SILCON LABS SiWx917 Wi-Fi 6 and Bluetooth LE Dev Kit User Guide
- September 14, 2024
- SILCON LABS
Table of Contents
- SiWx917 Wi-Fi 6 and Bluetooth LE Dev Kit
- Specifications
- SiWx917 Wi-Fi 6 and Bluetooth LE Dev Kit
- Product Usage Instructions
- 1. Getting Started
- 2. Programming
- 3. Running Applications
- 4. Debugging
- Q: Does the SiWx917 Dev Kit support Bluetooth LE?
- Q: How do I connect the Dev Kit to Simplicity StudioTM?
- Q: Can I develop custom IoT applications on the SiWx917 Dev
SiWx917 Wi-Fi 6 and Bluetooth LE Dev Kit
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Specifications
SiWx917 Wi-Fi 6 and Bluetooth LE Dev Kit
-
Low-cost, small form factor development and evaluation
platform -
Based on the SiWG917 Wireless System-on-Chip
-
Ideal for developing energy-friendly IoT applications
-
Built-in SEGGER J-Link debugger for easy debugging
-
USB Type-C connector for programming
-
64 Mbit QSPI PSRAM for running applications
-
Supported in Simplicity StudioTM
Product Usage Instructions
1. Getting Started
Connect the SiWx917 Dev Kit to your computer using a USB Type-C
cable.
2. Programming
Use the on-board J-Link debugger for programming the Dev Kit. A
USB virtual COM port is available for serial connection to the
target application.
3. Running Applications
Utilize the 64 Mbit QSPI PSRAM on the board to run applications
efficiently.
4. Debugging
The built-in SEGGER J-Link debugger allows for easy debugging of
applications.
Frequently Asked Questions (FAQ)
Q: Does the SiWx917 Dev Kit support Bluetooth LE?
A: Yes, the SiWx917 Dev Kit supports Bluetooth LE in addition to
Wi-Fi 6.
Q: How do I connect the Dev Kit to Simplicity StudioTM?
A: Connect the Dev Kit to your computer via USB and open
Simplicity StudioTM to start development.
Q: Can I develop custom IoT applications on the SiWx917 Dev
Kit?
A: Yes, the SiWx917 Dev Kit is an ideal platform for developing
energy-friendly IoT applications, and a Board Support Package (BSP)
is provided to help developers get started.
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UG581: SiWx917 Wi-Fi 6 and Bluetooth LE Dev Kit User’s Guide
The SiWx917 Wi-Fi 6 and Bluetooth LE Dev Kit is a low-cost, small form factor
development and evaluation platform for the SiWG917 Wireless System-on-Chip.
The board is a small and cost-effective, feature-rich, prototype and
development platform based on the SiWG917 Wireless System-on-Chip. The SiWx917
Dev Kit is an ideal platform for developing energy-friendly IoT applications.
A built-in SEGGER J-Link debugger ensures easy debugging through the USB
Type-C connector.
TARGET DEVICE
· SiWG917 Wireless System-on-Chip (SiWG917M111MGTBA)
· High-performance 2.4 GHz radio · 32-bit ARM® Cortex®-M4 with 180 MHz
maximum operating frequency · 8 MB flash and 320 kB RAM
KIT FEATURES
· 2.4 GHz ceramic chip antenna · Power control of on-board peripherals for
ultra-low power operation · Relative humidity and temperature sensor · Ambient
light sensor · 6-axis inertial sensor · MEMS stereo microphones · RGB LED and
two push buttons · 26-pin 2.54 mm breakout pads · Qwiic® connector · SEGGER
J-Link on-board debugger · Virtual COM port · Mini Simplicity connector (not
mounted)
for AEM using external Silicon Labs debugger · USB powered
SOFTWARE SUPPORT
· Simplicity StudioTM
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Copyright © 2024 by Silicon Laboratories
Rev. 1.0
Table of Contents
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. 4 1.1 Kit Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . 4 1.2 Getting Started . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . 4 1.3 Hardware Content . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . 4 1.4 Kit Hardware Layout . . . . . . . . . . . . . . . . . . . . .
