unicore UM960 High Precision RTK Positioning Module User Manual

UM960 High Precision RTK Positioning Module

INSTALLATION AND OPERATION
USER MANUAL
WWW.UNICORECOMM.COM

UM960
BDS/GPS/GLONASS/Galileo/QZSS
All-constellation Multi-frequency
High Precision RTK Positioning Module
Copyright© 2009-2023, Unicore Communications, Inc.
Data subject to change without notice.

Revision History

Optimize section 3.2 Antenna Feed Design
Optimize section 3.3 Power-on and Power-off
Add section 3.5 Recommended PCB Package Design| Sep., 2022

Legal right notice

This manual provides information and details on the products of Unicore Communication, Inc. (“Unicore”) referred to herein.
All rights, title and interest to this document and the information such as data, designs, layouts contained in this manual are fully reserved, including but not limited to the copyrights, patents, trademarks and other proprietary rights as relevant governing laws may grant, and such rights may evolve and be approved, registered or granted from the whole information aforesaid or any part(s) of it or any combination of those parts. Unicore holds the trademarks of, “UNICORECOMM” and other trade name, trademark, icon, logo, brand name and/or service mark of Unicore products or their product serial referred to in this manual (collectively “Unicore Trademarks”). This manual or any part of it, shall not be deemed as, either expressly, implied, by estoppel or any other form, the granting or transferring of Unicore rights and/or interests (including but not limited to the aforementioned trademark rights), in whole or in part.
Disclaimer
The information contained in this manual is provided “as is” and is believed to be true and correct at the time of its publication or revision. This manual does not represent, and in any case, shall not be construed as a commitments or warranty on the part of Unicore with respect to the fitness for a particular purpose/use, the accuracy, reliability and correctness of the information contained herein.
Information, such as product specifications, descriptions, features and user guide in this manual, are subject to change by Unicore at any time without prior notice, which may not be completely consistent with such information of the specific product you purchase.
Should you purchase our product and encounter any inconsistency, please contact us or our local authorized distributor for the most up-to-date version of this manual along with any addenda or corrigenda.

Foreword

This document describes the information of the hardware, package, specification and the use of Unicore UM980 modules.
Target Readers
This document applies to technicians who possess the expertise on GNSS receivers.

Introduction

UM960 is a new generation of GNSS high precision positioning RTK module from Unicore. It supports all constellations and multiple frequencies, and can simultaneously track BDS B1I/B2I/B3I/B1C/B2a + GPS L1/L2/L5 + GLONASS G1/G2+Galileo E1/E5a/E5b + QZSS L1/L2/L5 + SBAS. The module is mainly used in UAVs, lawn mower, handheld device, high precision GIS, precise agriculture, and intelligent drive.
UM960 is based on NebulasⅣ TM , a GNSS SoC which integrates RF-baseband and high precision algorithm. Besides, the SoC integrates a dual-core CPU, a high speed floating point processor and an RTK co-processor with 22 nm low power design, and it supports 1408 super channels and realizes 20 Hz RTK positioning output. All these above enable stronger signal processing.
UM960 features a compact size of 16.0 mm × 12.2 mm. It adopts SMT pads, supports standard pick-and-place and fully automated integration of reflow soldering.
Furthermore, UM960 supports interfaces such as UART, I2 C , which meets the customers’ needs in different applications. Reserved interface, not supported currently.
1.1 Key Features

• High precision, compact size and low power consumption
• Based on the new generation GNSS SoC -NebulasIV TM , with RF-baseband and high precision algorithm integrated
• 16.0 mm × 12.2 mm × 2.6 mm, surface-mount device
• Supports all-constellation multi-frequency on-chip RTK positioning solution
• Supports BDS B1I/B2I/B3I/B1C/B2a + GPS L1/L2/L5 + GLONASS G1/G2 + Galileo E1/E5b/E5a + QZSS L1/L2/L5 + SBAS
• All constellations and multiple frequencies RTK engine, and advanced RTK processing technology
• Independent tracking of different frequencies, and 60 dB narrowband anti-jamming
• Advanced function of jamming detection

1.2 Key Specifications
Table 1-1 Technical Specifications

Basic Information|
---|---
Channels| 1408 channels, based on NebulasIV TM
Constellations| GPS/BDS/GLONASS/Galileo/QZSS
Frequency|  GPS: L1C/A, L2P(W), L2C, L5
BDS: B1I, B2I, B3I, B1C, B2a
GLONASS: G1, G2
Galileo: E1, E5b, E5a
QZSS: L1, L2, L5
Power|
Voltage| +3.0 V~ +3.6 V DC
Power Consumption| 450mW（Typical）

