STANDSTAR SS23-QE-VA Jupiter AI Kit Instruction Manual

June 11, 2024
STANDSTAR

SS23-QE-VA Jupiter AI Kit
Instruction Manual STANDSTAR SS23-QE-VA Jupiter AI Kit - Product
packagingMake Shopping Easier
SS23-QE-VA (Jupiter AI Kit)
operation instruction
Current version: V0.5
Release date: 2023.0202

SS23-QE-VA Jupiter AI Kit

Confidential Information — Internl
The information contained in this file is confidential and/or legally privileged. If you have received this file in error, please delete this communication from any computer or network system. Please do not us, copy or disclose this file or any information contained. Thanks for your cooperation!
Revision record

version number Revised content Release time Reviser
V0.5 Document first draft editing Zhong.X

property in copyright
Without the written permission of our company, no unit or individual may extract or copy part or all of the contents of this document without authorization, and may not spread it in any form.
pay attention to
Due to product version upgrade or other reasons, the contents of this document will be updated from time to time. Unless otherwise agreed, this document is only used as a guide, and all statements, information and suggestions in this document do not constitute any express or implied warranty. This document is only used for internal training and learning of the company, and shall not be spread abroad.

Product overview

1.1 product background
In recent years, the Internet of Things and artificial intelligence have accelerated the empowerment of thousands of industries, which has greatly promoted the rapid development of the economy and society. In the field of smart retail, based on the Internet of Things, new technologies such as AI algorithm and image recognition are combined to realize users’ easy shopping and quick settlement, which opens up a new direction for smart container usage scenarios.
This product is a new industrial control box customized for the company under the Android 11 system based on Qualcomm 6490 high AI computing intelligent module and SLM750 4G module. This product adopts the camera scheme of auto- driving on the vehicle, and the MIPI camera installed on it adopts the mode of adding serial at the module end and deserializing serial at the host end to realize data transmission through the coaxial line, which has the characteristics of long transmission distance, high speed, no image delay and no jamming. SONY starlight sensor is used in the module, which can clearly capture information in dark environment. At the same time, the product also has 19 interfaces such as HDMI, USB, SIM card, lock, power supply and RS485, which fully meets the expansion needs of various peripherals of container retail
products.
1.2. Model description
Product name: Jupiter AI Kit
Model model: SS23-QE-VA
SS-Sandstar,QE-Qualcomm Edge, model differences are mainly distinguished by 4G module versions.
1.3. Product appearance

STANDSTAR SS23-QE-VA Jupiter AI Kit - Product
packaging Host renderings

STANDSTAR SS23-QE-VA Jupiter AI Kit - Camera
renderingsCamera renderings

1.4. Notes on the whole machine interface
Antenna information is provided by applicant. An intentional radiator is designed to ensure that no antenna other than that furnished by the responsible party shall be used with the device. The use of a permanently attached antenna or of an antenna that uses a unique coupling to the intentional radiator shall be considered sufficient to comply  with the provisions of this section.

Hardware introduction

2.1. External Block Diagram of Main Board
2.11. Dimension drawing of motherboard PCB interfaceSTANDSTAR SS23-QE-VA
Jupiter AI Kit - Dimension drawing 2.12. Function identification of motherboard PCB interface
STANDSTAR SS23-QE-VA Jupiter AI Kit - Function
identification 2.2. Block diagram outside the auxiliary board
2.2.1. PCB block diagram and dimensions of auxiliary board
STANDSTAR SS23-QE-VA Jupiter AI Kit - Block diagram

2.3. PCB manufacturing process
2.3.1. Motherboard
Main board PCB:6-layer through-hole plate with single-sided cloth;
Size: 180.0mm118.0mm1.2mm;
Surface technology: Ni/Au+OSP
Green oil color: black
2.3.2. Deputy Board
Auxiliary PCB:2-layer through-hole plate with double-sided cloth;
Size: 46.0mm*29.8.0mm;
Surface technology: Ni/Au
Green oil color: green
2.4. Description of Host Configuration List