. . . . . . . 5
2. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. 6 2.1 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . .
. . . 6 2.2 Current Consumption . . . . . . . . . . . . . . . . . . . . . . .
. . . . . 7
3. Hardware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
8 3.1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. 8 3.2 Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. 9 3.3 SiWG917 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. 9 3.4 Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. .10 3.4.1 Si7021 Relative Humidity and Temperature Sensor . . . . . . . . .
. . . . . . .11 3.4.2 ICS-43434 MEMS Stereo Microphones . . . . . . . . . . .
. . . . . . . . .11 3.4.3 ICM-40627 6-Axis Inertial Sensor . . . . . . . . . .
. . . . . . . . . . . .12 3.4.4 VEML6035 Ambient Light Sensor . . . . . . . .
. . . . . . . . . . . . . .13 3.4.5 External Memory . . . . . . . . . . . . .
. . . . . . . . . . . . . . .13 3.4.6 Push Buttons and RGB LED . . . . . . . .
. . . . . . . . . . . . . . . .14 3.4.7 ISP Mode Button . . . . . . . . . . .
. . . . . . . . . . . . . . . . .14 3.5 On-board Debugger . . . . . . . . . .
. . . . . . . . . . . . . . . . . .15 3.6 Connectors . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . .16 3.6.1 Breakout Pads . . . . . . . . . .
. . . . . . . . . . . . . . . . . .17 3.6.2 Qwiic Connector . . . . . . . . .
. . . . . . . . . . . . . . . . . . .18 3.6.3 Mini Simplicity Connector . . .
. . . . . . . . . . . . . . . . . . . . . .18 3.6.4 Debug USB Type-C Connector
. . . . . . . . . . . . . . . . . . . . . . .18
4. Debugging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.1 On-board Debugger . . . . . . . . . . . . . . . . . . . . . . . . . . .
.19 4.2 External Debugger. . . . . . . . . . . . . . . . . . . . . . . . . . .
. .20 4.2.1 External Debugger Considerations . . . . . . . . . . . . . . . . .
. . . . .20 4.3 Virtual COM Port . . . . . . . . . . . . . . . . . . . . . . .
. . . . . .21
5. Schematics, Assembly Drawings, and BOM . . . . . . . . . . . . . . . . . .
. 22
6. Kit Revision History and Errata . . . . . . . . . . . . . . . . . . . . .
. .23 6.1 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . .
. . .23 6.2 Errata . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . .23
7. Board Revision History and Errata . . . . . . . . . . . . . . . . . . . .
. . 24 7.1 Revision History . . . . . . . . . . . . . . . . . . . . . . . . .
. . . .24
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Rev. 1.0 | 2
7.2 Errata . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 8. Document Revision History . . . . . . . . . . . . . . . . . . . . . . . . . 25
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UG581: SiWx917 Wi-Fi 6 and Bluetooth LE Dev Kit User’s Guide
Introduction
1. Introduction
The SiWx917 Wi-Fi 6 and Bluetooth LE Dev Kit (OPN: SiWx917-DK2605A) has been
designed to inspire customers to make IoT devices and applications with the
Silicon Labs SiWG917 Wireless System-on-Chip. The highlights of the board
include different environmental sensors accessible to the SiWG917 wireless
SoC. The peripherals have been grouped into power domains that can be turned
on and off by the application code as needed.
Programming the SiWx917 Dev Kit is easily done using a USB Type-C cable and
the on-board J-Link debugger. A USB virtual COM port provides a serial
connection to the target application. Included on the board is a 64 Mbit QSPI
PSRAM that can be used for running applications. The SiWx917 Dev Kit is
supported in Simplicity StudioTM, and a Board Support Package (BSP) is
provided to give application developers a flying start.
Energy profiling and advanced wireless network analysis and debugging tools
are available through the provided Mini Simplicity Connector using an external
Silicon Labs debugger.
