Lenovo P720 Think Station User Guide
- June 15, 2024
- Lenovo
Table of Contents
- Lenovo P720 Think Station User Guide
- Specifications
- SECTION I: Platform Overview
- Product Usage Instructions
- Power Specifications
- SECTION II: Platform Detail
- SECTION III: Supported Component Detail
- of Cores| 2
- of Threads| 4
- of Ports| 1| 2| 4| 2| 2| Not Available| Not Available| Not Available
- SECTION IV: BIOS/Certifications/Standards/Environmental
- FAQs
- References
- Read User Manual Online (PDF format)
- Download This Manual (PDF format)
Lenovo P720 Think Station User Guide
Specifications
- CPU: Intel Xeon Scalable Processor (Platinum, Gold, Silver, Bronze)
- Socket Type: 2066 Socket-P (LGA 3647)
- Operating System Support: Windows 10, Windows 7, Ubuntu 16.04, Ubuntu 18.04, Ubuntu 20.04, CentOS 7.4 LTS
- Memory: Up to 12 DIMM Slots, ECC RDIMM DDR4, Up to 2933MHz
- Storage: SATA, PCIe, SAS, eSATA
- Video: Integrated Graphics, Discrete Graphics, Multi-GPU Support
- Front I/O: USB, Audio, Media Card Reader
- Rear I/O: USB, Audio, DisplayPort, HDMI, DVI, VGA Port, Serial Port, Ethernet
Downloads
Hardware Maintenance Manual| P720
HMM
---|---
Drivers & Software| P720 Drivers &
Software
Available Whitepapers| RTX GPU Support
Matrix
P920/P720 Power
Configurator
P920/P720 Memory
Configurator
Intel VROC
Support
To access additional whitepapers visit https: / support.lenovo.com and select ‘PC’ then ‘Workstations’
SECTION I: Platform Overview
Description| The ThinkStation P720 is high performance dual socket
workstation. An Intel Purley-based product, the P720 provides excellent
performance and quality for applications where processor, memory, graphics,
and storage requirements are key. The P720 is positioned between two Purley-
based workstations, the single socket P520 and dual socket P920.
---|---
CPU
Processor Support | Xeon Scalable Processors (Platinum, Gold, Silver, Bronze) |
---|---|
Socket Type | Socket-P0 (LGA 3647) |
Product Usage Instructions
Setting Up the ThinkStation P7
To set up the ThinkStation P7, follow these steps:
- Unpack the product and ensure that all the components are included.
- Place the workstation on a stable surface.
- Connect the power cable to the workstation and plug it into a power outlet.
- Connect the display and other peripherals to the appropriate ports on the front or rear I/O panel.
- Press the power button to turn on the workstation.
Operating System Installation
To install the operating system on the ThinkStation P7, follow these steps:
- Insert the installation media (DVD or USB) into the appropriatedrive.
- Restart the workstation and enter the BIOS setup by pressing the designated key during startup.
- Configure the boot order to prioritize the installation media.
- Save the changes and exit the BIOS setup.
- Follow the on-screen instructions to complete the operating system installation.
Preloaded| Windows 10 Pro 64-bit for Workstations Ubuntu 16.04 LTS (configuration specific) Ubuntu 18.04 LTS (configuration specific) Ubuntu 20.04 LTS (configuration specific)
---|---
Supported| Red Hat Enterprise Linux 7.3 Red Hat Enterprise Linux 8.2 Ubuntu 16.04 LTS
Ubuntu 18.04 LTS
Ubuntu 20.04 LTS
Memory
Slots | Up to 12 DIMMs |
---|---|
Channels | Each Processor Supports up to 6 DIMM Sockets, 6 Channels per CPU |
Type | 288-Pin, 1866/2133/2400/2666/2933MHz ECC RDIMM |
ECC Support | Yes |
Speed | Up to 2933MHz |
Max DIMM Size | 64GB DDR4 ECC RDIMM |
Max System Memory | 768GB |
Storage
SATA | 9 x SATA Connectors, Gen 3 |
---|---|
PCIe | 2 x M.2 PCIe connectors onboard |
SAS | Supported via Optional Broadcom Adapter |
eSATA | 1 x eSATA Connector, Gen 3 |
Video
Integrated Graphics | Not Available |
---|---|
Discrete Graphics | PCIe Add-In-Card, Details in Section Below |
Multi-GPU Support | Yes |
Type | PCIe Add-In-Card |
Bus Interface | PCIe x16 |
Slots
Slot 1| PCIe 3.0 x16, Full Height, Full Length, 75W, With Latch
Note – Full Length Supported if Onboard M.2 Slots Not Utilized
---|---
Slot 2| PCIe 3.0 x16, Full Height, Full Length, 75W, With Latch
Slot 3| PCIe 3.0 x8, Full Height, Full Length, 25W, Open Ended
Slot 4| PCIe 3.0 x16, Full Height, Full Length, 75W, With Latch
Slot 5| PCI, Full Height, Full Length
Slot 6| PCIe 3.0 x4, Full Height, Half Length, 25W, Open Ended (PCH)
Front I/O
USB | 4 x USB 3.1 Gen 1 Type-A 5Gb/s (includes one 15W charging port) |
---|---|
Audio | 1 x Combo Audio/Microphone Jack (3.5mm) |
Media Card Reader | Front 9 in 1 Media Card Reader Standard (USB 2.0) |
Optional: Front 15 in 1 Media Card Reader (requires Flex module)
Flex Bay| Flex Module: Supports Two 5.25″ Flex Bays With Several Options Integrated
• Up to Two Half Height Optical Drives
• Up to Two 5.25” slim ODD Cages
• Up to One Front Access Storage Enclosure
• Up to One Flex Module for One or More of the Following Options: 9.0mm Optical/ 15-in-1 USB 3.1 Gen 1 Reader/Front eSATA/Dual Port Front Thunderbolt/Front USB 3.1 Gen 1 Type-C/ 4-Digit Diagnostic Display
Note: 1. Only one can be supported from 15-in-1 reader, Thunderbolt, and 4-Digit display
2. Up to two ports are suppported from 1394, eSATA, and USB Type-C
Disclaimers| Note: Actual USB throughout will vary depending on the type and quantity of USB devices used.
Rear I/O
USB| 2 x USB 2.0 Type-A 480Mb/s
4 x USB 3.1 Gen 1 Type-A 5Gb/s
---|---
Audio| 3 x Rear (Line Out, Line In, MIC); Retaskable to 5.1
DisplayPort| As Supported by GPU
HDMI| As Supported by GPU
DVI| As Supported by GPU
VirtualLink| As Supported by GPU
VGA Port| As Supported by GPU
Serial Port| Optional 1 x Rear Port
Ethernet| 2 x 1GbE – RJ45
PS/2| 2 x PS/2
IEEE 1394| Not Available
---|---
eSATA| Optional PCIe Bracket
Parallel Port| Not Available
Optional Network Adapter| Intel I210-T1 Single Port Gigabit Ethernet Adapter
Intel I350-T2 Dual Port Gigabit Ethernet Adapter Intel I350-T4 Quad Port
Gigabit Ethernet Adapter
PCI-E 1 x WiFi Card with BT HP External Antenna Kit (8265 AC)
Disclaimers| Note: Actual USB throughout will vary depending on the type and quantity of USB devices used.