Performance

Positioning (RMS) Vertical: 2.5 m
Horizontat 0A m
DGPS (MS)
Vertical: 0.8 m
Horizontal 0.8 cm + 1 ppm
In (RMS)
Vertical: 1.5 cm + 1 ppm
Observation Accuracy (RMS)| BDS| GPS| GLONASS| Galileo
1311/1.1 C/A/G1/E1 Pseudorange| 10 cm| W an| 10 cm| 10 cm
BlU Ll C/A/G1/El Carrier Phase| 1 mm| 1 mm| 1 mm| 1 mm
1:12UL2P/G2/E5b Pseudorange| 10 cm| Wan| 10cm| 10 an
E2UL2P/G2/E5b Carrier Phase| 1 mm| 1 mm| 1 mm| 1 mm
113UL5/E5a Pseudorange| 10 cm| Wan| 10 cm| 10 an
B3UL5/E5a Carrier Phase| 1 mm| 1 mm| 1 mm| 1 mm
Time Pulse Accuracy (RMS)| 20 ns
Velocity Accuracy (RMS)| 0.03 m/s
Time to First Fix (TIFF)| Cold Start c 30 s
Initialization Time| c 5 s (Typical)
Initialization Reliability| .99.9%
Data Update Rate| 20 Hz Positioning
Differential Data| RTCM 2.3, RTCM3x, CMR
Data Format| NMEA-0183; Unicore
Physical Specifications|
---|---
Package| 24 pin LGA
Dimensions| 16.0 mm ×  12.2 mm ×  2.6 mm
Environmental Specifications|
Operating Temperature| -40 °C ~ +85 °C
Storage Temperature| -55 °C ~ +95 °C
Humidity| 95% No condensation
Vibration| GJB150.16A-2009; MIL-STD-810F
Shock| GJB150.18A-2009; MIL-STD-810F
Functional Ports|
UART x 3|
I2C  x 1|

1.3 Block Diagram

• RF Part
  The receiver gets filtered and enhanced GNSS signal from the antenna via a coaxial cable. The RF part converts the RF input signals into the IF signal, and converts IF analog signals into digital signals required for NebulasIV chip.

• NebulasIV SoC
  NebulasIV is UNICORECOMM’s new generation high precision GNSS SoC with 22 nm low power design, supporting all constellations, multiple frequencies and 1408 super channels. It integrates a dual-core CPU, a high speed floating point processor and an RTK co-processor, which can fulfill the high precision baseband processing and RTK positioning independently.

• External Interfaces
  The external interfaces of UM960 include UART, I2 C , PPS, EVENT, RESET_N, etc.’

Reserved interface, not supported currently.

Hardware

2.1 Pin Definition

Table 2-1 Pin Definition

or peripheral I/O
2| RSV| —| Reserved, must be floating; cannot connect ground or power supply or peripheral I/O
3| PPS| O| Pulse per second, with adjustable pulse width and polarity
4| EVENT| I| Event Mark, with adjustable frequency and polarity
5| RSV| —| Built-in function; recommended to add a through-hole testing point and a 10 kΩ pull-up resistor; cannot connect ground or power supply or peripheral I/O, but can be floating.
6| TXD2| O| UART2 output
7| RXD2| I| UART2 input
8| RESET_N| I| System reset; active Low. The active time should be no less than 5 ms.
9| VCC_RF1| O| External LNA power supply
10| GND| —| Ground
11| ANT_IN| I| GNSS antenna signal input
12| GND| —| Ground
13| GND| —| Ground
14| RTK_STAT| O| High level: RTK Fix;
Low level: RTK No Fix
15| RXD3| I| UART3 input
16| TXD3| O| UART3 output
17| RSV| —| Built-in function; recommended to add a through-hole testing point and a 10 kΩ pull-up resistor; cannot connect ground or power supply or peripheral I/O, but can be floating.
18| SDA| I/O| I 2C data
19| SCL| I/O| I 2 C clock
20| TXD1| O| UART1 output
21| RXD1| I| UART1 input
22| V_BCKP| I| When the main power supply VCC is cut off, V_BCKP supplies power to RTC and relevant register. Level requirement: 2.0 V ~ 3.6 V, and the working current is less than 60 μA at 25 °C. If you do not use the hot start function, connect V_BCKP to VCC. Do NOT connect it to ground or leave it floating.
23| VCC| I| Supply voltage
24| GND| —| Ground

