KingDian DDR High Quality Memoria User Manual

KingDian DDR High Quality Memoria

About Us

• Shenzhen KingDian Technology Co., Ltd. was founded in 2010. It is one of the earliest high-tech Companies engaged in SSD Solid State Drive, DDR Memories R&D, production and marketing in China.
• From the date of its establishment, Our company has been devoted to the intensive cultivation of the SSD Solid State Drive and DDR Memory industry, providing inexpensive and quality storage solutions for all walks of life.
• So far, we have set up branch offices in Korea, Latin America, North America, Mexico, Indonesia, Malaysia, the Philippines and Vietnam. Provide customers with more professional, timely and comprehensive localization services!
• In China mainland, we have our distribution channels in 28 provinces! We always put the quality of products in the most important position, we firmly believe that: The quality of the product is the life of a company! Our company have many professional engineers, and advanced equipment, to ensure that our products can be tested by the strictest and effective industry standards from a series of strict procedures like material inspection, production process control, product testing, and quality risk control, thereby to ensure provided the most satisfaction products to the users!
• We are committed to providing customers with high quality, the most cost-effective products, and constantly improve the intimate pre-sale, sale, and after-sales service, we strive to continue to create value for our customers!

Our vision

• To make “KingDian SSD” become a famous storage brand in the world!

Our mission

• Provide customers with high-quality products and services!
• Provide a positive growth platform for employees!
• To create a sustained return on investment for the shareholders!
• To create the value of justice and honesty for society!

Our view of quality

• Quality is the life ofan enterprise because remedies need to pay much more.

Our values

• Pragmatism, innovation, upwards, diligence!

DDR5 SODIMM Series(R51 Series)

DDR4 RGB With Heatsink UDIMM Series(R11 Series)

 | Series| DDR4 RGB With Heatsink UDlMM Series( 11 Serie )|
---|---|---|---
 | Brand| KingDian|
 | Capacity| 8GB| 16GB| 32GB|
 | Model Number| RII DDR4 – PC – 8GB| RII DDR4 – PC – 16GB| RII DDR4 – PC – 32GB|
 | Memory Speed /Frequency| 2666/3000/3200/3600MHz| 2666/3000/3200/3600MHz| 2666/3000/3200/3600MHz|
 | Rank(1Rx8/2Rx8/8Rx4)| 1Rx8| 1Rx8| 2Rx8|
 | CAS Latency-2666MHz| 9-19-19-43| 19-19-19-43| 19-19-19-43|
 | CAS Latency-3000MHz| 19-19-19-43| 19-19-19-43| 19-19-19-43|
 | CAS Latency-3200MHz| 22-22-22-52| 22-22-22-52| 22-22-22-52|
 | CAS Latency-3600MHz| 18-22-22-42| 18-22-22-42| 18-22-22-42|
 | No. of Memory IC| 4 // 8 // 16|
 | Operating Voltage| 1.2V|
 | Power Consumption| 3W|
 | Net Weight (g)| 44g|
 | Gross Weight(g)| 80g|
 | Controller IC| NO|
 | ECC(Error Correction Code)(YES/NO)| NO|
 | Overclock Support (YES/NO)| NO|
 | Heat Sink/ Heat Spreader| YES|
 | RGB lights| YES|
 | OEM/ODM Support| YES|
 | Pin Count| 288|
 | Form Factor| UDIMM|
 | Computer Memory Type(DRAM/SDRAM)| DRAM|
 | Operating Temperature| 0~85°C|
 | Storage Temperature| -40~100°C|
 | Warranty| 3 Years|
 | No. of Memory Channels (Single/Dual)| (Single/Dual)|
 | Product Dimension (W x Dx H)in mm| 145x46x5.5mm|
 | Buffered /Un-buffered Memory| Un-buffered Memory|
 | Memory IC Brand| Micron/Samsung/Sk Hynix|

DDR4 With Heatsink UDIMM Series (H11 Series)