Ethernet
Vendor | Intel Jacksonville I219LM, Intel Springville I210AT |
---|---|
Speeds | 10/100/1000Mbps |
Functions | PXE, ASF, WOL, Jumbo Frames, Teaming |
Connectors | 2 x RJ45 |
Audio
Vendor | Realtek |
---|---|
Type | HD (5.1) |
Internal Speaker | Yes |
Connectors | 3 x Rear 3.5mm Jacks (Line In, Line Out, Microphone In) |
Chipset | ALC662 |
Number of Channels | 6 Channels |
Number of Bits/Audio Resolution | 6 Channel DAC supports 16/20/24 bit PCM |
Stereo ADC supports 16/20 bit PCM
Thermal
Temp Sensors| Ambient Thermal Sensor – Thermal diode Connected to Super I/O CPU VR Sensor – Thermal diode Connected to Super I/O
DIMM VR Sensor- Thermal diode Connected to Super I/O PSU Thermal Sensor- Thermistor
PCI Zone 1 Sensor- Thermistor PCI Zone 1 Sensor- Thermistor PCI Zone 1 Sensor- Thermistor
M.2 Sensor- Thermistor
---|---
Fans| CPU x2 Fan 4-pin header with 3-pin key
Rear SYSTEM Fan x1 4-pin header, Lotes ABA-WAF-050-K01 Front Fan x1 4-pin header Lotes ABA-WAF-050-K01
ODD bay Fan x2 4-pin header with 3-pin key
PSU Fan x1 Main PSU power connector, DIMM Fans x2
Power Specifications
Power Supply | 900W and 690W | 1000W |
---|---|---|
Power Efficiency | 92% Efficient @ 50% Load | 92% Efficient @ 50% Load |
Main | C14 | C14 |
Operating Voltage Range | 100 – 240V | 100 – 240V |
Rated Voltage Range | 90-264VAC | 90-264VAC |
Rated Line Frequency | 47Hz / 63Hz | 47Hz / 63Hz |
Operating Line Frequency Range | 50Hz / 60Hz | 50Hz / 60Hz |
Rated Input Current | 9A-15A | 9A-15A |
Graphics | 1 x 8 pin (6+2) with 690 watt PSU |
2 x 8 pin (6+2) with 900 watt PSU Dongle to CPU 8-pin available
| 2 x (8 pin + 6 pin)
Power Supply Fan| Yes| Yes
ENERGY STAR® Qualified (config dependent)| Yes| Yes
80 PLUS Compliant| Yes| Yes
Built-in Self Test (BIST) LED| Yes| Yes
Aux Power Drop| Yes| Yes
BIOS
Vendor | AMI |
---|
Chassis Information
Color | Graphite Black |
---|---|
PSU | 1000W, 900W and 690W Available, Autosensing, 92% PSU, 80 PLUS Platinum |
Qualified
Thermal Solutions| Two System Fans Standard (1 front, 1 rear), One Fan per
CPU, One PSU Fan
Dimensions| 446mm/17.3″ H
485mm/19.1″ D
175mm/6.9″ W
Weight| 25.7kg / 56.7lbs
Packaging Dimensions
Height (mm/in) | 593mm / 23.35″ |
---|---|
Width (mm/in) | 317mm / 12.48″ |
--- | --- |
Depth (mm) | 611mm / 24.06″ |
Security & Serviceability
TPM | Infineon SLB9665TT TPM 2.0 |
---|---|
Asset ID | Yes, 1024 x 8bit |
vPro | Intel vPro for WS (AMT 9.x) |
Cable Lock Support | Yes, Optional Kensington Cable Lock |
Serial, Parallel, USB, Audio, Network, Enable/Disable Port Control | Yes |
Power-On Password | Yes |
Setup Password | Yes |
NIC LEDs (integrated) | Yes |
Access Panel Key Lock | Unique Key Lock Kit – Optional Common Key Lock Kit – |
Optional
Boot Sequence Control| Yes
Padlock Support| Not Supported
Boot without keyboard and/or mouse| Yes
Access Panel| Tool-less Side Cover Removal
Optical Drive| Tool-less
Hard Drives| Tool-less
Expansion Cards| Tool-less
Processor Socket| Tool-less
Color coded User Touch Points| Yes
Color-coordinated Cables and Connectors| Yes
Memory| Tool-less
System Board| Tool-less
Restore CD/DVD/USB Set| Not Included, Restore Media Available via Lenovo
Customer Support Center
Operating Environment
Air Temperature | Operating: 10⁰C to 35⁰C (50⁰F to 95⁰F) |
---|---|
Storage | Storage: -40⁰C to 60⁰C (-40⁰F to 140⁰F) in Original Shipping Carton |
Storage: -10⁰C to 60⁰C (14⁰F to 140⁰F) Without Carton
Humidity| Relative Humidity Operating: 10% to 80% (non-condensing) Relative
Humidity Storage/Transit: 10% to 90% (non-condensing)
| Wet Bulb Temperature Operating: 25⁰C (77⁰F) max
Wet Bulb Temperature Non-operating: 40⁰C (104⁰F) max
---|---
Altitude| Operating: -15.2m to 3048m (-50ft to 10000ft) Storage: -15.2m to
10668m (-50ft to 35000ft)
Vibration| Package Vibration:
Random,1.04G at 2-200 Hz, 15 Minutes XYZ 6 faces Operating Vibration:
Random,0.27G at 5-500 Hz, 30 Minutes Per Surface (X,Y,Z) Non-Operating Vibration:
Random,1.04G at 2-200 Hz, 15 Minutes Per Surface (±X,±Y,±Z)
Shock| Operation Shock: 3ms (15G) for 4 Axis (+X, -X, +Y,-Y)
3ms (30G) for 2 Axis (+Z, -Z), Half-sine Wave, Each Side Will do One Time
Rack Operation Shock: 5ms (15G) for 6 Axis (+X, -X, +Y,-Y,+Z, -Z), Half- sine Wave, Each Side Will do One Time
Non-operating Shock: Trapezoidal Wave, 50G, 9ms, 6 Sides (+X, -X, +Y,- Y, +Z ,-Z), Filter 300Hz, Each Side Shock One Time
SECTION II: Platform Detail
Board Size | 13.15″ x 14.9″ (334mm x 378.5mm) |
---|---|
Layout | Custom ATX |
Disclaimers |
Motherboard Core
Processor Support | Xeon Scalable Processors (Platinum, Gold, Silver, Bronze) |
---|---|
Socket Type | Socket-P0 (LGA 3647) |
Memory Support | DDR4 up to 2933MHz RDIMM Memory |
CPU-CPU Interconnect | UPI up to 10.4GT/s |
Voltage Regulator | Intel VR13.0 – 165W TDP Capable |
Chipset (PCH) | Intel C621 Chipset |
Flash | 32MB |
Super I/O | Nuvoton NCT6685 |
Clock | Intel Native isCLK |
Audio | Realtek ALC662 Codec |
Ethernet | Intel Jacksonville I219LM, Intel Springville I210AT |
SAS | Optional via Broadcom Adapter |
Disclaimers |
Supported Components
Processor Level | Platinum | Gold | Silver | Bronze |
---|---|---|---|---|
Processor | Intel Xeon PLATINUM 8160T | Intel Xeon GOLD 6242 |
Intel Xeon GOLD 6238T
Intel Xeon GOLD 6234
Intel Xeon GOLD 6230