Connecting external hardware to the SiWx917 Dev Kit can be done using the 26
breakout pads which present peripherals from the SiWG917 Wireless such as I2C,
SPI, UART, and GPIOs. The board also features a Qwiic connector which can be
used to connect hardware from the Qwiic Connect System through I2C.
1.1 Kit Contents
The following item is included as a part of the kit: · 1x SiWx917 Dev Kit
board (BRD2605A)
1.2 Getting Started
Detailed instructions for how to get started with your new SiWx917 Dev Kit can
be found on the Silicon Labs web page: https:// www.silabs.com/dev-tools
1.3 Hardware Content
The following key hardware elements are included on the SiWx917 Dev Kit: ·
SiWG917 Wireless SoC with 180 MHz operating frequency, 8 MB flash, and 320 kB
RAM · 2.4 GHz ceramic antenna for wireless transmission · Silicon Labs Si7021
relative humidity and temperature sensor · TDK InvenSense ICM-40627 6-axis
inertial sensor · Two ICS-43434 MEMS microphones · Ambient light sensor
(VEML6035) · Macronix ultra low power 8 Mbit SPI flash (MX25R8035F) · RGB LED
and two push buttons · Isolation switches for ultra-low power operation · On-
board SEGGER J-Link debugger for easy programming and debugging, which
includes a USB virtual COM port · Mini Simplicity connector for access to
energy profiling and advanced wireless network debugging · Breakout pads for
GPIO access and connection to external hardware · Qwiic connector for
connecting external hardware from the Qwiic Connect System · Reset button
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Rev. 1.0 | 4
1.4 Kit Hardware Layout SiWx917 Dev Kit layout is shown below.
Left I2S Microphone
2.4 GHz Chip Antenna
Top View
UG581: SiWx917 Wi-Fi 6 and Bluetooth LE Dev Kit User’s Guide
Introduction
Right I2S Microphone
30.4 mm Bottom View
qwiic Header 26-pin
Breakout Pads
ISP Button 6-axis
Inertial Sensor RGB LED
Reset Button
USB Type-C Connector – Virtual COM port – Debug access
SiWG917 Wireless SOC
On-board USB J-Link Debugger
Dip Switch for PSRAM
Ambient Light & UV
Sensor
Push Buttons
55.0 mm
Humidity and Temperature Sensor
Mini Simplicity Connector
Note: Mini Simplicity connector is not mounted on the board
Figure 1.1. SiWx917 Dev Kit Hardware Layout
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Rev. 1.0 | 5
2. Specifications
UG581: SiWx917 Wi-Fi 6 and Bluetooth LE Dev Kit User’s Guide
Specifications
2.1 Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
USB Supply Input Voltage
VUSB
—
5.0
—
V
Supply Input Voltage (VMCU supplied externally)1
VVMCU
1.9
3.3
3.6
V
Operating Temperature
TOP
-40
—
85
°C
Note:
1. Brightness of the RGB LED will vary with the supply voltage. Due to
manufacturing tolerances, functionality is not guaranteed over the entire
working range.
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UG581: SiWx917 Wi-Fi 6 and Bluetooth LE Dev Kit User’s Guide
Specifications
2.2 Current Consumption
The operating current of the board greatly depends on the application. The
table below attempts to give some indication of how different features of the
board contribute to the overall power consumption. Note that the numbers are
taken from the data sheets for the devices. For a full overview of the
conditions that apply for a specific number from a data sheet, the reader is
encouraged to read the specific data sheet.
