| |

mA

13| General purpose timer current| Per timer at max. clock rate| ITIM| | 0.25| | mA
14| General purpose ADC current| Max. Sample rate, DMA| IADC| | 1.1| | mA
15| USB Active Current| | IUSB| | 1| | mA
16| USB Suspend Mode Current| | IUSBSUSP| | | 2.5| mA
RX Current
17| Radio receiver MAC and Baseband| ARM® CortexTM M3 sleeping.| IRX| | 23.5| | mA
18| Receive current

consumption

| Total, 12MHz

clock speed

| IRX| | 27| | mA
19| Receive current consumption| Total, 24MHz clock speed| IRX| | 28| | mA

20

| Receive current

consumption BOOST MODE

| Total, 12MHz clock speed|

IRX

| |

29

| |

mA

21

| Receive current

consumption BOOST MODE

| Total, 24MHz clock speed|

IRX

| |

30

| |

mA

TX Current

22

| Transmit current consumption| at +3dBm module output power,

CPU at 12MHz

|

ITXVCC

| |

31.5

| |

mA

23

| Transmit Current consumption

BOOST MODE

| at +8dBm module output power,

CPU at 12MHz

|

ITXVCC

| |

44

| |

mA

24

| Transmit current consumption| at +0dBm module output power,

CPU at 12MHz

|

ITXVCC

| |

29

| |

mA

25

| Transmit current consumption| at min. module

output power, CPU at 12MHz

|

ITXVCC

| |

24

| |

mA

26

| Transmit current consumption| at +8dBm module

output power, CPU at 24MHz

|

ITXVCC

| |

45

| |

mA

26

| Wake time from deep sleep| From wakeup event to 1st

instruction

| | |

110

| |

µs

27

|

Shutdown time

| From last instruction into

deep sleep

| | |

5

| |

µs

Table 8: DC Electrical Characteristics

Please Note : The average current consumption during operation is dependent on the firmware and the network load.

Digital I/O Specifications

The digital I/Os of the ETRX35x module
VCC = 3.0V, TAMB = 25°C, NORMAL MODE unless otherwise stated

No.| Item| Condition / Remark| Symbol| Value| Unit
---|---|---|---|---|---
Min| Typ| Max

1

| Low Schmitt switching threshold| Schmitt input threshold going

from high to low

|

VSWIL

|

0.42 x VCC

| |

0.5 x VCC

|

Vdc

2

| High Schmitt switching threshold| Schmitt input threshold going

from low to high

|

VSWIH

|

0.62 x VCC

| |

0.8 x VCC

|

Vdc

3| Input current for logic 0| | IIL| | | -0.5| µA
4| Input current for logic 1| | IIH| | | 0.5| µA
5| Input Pull-up resistor value| | RIPU| 24| 29| 34| kΩ
6| Input Pull-down resistor

value

| | RIPD| 24| 29| 34| kΩ

7

|

Output voltage for logic 0

| IOL = 4mA (8mA) for standard (high

current) pads

|

VOL

|

0

| |

0.18 x VCC

|

V

8

|

Output voltage for logic 1

| IOH = 4mA (8mA)for standard (high

current) pads

|

VOH

|

0.82 x VCC

| |

VCC

|

V

9| Output Source Current| Standard current pad| IOHS| | | 4| mA
10| Output Sink current| Standard current

pad

| IOLS| | | 4| mA
11| Output Source Current| High current pad (1)| IOHH| | | 8| mA
12| Output Sink current| High current pad (1)| IOLH| | | 8| mA
13| Total output current| | IOH + IOL| | | 40| mA
| | Table 9. Digita| l I/O Specifications|
No.| Item| Condition / Remark| Symbol| Value| Unit
Min| Typ| Max