Intel Xeon GOLD 5222
Intel Xeon GOLD 5218
Intel Xeon GOLD 6142
Intel Xeon GOLD 6136
Intel Xeon GOLD 6134
Intel Xeon GOLD 6128
Intel Xeon GOLD 5122
Intel Xeon GOLD 5120T
Intel Xeon GOLD 5118
| Intel Xeon SILVER 4216
Intel Xeon SILVER 4215
Intel Xeon SILVER 4214
Intel Xeon SILVER 4214R
Intel Xeon SILVER 4210
Intel Xeon SILVER 4210R
Intel Xeon SILVER 4209T
Intel Xeon SILVER 4208
Intel Xeon SILVER 4116
Intel Xeon SILVER 4114
Intel Xeon SILVER 4114T
Intel Xeon SILVER 4112
Intel Xeon SILVER 4110
Intel Xeon SILVER 4109T
Intel Xeon SILVER 4108
| Intel Xeon BRONZE 3204
Memory Type| RDIMMs – 2666MHz or 2933MHz, CPU Dependent
Memory| 8GB DDR4 ECC RDIMM PC4-2933
16GB DDR4 ECC RDIMM PC4-2933
32GB DDR4 ECC RDIMM PC4-2933
64GB DDR4 ECC RDIMM PC4-2933
8GB DDR4 ECC RDIMM PC4-2666
16GB DDR4 ECC RDIMM PC4-2666
32GB DDR4 ECC RDIMM PC4-2666
Disclaimers| | | |
Storage
3.5″ SATA Hard Disk Drive (HDD)| 1TB SATA HDD 7200rpm, 6Gb/s, 3.5″
2TB SATA HDD 7200rpm, 6Gb/s, 3.5″
4TB SATA HDD 7200rpm, 6Gb/s, 3.5″ (enterprise class) 6TB SATA HDD 7200rpm, 6Gb/s, 3.5″ (enterprise class)
---|---
2.5″ SATA Hard Disk Drive (HDD)| 500GB 2.5″ SATA HDD 7200rpm (FIPS certified)
2.5″ SATA Solid State Drive (SSD)| 256GB SATA SSD, 6Gb/s, TLC, 2.5″, OPAL
512GB SATA SSD, 6Gb/s, TLC, 2.5″ OPAL
512GB SATA SSD, 6Gb/s, TLC, 2.5″, Non-OPAL
1024GB SATA SSD, 6Gb/s, TLC, 2.5″ OPAL
2048GB SATA SSD, 6Gb/s, TLC, 2.5″ OPAL
M.2 PCIe Solid State Drive (SSD)| 256GB M.2 PCIe – SSD, Gen 3 x4, NVMe, OPAL
256GB M.2 PCIe – SSD, Gen 3 x4, NVMe, OPAL – Intel
512GB M.2 PCIe – SSD, Gen 3 x4, NVMe, OPAL
512GB M.2 PCIe – SSD, Gen 3 x4, NVMe, OPAL – Intel
512GB M.2 PCIe – SSD, Gen 3 x4, NVMe, Non-OPAL
| 1024GB M.2 PCIe – SSD, Gen 3 x4, NVMe, OPAL
2048GB M.2 PCIe – SSD, Gen 3 x4, NVMe, OPAL
---|---
PCIe Add-in-Card Solid State Drive (SSD)| 480GB Half Height, Half Length, PCIe
NVMe SSD, Gen 3 x4 – Intel 905p
Disclaimers|
RAID
RAID Levels and Requirements| M.2 RAID via Intel VROC
SATA RAID via Onboard Intel Controller or Broadcom Adapter SAS RAID via Broadcom Adapter
---|---
Notes| Supported RAID levels for a system will vary from the stated
capabilities of the RAID controller due to dependencies on the number and
capacity of physical disks in the system and on customer requirements for
performance, fault tolerance, or data redundancy.
Max supported RAID 0/1/5/10.
Optional Hard Disk Drive Controllers| Broadcom 9460-16i ROC PCIe Adapter,
Supports 0/1/5/10 Broadcom 9440-8i IOC PCIe Adapter, Supports 0/1/5/10
Intel VROC| Intel Virtual RAID On CPU (VROC) – Basic, Supports 0/1/10
Intel Virtual RAID On CPU (VROC) – Premium, Supports 0/1/5/10
Disclaimers|
Optical Drive/Removable Media
DVD-ROM Drive | DVD-ROM Drive – 16x/48x Slim SATA DVD-ROM |
---|---|
DVD Burner/CD-RW Drive | DVD Burner/CD-RW Rambo Drive Slim ODD DVD Burner/CD-RW |
Blu-Ray Burner Drive | Blu-Ray Burner Drive w/AACS encryption Slim Blu-Ray ODD |
DVD Burner
Media Card Reader Specifications| Front 9-in-1 USB 2.0 Media Card Reader
Standard
Optional Front 15-in-1 Media Card Reader (requires Flex module)
Disclaimers|
Keyboard and Pointing Devices
Keyboard| Traditional USB Keyboard Traditional PS/2 Keyboard Smart Card USB
Keyboard Calliope USB Keyboard
---|---
Pointing Devices| Calliope USB Mouse Lenovo USB Laser Mouse Fingerprint USB
Mouse PS/2 Optical Mouse
Disclaimers|
Expansion Bays
5.25″ External Access Bays| Two 5.25″ Flex Bays, Supports the Following:
• Up to Two Half Height Optical Drives
• Up to Two 5.25” Slim ODD Cages, Each Supports One 9.0mm Optical Drive
• Up to One 5.25″ Slim ODD and HDD Cage for One 9.0mm Optical Drive Plus One 3.5″ or 2.5″ SATA Disk
• Up to One Front Access Storage Enclosure for One 3.5″ or 2.5″ SATA Disk
• Up to One Flex Module for One or More of the Following Options: 9.0mm Optical/15-in-1 USB 3.1 Gen 1 Reader/Front eSATA/Front Thunderbolt/Front USB 3.1 Gen 1 Type-C
Note: 1. Only one can be supported from the following: 15-in-1 memory card reader, dual Thunderbolt ports
Note: 2. Up to two ports are suppported from 1394, eSATA, and USB Type-C
---|---
Disclaimers|
PCIe Adapters
Network| Intel I210-T1 Single Port Gigabit Ethernet Adapter Intel I350-T2 Dual Port Gigabit Ethernet Adapter Intel I350-T4 Quad Port Gigabit Ethernet Adapter Bitland BN8E88 1000M PCIe ASF FH
Aquantia 5G Ethernet Adapter (single port) Intel X540-T2 10G Ethernet Adapter (dual port) Intel X550-T2 10G Ethernet Adapter (dual port)
---|---
Thunderbolt| Front Thunderbolt Card Kit – Supports Two Optional Thunderbolt
Ports (USB Type-C) on Flex Module, One of Two Ports Supports Video Out Rear
Thunderbolt PCIe Adapter
USB| Rear USB 3.1 Type C PCIe Adapter V1.0 FH Bracket
WiFi Cards| Intel PCIe WiFi Card With BT External Antenna Kit (8265 AC)
PCIe to M.2 Adapter Card| PCIe x4 to M.2 Adapter (for NVMe SSD) Quad M.2 PCIe
Adapter
Disclaimers|
Upgrading Memory
To upgrade the memory on the ThinkStation P7, follow these steps:
- Ensure that the workstation is powered off and unplugged.
- Remove the side panel to access the DIMM slots.
- Insert the new memory module into an available DIMM slot, aligning the notch on the module with the key in the slot.
- Press down firmly on the module until it clicks into place.
- Replace the side panel and reconnect any cables that were disconnected.