project| describe| specifications|

remarks

---|---|---|---
SOC main chip| Architecture/number of cores/frequency| Qualcomm Kryo™ 670|
8-core|
1 A 78 2 . 7 GHz + 3 A 78 2 . 4 GHz + 4 * A 55 1 . 9 GHz
GPU model/frequency| Adreno™ GPU 635|
save| EMMC| 128GB|
DDR4X| 8GB|
button| Reset button| | Press the system software to restart.
communica tion module| SS23-QE-VA| FDD:B2/4/5/12/13/17/26 TDD:B41
WCDMA:B2/4/5| North America: USA/Canada/Guam, etc.
audio frequency| SPK| | 8 euro 5W
earphone| 3.5mm earphone|
Power Supply| Main power input| 3PIN main power input| 12V/10A
Power on| Power-on automatically triggers startup.|
Peripheral interface| CAM1| Purple FARKA interface| MIPI CSI0
CAM2| Blue FARKA interface| MIPI CSI1
CAM3| White FARKA interface| MIPI CSI2
CAM4| Black FARKA interface| MIPI CSI2
USB white interface| USB2.0 HOST Type-A interface| 5V/0.5A
USB blue interface| US3.0 HOST Type-A interface| 5V/1A
RS485| 5V level signal; Support 5V and 12V power supply.| 12V1A/5V1A
RS485| 5V level signal; Support 5V and 12V power supply.| 12V1A/5V1A
WAN| 10/100M Ethernet|
LAN| |
HDMI| Support hot plug, not audio.| HDMI Ver1. 4 ,5V/100mA
| Type-c| OTG interface|
---|---|---|---
LED| PWM dimming| 12V@4A(OCP)
DC OUT| | 12V/2.1A
GPIO| DS18B20 temperature probe| 12V/100mA,5V/100mA
LOCK1| 8pin| 12V/1A
LOCK2| 8pin| 12V/1A
Indicator light| Power indicator: Orange-green double color, when the powersupply is not connected, the light goes out, when the power supply system does not enter the orange light, the power supply system enters the green light. Network indicator: Red, orange and green, 4G is not turned on, RGB lights go off, weak signal red light, medium signal orange light, good signal green light.|

2.5. Description of camera configuration list

Image sensor| model| IMX307|
---|---|---|---
pixel| 2M|
optical format| 1/2.8-inch|
Pixel Size| 2.9μm x 2.9μm|
effective pixels| FULL HD 1920(H)X1080(V)|
AEB| support|
AEC| support|
Image sensor| model| IMX307|
pixel| 2M|
optical format| 1/2.8-inch|
Pixel Size| 2.9μm x 2.9μm|
effective pixels| FULL HD 1920(H)X1080(V)|
AEB| support|
AEC| support|
| AGC| support|
---|---|---|---
Support frame rate| 30/60FPS| One-way 954 only supports one-way camera 60FPS.
camera lens| FOV| D=164°/H=142°/V=81°|
CRA| 21°|
MAX IMAGE HEIGHT| Φ6.3|
FOCAL LENGTH (EFL)| 2.2mm|
FLANGE BACK LENGTH| 3.0mm|
Element| 6G+IR|
Waterproof and dustproof| IP67|
operating voltage| operating voltage| |
operational current| Demisting mode|
Non-defogging mode|
Heat patch specification| 10Ω|
the protection grades|
Dustproof and waterproof| ****

IP65

| IP67 can be achieved.
joggle/inte rface| mounted on a vehicle| FARKA|

Electrical parameters

project minimum typical maximum
Power adapter voltage 12V
ripple 50mV
electric current 10A

Thermal design

  • The shielding covers COU and FLASH are pasted with graphite sheets to increase the heat dissipation effect.
  • Thermal conductive silica gel pads are attached to the core module and 4G module on the front of the motherboard to increase the heat dissipation effect.
    Core module heat conductive silicon pad| Thermal conductive silica gel pad, with thermal conductivity of 5W, with release film on both sides whensupplied separately, 46461mm.
    ---|---
    4G module heat-conducting silica gel pad| Thermal conductive silica gel pad, with thermal conductivity of 5W, requires release film on both sides when supplied separately, 27 2727*1.5mm
  • The exposed copper area near the center on the reverse side of the main board is provided with a heat-conducting silica gel pad attached to the metal bottom shell component to increase the heat dissipation effect.
    Thermal conductive silica gel pad on the back of motherboard| Thermal conductive silica gel pad, with thermal conductivity of 5W, requires double- sided release film, 16168mm when supplied separately.
    ---|---
  • Aluminum alloy radiators and fans are installed on the core module and 4G module to enhance the heat conduction of the module and the convection of cold and hot air outside, and enhance the cooling effect.
    radiator| The cutting size of radiator is 112.57416mm, and fixing holes are opened.
    ---|---
    fan| 6010 fan, voltage: 5V, current: 0.2A,IP5X.