Table 2.1. Current Consumption
Parameter
Symbol
Condition
Typ
SiWx917 Current Consump- ISiWG917 Active current at 180MHz in high performance mode
50
tion1
Sleep without RAM Retention
1.5
RH/Temp Sensor Current Consumption2
ISi7021
Standby, -40 to +85 °C RH conversion in progress
0.06 150
Temperature conversion in progress
90
Peak IDD during I2C operations
3.5
Microphone Current Con-
IMIC
Sleep mode, fs less than 3.125 kHz
12
sumption3,4,
Performance mode (VDD = 1.8 V)
490
IMU Current Consumption5
IIMU
Full-chip sleep mode at 1.8 V supply
7.5
Accelerometer low power mode (Gyroscope desabled)
46
QSPI PSRAM Current Con- IAPS6404L Standby current (standard room temp)
100
sumption6
Ambient Light Sensor Cur-
IVEML6035 Shutdown at 1.8 V supply
0.5
rent Consumption7
Operation mode at 1.8 V supply (ALS only)
170
On-board Debugger Sleep Current Consumption8
IDBG
On-board debugger current consumption when USB cable
80
is not inserted (EFM32GG12 EM4S mode current con-
sumption)
Note: 1. From SiWG917 SoC data sheet. 2. From Si7021-A20 data sheet. 3. From ICS-43434 data sheet. 4. Per microphone. 5. From SICM-40627 data sheet. 6. From APS6404L-3SQR-ZR data sheet. 7. From VEML6035 data sheet. 8. From EFM32GG12 data sheet.
Unit µA/MHz
µA µA µA µA mA µA µA µA mA µA
µA µA nA
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UG581: SiWx917 Wi-Fi 6 and Bluetooth LE Dev Kit User’s Guide
Hardware
3. Hardware
The core of the SiWx917 Dev Kit is the SiWG917 Wireless System-on-Chip. The
board also contains several peripherals connected to the SiWG917. Refer to
section 1.4 Kit Hardware Layout for placement and layout of the hardware
components.
3.1 Block Diagram An overview of the SiWx917 Dev Kit is illustrated in the figure below.
Debugging
Device Connectivity
USB Type-C Connector
Mini-Simplicity Breakout Pads Connector
Qwiic Connector
J-Link Debugger Memory
64-Mbit
QSPI PSRAM
IS2PS.4MMGAoHdze CoBAnnuntteetoncntnoar
SiWG917 Wireless SoC
Sensors Si7021
VEML6035
Temperature & Humidity
Sensor
ICS-43434
Ambient Light Sensor
ICM-40627
2x I2S Microphones
6-axis Inertial Sensor
Figure 3.1. Kit Block Diagram
Radio
2.4 GHz Antenna Buttons and LED
User Buttons & RGB LED
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UG581: SiWx917 Wi-Fi 6 and Bluetooth LE Dev Kit User’s Guide
Hardware
3.2 Power Supply The kit can be powered through one of these interfaces: · USB
Type-C · Mini Simplicity connector The figure below shows the power options
available on the kit and illustrates the main system power architecture.
Mini Simplicity Connector/
Breakout Pads
5V0
VMCU
USB Type-C
IN
OUT
LDO
SiWG917 Wireless SoC
Figure 3.2. SiWx917 Dev Kit Power Architecture
Power is normally applied through the USB cable. When the USB cable is
connected, VBUS is regulated down to 3.3 V. Power can also be applied through
the Mini Simplicity connector (or Breakout Pads). There must be no other power
sources present on the kit as power is injected directly to the VMCU net.
Powering the SiWx917 Dev Kit through the Mini Simplicity connector allows
current measurements using the Advanced Energy Monitoring (AEM) as described
in section 4.2 External Debugger. Important: When powering the board through
the Mini Simplicity connector (not mounted on board), the USB power source
must be removed.
The power supply options are summarized in the table below.
Table 3.1. SiWx917 Dev Kit Power Options
Supply Mode USB power
Mini Simplicity
Typical Input Voltage 5.0 V 3.3 V
VMCU Source On-board regulator Debugger dependent
3V3 On-board regulator
Disconnected
5V USB VBUS No voltage present
3.3 SiWG917 Reset
The SiWG917 can be reset by a few different sources: · A user pressing the
RESET button. · The on-board debugger pulling the #POC_IN pin low. · An
external debugger pulling the #POC_IN pin low.
