EBYTE E78-900M22S1A ASR6505 868/915MHz LoRaWAN RF Module User Manual

EBYTE E78-900M22S1A ASR6505 868/915MHz LoRaWAN RF Module

Disclaimer
EBYTE reserves all rights to this document and the information contained herein. Products, names, logos and designs described herein may in whole or in part be subject to intellectual property rights. Reproduction, use, modification or disclosure to third parties of this document or any part thereof without the express permission of EBYTE is strictly prohibited. The information contained herein is provided “as is” and EBYTE assumes no liability for the use of the information. No warranty, either express or implied, is given, including but not limited, with respect to the accuracy, correctness, reliability and fitness for a particular purpose of the information. This document may be revised by EBYTE at any time. For most recent documents, Please visit www.ebyte.com

Overview

Introduction

The E78 series products are radio frequency transceiver modules with multiple frequency bands designed and produced by Ebyte, with long communication distance and extremely low current consumption in low power consumption mode. This module is a small-volume patch type (pinspacing 1.1mm). The E78 series products use ASR’s ASR6505 chip, which is a single-chip SoC integrated with ultra-low power LoRa, using Semtech’s advanced
low-power LoRa Transceiver SX1262, and integrates a STM8L152 low-power MCU, Flash capacity 64kB, SRAM Capacity 4kB, EEPROM capacity 2K, small size, ultra- low power consumption, support LoRaWAN, LinkWAN multiple protocol standards, suitable for a variety of Internet of Things application scenarios, is currently the best choice for LPWAN application chips. The E78 series products are hardware platforms and cannot be used independently. Users need to carry out secondary development. (We can customize standard LoRaWan and Ali linkWan nodes)

Features:

Under ideal test conditions, the communication distance can reach 5.5km; The maximum transmit power is 22dBm, and the software is multi-level adjustable; Support license-free ISM 868/915MHz frequency band; Support multiple modulation modes (GFSK Mode, LoRa); Support 1.8～3.7V power supply, power supply greater than 3.3V can guarantee the best performance; Industrial standard design, supporting long-term use at -40～+85℃;
Dual antennas are optional (IPX/PCB), which is convenient for users to develop and integrate; Based on the ASR6505 chip development, users can directly use it for secondary development.

Applications:

• Smart home and industrial sensors, etc.;
• Security system, positioning system;
• Wireless remote control, UAV;
• Wireless game remote control;
• Healthcare products;
• Wireless voice, wireless headset;
• Automotive industry applications.

Parameters

Limit Parameters:

Main Parameters

| Value| ****

Notice

---|---|---
Min.| Max.
Power supply voltage (V)| 0| 3.9| Over 3.9V will permanently burn the module

Blocking power (dBm)

| ****

–

| ****

10

| The probability of burning is small when used at

close range

Working temperature (℃)| -40| +85| Industrial grade

Operating Parameters:

Main Parameters

| Value| ****

Notice

---|---|---
Min.| Typical| Max.
Working voltage (V)| 1.8| 3.3| 3.7| ≥3.3V can guarantee output power
Communication level (V)| –| 3.3| –| Using 5V TTL is risky to burn
Working temperature (℃)| -40| –| +85| Industrial design
Working frequency (MHz)| 850| 868/915| 925| Support ISM frequency band

Power

| Emission current (mA)| –| 145| –| Instantaneous power consumption
Receiving current (mA)| –| 13| –| –
Sleep current (μA)| –| 2.0| –| Software shutdown
Maximum transmit power (dBm)| –| 21.5| 22| –
Receiving sensitivity (dBm)| -122| -123| -126| The air rate is 595kbps

Air rate

| LoRa（bps）| –| –| 62.5K| User programmable customization
GFSK（bps）| –| –| 300K| User programmable customization
Parameters| Value| Notice
---|---|---

Ideal Range

| ****

5500m

| At Max TX power and 2.4kbps air rate, Two modules in a line of

sight, clear weather, with 5dbi antennas at 2.5meters.