4.1. The key parameters of the fan are as follows

No. Item Specification Condition
1.1 Product Model FD6010B1H-APOO
1.2 Outline Dimension 55×10.0 mm
1.3 Rated Voltage 5 VDC
1.4 Operating Voltage 3.5 VDC – 5.5 VDC
1.5 Starting Voltage 3.5 VDC Rated Voltage
1.6 Rated Current 0.17 A ± 0.02 A b.25°C 65%RH
1.7 Rated Power 0.85 W ± 0.24 W c.5 EMS
1.8 Rated Speed 4000 RPM ± 10% Measure after 5 minutes
1.9 Max. Air Flow 14.74 CFM min 13.27 Rated Voltage
25.04 M3/hrs min 22.54 b.Standard: AMCA
1.10 Max. Static Pressure 2.28 mm-H20 min 2.05 Rated Current
0.09 Inch-H20 min 0.08
1.11 Noise Level 32.3 dB(A) max 35.5 Rated Voltage

Non-Echo Chamber
Standard: ISO 7779
Distance: 1M
1.12| Life Expectancy| 70000  hrs at 40 °C| Rated Voltage
Conf. Level 90%
1.13| No. of Pole| 4 Pole|
1.14| Rotational Direction| Counter-Clockwise| On blade side
1.15| Net Weight| 13 g|

4.2. Temperature rise test

Test requirements

|

test method

---|---
**** Ambient temperature: 30℃| When the camera is mounted for 1.5 hours, record the highest temperature point of the camera with a temperature gun, and record the abnormal hot spot of the device with a temperature gun.


Ambient temperature: 55℃

| The equipment brush is an overclocking software version, full of CPU and GPU, and tested after startup until it reaches thermal balance (1-2 hours).
testing nominative| test result
1.  The highest temperature of the motherboard, record data.
2.  Record the data at the| Camera: 42.1 CPU:64.3
highest temperature of the camera.|
---|---
1. CPU does not reduce frequency.
2.   Temperature difference| CPU data acquisition constant temperature: 39.8
CPU instruction core temperature: 92

STANDSTAR SS23-QE-VA Jupiter AI Kit - heating moduleCamera heating module is not turned on.STANDSTAR SS23-QE-VA
Jupiter AI Kit - plate temperature

Environment and reliability

project| specifications|

remarks

---|---|---
**** working environment| temperature| -20℃~65℃|
humidity| 15%~90%, no condensation|
Storage environment| temperature| -20℃~80℃|
humidity| 5%~93%, no condensation|
the protection grades| /|
Environmental certification| Guotui Rohs|

Radio frequency antenna information

6.1. 4G antenna performance parameters

STANDSTAR SS23-QE-VA Jupiter AI Kit - Block diagram 1

Working frequency 824-960/1710-2170/2300-2690MHz
input impedance 50 ohm
standing-wave ratio ≦ 2.0
Maximum gain ≦ 3.78dBi
direction omnidirection
Polarization mode vertical polarization
structural style monopole
Product length 315 mm
connector SMA-J
Connectortension 5kg min
feeder line RG- 174LL coaxial

line

Feeder length| one meter
Installation mode| Magnet adsorption
Working temperature| -30℃ ~65℃
storage temperature| -30℃ ~75℃

6.1. 2.4G WIFI antenna performance parameters
STANDSTAR SS23-QE-VA Jupiter AI Kit - Block diagram 2

Working frequency 2.4G
input impedance 50 ohm
standing-wave ratio ≦ 2.0
Maximum gain ≦ 2.93 dBi
direction omnidirection
Polarization mode vertical polarization
structural style dipole
Product length 180 mm
--- ---
connector SMA-J
Connector tension 5kg min
feeder line RG- 174LL coaxial line
Feeder length one meter
Installation mode Magnet adsorption
Working temperature -30℃ ~65℃
storage temperature -30℃ ~75℃

Product packaging

STANDSTAR SS23-QE-VA Jupiter AI Kit - Product
packaging

FCC Warning:

Any Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

  1. This device may not cause harmful interference, and
  2. this device must accept any interference received, including interference that may cause undesired operation.

Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not  installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the equipment and receiver.
  • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.

FCC Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment .
This equipment should be installed and operated with a minumum distance of 20 cm between the radiator and your body.

Confidential Information — Internl
The information contained in this file is confidential and/or legally privileged. If you have received this file in error, please delete this communication from any computer or network system. Please do not us, copy or disclose this file or any information contained. Thanks for your cooperation!

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