32GB
Memory Speed /Frequency| 2400/2666/3200MHz| 2666/3200MHz| 2666/3200MHz| 2666/3200MHz
Rank(1Rx8/2Rx8/8Rx4)| 1Rx8| 1Rx8| 2Rx8| 2Rx8
CAS Latency-2400MHz| 17-17-17-39|  |  |
CAS Latency-2666MHz| 19-19-19-43| 19-19-19-43| 19-19-19-43| 19-19-19-43
CAS Latency-3200MHz| 22-22-22-52| 22-22-22-52| 22-22-22-52| 22-22-22-52
No. of Memory IC| 4//8//16
Operating Voltage| 1.2V
Power Consumption| 288
Net Weight (g)| 36g
Gross Weight(g)| 72g
Controller IC| 3W
ECC(Error Correction Code)(YES/NO)| NO
Overclock Support (YES/NO)| NO
Heat Sink/ Heat Spreader| NO
OEM/ODM Support| YES
Pin Count| YES
Form Factor| UDIMM
Computer Memory Type(DRAM/SDRAM)| DRAM
Operating Temperature| 0~85°C
Storage Temperature| -40~100°C
Warranty| 3 Years
No. of Memory Channels (Single/Dual)| (Single/Dual)
Product Dimension (W x Dx H)in mm| 145x43x5mm
Buffered /Un-buffered Memory| Un-buffered Memory
Memory IC Brand| Micron/Samsung/Sk Hynix

DDR4 With Heatsink UDIMM Series(H12 Series)

32GB
Memory Speed /Frequency| 2400/2666/3200MHz| 2666/3200MHz| 2666/3200MHz| 2666/3200MHz
Rank(1Rx8/2Rx8/8Rx4)| 1Rx8| 1Rx8| 2Rx8| 2Rx8
CAS Latency-2400MHz| 17-17-17-39|  |  |
CAS Latency-2666MHz| 19-19-19-43| 19-19-19-43| 19-19-19-43| 19-19-19-43
CAS Latency-3200MHz| 22-22-22-52| 22-22-22-52| 22-22-22-52| 22-22-22-52
No. of Memory IC| 4//8//16
Operating Voltage| 1.2V
Pin Count| 288
Net Weight (g)| 36g
Gross Weight(g)| 72g
Power Consumption| 3W
Controller IC| NO
ECC(Error Correction Code)(YES/NO)| NO
Overclock Support (YES/NO)| NO
Heat Sink/ Heat Spreader| YES
OEM/ODM Support| YES
Form Factor| UDIMM
Computer Memory Type(DRAM/SDRAM)| DRAM
Operating Temperature| o~85°c
Storage Temperature| -40~100°C
Warranty| 3 Years
No. of Memory Channels (Single/Dual)| (Single/Dual)
Product Dimension (W x Dx H)in mm| 139x38x7mm
Buffered /Un-buffered Memory| Un-buffered Memory
Memory IC Brand| Micron/Samsung/Sk Hynix

DDR4 With Heatsink UDIMM Series(H13 Series)

32GB
Memory Speed /Frequency| 2400/2666/3200MHz| 2666/3200MHz| 2666/3200MHz| 2666/3200MHz
Rank(1Rx8/2Rx8/8Rx4)| 1Rx8| 1Rx8| 2Rx8| 2Rx8
CAS Latency-2400MHz| 17-17-17-39|  |  |
CAS Latency-2666MHz| 19-19-19-43| 19-19-19-43| 19-19-19-43| 19-19-19-43
CAS Latency-3200MHz| 22-22-22-52| 22-22-22-52| 22-22-22-52| 22-22-22-52
No. of Memory IC| 4//8//16
Operating Voltage| 1.2V
Pin Count| 228
Net Weight (g)| 36g
Gross Weight{g)| 72g
Power Consumption| 3W
Controller IC| NO
ECC(Error Correction Code)(YES/NO)| NO
Overclock Support (YES/NO)| NO
Heat Sink/ Heat Spreader| YES
OEM/ODM Support| YES
Form Factor| UDIMM
Computer Memory Type(DRAM/SDRAM)| DRAM
Operating Temperature| 0~80°C
Storage Temperature| -40~100°C
Warranty| 3 Years
No. of Memory Channels (Single/Dual)| (Single/Dual)
Product Dimension (W x Dx H)in mm| 135x38x7mm
Buffered /Un-buffered Memory| Un-buffered Memory
Memory IC Brand| Micron/Samsung/Sk Hynix