Crystal frequency| 32MHz| TXCO
Modulation| LoRa(recommended)| GFSK ，LoRa
Encapsulation method| SMA| –
Interface method| Stamp-hole| Diameter 1.1mm
Dimensions| 26*16mm| –
RF interface| IPEX/stamp-hole| Equivalent impedance is about 50Ω

Hardware Notice:

•  When designing the power supply circuit for the module, it is recommended to reserve more than 30% of the remaining amount, and the whole machine is beneficial for long-term stable operation;；
•  The current required for the moment of launch is large but often because the launch time is extremely short, the total energy consumed may be smaller;
•  When the customer uses an external antenna, the impedance matching degree between the antenna and the module at different frequency points will affect the magnitude of the emission current to varying degrees;
•  The current consumed by the RF chip in the pure receiving state is called the receiving current. Some RF chips with communication protocols or developers have loaded some self-developed protocols on the whole machine, which may cause the receiving current of the test to be too large；
•  When the customer uses an external antenna, the impedance matching degree between the antenna and the module at different frequency points will affect the magnitude of the emission current to varying degrees；
•  The shutdown current is often much smaller than the current consumed by the power supply part of the whole machine at no load, without excessive demand;
•  Due to the inherent error of the material itself, a single LRC component has an error of ±0.1%, but hesitant to use multiple LRC components in the entire RF loop, there will be accumulation of errors, resulting in differences in the emission current and the receiving current of different modules；
•  Reducing the transmit power can reduce power consumption to a certain extent, but reducing the transmit power transmission for many reasons will reduce the efficiency of the internal PA.

Size and Pin definition

Size and Pin definition

Pin definition

impedance)
20| GND| –| Ground wire, connected to the power reference ground
21| GND| –| Ground wire, connected to the power reference ground
22| GND| –| Ground wire, connected to the power reference ground
23| GND| –| Ground wire, connected to the power reference ground
24| SPI-NSS| Input| SPI selection pin, external SPI can be selected
25| SPI-SCK| Input| SPI-SCK pin, can be used as external SPI
26| SPI_MISO| Output| SPI_MISO pin, can be used as external SPI
27| SPI_MOSI| Input| SPI MOSI pin, can be used as external SPI
28| LCD-SEG1| –| MCU GPIO
29| LCD-SEG2| Input/Output| MCU GPIO
30| SWIM| Input/Output| Programming pin
31| NRST| Input| External reset pin
32| LCD-COM0| Input/Output| MCU GPIO
33| LCD-COM1| Input/Output| MCU GPIO
34| LCD-COM2| Input/Output| MCU GPIO
35| VREFP| Input| ADC reference voltage input
36| UART1-RX| Input| UART1-RX pin
37| UART1-TX| Output| UART1-TX pin
38| VLCD| Input| VLCD pin
39| LCD-SEG0| Input/Output| MCU GPIO
---|---|---|---
40| GND| –| Ground wire, connected to the power reference ground
41| LCD-SEG3| Input/Output| MCU GPIO
42| LCD-COM3| Input/Output| MCU GPIO
43| LCD-SEG4| Input/Output| MCU GPIO
44| LCD-SEG5| Input/Output| MCU GPIO
45| UART0-RX| Input| UART0-RX pin
46| UART0-TX| Output| UART0-TX pin
47| LCD-SEG6| Input/Output| MCU GPIO
48| LCD-SEG7| Input/Output| MCU GPIO
49| LCD-SEG8| Input/Output| MCU GPIO
50| LCD-SEG9| Input/Output| MCU GPIO
51| VCC| –| Power supply, range 1.8V~3.7V (recommend to add ceramic filter capacitor)
52| GND| –| Ground wire, connected to the power reference ground
For more information about module pin definition, software driver and communication protocol, please see ASR6505 Datasheet