SECTION III: Supported Component Detail
CPU Specifications
CPU| I
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| I
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| I
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---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---
| P L A T I N U M 8
1
6
0
T
| G O L D 6
2
4
2
| G O L D 6
1
4
2
| G O L D 6
1
3
6
| G O L D 6
2
3
8
T
| G O L D 6
2
3
4
| G O L D 6
1
3
4
| G O L D 6
2
3
0
| G O L D 6
1
2
8
| G O L D 5
2
2
2
| G O L D 5
1
2
2
| G O L D 5
1
2
0
T
| G O L D 5
2
1
8
| G O L D 5
11
8
| G O L D 5
11
5
| n S I L V E R 4
2
1
6
| n S I L V E R 4
11
6
| n S I L V E R 4
2
1
5
| V E R 4
2
1
4
| n S I L V E R 4
11
4
| n S I L V E R 4
11
4
T
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---
of Cores| 2
4
| 1
6
| 1
6
| 1
2
| 2
2
| 8| 8| 2
0
| 6| 4| 4| 1
4
| 1
6
| 1
2
| 1
0
| 1
6
| 1
2
| 8| 1
2
| 1
0
| 1
0
| 4| 1
0
|
of Threads| 4
8
| 3
2
| 3
2
| 2
4
| 4
4
| 1
6
| 1
6
| 4
0
| 1
2
| 8| 8| 2
8
| 3
2
| 2
4
| 2
0
| 3
2
| 2
4
| 1
6
| 2
4
| 2
0
| 2
0
| 8| 2
0
|
Processor Base Frequency| 2
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| 2
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| 2
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|
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Max Turbo Frequency| 3
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| 3
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| 3
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|
Cache| 3
3
M B L 3
| 2
2
M B
| 2
2
M B L 3
| 2
4
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5
M B L 3
| 3
0
.2
5
M B
| 2
4
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5
M B
| 2
4
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5
M B L 3
| 2
5
M B
| 1
9
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5
M B L 3
| 1
6
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M B
| 1
6
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M B L 3
| 1
9
.2
5
M B L 3
| 2
2
M B
| 1
6
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M B L 3
| 1
7
5
M B L 3
| 2
2
M B
| 1
6
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M B L 3
| 11
M B
| 1
6
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M B
| 1
7
5
M B L 3
| 1
7
TDP| 15
0
W
| 15
0
W
| 15
0
W
| 15
0
W
| 12
5
W
| 13
0
W
| 13
0
W
| 12
5
W
| 11
5
W
| 10
5
W
| 10
5
W
| 10
5
W
| 12
5
W
| 10
5
W
| 8
5
W
| 10
0
W
| 8
5
W
| 8
5
W
Intel ARK Spec Link| I
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1
6
0
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| I
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2
4
2
| I
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1
4
2
| I
n t el X
e o n G O L D 6
1
3
6
| I
n t el X
e o n G O L D 6
2
3
8
T
| I
n t el X
e o n G O L D 6
2
3
4
| I
n t el X
e o n G O L D 6
1
3
4
| I
n t el X
e o n G O L D 6
2
3
0
| I
n t el X
e o n G O L D 6
1
2
8
| I
n t el X
e o n G O L D 5
2
2
2
| I
n t el X
e o n G O L D 5
1
2
2
| I
n t el X
e o n G O L D 5
1
2
0
T
| I
n t el X
e o n G O L D 5
2
1
8
| I
n t el X
e o n G O L D 5
11
8
| I
n t el X
e o n G O L D 5
11
5
| I
n t e l X
e o n S I L V E R 4
2
1
6
| I
n t e l X
e o n S I L V E R 4
11
6
| I
n t e l X
e o n S I L V E R 4
2
1
5
| I
n t e l S I L V E R 4
2
1
4
| I
n t e l X
e o n S I L V E R 4
11
4
| I
n t e l X
e o n S I L V E R 4
11
4
T
HDD Specifications
Drive| 500GB SATA –
7200rpm, 6Gb/s, 2.5″
| 1TB SATA –
7200rpm, 6Gb/s, 3.5″
| 2TB SATA –
7200rpm, 6Gb/s, 3.5″
| 4TB SATA –
7200rpm, 6Gb/s, 3.5″
| 6TB SATA –
7200rpm, 6Gb/s, 3.5″
---|---|---|---|---|---
3.5″ SATA Hard Disk Drive (HDD)| Not Available| Yes| Yes| Yes| Yes
2.5″ SATA Hard Disk Drive (HDD)| Yes| Not Available| Not Available| Not
Available| Not Available
Connector| SANTA| SANTA| SANTA| SANTA| SANTA
Transfer Rate (Gb/sec)| 160MB/s OD
Read
| Average Data Rate, Read/Write 156MB/s| Average Data Rate, Read/Write
156MB/s| Sustained Data Transfer Rate 216 – 226MB/s| Sustained Data Transfer
Rate 216 – 226MB/s
Spindle Speed (RPM)| 7,200| 7,200| 7,200| 7,200| 7,200
DC Power to Drive Ready (sec)| 3.5| <10.0| <17.0| <17.0| <17.0
Average Latency (msec)| 4.2| 4.16| 4.16| 4.16| 4.16
Input (VDC)| 5| 5| 5| 5| 5
Typical (Watts)| 1.9| 6.19| 6.7| 7.35| 8.13
Idle (Watts)| 0.7| 4.6| 4.5| 5.45| 6.21
Physical Dimensions| 69.85mm x 100.34mm x 7mm| 101.6mm x 146.99mm x 19.88mm|
101.6mm x 146.99mm x 26.1mm| 101.85mm x 147mm x 26.1mm| 101.85mm x 147mm x
26.1mm
Weight (grams)| 90| 420| 535| 680| 705
Operating (C) Ambient| 0 to 60| 0 to 60| 0 to 60| 5 to 60| 5 to 60
Operating (C) Base Casting| 60| 60| 60| 60| 60
Non-Operating (C) Ambient| (-40 to 70)| (-40 to 70)| (-40 to 70)| (-40 to 70)|
(-40 to 70)
Gradient (C per Hour)| 20| 20| 20| 20| 20
Operating (Gs @ 2ms)| 400| 70| 80| Read 70 Gs
/ Write 40 Gs
| Read 70 Gs
/ Write 40 Gs
Non-Operating (Gs @ 2ms)| 1000| 350| 300| 300| 250
Solid State Storage Specifications
Drive| 512GB
2.5″ SATA SSD
| 1TB
2.5″ SATA SSD
| 2TB
2.5″ SATA SSD
| 256G B NVMe M.2 SSD TLC| 512GB NVMe M.2 SSD TLC| 1024G B NVMe M.2 SSD TLC| 2048
GB NVMe M.2 SSD TLC
| 480G B AIC
Optan e™ SSD
| 1.5TB U.2
Optan e ™ SSD
---|---|---|---|---|---|---|---|---|---
Dimensions Millimeters (W x D x H)| 70 x
100 x
7.0
| 70 x
100 x
7.0
| 70 x
100 x
7.0
| 22 x
80 x
2.3
| 22 x
80 x
2.3
| 22 x
80 x
2.3
| 22 x
80 x
2.3
| 20 x
168 x
104
| 70 x
100 x
15
Interface Type| SATA- III| SATA- III| SATA- III| PCIe
Gen
| PCIe
Gen
| PCIe
Gen
| PCIe
Gen
| PCIe
Gen
| PCIe
Gen
| | | | 3.0 x4 NVMe| 3.0 x4 NVMe| 3.0 x4 NVMe| 3.0 x4 NVMe| 3.0 x4 NVMe| 3.0
x4 NVMe
---|---|---|---|---|---|---|---|---|---
Power Active (AVG)| 1.9W| 2.2W| 6W| 5W| 5W| 5W| 5W| 18W| 18W
Power Idle| 50m W| 50m W| 50m W| 50m W| 50m W| 50m W| 50m W| 7W| 7W
Typical Sequential Read| 540M
B/s
| 540M
B/s
| 530M
B/s
| 3000
MB/s
| 3200
MB/s
| 3200
MB/s
| 3500
MB/s
| 2700
MB/s
| 2700
MB/s
Typical Sequential Write| 500M
B/s
| 500M
B/s
| 500M
B/s
| 1300
MB/s
| 1600
MB/s
| 1600
MB/s
| 3000
MB/s
| 2200
MB/s
| 2200
MB/s
Operating Temperature Range| 0 to 55°C| 0 to 55°C| 0 to 55°C| 0 to 55°C| 0 to
55°C| 0 to 55°C| 0 to 55°C| 0 to 85°C| 0 to 85°C
Endurance Rating (Lifetime Writes)| 150TB| 300T B| 600T B| 85TB| 150TB| 300T
B| 600T B| 8.76P B| 27.3P B
Mean Time Between Failures (MTBF)| 2.0M POH| 2.0M POH| 2.0M POH| 2.0M POH|
2.0M POH| 2.0M POH| 2.0M POH| 2.0M POH| 2.0M POH
Hardware Encryption| AES 256-
bit
| AES 256-
bit
| AES 256-
bit
| AES 256-
bit
| AES 256-
bit
| AES 256-
bit
| AES 256-
bit
| No| No
Disclaimers| SSD performance was measured with Crystal Disk Mark version 6.0.2
with the default 1000 MB data set. Sequential measurements are with 1 Thread,
Queue-Depth 32. Random measurements are with 4 threads and queue-depth 32.