1

| Low Schmitt switching threshold| Schmitt input threshold going

from high to low

|

VSWIL

|

0.42 x VCC

| |

0.5 x VCC

|

Vdc

2

| High Schmitt switching threshold| Schmitt input

threshold going from low to high

|

VSWIH

|

0.62 x VCC

| |

0.68 x VCC

|

Vdc

3| Input current for logic 0| | IIL| | | -0.5| µA
4| Input current for logic 1| | IIH| | | 0.5| µA
5| Input Pull-up resistor value| Chip not reset| RIPU| 24| 29| 34| kΩ
6| Input Pull-up resistor value| Chip reset| RIPURESET| 12| 14.5| 17| kΩ

Table 10. nReset Pin Specifications

Notes

1. High current pads are PA6, PA7, PB6, PB7, PC0

A/D Converter Characteristics

The ADC is a first-order sigma-delta converter. For additional information on the ADC please refer to the EM358x datasheet.

No.| Item|
---|---|---
1| A/D resolution| Up to 14 bits
2| A/D sample time for 7-bit conversion| 5.33µs (188kHz)
3| A/D sample time for 14-bit conversion| 682µs
4| Reference Voltage| 1.2V

Table 11. A/D Converter Characteristics

AC Electrical Characteristics

VCC = 3.0V, TAMB = 25°C, NORMAL MODE measured at 50Ω terminal load connected to the U.FL socket

(1% PER and desired signal –82dBm acc. to [1])

| | 35| | dB
6| Low-Side Adjacent Channel Rejection

(1% PER and desired signal –82dBm acc. to [1])

| | 35| | dB
7| 2nd High-Side Adjacent Channel Rejection

(1% PER and desired signal –82dBm acc. to [1])

| | 46| | dB
8| 2nd Low-Side Adjacent Channel Rejection

(1% PER and desired signal –82dBm acc. to [1])

| | 46| | dB
9| Channel Rejection for all other channels

(1% PER and desired signal –82dBm acc. to [1])

| | 40| | dB
10| 802.11g rejection centred at +12MHz or –13MHz

(1% PER and desired signal –82dBm acc. to [1])

| | 36| | dB
11| Co-channel rejection

(1% PER and desired signal –82dBm acc. to [1])

| | -6| | dBc
12| Relative frequency error

(2x40ppm required by [1])

| -120| | 120| ppm
13| Relative timing error

(2x40ppm required by [1])

| -120| | 120| ppm
14| Linear RSSI range| 40| | | dB

15

| Output power at highest power setting NORMAL MODE

BOOST MODE

| 0| 3

8

| |

dBm

16| Output power at lowest power setting| | -55| | dBm
17| Error vector magnitude as per IEEE802.15.4| | 5| 15| %
18| Carrier frequency error| -40| | 40| ppm
19| PSD mask relative

3.5MHz distance from carrier

| -20| | | dB
20| PSD mask absolute

3.5MHz distance from carrier

| -30| | | dBm

Table 12. RF Electrical Characteristics

Please Note: For the relationship between EM358x power settings and module output power please relate to chapter 10.1 of this document. When developing custom firmware the output power settings described in this document relate directly to the EM358x power settings accessible via the Ember stack API.

Table 15: nReset Specifications

TX Power Characteristics

The diagrams below show the typical output power and module current in dependency on module EM3588 power setting. Power settings above 3dBm have Boost Mode enabled. Please note that the output power is independent of the supply voltage as the radio is supplied by an internally regulated voltage.

Power Settings for Regulatory Compliance
Due to national restrictions the maximum power levels of the ETRX358x and ETRX358xHR family of modules need to be adjusted as shown in the tables below. The default power setting of the EmberZNet stack is +3dBm.

European Compliance** the maximum Power settings for FCC, IC and C-Tick compliance.
Antenna| Channels 11-18| Channels 19-24| Channel 25| Channel 26
1/2 Wave| 8dBm boost| 8dBm boost| 7dBm boost| -8dBm normal
1/4 Wave| 8dBm boost| 8dBm boost| 7dBm boost| -8dB normal
On Board| 8dBm boost| 8dBm boost| 7dBm boost| -8dB normal

Table 11: Maximum Power Settings for FCC, IC Compliance

Physical Dimensions

Table 12: ETRX3 Physical Dimensions
For ideal RF performance when using the on-board antenna, the antenna should be located at the corner of the carrier PCB. There should be no components, tracks or copper planes in the keep-out area which should be as large as possible. When using the U.FL RF connector the keep-out area does not have to be obeyed. Note: The modules’ transmit/receive range will depend on the antenna used and also the housing of the finished product.