DDR4 With Heatsink UDIMM Series (H14 Series)

32GB
Memory Speed /Frequency| 2400/2666/3200MHz| 2666/3200MHz| 2666/3200MHz| 2666/3200MHz
Rank(1Rx8/2Rx8/8Rx4)| 1Rx8| 1Rx8| 2Rx8| 2Rx8
CAS Latency-2400MHz| 17-17-17-39|  |  |
CAS Latency-2666MHz| 19-19-19-43| 19-19-19-43| 19-19-19-43| 19-19-19-43
CAS Latency-3200MHz| 22-22-22-52| 22-22-22-52| 22-22-22-52| 22-22-22-52
No. of Memory IC| 4//8//16
Operating Voltage| 1.2V
Pin Count| 288
Net Weight (g)| 36g
Gross Weight(g)| 72g
Power Consumption| 3W
Controller IC| NO
ECC(Error Correction Code)(YES/NO)| NO
Overclock Support (YES/NO)| NO
Heat Sink/ Heat Spreader| YES
OEM/ODM Support| YES
Form Factor| UDIMM
Computer Memory Type(DRAM/SDRAM)| DRAM
Operating Temperature| 0~85°C
Storage Temperature| -40~100°C
Warranty| 3 Years
No. of Memory Channels (Single/Dual)| (Single/Dual)
Product Dimension (W x Dx H)in mm| 139x41x7mm
Buffered /Un-buffered Memory| Un-buffered Memory
Memory IC Brand| Micron/Samsung/Sk Hynix

DDR4 With Heatsink UDIMM Series(H15 Series)

2666/3200MHz
Rank(1Rx8/2Rx8/8Rx4)| 1Rx8| 1Rx8| 2Rx8| 2Rx8
CAS Latency-2400MHz| 17-17-17-39|  |  |
CAS Latency-2666MHz| 19-19-19-43| 19-19-19-43| 19-19-19-43| 19-19-19-43
CAS Latency-3200MHz| 22-22-22-52| 22-22-22-52| 22-22-22-52| 22-22-22-52
No. of Memory IC| 4//8//16
Operating Voltage| 1.2V
Pin Count| 288
Net Weight (g)| 36g
Gross Weight(g)| 72g
Power Consumption| 3W
Controller IC| NO
ECC(Error Correction Code)(YES/NO)| NO
Overclock Support (YES/NO)| NO
Heat Sink/ Heat Spreader| YES
OEM/ODM Support| YES
Form Factor| UDIMM
Computer Memory Type(DRAM/SDRAM)| DRAM
Operating Temperature| o~85°C
Storage Temperature| -40~100°C
Warranty| 3 Years
No. of Memory Channels (Single/Dual)| (Single/Dual)
Product Dimension (W x Dx H)in mm| 133x35x5mm
Buffered /Un-buffered Memory| Un-buffered Memory
Memory IC Brand| Micron/Samsung/Sk Hynix

DDR4 With Heatsink UDIMM Series (H16 Series)

32GB
Memory Speed /Frequency| 2400/2666/3200MHz| 2666/3200MHz| 2666/3200MHz| 2666/3200MHz
Rank(1Rx8/2Rx8/8Rx4)| 1Rx8| 1Rx8| 2Rx8| 2Rx8
CAS Latency-2400MHz| 17-17-17-39|  |  |
CAS Latency-2666MHz| 19-19-19-43| 19-19-19-43| 19-19-19-43| 19-19-19-43
CAS Latency-3200MHz| 22-22-22-52| 22-22-22-52| 22-22-22-52| 22-22-22-52
No. of Memory IC| 4//8//16
Operating Voltage| 1.2V
Pin Count| 288
Net Weight (g)| 36g
Gross Weight(g)| 72g
Power Consumption| 3W
Controller IC| NO
ECC(Error Correction Code)(YES/NO)| NO
Overclock Support (YES/NO)| NO
Heat Sink/ Heat Spreader| YES
OEM/ODM Support| YES
Form Factor| UDIMM
Computer Memory Type(DRAM/SDRAM)| DRAM
Operating Temperature| 0~85°C
Storage Temperature| -40~100°C
Warranty| 3 Years
No. of Memory Channels (Single/Dual)| (Single/Dual)
Product Dimension (W x Dx H)in mm| 138x36x7mm
Buffered /Un-buffered Memory| Un-buffered Memory
Memory IC Brand| Micron/Samsung/Sk Hynix