Discrete Graphics Adapter
Adapter| Qu ad ro P4 00| Qu ad ro P6 20| Qu ad ro P1 00
0
| Qu ad ro P2 20
0
| T4 00| T6 00| T1 00
0
| Qu ad ro RT X 40
00
| Qu ad ro RT X 50
00
| Qu ad ro RT X 60
00
| Qu ad ro RT X 80
00
| RT X A4 00
0
| RT X A5 00
0
| RT X A6 00
0
| Qu ad ro GV 10
0
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---
Bus Interface| PC
Ie 3.
0
x1 6
| PC
Ie 3.
0
x1 6
| PC
Ie 3.
0
x1 6
| PC
Ie 3.
0
x1 6
| PC
Ie 3.
0
x1 6
| PC
Ie 3.
0
x1 6
| PC
Ie 3.
0
x1 6
| PC
Ie 3.
0
x1 6
| PC
Ie 3.
0
x1 6
| PC
Ie 3.
0
x1 6
| PC
Ie 3.
0
x1 6
| PC
Ie 4.
0
x1 6
| PC
Ie 4.
0
x1 6
| PC
Ie 4.
0
x1 6
| PC
Ie 3.
0
x1 6
Display Interface| 3 x m DP 1.4| 4
x m DP 1.4
| 4
x m DP 1.4
| 4
x DP 1.4
| 3 x m DP 1.4| 4
x m DP 1.4
| 4
x m DP 1.4
| 3 x DP 1.4
1 x Vir tu alL ink
| 4
x DP 1.4
1 x Vir tu alL ink
| 4
x DP 1.4
1 x Vir tu alL ink
| 4
x DP 1.4
1 x Vir tu alL ink
| 4
x DP 1.4
a
| 4
x DP 1.4
a
| 4
x DP 1.4
a
| 4
x DP 1.4
Graphics Chipset| Pa sc al| Pa sc al| Pa sc al| Pa sc al| Tu rin g| Tu rin g| Tu rin g| Tu rin g| Tu rin g| Tu rin g| Tu rin g| A
m pe re
| A
m pe re
| A
m pe re
| Vo lta
Memory Clock Frequency (MHz)| 1003
MHz
| 1252
MHz
| 1253
MHz
| 1251
MHz
| 1625
MHz
| 1750
MHz
| 1750
MHz
| 1750
MHz
| 2000
MHz
| 858
MHz
Memory Size| 2G B G D| 2G B G D| 4G B G D| 5G B G D| 2G B G D| 4G B G D| 4G B G D| 8G B G D| 16
GB G D
| 24
GB G D
| 48
GB G D
| 16
GB G D
| 24
GB G D
| 48
GB G D
| 32
GB HB M2
| DR 5| DR 5| DR 5| DR 5X| DR 6| DR 6| DR 6| DR 6| DR 6| DR 6| DR 6| DR 6| DR
6| DR 6|
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---
Memory Interface| 64
–
bit
| 12
8-
bit
| 12
8-
bit
| 16
0-
bit
| 64
–
bit
| 12
8-
bit
| 12
8-
bit
| 25
6-
bit
| 25
6-
bit
| 38
4-
bit
| 38
4-
bit
| 25
6-
bit
| 38
4-
bit
| 38
4-
bit
| 40
96
–
bit
Memory Bandwidth| Up to 32 GB
/s
| Up to 80 GB
/s
| Up to 82 GB
/s
| Up to 20
0G
B/ s
| 80
GB
/s
| 16
0G
B/ s
| 16
0G
B/ s
| Up to 41
6G
B/ s
| Up to 44
8G
B/ s
| Up to 67
2G
B/ s
| Up to 67
2G
B/ s
| 44
8
GB
/s
| Up to 76
8G
B/ s
| Up to 76
8G
B/ s
| Up to 87
0G
B/ s
GPU Cores| CU D A
Co res
: 25
6
| CU D A
Co res
: 51
2
| CU D A
Co res
: 64
0
| CU D A
Co res
: 12
80
| CU D A
Co res
: 38
4
| CU D A
Co res
: 64
0
| CU D A
Co res
: 89
6
| CU D A
Co res
: 23
04
Te ns or Co res
: 28
8
RT
Co res
: 36
| CU D A
Co res
: 30
72
Te ns or Co res
: 38
4
RT
Co res
: 48
| CU D A
Co res
: 46
08
Te ns or Co res
: 57
6
RT
Co res
: 72
| CU D A
Co res
: 46
08
Te ns or Co res
: 57
6
RT
Co res
: 72
| CU D A
Co res
: 64
11
Te ns or Co res
: 19
2
RT
Co res
: 48
| CU D A
Co res
:
8,1
92
Te ns or Co res
: 25
6
RT
Co res
: 64
| CU D A
Co res
:
10,
75
2
Te ns or Co res
: 33
6
RT
Co res
: 84
| CU D A
Co res
: 51
20
Te ns or Co res
: 64
0
GPU Core Frequency (MHz)| 1228M
Hz
| 1266M
Hz
| 1266M
Hz
| 1000
MHz
| 1005
MHz
| 1620
MHz
| 1440
MHz
| 1395M
Hz
| 1132M
Hz
Maximum Power Consumption| 30
W
| 40
W
| 47
W
| 75
W
| 30
W
| 40
W
| 50
W
| Total board power: 16
0
W
Total grap hics power: 12
5
W
| Total board power: 26
5
W
To tal gr ap hic s po we r: 23
0
W
| Total board power: 29
5
W
To tal gr ap hic s po we r: 26
0
W
| Total board power: 29
5
W
To tal gr ap hic s po we r: 26
0
W
| 14
0
W
| 23
0
W
| 30
0
W
| 25
0
W
Supported Resolutions and Max Refresh Rates (Hz) (Note: Analog and/or Digital)| 3 x
409
6×2
160
@ 60H
z 1 x
512
0×2
| 4 x
409
6×2
160
@ 60H
z 4 x
512
0×2
| 4 x
409
6×2
160
@ 60H
z 4 x
512
0×2
| 4 x
409
6×2
160
@ 120
Hz 4 x
512
0×2
| 4 x
384
0×2
160
@ 120
Hz 4 x
512
0×2
| 4 x
409
6×2
160
@ 120
Hz 4 x
512
0×2
| 4 x
409
6×2
160
@ 120
Hz 4 x
512
0×2
| 4 x
384
0 x
216
0 @
120
Hz 4 x
512
0×2
| 4 x
409
6×2
160
@ 120
Hz 4 x
512
0×2
| 4 x
409
6×2
160
@ 120
Hz 4 x
512
0×2
| 4 x
409
6×2
160
@ 120
Hz 4 x
512
0×2
| 4 x
409
6×2
160
@ 120
Hz 4 x
512
0×2
| 880
@ 60H
z
| 880
@ 60H
z
| 880
@ 60H
z
| 880
@ 60H
z
| 880
@ 60H
z 4 x
768
0×4
320
@ 60H
z
| 880
@ 60H
z 2 x
768
0×4
320
@ 60H
z
| 880
@ 60H
z 2 x
768
0×4
320
@ 60H
z
| 880
@ 60H
z 2 x
768
0×4
320
@ 60H
z
| 880
@ 60H
z 2 x
768
0×4
320
@ 60H
z
| 880
@ 60H
z 2 x
768
0×4
320
@ 60H
z
| 880
@ 60H
z 2 x
768
0×4
320
@ 60H
z
| 880
@ 60H
z 2 x
768
0×4
320
@ 60H
z
---|---|---|---|---|---|---|---|---|---|---|---|---
Thermal Solution| Ult ra- qu iet Ac tiv e Fa nsi nk| Ult ra- qu iet Ac tiv e
Fa nsi nk| Ult ra- qu iet Ac tiv e Fa nsi nk| Ult ra- qu iet Ac tiv e Fa nsi
nk| Ac tiv e| Ac tiv e| Ac tiv e| Ult ra- qu iet Ac tiv e Fa nsi nk| Ult ra-
qu iet Ac tiv e Fa nsi nk| Ult ra- qu iet Ac tiv e Fa nsi nk| Ult ra- qu iet
Ac tiv e Fa nsi nk| Ac tiv e| Ac tiv e| Ac tiv e| Ult ra- qu iet Ac tiv e Fa
nsi nk
Dimension| 2.7
13” H
x 5.7
” L
Sin gle Sl ot, Lo w Pr ofil e
| 2.7
13” H
x 5.7
” L
Sin gle Sl ot, Lo w Pr ofil e
| 2.7
13” H
x 5.7
” L
Sin gle Sl ot, Lo w Pr ofil e
| 4.