Recommended Reflow Profile

Recommended temperature profile for reflow soldering

Use of “No-Clean” solder paste is recommended to avoid the requirement for a cleaning process. Cleaning the module is strongly discouraged because it will be difficult to ensure no cleaning agent and other residuals are remaining underneath the shielding can as well as in the gap between the module and the host board.

Please Note:
Maximum number of reflow cycles: 2
Opposite-side reflow is prohibited due to the module’s weight. (i.e. you must not place the module on the bottom / underside of your PCB and re-flow).

Product Label Drawing

The label dimensions are 16.0mm x 14.0 mm. The label will withstand temperatures and chemicals used during a typical manufacturing process.

compliance marks and the FCC and IC IDs, etc., will be engraved on the hatched-out area or printed on the back side of the module, according to regulatory body requirements.
QR Code| QR Code containing information in the format YYWWMMABCDE YY: Last two digits of the assembly year

WW: Two-digit workweek when the device was assembled MMABCDE: Silicon Labs unit code

YYWWTTTTTT| Serial Number Code in the format YYWWTTTTTT YY: Last two digits of the assembly year

WW: Two-digit workweek when the device was assembled TTTTTT: Manufacturing trace code. The first letter is the device revision.

Table 13: ETRX358x Label Details

Recommended Footprint

In order to surface mount an ETRX3 series module, we recommend that you use pads which are 1mm wide and 1.2mm high. You must retain the keep-out zone shown in section 11, and ensure that this keep-out area is free of components, copper tracks and/or copper planes/layers.
You must also ensure that there is no exposed copper on your layout which may contact with the underside of the ETRX3 series module.
For best RF performance it is required to provide good ground connections to the ground pads of the module. It is recommended to use multiple vias between each ground pad and a solid ground plane to minimize inductance in the ground path.

The land pattern dimensions above serve as a guideline.
We recommend that you use the same pad dimensions for the solder paste screen as you have for the copper pads. However these sizes and shapes may need to be varied depending on your soldering processes and your individual production standards. We recommend a paste screen thickness of 120μm to 150μm.
Figure 9 shows the typical pad dimensions of the module and Figure 10-Figure 12 in section 14.1 show examples of how to align the module on its host PCB.

Although the undersides of the ETRX3 series modules are fully coated, no exposed copper, such as uncovered through-hole vias, planes or tracks on your board component layer, should be located below the ETRX3 series module in order to avoid ‘shorts’. All ETRX3 series modules use a multilayer PCB containing an inner RF shielding ground plane, therefore there is no need to have an additional copper plane directly under the ETRX3 series module.

Finally it is recommended to use no clean flux when soldering the ETRX358x family of modules and to not use a washing process after reflow. If the process does require washing then care must be taken that no washing agent is trapped underneath the shielding can after the drying process has completed.

Recommended Placement
When placing the module please either locate the antenna in the corner as shown in Figure 10 so that the recommended antenna keepout zone is being followed, or add a no copper zone as indicated in Figure 12.

Example Carrier Board
Since the RF performance of the module with the on board antenna is strongly dependent on the proper location of the module on its carrier board, Figure 13 shows the reference carrier board which was used during testing by Telegesis.

For best performance it is recommended to locate the antenna towards the corner of the carrier board and to respect the recommended keep-out areas as described in section 11.
Finally to provide a good reference ground to the on board antenna, the carrier board should have a ground plane spanning no less than 40 x 40mm. In many cases a smaller ground plane will suffice, but degradation in radio performance could be the result.

Reliability Tests

The measurements below have been conducted on random samples out of mass production and passed after the module has been exposed to standard room temperature and humidity for 1 hour.