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UG581: SiWx917 Wi-Fi 6 and Bluetooth LE Dev Kit User’s Guide
Hardware
3.4 Peripherals
The SiWx917 Dev Kit contains a set of peripherals that can be accessed from
the SiWG917. All the peripherals (except QSPI PSRAM) have enable signals which
can be used to completely turn off the peripherals that are not in use, or
they can be put into a state that draws minuscule amount of power. This allows
for the lowest possible power consumption in every application. The following
peripherals are accessible to the SiWG917:
· Silicon Labs Si7021 relative humidity & temperature sensor · 2x TDK
InvenSense ICS-43434 MEMS microphones with I2S output · TDK InvenSense
ICM-40627 6-axis inertial measurement sensor · Vishay VEML6035 ambient light
sensor · AP Memory Technology APS6404L-3SQR-ZR QSPI PSRAM · RGB LED and two
push buttons
The figure below gives an overview of the peripherals that are connected to
the SiWG917. Note that some of the peripherals share the same interface and
enable signals.
ICM-40627
APS6404L QSPI
PSRAM
VMCU
SENSOR ENABLE
VMCU
SPI IMU CS
SPI 3
IMU INTERRUPT
TS3A27518E VMCU
OFF ON
Buttons
QSPI 6
PC10 (I2C0_SCL#14) PC11 (I2C0_SDA#16)
GPIO 2
SiWG917 Wireless SoC
RGB LED
GPIO 3
I2C 2 VMCU
I2C 2
ALS INTERRUPT VMCU
I2S 3
MIC ENABLE
SWO
Si7021 VEML6035 2x ICS-43434 ISP Button
Figure 3.3. Peripherals
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UG581: SiWx917 Wi-Fi 6 and Bluetooth LE Dev Kit User’s Guide
Hardware
3.4.1 Si7021 Relative Humidity and Temperature Sensor
The Si7021 I2C relative humidity and temperature sensor is a monolithic CMOS
IC integrating humidity and temperature sensor elements, an analog-to-digital
converter, signal processing, calibration data, and an I2C interface. The
patented use of industry-standard, low-K polymeric dielectrics for sensing
humidity enables the construction of low-power, monolithic CMOS Sensor ICs
with low drift and hysteresis, and excellent long term stability. The Si7021
offers an accurate, low-power, factory-calibrated digital solution ideal for
measuring humidity, dew-point, and temperature in applications ranging from
HVAC/R and asset tracking to industrial and consumer platforms.
On the SiWx917 Dev Kit, the Si7021 is connected through a switch. The switch
must therefore be enabled by setting UULP_VBAT_GPIO_1 high before it can be
used by the application. This enables power to the Si7021 and connects the I2C
lines used for the sensor to the SiWG917 I2C bus. Note the presence of the
pull-down resistor on the SENSOR_ENABLE line to pull it LOW by default. The
figure below shows how the Si7021 is connected to the SiWG917.
SiWG917
VMCU
VDD_SENSOR
Si7021
ULP_GPIO_7 ULP_I2C_SCL ULP_GPIO_6 ULP_I2C_SDA
UULP_VBAT_GPIO_1 SENSOR_ENABLE
SENSOR_I2C_SCL SENSOR_I2C_SDA
0: Sensor is not powered 1: Sensor is powered
Temperature & Humidity
Sensor
Figure 3.4. Si7021 Relative Humidity and Temperature Sensor
Although measures have been taken to thermally isolate the sensor from the board, temperature readings will be influenced when power is dissipated on the board. More accurate temperature measurements are achieved when powering the board through the Mini Simplicity connector as self-heating from the on-board LDO is eliminated and the on-board debugger is put in a low-power state.
3.4.2 ICS-43434 MEMS Stereo Microphones
The ICS-43434 microphones are omnidirectional MEMS microphones with a wideband
frequency response and a digital I2S output. The microphones include a MEMS
sensor, signal conditioning, ADC, filters, and different operating modes. The
ICS-43434 is a bottom port microphone, and it is placed on the bottom side of
SiWx917 Dev Kit with acoustic ventilation holes going through to the top side.
These holes let sound waves into the microphone package.