4″ H
x 7.9
″ L Sin
gle Sl ot
| 2.7
″ H x 6.1
″ L Sin
gle Sl ot
| 2.7
″ H x 6.1
″ L Sin
gle Sl ot
| 2.7
″ H x 6.1
″ L Sin
gle Sl ot
| 4.
4″ H
x 9.5
″ L Sin
gle Sl ot
| 4.
4″ H
x 10.
5″ L
Du al Sl ot, Fu ll He ig ht
| 4.
4″ H
x 10.
5″ L
Du al Sl ot, Fu ll He ig ht
| 4.
4″ H
x 10.
5″ L
Du al Sl ot, Fu ll He ig ht
| 4.
4″ H
x 9.5
″ L Sin
gle Sl ot
| 4.
4″ H
x 10.
5″ L
Du al Sl ot, Fu ll He ig ht
| 4.
4″ H
x 10.
5″ L
Du al Sl ot, Fu ll He ig ht
| 4.
4″ H
x 10.
5″ L
Du al Sl ot, Fu ll He ig ht
Advanced Display| Not Avai labl e| Not Avai labl e| Not Avai labl e| Not Avai
labl e| SYN C 2| SYN C 2| SYN C 2| SYN C 2| SYN C 2| SYN C 2| SYN C 2| Not
Avai labl e
SLI/NVLink Support| Not Avail able| Not Avail able| Not Avail able| Not Avail
able| Not Avail able| NVL
ink
| NVL
ink
| NVL
ink
| NVL
ink
| NVL
ink
| NVL
ink
Intel® Ethernet Specifications
Card| Intel I210-T1
Single Port Gigabit Ethern et Adapt er (Sprin gville)
| Intel I350- T2
Dual Port Gigabit Ethernet Adapt er (Stony Lake T2)
| Intel I350- T4
Quad Port Gigabit Ethernet Adapt er (Stony Lake T4)
| Intel X540- T2
Dual Port Coppe r 10Gb Ethern et Adapter
| Intel X710- DA2
Dual Port Fiber 10Gb
Ethern et Adapter
| Intel Ethernet SFP+ SR
Optics Module
| Intel Dual Band Wireless ss-AC 7260 ASM| Intel Winsto rm Peak 8265
2×2
AC+BT 4.2
Vpro M.2
Combo
---|---|---|---|---|---|---|---|---
Supplier PN| I210T1, MM# 941033| I350T2 G1P20, MM# 928941| I350T4 G1P20, MM#
92894
2
| MM#9 28955| MM# 952103| MM#: 941243| 7260H MWDT X.R, MM# 936170| MM#: 94665
8
Data Rates Supported| 10/100
/1000
Mbps copper
| 10/100
/1000
Mbps (Copp er), 1000M
bps (Fiber)
| 10/100
/1000
Mbps (Copp er), 1000M
bps (Fiber)
| 100/10
00Mbp s and 10Gbp s Coppe r
| 1GbE/1
0GbE
Optical fiber 10GbE
Direct Attach (DAC)
| Not Availab le| Intel Dual Band Wirele ss-AC 7260| Intel Dual Band Wirele
ss-AC 8265
---|---|---|---|---|---|---|---|---
Controller Details| Intel® Ethern et Contro ller I210| Intel Ethern et Contro
ller I350| Intel Ethern et Contro ller I351| Intel Ethern et Contro ller X540|
Intel Ethern et Contro ller X710- AM2| Not Availab le| Intel Dual Band Wirele
ss-AC 7260,
Dual Band, 2×2,
WiFi+B T
| Intel Dual Band Wirele ss-AC 8265,
2×2,
WiFi+B T, MU- MIMO
Controller Bus Architecture| PCIe 2.1
(5GT/s
)
| PCIe 2.1
(5GT/s
)
| PCIe 2.1
(5GT/s
)
| PCIe 2.1
(5GT/s
)
| PCIe 3.0
(8GT/s
)
| Not Availab le| PCIe M.2| PCIe M.2
Data Transfer Mode| Ethern et| Ethern et| Ethern et| Ethern et| Ethern et| Not
Availab le| WiFi (802.11
ac), 2.4GHz
, 5GHz
| WiFi (802.11
ac), 2.4GHz
, 5GHz
Power Consumption| 0.81W| Coppe r:
I350- T2 V2= 4.4W
Fiber: I350- F2= 5.5W
| Coppe r: I350T4 V2= 5W
LC-
Fiber: I350F4
= 6W
| X540- T2:
10Gps= 17.4W
1Gbps= 9.5W
100Mb
ps=6.6 W X540- T1:
10Gbp s=10.8 W
1Gbps= 7.7W
100Mb
ps= 6.4W
| Dual- port 10GBA SE- SR= 4.3W
typ/4.8 W max Dual- port 1000B ASE- SX= 4W
typ/4.3 W max Dual- port 10GBA SE- LR= 4.5W
typ/ 5.1W
max Dual- port Direct Attach (Twina x)= 3.3W
typ/3.7 W max
| Not Availab le| Not Availab le| Not Availab le
IEEE Standards Compliance| IEEE 802.3/1
0BASE
-T, 100BA SE-TX, 1000B ASE-T
| IEEE 802.3/1
0BASE
-T, 100BA SE-TX, 1000B ASE-T
| IEEE 802.3/1
0BASE
-T, 100BA SE-TX, 1000B ASE-T
| IEEE 802.3
100/10
00/10
GBASE
-T
| IEEE 802.3
1/1010
GBASE
– SR/LR, SFF- 8431
| Not Availab le| IEEE 802.11a
bgn, 802.11a
c, 802.11d
, 802.11e,
| IEEE 802.11a
bgn, 802.11a
c, 802.11d
, 802.11e,
| | | | | 10GSF P+DAC| | 802.11i,
802.11h
, 802.11
w
| 802.11i,
802.11h
, 802.11
w, 802.11r,
802.11k,
802.11v
(pendi ng)
---|---|---|---|---|---|---|---|---
Boot ROM Support| PXE
boot, Intel iSCSI
Remot e Boot for Windo ws, Linux and Vmwar e, Intel BootA gent Softwa re via PXE or BootP, WDMS
or
UEFI
| PXE
boot, Intel iSCSI
Remot e Boot for Windo ws, Linux and Vmwar e, Intel BootA gent Softwa re via PXE or BootP, WDMS
or
UEFI
| PXE
boot, Intel iSCSI
Remot e Boot for Windo ws, Linux and Vmwar e, Intel BootA gent Softwa re via PXE or BootP, WDMS
or
UEFI
| PXE
boot, Intel iSCSI
Remot e Boot for Windo ws, Linux and Vmwar e, Intel BootA gent Softwa re via PXE or BootP, WDMS
or
UEFI
| PXE
boot, Intel iSCSI
Remot e Boot for Windo ws, Linux and Vmwar e, Intel BootA gent Softwa re via PXE or BootP, WDMS
or
UEFI
| Not Availab le| Not Availab le| Not Availab le
Network Transfer Mode (Full/Half Duplex)| Suppor ted| Suppor ted| Suppor ted|
Suppor ted| Suppor ted| Not Availab le| Not Availab le| Not Availab le
Network Transfer Rate| 1,000M
bps Full Duplex
| 1,000M
bps Full Duplex
| 1,000M
bps Full Duplex
| 1,000M
bps Full Duplex
| 1,000M
bps Full Duplex
| Not Availab le| 300/8
67Mbp s
| 867Mb
ps
Operating System Driver Support| Windo ws 7/8/10,
Linux, Free BSD, XEN,V
VMware
| Windo ws 7/8/10,
Linux, Free BSD, XEN,V
VMware
| Windo ws 7/8/10,
Linux, Free BSD, XEN,V
VMware