Freq.:40Hz,Amplitude:1.5mm 20min. / cycle,1hrs. each of X and Y axis
2| Shock test| the same as the above| Dropped onto hard wood from height of 50cm for 10 times
3| Heat cycle test| the same as the above| -40°C for 30min. and +85°C for 30min.; each temperature 300 cycles
5| Low temp. test| the same as the above| -40°C, 300h
6| High temp. test| the same as the above| +85°C, 300h

Table 14: Reliability Tests

Application Notes

Safety Precautions

These specifications are intended to preserve the quality assurance of products as individual components.
Before use, check and evaluate the module’s operation when mounted on your products. Abide by these specifications when using the products. These products may short-circuit. If electrical shocks, smoke, fire, and/or accidents involving human life are anticipated when a short circuit occurs, then provide the following failsafe functions as a minimum:

1. Ensure the safety of the whole system by installing a protection circuit and a protection device.
2. Ensure the safety of the whole system by installing a redundant circuit or another system to prevent a single fault causing an unsafe status.

Design Engineering Notes

1. Heat is the major cause of shortening the life of the modules. Avoid assembly and use of the target equipment in conditions where the product’s temperature may exceed the maximum allowable.
2. Failure to do so may result in degrading of the product’s functions and damage to the product.
3. If pulses or other transient loads (a large load applied in a short time) are applied to the products, before use, check and evaluate their operation when assembled onto your products.
4. These products are not intended for other uses, other than under the special conditions shown below. Before using these products under such special conditions, check their performance and reliability under the said special conditions carefully, to determine whether or not they can be used in such a manner.
5. In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where liquid may splash.
6. In direct sunlight, outdoors, or in a dusty environment
7. In an environment where condensation occurs.
8. In an environment with a high concentration of harmful gas (e.g. salty air, HCl, Cl2, SO2, H2S, NH3, and NOx)
9. If an abnormal voltage is applied due to a problem occurring in other components or circuits, replace these products with new products because they may not be able to provide normal performance even if their electronic characteristics and appearances appear satisfactory.
10. Mechanical stress during assembly of the board and operation has to be avoided.
11. Pressing on parts of the metal cover or fastening objects to the metal cover is not permitted.

Storage Conditions

1. The module must not be stressed mechanically during storage.
2. Do not store these products in the following conditions or the performance characteristics of the product, such as RF performance, may well be adversely affected:
3. Storage in salty air or in an environment with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NOX
4. Storage (before assembly of the end product) of the modules for more than one year after the date of delivery at your company even if all the above conditions (1) to (3) have been met, should be avoided.

Packaging

Embossed Tape

1. Dimensions of the tape

2. Cover tape peel force

3. Empty pockets NB: Empty pockets in the populated area will be less than two per reel and those empty pockets will not be consecutive.
   Component Orientation
   Top cover tape will not obstruct the carrier tape holes and will not extend beyond the edges of the carrier tape Reel Dimensions

4. Quantity per reel : 600 pieces

5. Marking: Part No. / Quantity / Lot No. and manufacturer part# with bar-code will be on the reel Packaging

6. Each reel will be packed in a hermetically-sealed bag

7. Marking: Reel / Antistatic Packaging / Reel Box and outer Box will carry the following label

selected during ATE. If needed multiline.
2D-Barcode| Information in the 32×32 Datamatrix 2D-Barcode are and identifier “!REEL” [5 characters], the reel number [6 characters], the Module Order code [max 18 characters ], the quantity [max 4 characters] , the date code in the format Year-Month-Day [6 characters] and the product code [max 40 characters] , all separated by a semicolon.