DDR4 With Heatsink UDIMM Series(H17 Series)

32GB
Memory Speed /Frequency| 2400/2666/3200MHz| 2666/3200M Hz| 2666/3200MHz| 2666/3200MHz
Rank(1Rx8/2Rx8/8Rx4)| 1Rx8| 1Rx8| 2Rx8| 2Rx8
CAS Latency-2400MHz| 17-17-17-39|  |  |
CAS Latency-2666MHz| 19-19-19-43| 19-19-19-43| 19-19-19-43| 19-19-19-43
CAS Latency-3200MHz| 22-22-22-52| 22-22-22-52| 22-22-22-52| 22-22-22-52
No. of Memory IC| 4//8//16
Operating Voltage| 1.2V
Pin Count| 288
Net Weight (g)| 36g
Gross Weight(g)| 72g
Power Consumption| 3W
Controller IC| NO
ECC(Error Correction Code)(YES/NO)| NO
Overclock Support (YES/NO)| NO
Heat Sink/ Heat Spreader| YES
OEM/ODM Support| YES
Form Factor| UDIMM
Computer Memory Type(DRAM/SDRAM)| DRAM
Operating Temperature| 0~85°C
Storage Temperature| -40~100°C
Warranty| 3 Years
No. of Memory Channels (Single/Dual)| (Single/Dual)
Product Dimension (W x Dx H)in mm| 133X33X7mm
Buffered /Un-buffered Memory| Un-buffered Memory
Memory IC Brand| Micron/Samsung/Sk Hynix

DDR4 With Heatsink UDIMM Series(H18 Series)

32GB
Memory Speed /Frequency| 2400/2666/3200MHz| 2666/3200MHz| 2666/3200MHz| 2666/3200MHz
Rank(1Rx8/2Rx8/8Rx4)| 1Rx8| 1Rx8| 2Rx8| 2Rx8
CAS Latency-2400MHz| 17-17-17-39|  |  |
CAS Latency-2666MHz| 19-19-19-43| 19-19-19-43| 19-19-19-43| 19-19-19-43
CAS Latency-3200MHz| 22-22-22-52| 22-22-22-52| 22-22-22-52| 22-22-22-52
No. of Memory IC| 4//8//16
Operating Voltage| 1.2V
Pin Count| 288
Net Weight (g)| 36g
Gross Weight(g)| 72g
Power Consumption| 3W
Controller IC| NO
ECC(Error Correction Code)(YES/NO)| NO
Overclock Support (YES/NO)| NO
Heat Sink/ Heat Spreader| YES
OEM/ODM Support| YES
Form Factor| UDIMM
Computer Memory Type(DRAM/SDRAM)| DRAM
Operating Temperature| 0~85°C
Storage Temperature| -40~100°C
Warranty| 3 Years
No. of Memory Channels (Single/Dual)| (Single/Dual)
Product Dimension (W x Dx H)in mm| 133x33x7
Buffered /Un-buffered Memory| Un-buffered Memory
Memory IC Brand| Micron/Samsung/Sk Hynix

