UNICOM Engineering E-1800 R7 High Reliability Medium Density Enterprise Computing Systems Instructions

June 4, 2024
UNICOM Engineering

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UNICOM Engineering E-1800 R7 High-Reliability Medium Density Enterprise

Computing Systems

UNICOM-Engineering-E-1800-R7-High-Reliability-Medium-Density-Enterprise-
Computing-Systems-PRODUCT

Unit Disassembly for WEEE

Revision| Date| MR #| Revised By| Description of Changes
---|---|---|---|---
01| 06/29/2023| 37592| John Loos| Draft
0A| 11/28/2023| 37592| John Loos| Released

NOTE: Disconnect any AC Power Cords or shut off any DC power source attached to the power supplies and then remove any wires connected to the DC power supplies before disassembly of the unit.

PRODUCT DISASSEMBLY INSTRUCTIONS

Most parts can be removed easily by hand. In some cases, common household tools such as Philips and/or flat-head screwdrivers may be necessary. Some components may require needle-nose pliers. Instructions for removing parts in this product can be found in the Intel System Integration and Service Guide documentation. All removed components should be disposed of in the appropriate recycling bin. The most recent documentation for this server can be found online at:

https://www.intel.com/content/www/us/en/products/details/servers/server- systems/server-m50fcp/docs.html

Revision 1.2 is attached here for reference:

  • Intel_Server_System_M50FCP1UR_TPS_Re

Images shown are representative of the product and may vary depending on the actual configuration.

Example: 12-drive, E-1800 R7 Server with lid:]

UNICOM-Engineering-E-1800-R7-High-Reliability-Medium-Density-Enterprise-
Computing-Systems-FIG-2

Example: E-2900 R7 Internal View

UNICOM-Engineering-E-1800-R7-High-Reliability-Medium-Density-Enterprise-
Computing-Systems-FIG-3

Recycling/Material Code Important Information

Material /Components, which must be removed and treated separately
Lithium Battery| Battery-free of hazardous substances, installed in the socket on the motherboard
Printed circuit boards| Motherboard, DIMMs, PCI card, PCI riser, Power Supply, and DVD adapter PCB
Disk Drives| Hard Drive, DVD Drive, Solid State Drive
|
Material /Components, which can disturb certain recycling processes
Aluminum| Heat sink, handles
|
Material /Components, through which benefits can normally be achieved
Cold Rolled Steel| Top cover, chassis bottom, and rails

  • ABS| Pushbuttons, Shroud
    Cables| Distributed in device
    Fans|
    |
    Special notes
  • Flame retardant of plastics does not contain PBB and PBDE.

Annex A

Producer: <Company name, other on addressing the producer>
Scope of information sheet: < Product category as in Annex IA of WEEE

Directive, or type of equipment as in Annex 1B of WEEE Directive, or producer’s Product Family, or

single products identified by brand and model name >

Component or Material Remarks / Location
Battery (internal *) containing Mercury (Hg)/ NiCad/Lithium/ Other **Lithium

battery**

Located on the motherboard

Backlighting lamps of LCD/TFT or similar screens containing Mercury (Hg)| NONE
Mercury (Hg) in other applications| NONE
Cadmium
| NONE
Gas discharge lamps| NONE
Plastic containing ruminated flame retardants other than in Printed Circuit Assemblies *| NONE
Component or Material| Remarks / Location
---|---
Liquid Crystal Displays with a surface greater than 100 cm2| NONE
Capacitors with PCB’s| NONE
Capacitors with substances of concern** + height > 25 mm, diameter > 25 mm or proportionately similar volume| NONE
Asbestos|
NONE
Refractory ceramic fibers|
NONE
Radio-active substances|
NONE
Beryllium Oxide|
NONE
Other forms of Beryllium|
BE-CU in some connector contacts
Gasses – which fall under Regulation (EC) 2037/2000 and all hydrocarbons (HC).|
NONE**
Components with pressurized gas which need special attention (Pressure > 1,5 bar) ***
| NONE
Liquids if volume > 10 cl (or equivalence in weight, e.g. for PCB, oil…)| NONE
Mechanical components that store mechanical energy (i.e. springs) or equivalent parts that need special attention

(diameter > 10 mm and height > 25 mm or proportionally similar volume and expanding)

| NONE
PBDE (deca- & octa-BDE) and Perfluorocatane sulfantes (PFOS) in Directive 2006/122/EC| NONE

  • = Arrow indicates the need for the location of the compartment/ substances within the product. When the location of a substance/component is requested, it is at the part level, e.g. main board, housing, etc
  • Internal means that batteries can only be removed by opening the product using (a) tool(s).
  • Substances are considered to be in the product if present above the levels specified in Commission Decision 2011/65/EU (RoHS Directive) or if their use is permitted through exemptions in Annex III of this directive.
  • To be coherent with the industry’s current standards and practices on tracking of plastic parts, the Directive 2002/96 (EC) Annex II requirement is understood to focus on plastic parts that weigh more than 25 g.
  • The substance of concern other than PCB, to be specified/ addressed further in the context of Directive 2002/96 (EC) Annex II national requirements and European developments
  • Needs of an equivalent nature as those for maintenance, service manuals, and installation for safety purposes.

Specifications

  • Product Name : E-1800 R7 Unit
  • Document Number / Disk File : 597-2001-00
  • Assemblies Covered : E-1800 R7 (786-7327-00)

FAQ

Q: What tools are recommended for disassembling the E-1800 R7 Unit?
A: Common household tools such as Philips and flat-head screwdrivers, as well as needle-nose pliers, may be required for disassembly.

Q: Where can I find the most recent documentation for this server?
A: The latest documentation can be accessed online at the provided Intel website link.

Q: How should I dispose of removed components?
A: All removed components should be disposed of in the appropriate recycling bin following electronic waste disposal guidelines.

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