Surenoo STP0320D2-240320 Series TFT LCD Panel User Manual

: June 3, 2024
: Surenoo

Table of Contents

General Description
Mechanical Specification
.Mechanical DimensioN
References
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Surenoo STP0320D2-240320 Series TFT LCD Panel User Manual

General Description

MODEL NO	STP0320D2-240320 YT320L008
Display Mode	Transmissive
Display Format	Graphic 240RGB*320 Dot-matrix 240xRGBx320
Input Data	4 Line-SPI/8bit/16bit interface
Viewing Direction	12 o’clock 12
Drive	ST7789V

Mechanical Specification

Item	Specifications	Unit
Dimensional outline
54.00(W)77.40(H)2.40(T)（NTP）54.00(W)77.40(H)3.70(T)（RTP）(FPC not include)

*** mm
Resolution| 240RGB320| dots
LCD Active area| 48.60(W)64.80 (H)| mm
Pixel size| 0.2025W)0.2025(H)| mm

.Mechanical DimensioN

Mechanical Dimension

Electrical Maximum Rating

Item	Symbol	Min	Max
Supply voltage （ VDDI ）	V	1.8
3.3	V	–
Supply voltage （ VDD ）	V	2.8
3.3	V	–
Operating temperature	T OPR	-20	70
℃	–
Storage temperature	T STR	-30	80
℃	–

Brightness characteristic &Power dissipation

Item	Symbol	Min	Typical
LED module Forward voltage	V LED	2 ． 9
3.1	3.3	V
LED module current	I LED	–	90
–	mA
LCD Surface Luminance	L S	330	350
–	C d / m 2
LCM Surface brightness uniform	L D	80
–	–	%
LCD power dissipation	P LCD	–	0.32
–	W

Module Function Description

P I N N o .| S y m b o l| Description| N o t e s
---|---|---|---
1| **XL(X-)| Touch panel Logical foot| ****–
2| YU(Y+)| Touch panel Logical foot| ****–
3| XR(X+)| Touch panel Logical foot| ****–
4| YD(Y+)| Touch panel Logical foot| ****–
5| GND| Ground| ****–
6| VDDI| Power Supply for I/O System.| ****–
** 7| **VDD| Power Supply for Analog, Digital System and Booster Circuit.| ****–
8| TE| Tearing effect signal is used to synchronize MCU to frame| ****–
** 9| **CSX/SPI CSX| -Chip selection pin Low enable.High disable.| ****–
** 10| **DCX/SPI SCL| -Display data/command selection pin in parallel interface.
-This pin is used to be serial interface clock.| **
**** 11| **WRX/A0(SPI4)| **
– Display data/command selection pin in 4-line serial interface.|
12| **RDX| -Read enable in 8080 MCU parallel interface.-If not used, please fix this pin at VDDI or GND. (| ****–
---|---|---|---
** 13| **SPI SDI/SDA| SPI interface input pin.-The data is latched on the rising edge of the SCL signal.-If not used, please fix this pin at VDDI or DGND level.| ****–
** 14| **SPI SDO| -SPI interface output pin.-The data is output on the falling edge of the SCL signal.-If not used, let this pin open.| ****–
** 15| **RESX| -This signal will reset the device and it must be applied to properly initialize the chip.-Signal is active low.| ****–
16| ****GND| Ground| ****–
17-24| DB0-DB7| MCU parallel interface data bus.| ****–
25-32| DB8-DB15| MCU parallel interface data bus.| ****–
33| LED-A| Anode of Backlight (2.9V-3.3V Typical:3.1V)| ****–
34-36| LED-K| Cathode of Backlight| ****–
37| GND| Ground| ****–
38| IM0| -The MCU interface mode select.| ****–
** 39| **IM1| **| **–
40| IM2| | ****–**

STP0320D2 MCU-16

STP0320D2 MCU-8

STP0320D2 4-W SPI

Item	Symbol	Condition	Remark	Unit
Min.	Typ.	Max.
Response time	Tr+Tf	θ=0°	–	25
Contrast ratio	CR	θ=0°	350	500

Viewing Angle

Item	Symbol	Condition	Remark	Unit
Min.	Typ.	Max.
******** Viewing angle	Top	CR≥10	40	50
Bottom	CR≥10	55	65	–
Left	CR≥10	55	65	–
Right	CR≥10	55	65	–

overview

NO.	ITEM	CONDITION	CRITERION
1	High Temperature Non-Operating Test	80℃*120Hrs	No Defect Of
Operational
2	Low Temperature Non-Operating Test	-30℃*120Hrs	Function In Room
Temperature Are
3	High Temperature/Humidity Non Operating Test	60℃90%RH120Hrs	Allowable
4	High Temperature Operating Test	70℃*72Hrs
5	Low Temperature Operating Test	-20℃*72Hrs
6	Thermal Shock Test	-20 ℃ (30Min) Q70 ℃
(30Min) *10CYCLES

.Inspection standard

NO	Defect item	Criteria
**** 1	Dimension Unconformity(Major defect)	By Engineering Drawing
******** 2	Cracks(Major defect)	1. Linear cracks panel【Reject】2.
Nonlinear crack contrast by limited sample	****
******** 3	Glass extrude the conductive area(minor defect)	a:

disregards and no influence assemblage.1) b≤1/3Pin width(non bonding area)【Accept】2) bonding area≤0.5mm【Accept】| A: Length, b: Width

4

| Pin-side ,conductive area damaged(minor defect)| (a c: disregards)b≤1/3of effective length for bonding electrode【Accept】| a: length, b: Width, c: Thickness

---|---|---|---
**** 5| Pin-side,non-conductive area damaged(minor defect)| 1) Damage area don’t touch the ITO (Inclueling contraposition mark, except scribing mark)【Accept】2) C<T b≦BM1/3of width【Accept】3) c=Tb not touch the seal glue【Accept】4) a disregards| a: Length, b: Width c: Thickness

**** 6| Non-pin-side damage(minor defect)| c<T1)b exceeds 1/3Bm【Reject】c=Tb not touch the seal glue【Reject】| c: Thickness b: width ofdamage

LCD appearance defect(View area)

NO	Defect item	Criteria	Remark
******** 1	******** Fiber、glass cratch、polarizer
scratch/folded(minor defect)	Specification	Allowable	note1:L: Length, W:

Width note2: disregard if out of AA ****
W≦0.03mm| disregard
0.03mm<W≦0.05mm;L≦3.0mm| 2
0.05mm<W≦0.1mm;L≦3.0mm| 1
W>0.1mm;L>3.0mm| 0
**** 2| Polarizer bubble、concave and convex(minor defect)| φ≦0.2mm| disregard| note1: φ=(L+W)/2,L:Length,W :Widthnote2:disregard if out of AA
0.2mm<φ≦0.3mm| 2
0.3mm<φ≦0.5mm| 1
0.5mm<φ| 0
3| Black dots、dirty dots、| φ≦0.15mm| disregard| note2:disregard if out of AA
| impurities、eye winker(minor defect)| 0.15mm<φ≦0.25mm| 2|
---|---|---|---|---
0.25mm<φ≦0.3mm| 1
0.3mm<φ| 0
**** 4| **** Polarizer prick(minor defect)| φ≦0.1mm| disregard| note1: φ=(L+W)/2,L=Length,W=Widthnote2:the distance between two dots>5mm
0.1mm<φ≦0.25mm| 3
φ>0.25mm| 0