VICOR 18372 Through-Hole Socket-Mount System Instruction Manual

: June 12, 2024
: VICOR

Table of Contents

18372 Through-Hole Socket-Mount System
References
Module Exchange Tool
References
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16. Through-Hole Socket-Mount System (InMate)
Design Guide & Applications Manual

18372 Through-Hole Socket-Mount System

Maxi, Mini, Micro Family DC-DC Converters and Configurable Power Supplies

InMates are an innovative solution for through-hole socket requirements. Consisting of individual plastic carriers for the input and the output, each contains an array of sockets for either a full-, half- or quarter-brick sized module. The sockets are factory loaded into the carrier, which holds them rigidly in place throughout the assembly and soldering process. The carriers are later removed, leaving the sockets accurately positioned.
Designed for use with pin-compatible Maxi, Mini and Micro Family converters, InMates are available for a wide range of PCB sizes and mounting styles. PCB thicknesses can range from 0.055in [1,39mm] to 0.1375in [3,49mm].
Sockets also allow for mounting modules either inboard, with a cutout in the PCB for the module, to minimize the height above the board or onboard. InMates are compatible with the ModuMate or RoHS pin style.
InMates are available in standard recyclable JEDEC style trays for use with automated pick-and-place equipment and are compatible with most standard wave or hand solder operations. The sockets are soldered into the board as part of the PCB assembly process. The module can then be plugged into place at anytime later.
NOTE: Please refer to Section 13 of the design guide for the InMate soldering procedure.
VICOR 18372 Through-Hole Socket-Mount System - Fig2 Figure 16.1 — InMate carrier / socket assembly and soldering process Table 16.1 — Guide to InMate selection

Select Board Thickness:
Nominal 0.062in [1,5mm], 0.093in [2,4mm] or 0.125in [3,1mm].
Select Mounting Style:
Inboard requires a PCB cutout for the “belly” of the module.
See dotted lines in PCB drawing links on Page 80 for cut-out area.
Identify Module Type:
Full brick (Maxi), half brick (Mini) or quarter brick (Micro).
Select the Ordering Part Number:
Order packages of five input / output sets or in higher quantities order input and output InMates separately. For individual input or output InMates, minimum orders of 35 for Maxi or Mini and 40 for Micro apply.
Verify Correct Pin Style for the Module:
For predefined parts, “S” or “F”= short ModuMate and “N” or “G” = long ModuMate

See Table 16.4 for standoff recommendations.

Parameter	Specification Value	Reference

Compatibility
Module Pin Styles| F = short Au plated| Short RoHS pins Short ModuMate pins
S = short Au plated
G = long Au plated| Long RoHS pins Long ModuMate pins
N = long Au plated
Mechanical
Contact Normal Force| 100g EOL min| GR-1217-CORE, R5-23
Number of Mating Cycles| 5 max [h]| Exception to GR-1217-CORE which specifies 25 mating cycle
Module Engagement Force| 32lbs per connector set max| GR-1217-CORE, R5-31,32
Module Disengagement Force| 32lbs per connector set max| GR-1217-CORE, R5-31,32
Electrical
Current Rating for Output Pin Sockets| 50A Maxi [e] / 50A Mini / 25A Micro (Based on 248°F [120°C] max socket temp & 86°F [30°C] max temperature rise of contact)| Gold plating standards and accepted industry standards such as IICIT, EIA, Bellcore guidelines
Low-Level Contact Resistance 0.080in [2,03mm] dia socket (LLCR)| 400μΩ max| GR-1217-CORE, 6.2.1
Low-Level Contact Resistance 0.150in [3,81mm] dia socket (LLCR)| 300μΩ max| GR-1217-CORE, 6.2.1
Low-Level Contact Resistance 0.180in [4,57mm] dia sockets (LLCR)| 200μΩ max| GR-1217-CORE, 6.2.1
Thermal
Max Socket Temperature| 248°F [120°C] max| Max continuous-use temperature for gold plating
Temperature Rise| 86°F [30°C] max| GR-1217-CORE [g] EIA-364-70A [f]
Environmental
Shock and Vibration| InMate products are tested in random vibration environments to best simulate the broad spectrum of frequencies and amplitudes that may be encountered in typical applications. Actual system resonant frequencies will depend on PCB construction and mounting details. For critical or unusual shock and vibration environments, the performance of the system should be independently verified.