2.2 Electrical Specifications
2.2.1 Absolute Maximum Ratings
Table 2-2 Absolute Maximum Ratings

2.2.2 Operating Conditions
Table 2-3 Operational Conditions

Parameter| Symbol| Min.| Typ.| Max.| Unit| Condition
---|---|---|---|---|---|---
Power Supply (VCC)| VCC| 3| 3.3| 3.6| V|
Maximum Ripple Voltage| Vrpp| 0| | 50| mV|
Working Current2| Iopr| | 136| 218| mA| VCC = 3.3 V
VCC_RF Output Voltage| VCC_RF| | VCC-0.1| | V|
VCC_RF Output Current| ICC_RF| | | 50| mA|
Operating Temperature| Topr| -40| | 85| ° C|
Power Consumption| P| | 450| | mW|

2.2.3 IO Threshold
Table 2-4 IO Threshold

Parameter| Symbol| Min.| Typ.| Max.| Unit C| Condition
---|---|---|---|---|---|---
Low Level
Input Voltage| Vin_low| 0| | 0.6| V|
High Level
Input Voltage| Vin_high| VCC ×  0.7| | VCC + 0.2| V|
Low Level
Output Voltage| Vout_low| 0| | 0.45| V| Iout = 2 mA
High Level
Output Voltage| Vout_high| VCC –
0.45| | VCC| V| Iout = 2 mA

2.2.4 Antenna Feature
Table 2-5 Antenna Feature

Parameter| Symbol| Min.| Typ.| Max.| Unit C| Condition
---|---|---|---|---|---|---
Optimum Input Gain| Gant| 18| 30| 36| dB|

2 Since the product has capacitors inside, inrush current occurs during power- on. You should evaluate in the actual environment in order to check the effect of the supply voltage drop caused by inrush current in the system.

2.3 Dimensions
Table 2-6 Dimensions

Hardware Design

3.1 Recommended Minimal Design L1: 68 nH RF inductor in 0603 package is recommended
C1: 100 nF + 100 pF capacitors connected in parallel is recommended
C2: 100 pF capacitor is recommended
C3: N 10 μF + 1 100 nF capacitors connected in parallel is recommended, and the total inductance should be no less than 30 μF
R1: 10 kΩ resistor is recommended
3.2 Antenna Feed Design
UM980 just supports feeding the antenna from the outside of the module rather than from the inside. It is recommended to use devices with high power and that can withstand high voltage. Gas discharge tube, varistor, TVS tube and other high-power protective devices may also be used in the power supply circuit to further protect the module from lightning strike and surge.
**** If the antenna feed supply ANT_BIAS and the module’s main supply VCC use the same power rail, the ESD, surge and overvoltage from the antenna will have an effect on VCC, which may cause damage to the module. Therefore, it is recommended to design an independent power rail for the ANT_BIAS to reduce the possibility of module damage.

Notes:

• L1: feed inductor, 68 nH RF inductor in 0603 package is recommended
• C1: decoupling capacitor, recommended to connect two capacitors of 100 nF/100 pF in parallel
• C2: DC blocking capacitor, recommended 100 pF capacitor
• Not recommended to take VCC_RF as ANT_BIAS to feed the antenna (VCC_RF is not optimized for the anti-lightning strike and anti-surge due to the compact size of the module).
• D1: ESD diode, choose the ESD protection device that supports high frequency signals (above 2000 MHz)
• D2: TVS diode, choose the TVS diode with appropriate clamping specification according to the requirement of feed voltage and antenna withstand voltage

3.3 Power-on and Power-off
VCC

• The VCC initial level when power-on should be less than 0.4 V.
• The VCC ramp when power-on should be monotonic, without plateaus.
• The voltages of undershoot and ringing should be within 5% VCC.
• VCC power-on waveform: The time interval from 10% rising to 90% must be within 100 μs ~1 ms.
• Power-on time interval: The time interval between the power-off (VCC < 0.4 V) to the next power-on must be larger than 500 ms.

V_BCKP

• The V_BCKP initial level when power-on should be less than 0.4 V.
• The V_BCKP ramp when power-on should be monotonic, without plateaus.
• The voltages of undershoot and ringing should be within 5% V_BCKP.
• V_BCKP power-on waveform: The time interval from 10% rising to 90% must be within 100 μs ~1 ms.
• Power-on time interval: The time interval between the power-off (V_BCKP < 0.4 V) to the next power-on must be larger than 500 ms.