DDR5 UDIMM Series

DDR5 SODIMM Series

DDR4 UDIMM Series

2666/3200MHz
Memory Bandwidth(GB/s)| 19200| 21300| 21300| 21300
Rank(1Rx8/2Rx8/8Rx4)| 1Rx8| 1Rx8| 2Rx8| 2Rx8
CAS Latency-2400MHz| 17-17-17-39| 17-17-17-39|  |
CAS Latency-2666MHz| 19-19-19-43| 19-19-19-43| 19-19-19-43| 19-19-19-43
CAS Latency-3200MHz|  | 22-22-22-52| 22-22-22-52| 22-22-22-52
No. of Memory IC| 4//8//16
Power Consumption| 3W
Controller IC| NO
Overclock Support (YES/NO)| NO
ECC(Error Correction Code)(YES/NO}| NO
Net Weight (g)| 20g
Gross Weight(g)| 45g
Pin Count| 288
Operating Voltage| 1.2V
OEM/ODM Support| YES
Heat Sink/ Heat Spreader| NO
Form Factor| UDIMM
Computer Memory Type(DRAM/SDRAM)| DRAM
Operating Temperature| 0~70°C
Storage Temperature| -40~85°C
Warranty| 3 Years
No. of Memory Channels (Single/Dual)| (Single/Dual)
Product Dimension (W x Dx H)in mm| 133x30x4.0mm
Buffered /Un-buffered Memory| Un-buffered Memory
Memory IC Brand| Micron/Samsung/Sk Hynix

DDR4 SODIMM Series

2666/3200MHz
Memory Bandwidth(GB/s)| 19200| 21300| 21300| 21300
Rank(1Rx8/2Rx8/8Rx4}| 1Rx8| 1Rx8| 2Rx8| 2Rx8
CAS Latency-2400MHz| 17-17-17-39| 17-17-17-39|  |
CAS Latency-2666MHz| 19-19-19-43| 19-19-19-43| 19-19-19-43| 19-19-19-43
CAS Latency-3200MHz|  | 22-22-22-52| 22-22-22-52| 22-22-22-52
No. of Memory IC| 4//8//16
Operating Voltage| 1.2V
Power Consumption| 3W
Net Weight (g)| 15g
Gross Weight(g)| 40g
Controller IC| NO
Overclock Support (YES/NO}| NO
Heat Sink/ Heat Spreader| NO
ECC(Error Correction Code)(YES/NO}| NO
Pin Count| 260
OEM/ODM Support| YES
Computer Memory Type(DRAM/SDRAM}| DRAM
Operating Temperature| 0~70°C
Storage Temperature| -40~85°C
Warranty| 3 Years
Form Factor| SODIUM
No. of Memory Channels (Single/Dual)| (Single/Dual)
Product Dimension (W x Dx H)in mm| 70x30x3.5mm
Buffered /Un-buffered Memory| Un-buffered Memory
Memory IC Brand| Micron/Samsung/Sk Hynix

DDR3 UDIMM Series

DDR3 SODIMM Series

KingDian International Branches

International Branches

HQ: Shenzhen KingDian Technology Co., Ltd.

• Address: 6th Floor, Block B2, Fuxinlin Industrial Park, Hangcheng
• Industrial Zone, Xixiang Street, Baoan District, Shenzhen, Guangdong,
• China(518102)
• Customer Serivce: +860755-85281822
• Fax:+860755-85281822-608
• www.kingdianssd.com

Latin America Branch Office

• Address: Rua marquesa de santos, 27 apt 410 – Rio De aneiro-Brazil
• North America Branch Office
• Address:2651 S Course Dr #205 Pompano Beach-Miami-FL F33069

Indonesia/Malaysia Branch Office

• Address: JI.Suryo No.137,Jagalan, Kecamatan Jebres, Kota
• Surakarta, Jawa Tengah,Indonesia

Vietnam Branch Office

• Address:220 Xo Viet Nghe Tinh Street, Ward 21, Binh ThanhDistrict,
• Ho Chi Minh City, Vietnam

Korea Branch Office

• Address:934 Dong, Gwanak-ro Gwanak-gu Seoul, Korea

Philippine Branch Office

• Address:169 P. Parada St., Brgy. Sta Lucia, San Juan City 1500
• Philippines

Mexico Branch Office

• Address:Calle Jacarsndas Mz 156 LT 29 Hacienda Ojo de Agua,
• Tecamac – Estado de Mexico 55770

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