Table 16.2 — InMate specifications and materials

Materials	Ratings

Headers
Material: Ryton™ R–7 PPS, 65% Glass Fiber and Mineral-Filled Compound| Poly- Phenylene Sulfide
Flammability| UL94 V-0/5VA
Thermal Stability (short term)| 500°F [260°C]
Thermal Stability (long term)| 392°F [200°C]
Solder Cap
Material| 305 stainless steel
Plating| Clear passivate to repel solder
Sockets
Material| Brush Wellman Alloy #25 C17200 deep draw quality or equiv. 0.010in thick
Plating| Woods nickel strike followed by 50μin min low stress sulfamate-based electrolytic nickel, followed by 20μin min hard gold, followed by 10μin min soft gold

Table 16.3 — Material properties of InMate components
[e] For 80A operation with Maxi, contact Applications Engineering.
[f] GR-1217-CORE issue 1, November 1995 Generic requirements for separable electrical connectors used in telecommunications hardware.
A module of NEBSFR, FR-2063
[g] ANSI/EIA-364 American National Standards Institute / Electronic Industries Association (Electronic Components, Assemblies & Materials Association)
[h] The module and socket must be replaced after five mating cycles.

Standoff Kits for InMate Mounted Modules

Board Thickness| Mounting Options| Slotted Baseplate| Through-Hole Baseplate| Threaded
Baseplate
Nominal (Min / Max]| Mounting Style| Through-Hole Heat Sink| Threaded Heat Sink| Through-Hole Heat Sink| Threaded Heat Sink| Through-Hole
Heat Sink
0.062in (0.055in /
0.071in)
1,5mm (1,4mm /1,8mm)| Inboard| Kit -18153| Kit -18154| Kit -18148| Kit -18149| Kit -18148
Bag -19129| Bag -19130| Bag -19124| Bag -19125| Bag -19124
Onboard| Kit -18158| Kit -18159| Kit -18153| Kit -18155| Kit -18153
Bag -19134| Bag -19135| Bag -19129| Bag -19131| Bag -19129
0.093in (0.084in / 0.104in)
2,4mm (2,1mm /2,6mm)| Inboard| Kit -18153| Kit -18154| Kit -18148| Kit -18149| Kit -18148
Bag -19129| Bag -19130| Bag -19124| Bag -19125| Bag -19124
Onboard| Kit -18156| Kit -18157| Kit -18150| Kit -18152| Kit -18150
Bag -19132| Bag -19133| Bag -19126| Bag -19128| Bag -19126
0.125in (0.113in / 0.138in)
3,1mm (2,8mm / 3,5mm)| Onboard| Kit – 24054| Kit -18157| Kit -24056| Kit – 18152| Kit-24056
Bag -19132| Bag -19133| Bag -19126| Bag – 19128| Bag-19126
Kits include six (6] standoffs and screws. Mini and Micro modules require a minimum of four (4] standoffs. Bags of one hundred (100] do not include screws; #4-40 thread hardware required.

Table 16.4 — In Mate standoff recommendations

References

Module Exchange Tool

Used in facilitating the proper extraction of modules from In Mate or Surf Mate sockets.
Removal without using the Exchange Tool may cause damage to the sockets.

Description| Part Number|
---|---|---
Maxi Exchange Tool| 22827
Mini Exchange Tool| 22828
Micro Exchange Tool| 22829

Maxi, Mini, Micro Design Guide
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