| Windo was 7/8/10,
Windows Server Linux, FreeBSD D
| Windows 2008,
2012; RHEL 6.5/7.0,
FreeBSD D 9/10,
Vmware e ESXi 5.x
| Not Available le| Windows 10, 32-bit*, Windows 10,
64-
bit, Windows 8.1, 32-bit, Windows 8.1,
64-
bit, Windows 8, 32-bit, Windows 8,
64-
bit, Windows 7, 32-bit, Windows 7,
64-
bit, Linux
| Windows 10,
64-
bit*, Windows 8.1,
64-
bit, Windows 7, 32-bit, Windows 7,
64-
bit, Linux
Manageability| Suppor ted| Suppor ted| Suppor ted| Suppor ted| Suppor ted| Not
Available| Not Available| Not Available
| | | | | | le| le| le
---|---|---|---|---|---|---|---|---
Manageability Capabilities Alerting| Suppor ted| Suppor ted| Suppor ted|
Suppor ted| Suppor ted| Not Available| Not Available| Not Available
TDP| Firmw are Based Therm al Management| Firmw are Based Therm al Management|
Firmw are Based Therm al management| Firmw are Based Therm al management|
Not Available| Not Available| Not Available| Not Available
Operating Temperature Range| 0°C to 55°C (32°F
to 131°F)
| 0°C to 55°C (32°F
to 131°F)
| 0°C to 55°C (32°F
to 131°F)
| 0°C to 55°C (32°F
to 131°F)
| 0°C to 55°C (32°F
to 131°F)
| Not Available| 0°C to 80°C (32°F
to 176°F)
| 0°C to 80°C (32°F
to 176°F)
of Ports| 1| 2| 4| 2| 2| Not Available| Not Available| Not Available
Data Rate Per Port| 10/100
/1000
Mbps (copper)
| 10/100
/1000
Mbps (copper), 1000M
bps (fibre)
| 10/100
/1000
Mbps (copper), 1000M
bps (fibre)
| 100/1,0
00Mbp s, 10Gbp s
| 1Gbps, 10Gbp s| Not Available| Not Available| Not Available
System Interface Type| PCIe
Gen 2.1
| PCIe
Gen 2.1
| PCIe
Gen 2.1
| PCIe
Gen 2.1
| PCIe 3.0| Not Available| PCIe M.2| PCIe M.2
NC Sideband Interface| Not Available| Not Available| Not Available| Not
Available| Yes| Not Available| Not Available| Not Available
Jumbo Frames Supported| Yes| Yes| Yes| Yes| Yes| Not Available| Not Available|
Not Available
1000Base-T| Yes| Yes| Yes| Yes| Not Available| Not Available| Not Available
IEEE 1588| Suppor ted| Suppor ted| Suppor ted| Not Available| Suppor ted| Not
Available| Not Available| Not Available
Supported Under vPro| Not Available| Not Available| Not Available| Not
Available| Not Available| Not Available| Suppor ted| Suppor ted
Ethernet
Model| i210-T1| Dual Port Copper
= I350- T2V2
Dual Port LC- Fiber= I350-F2
| Dual Port Copper
= I350- T4 V2
Dual Port LC- Fiber= I350-F4
| Dual Port Copper
= X540- T2
| X710- DA2| AC 7260 NGW| AC 8265 NGW
---|---|---|---|---|---|---|---
Connector| RJ-45
Copper
| 2 x Ports| 4 x Ports| 2 x Ports| 2 x SFPs Recepta| 2 x Antenna| 2 x Antenna
| | RJ-45
Copper or 2 x Ports
LC-Fiber
| RJ-45
Copper or 4 x Ports
LC-Fiber
| RJ-45
Copper
| ble| s| s
---|---|---|---|---|---|---|---
Website| i210 T1| i350 T2/F2| i350 T4/F4| x540 T2| x710 DA2| 7260
NGW
| 8265
NGW
Auto-Negotiation| IEEE 802.3
Auto- negotiat on
| IEEE 802.3
Auto- negotiaton
| IEEE 802.3
Auto- negotiat on
| IEEE 802.3
Auto- negotiat on
| IEEE 802.3
Auto- negotiat on
| Not Availabl e| Not Availabl e
Intel® vPro™| Not Availabl e| Not Available| Not Availabl e| Not Availabl e|
Not Availabl e| Support ed| Support ed
Intel® Standard Manageablity| Supported| Supported| Supported| Supported|
Supported| Not Available| Not Available
Power Optimizer Platform Low-power Management Systems| Supported| Supported|
Support ed| Support ed| Support ed| Support ed| Support ed
Energy Efficient Ethernet| Supported| Supported| Support ed| Not Available|
Support ed| Not Available| Not Available
TCP/UDP Checksum and Segmentation Offload (IPv4 and IPv6)| Supported|
Supported| Support ed| Support ed| Support ed| Not Available| Not Available
Receive Side Scaling| Supported| Supported| Support ed| Support ed| Support
ed| Not Available| Not Available
Dual Tx and Rx Queues| Yes| Yes| Yes| Yes| Yes| Not Available| Not Available
Jumbo Frames (up to 9KB)| Supported| Supported| Support ed| Not Available|
Support ed| Not Available| Not Available
Teaming| Supported| Supported| Support ed| Support ed| Support ed| Not
Available| Not Available
Wake from Deep Sx| Supported| Supported| Support ed| Not Available| Not
Available| Not Available| Not Available
Server Operating System Support| Windows Server 2008,
2012,
2019
Linux (RHEL/ SLES),
Free BSD,
Xen, Vmware
| Windows Server 2008,
2012,
2019
Linux (RHEL/ SLES),
Free BSD,
Xen, Vmware
| Windows Server 2008,
2012,
2019
Linux (RHEL/ SLES),
Free BSD,
Xen, Vmware
| Windows Server 2003,
2008;
RHEL 4,
Linux/S LES 11,
Vmware
| Window s 2008,
2012; RHEL 6.5/7.0,
Free BSD 9/10,
Vmware ESXi 5.x
| Not Available| Not Available
Network Proxy/ARP Support| Supported| Supported| Support ed| Support ed|
Support ed| Not Available| Not Available
Adding Storage
To add storage to the ThinkStation P7, follow these steps:
- Ensure that the workstation is powered off and unplugged.