Ordering Information

ETRX3581 3 , 4

ETRX3582 3 , 4

ETRX3585 3 , 4

ETRX3586 3 , 4

| Telegesis Wireless Mesh Networking Module with Silicon Labs ZigBee Technology:

• Based on Silicon Labs EM358x SoC
• Integrated 2.4GHz Antenna

ETRX3587 3
ETRX3588 3

ETRX3581HR 3 , 4

ETRX3582HR 3 , 4

ETRX3585HR 3 , 4

ETRX3586HR 3 , 4

| Telegesis Wireless Mesh Networking Module with Silicon Labs ZigBee Technology:

• Based on Silicon Labs EM358x SoC
• U.FL coaxial Antenna Connector

ETRX3587HR 3
ETRX3588HR 3 , 4

ETRX357DVK4| Telegesis Development Kit with:

• **** 3 x ETRX3DVK Development Boards
• 3 x USB cables
• 2 x ETRX357 on carrier boards
• 2 x ETRX357HR on carrier boards
• 2 x ETRX357-LRS on carrier boards
• 2 x ETRX357HR-LRS on carrier boards
• 1 x ETRX3USB USB stick
• 2 x ½-wave antennae2 x ¼-wave antennae

ETRX3587 Expansion Pack4|

• 2 x ETRX3587 on carrier boards
• 2 x ETRX3587HR on carrier boards
• 2 x ETRX3587-LRS on carrier boards
• 2 x ETRX3587HR-LRS on carrier boards

Notes:

1. Customers’ PO’s must state the Ordering/Product Code.
2. There is no “blank” version of the ETRX358x modules available.
3. MOQ and Lead Time applies.
4. This part is End of Life (EOL) and is no longer available.

RoHS Declaration

Declaration of environmental compatibility for supplied products:
Hereby we declare based on the declaration of our suppliers that this product does not contain any of the substances which are banned by Directive 2011/65/EU (RoHS2) or if they do, contain a maximum concentration of 0,1% by weight in homogeneous materials for:

• Lead and lead compounds
• Mercury and mercury compounds
• Chromium (VI)
• PBB (polybrominated biphenyl) category
• PBDE (polybrominated biphenyl ether) category

And a maximum concentration of 0.01% by weight in homogeneous materials for:

• Cadmium and cadmium compounds

Data Sheet Status

Telegesis (UK) Ltd. reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. Please consult the most recently issued data sheet before initiating or completing a design.

Related Documents

1. IEEE Standard 802.15.4 –2003 Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs)
2. Datasheet EM358x, Silicon Labs. (www.silabs.com)
3. Datasheet U.FL-Series 2004.2 Hirose Ultra Small Surface Mount Coaxial Connectors -Low Profile 1.9mm or 2.4mm Mated Height
4. The ZigBee specification (www.zigbee.org)
5. Specification for Antenova Rufa Antenna (www.antenova.com)
6. Embedded Antenna design Ltd. (EAD Ltd.) (www.ead-ltd.com)

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Disclaimer
Silicon Labs intends to provide customers with the latest, accurate, and in- depth documentation of all peripherals and modules available for system and software imple-menters using or intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and “Typical” parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without further notice to the product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Without prior notification, Silicon Labs may update product firmware during the manufacturing process for security or reliability reasons. Such changes will not alter the specifications or the performance of the product. Silicon Labs shall have no liability for the consequences of use of the infor-mation supplied in this document. This document does not imply or expressly grant any license to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any FDA Class III devices, applications for which FDA premarket approval is required or Life Support Systems without the specific written consent of Silicon Labs. A “Life Support System” is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons. Silicon Labs disclaims all express and implied warranties and shall not be responsible or liable for any injuries or damages related to use of a Silicon Labs product in such unauthorized applications.

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References

• Antennas for GNSS, 5G, Bluetooth and Wi-Fi | Antenova
• Antennas for GNSS, 5G, Bluetooth and Wi-Fi | Antenova
• Welcome to Embedded Antenna Design Ltd - EAD
• Welcome to Embedded Antenna Design Ltd - EAD
• Silicon Labs
• Silicon Labs
• About Us - Silicon Labs
• Silicon Labs Community
• Products - Silicon Labs
• CSA-IOT - Connectivity Standards Alliance
• CSA-IOT - Connectivity Standards Alliance

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