3.4 Grounding and Heat Dissipation

The 55 pads in the rectangle in Figure 3-3 are for grounding and heat dissipation.
In the PCB design, they must be connected to a large sized ground to strengthen the heat dissipation. 3.5 Recommended PCB Package Design
3.5 Recommended PCB Package Design
See the following figure for the recommended PCB package design.

Remark:

• For the convenience of testing, the soldering pads of the pins are designed long, exceeding the module border much more. For example:
• The pads denoted as detail C are 1.50 mm longer than the module border.
• The pad denoted as detail A is 0.49 mm longer than the module border. It is relatively short as it is an RF pin pad, so we hope the trace on the surface is as short as possible to reduce the impact of interference.
• In order to effectively reduce the possibility of solder bridge during the soldering, the pin pads are designed narrower than the pins. However, the pad denoted as detail A has the same width as the pin, as we hope the resistance is as continuous as possible at the RF pin.

Production Requirement

Recommended soldering temperature curve is as follows: Temperature Rising Stage

• Rising slope: Max. 3 °C/s
• Rising temperature range: 50 °C to 150 °C

Preheating Stage

• Preheating time: 60 s to 120 s
• Preheating temperature range: 150 °C to 180 °C

Reflux Stage

• Over melting temperature (217 °C) time: 40 s to 60 s
• Peak temperature for soldering: no higher than 245 °C

Cooling Stage

• Cooling slope: Max. 4 °C / s
• In order to prevent falling off during soldering of the module, do not solder it on the back of the board during design, and it is not recommended to go through  soldering cycle twice.
• The setting of soldering temperature depends on many factors of the factory, such as board type, solder paste type, solder paste thickness etc. Please also refer to the  relevant IPC standards and indicators of solder paste.
• Since the lead soldering temperature is relatively low, if using this method, please give priority to other components on the board.
• The opening of the stencil needs to meet your design requirement and comply with the examine standards. The thickness of the stencil is recommended to be 0.15mm.

Packaging

5.1 Label Description 5.2 Product Packaging
The UM980 module uses carrier tape and reel (suitable for mainstream surface mount devices), packaged in vacuum-sealed aluminum foil antistatic bags, with a desiccant inside to prevent moisture. When using reflow soldering process to solder modules, lease strictly comply with IPC standard to conduct temperature and humidity control on the modules. As packaging materials such as the carrier tape can only withstand the temperature of 55 degrees Celsius, modules shall be removed from the package during baking.

Note:

1. The cumulative tolerance of 10 side holes should not exceed ± 0.2 mm.
2. Material of the tape: Black antistatic PS (surface impedance 10 5 -10 11 ) (surface static voltage <100 V), thickness: 0.35 mm.
3. Total length of the 13-inch reel package: 6.816 m (Length of the first part of empty packets: 0.408 m, length of packets containing modules: 6 m, length of the last part of empty packets: 0.408 m).
4. Total number of packets in the 13-inch reel package: 284 (Number of the first part of empty packets: 17; actual number of modules in the packets: 250; number of the last part of empty packets: 17).
5. All dimension designs are in accordance with EIA-481-C-2003.
6. The maximum bending degree of the carrier tape within the length of 250 mm should not exceed 1 mm (see the figure below).

Table 5-1 Package Description

External diameter: 330 mm
Internal diameter: 100 mm
Width: 24 mm
Thickness: 2.0 mm
Carrier Tape| Space between (center-to-center distance): 24 mm

The UM960 is rated at MSL level 3. Refer to the relevant IPC/JEDEC J-STD-033 standards for the package and operation requirements. You may access to the website www.jedec.org to get more information.
The shelf life of the UM960 module packaged in vacuum-sealed aluminum foil antistatic bags is one year.

Unicore Communications, Inc.
F3, No.7, Fengxian East Road, Haidian, Beijing, P.R.China,
100094
www.unicorecomm.com
Phone: 86-10-69939800
Fax: 86-10-69939888
info@unicorecomm.com
www.unicorecomm.com

References

• 百度翻译-200种语言互译、沟通全世界！
• Home | JEDEC
• 和芯星通北斗导航芯片-北斗导航模块北斗高精度定位板卡国内外领先的芯片、OEM板卡和产品解决方案提供商
• 和芯星通北斗导航芯片-北斗导航模块北斗高精度定位板卡国内外领先的芯片、OEM板卡和产品解决方案提供商
• Home | JEDEC

Read User Manual Online (PDF format)

Download This Manual (PDF format)

Download this manual  >>