- Open the case by removing the appropriate screws or latches.
- Identify an available storage bay or connector for your desired storage type (SATA, PCIe, SAS, eSATA).
- Connect the storage device to the appropriate port or install it in a vacant bay.
- Secure the storage device in place using screws or latches.
- Close the case and reconnect any cables that were disconnected.
SECTION IV: BIOS/Certifications/Standards/Environmental
BIOS Specifications
WMI Support| Compliant With Microsoft WBEM and the DMTF Common Information
Model
---|---
ROM-Based Setup Utility (F1)| System Configuration Setup Program (text only
interface) Available at Power-on With F1 Key
Bootblock Recovery| Recovers System BIOS if the Flash ROM Becomes Corrupted
Replicated Setup| Saves System Configuration Settings to a File That Can Then
be Used to Replicate the Settings to Other Systems
Boot Control| Boot Control Available Through ROM-based Setup Utility or With
F12 Key at Power-on
Memory Change Alert| Power-on Error Message in the Event of a Decrease in
System Memory
Thermal Alert| Power-on Error message in the Event of a Fan Failure
Asset Tag| Supports Ability to Set SMBIOS Type 2 Baseboard Asset Tag Field
System/Emergency ROM Flash Recovery With Video| Supports Process to Recover
the System BIOS if the Flash ROM Becomes Corrupted
Remote Wakeup/Remote Shutdown| System Admin Can Power On/Off a Client Computer
from a Remote Location to Provide Maintenance
Quick Resume Time| Supports Low Power S3 (suspend to RAM) and Prompt Resume
Times
ROM Revision Level| System UEFI (BIOS) Version Reported in SMBIOS Type 0
Structure and in BIOS Setup
Keyboard-less Operation| System Can be Booted Without a Keyboard
Per-port Control| Allows I/O Ports to be Individually Enabled/Disabled Through
ROM- based Setup or WMI Interface
Adaptive Cooling| Offers Multiple Settings for Fan Control Ranging Between
Better Performance and Better Acoustics
Security| User and Administrator Passwords Can Protect Boot and ROM-based
Setup
– Support Electronic Lock
– Chassis Intrusion Detection
– UEFI Secure Boot Support
– HDD Password Can Protect HDD Data
– Windows UEFI Firmware Update Support
– Device Guard Support
– Optional Access Panel Lock, Kensington Lock, and Pad Lock
Intel(R) AMT (includes ASF 2.0)| Allows System to be Supported from a Remote
Location
Intel(R) TXT| Intel(R) Trusted Execution Technology Provides a Security
Foundation to Build Protections Against Software Based Attacks
Memory Modes| Supports Mirroring, Lock Step, and Sparing Memory Modes
Windows 10 Ready| Supports Windows 10 Requirements for Secure Flash, UEFI v
2.6 Device Guard Support Spec
Industry Standard Specification Support
UEFI | Unified Extensible Firmware Interface v2.7 |
---|---|
ACPI (Advanced Configuration and Power management Interface) | Advanced |
Configuration and Power Interface v6.1
ASF 2.0| DMTF Alert Standard Format Specification v2.0
ATA (IDE)| AT Attachment 6 with Packet Interface (ATA/ATAPI-6)
CD Boot| El Torito Bootable CD-Rom Format Specification, v1.0
EHCI| Enhanced Host Controller Interface for Universal Serial Bus, Revision
v1.0
PCI| NA (No PCI slot)
PCI Express| PCI Express Base Specification v3.0
SATA| Serial ATA Revision 3.0 Specification
TPM| Trusted Computing Group TPM Specification v2.0
UHCI| Universal Host Controller Interface Design Guide, Revision v1.1
USB| Universal Serial Bus Revision v1.1 Universal Serial Bus v2.0 Universal
Serial Bus v3.0
SMBIOS| DMTF System Management Spec v3.2.1
XHCI| XHCI SPEC Revision v1.2
Social and Environmental Responsibility
Quality Control| Lenovo is a member of an eco-declaration system that enforces
regular independent quality control
---|---
Hazardous Substances and Preparation| • Products do not contain more than;
0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1%
polybrominated biphenyls (PBB) or 0.1% polybrominated diphenyl ethers (PBDE).
(See legal reference and Note B1)
• Products do not contain Asbestos
• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydro chloro fluor carbons (HCFC), Halons, carbon tetra chloride, 1,1,1- trichloroethane, methyl bromide
• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
• Products do not contain more than 0.1% short chain chloro paraffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm²/week
REACH Article 33 information about substances in articles is available at:
http: /www.lenovo.com/social_responsibility/us/en/ThinkGreen_produc ts.html#environment
Batteries| Not Available
Safety, EMC Connection to the Telephone Network and Labeling| Not Applicable,
no Connection to a Telephone Network
Safety, EMC Connection to the Telephone Networkand Labeling
System Software Manager| Lenovo ThinkStation Supports Software Management
Tools by Lenovo Vantage
---|---
Regulations & Standards
EMC & Safety| FCC DoC for North America VCCI Certification for Japan BSMI Certification for Taiwan EU/EFTA CE Mark & DoC
UL/CUL(P920,P720,P520,P520c), cTUVus(P330) UL-GS(P920,P720,P520,P520c), TUV- GS(P330)
IEC60950-1 CB Report/Certificate Saudi Arabia SASO
Kuwait KUCAS China CCC Mark
Hong Kong SAR (CB report) Singapore PSB
South Africa SABS Russia-EAC Morocco-CM Mexico-NOM Kazakhstan-EAC Belarus-EAC Serbia KVALITET Ukraine UKrCEPRO India-BIS
USA Chemical Emission Test
---|---
Environmentals
Energy Star | ENERGY STAR® v7.0 |
---|---|
EPEAT | EPEAT® Silver Certification Available on Select Models |
Greenguard | Greenguard |
RoHS | RoHS Compliant |
ErP Lot-3 2013 | Yes |
Hazardous Substances | • Products do not contain more than; 0.1% lead, 0.01% |
cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenol ethers (PBDE)
• Products do not contain Asbestos
• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydro bromo fluoro carbons (HBFC), hydro chloro fluor carbons (HCFC), Halons, carbon tetrachloride, 1,1,1- trichloroethane, methyl bromide
• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
• Products do not contain more than 0.1% short chain chloro paraffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm_/week
Disclaimers| EPEAT registered where applicable. EPEAT registration varies by country. See www.epeat.net for registration status by country.
FAQs
Q: What operating systems are supported by the ThinkStation P7?
A: The ThinkStation P7 supports Windows 10, Windows 7, Ubuntu 16.04, Ubuntu
18.04, Ubuntu 20.04, and CentOS 7.4 LTS.
Q: How many DIMM slots are available for memory expansion?
A: The ThinkStation P7 has up to 12 DIMM slots for memory expansion.
Q: Can I use both integrated and discrete graphics on the ThinkStation P7?
A: Yes, the ThinkStation P7 supports both integrated graphics and discrete
graphics, as well as multi-GPU configurations.
Q: How do I upgrade the memory on the ThinkStation P7?
A: To upgrade the memory, follow the steps outlined in the “Upgrading Memory”
section of the user manual.
Q: What storage options are available for the ThinkStation P7?
A: The ThinkStation P7 supports SATA, PCIe, SAS, and eSATA storage options.
References
- lenovo.com/social_responsibility/us/en/ThinkGreen_produc
- workstations :: thinkstation p series workstations :: thinkstation p720 Lenovo PC Support - Lenovo Support US
- Lenovo Support | Drivers, Troubleshooting, Warranty, Repair | Lenovo Support US
- Lenovo Support | Drivers, Troubleshooting, Warranty, Repair | Lenovo Support US
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