Hardware and Software Guide

Hardware Design

•  It is recommended to use a DC stabilized power supply to supply power to the module, and the power ripple coefficient should be as small as possible, and the module should be reliably grounded;
•  Please pay attention to the correct connection of the positive and negative poles of the power supply. Reverse connection may cause permanent damage to the module;
•  Please check the power supply to ensure that it is within the recommended power supply voltage. If it exceeds the maximum value, it will cause permanent damage to the module;
•  Please check the stability of the power supply, and the voltage should not fluctuate greatly and frequently;
•  When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the margin, and the whole machine is conducive to long-term stable operation;
•  The module should be as far away as possible from the power supply, transformer, high-frequency wiring and other parts with large electromagnetic interference;
•  High-frequency digital wiring, high-frequency analog wiring, and power wiring must avoid the bottom of the module. If it is necessary to pass under the module, assume that the module is soldered to the Top Layer, and the top ayer of the contact part of the module is covered with copper (all copper And well grounded), it must be close to the digital part of the module and routed in the Bottom Layer;
•  Assuming that the module is soldered or placed on the Top Layer, it is also wrong to randomly route the wires on the Bottom Layer or other layers, which will affect the stray and receiving sensitivity of the module to varying degrees;
•  Assuming that there are devices with large electromagnetic interference around the module, it will greatly affect the performance of the module. According to the intensity of the interference, it is recommended to stay away from the module. If the situation permits, proper isolation and shielding can be done;
•  Assuming that there are traces with large electromagnetic interference around the module (high-frequency digital, high-frequency analog, power wiring), it will also greatly affect the performance of the module. According to the intensity of the interference, it is recommended to stay away from the module. Isolation and shielding;
•  If the communication line uses 5V level, a 1k-5.1k resistor must be connected in series (not recommended, there is still a risk of damage);
•  Try to stay away from part of the physical layer that is also 2.4GHz TTL protocol, for example: USB3.0;
•  The antenna installation structure has a great impact on the performance of the module. Make sure that the antenna is exposed, preferably vertically upward. When the module is installed inside the case, a high-quality antenna extension cable can be used to extend the antenna to the outside of the case;

Software Writing

•  This module is SX1262+STM8L152 integrated, and its driving method is completely equivalent to SX1262, and users can operate according to SX1262 or ASR6505 chip book;
•  At the same time, please refer to the E78-900M22S1A and E78-900TBL-01A pin corresponding STM8 data provided by our company during the secondary development.
•  The voltage range of the active crystal oscillator is 1.8V to 3V. 2.2V is recommended. 3.3V may be damaged.

Programming Diagram and Guide

E78-900M22S1A burning interface

Connect the module pins 30 and 31, and use ST-LINK or STM8 debugging tools to download the program.

For secondary development, you are recommended to use test kit E78-900TBL-01A. It is convenient and efficient. First, power the module through the serial port of the test kit, and then connect the NRST pin and SWIM pin of ST-LINK to the test kit to download the program. As shown above.

Production guidance

Reflow soldering temperature

3℃/second max
Liquidous Temperature (TL)| Liquid phase temp.| 183℃| 217℃

Time(tL)Maintained Above(TL)

| Time below liquid phase

line

| ****

60-90 sec

| ****

30-90 sec

Peak temperature(Tp)| Peak temp.| 220-235℃| 230-250℃
Average ramp-down rate(Tp to Tsmax)| Average ramp-down rate| 6℃/second max| 6℃/second max

Time 25℃ to peak temperature

| Time to peak temperature

for 25℃

| ****

6 minutes max

| ****

8 minutes max

Reflow soldering curve

FAQ

Communication range is too short

•  The communication distance will be affected when obstacle exists.
•  Data lose rate will be affected by temperature, humidity and co-channel interference.
•  The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground.
•  Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea.
•  The signal will be affected when the antenna is near metal object or put in a metal case.
•  Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the distance).
•  The power supply low voltage under room temperature is lower than 2.5V, the lower the voltage, the lower the transmitting power.
•  Due to antenna quality or poor matching between antenna and module.

Module is easy to damage

•  Please check the power supply source, ensure it is 2.0V~3.6V, voltage higher than 3.6V will damage the module.
•  Please check the stability of power source, the voltage cannot fluctuate too much.
•  Please make sure antistatic measure are taken when installing and using, high frequency devices have electrostatic susceptibility.
•  Please ensure the humidity is within limited range, some parts are sensitive to humidity.
•  Please avoid using modules under too high or too low temperature.

BER (Bit Error Rate) is high

•  There are co-channel signal interference nearby, please be away from interference sources or modify frequency and channel to avoid interference;
•  Poor power supply may cause messy code. Make sure that the power supply is reliable.
•  The extension line and feeder quality are poor or too long, so the bit error rate is high;

Revision history

About us

• Website: www.ebyte.com
• Sales: info@cdebyte.com
• Support: support@cdebyte.com
• Tel: +86-28-61399028 Ext. 812
• Fax: +86-28-64146160
  Address: Innovation Center B333~D347, 4# XI-XIN road,High-tech district (west), Chengdu, Sichuan, China

References

• 串口服务器_数传电台_4G DTU_遥控开关_LoRa/ZigBee/WiFi/蓝牙模块-成都亿佰特电子科技有限公司官网

Read User Manual Online (PDF format)

Download This Manual (PDF format)

Download this manual  >>