On SiWx917 Dev Kit, the ICS-43434 microphones are connected through a switch.
The switch must therefore be enabled by setting UULP_VBAT_GPIO_0 high before
it can be used by the application. This enables power to the microphones and
connects the I2S lines used for the sensor to the SiWG917. Note the presence
of the pull-down resistor on the MIC_ENABLE line. The figure below shows how
the ICS-43434 microphones are connected to the SiWG917.
SiWG917
VMCU
GPIO_46 GPIO_48 GPIO_47
I2S_CLK I2S_DIN I2S_WS
UULP_VBAT_GPIO_0 MIC_ENABLE
VDD_MIC
MIC_I2S_CLK MIC_I2S_DIN MIC_I2S_WS 0: Sensor is not powered 1: Sensor is
powered
ICS-43434
VDD_MIC
I2S Microphone (R)
ICS-43434
VDD_MIC
I2S Microphone (L)
Figure 3.5. ICS-43434 MEMS Microphones
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UG581: SiWx917 Wi-Fi 6 and Bluetooth LE Dev Kit User’s Guide
Hardware
3.4.3 ICM-40627 6-Axis Inertial Sensor
The ICM-40627 is a 6-axis inertial sensor consisting of a 3-axis gyroscope and a 3-axis accelerometer. The sensor detects acceleration and angular rate in and around the X-, Y-, and Z-axes with integrated 16-bit ADCs and programmable digital filters.
On the SiWx917 Dev Kit, the ICM-40627 is connected through a switch. The switch must be enabled by setting UULP_VBAT_GPIO_1 high before it can be used by the application. This enables power to the ICM-40627 and connects the SPI lines used for the sensor to the SiWG917 SPI bus. Note the presence of the pull-down resistor on the SENSOR_ENABLE line to pull it LOW by default. The SPI CS line is also exported on the breakout pads, so simultaneous SPI operation on the breakout pads and IMU is not possible unless an alternative pin is used for SPI CS on the breakout pads. The figure below shows how the ICM-40627 is connected to the SiWG917.
SiWG917
VMCU
VDD_SENSOR
ULP_GPIO_8 ULP_GPIO_1 ULP_GPIO_2 ULP_GPIO_10 UULP_VBAT_GPIO_3
ULP_SPI_CLK ULP_SPI_MOSI ULP_SPI_MISO ULP_SPI_CS IMU_ALS_INT
UULP_VBAT_GPIO_1 SENSOR_ENABLE
IMU_SPI_CLK IMU_SPI_MOSI IMU_SPI_MISO IMU_SPI_CS IMU_INT
0: Sensor is not powered 1: Sensor is powered
ICM-40627
6-axis Intertial Sensor
Figure 3.6. ICM-40627 6-Axis Inertial Sensor
The inertial sensor is located close to the geometrical center of the board.
The coordinate system and rotation of the sensor follows the right-hand rule,
and the spatial orientation of the board is shown in the figure below.
Z
Y
X
Pin 1 chip identifier
Figure 3.7. SiWx917 Dev Kit Spatial Orientation
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UG581: SiWx917 Wi-Fi 6 and Bluetooth LE Dev Kit User’s Guide
Hardware
3.4.4 VEML6035 Ambient Light Sensor
The VEML6035 is an ambient light sensor with I2C digital interface.
On the SiWx917 Dev Kit, the VEML6035 is connected through a switch. The switch
must therefore be enabled by setting UULP_VBAT_GPIO_1 high before it can be
used by the application. This enables power to the VEML6035 and connects the
I2C lines used for the sensor to the SiWG917 I2C bus. The I2C lines are shared
with other on-board I2C peripherals. Note the presence of the pull-down
resistor on the SENSOR_ENABLE line to pull it LOW by default. The I2C bus is
shared with the Qwiic Connector and is also exported on the breakout pads. The
figure below shows how the VEML6035 is connected to the SiWG917.
SiWG917
VMCU
ULP_GPIO_7 ULP_GPIO_6 UULP_VBAT_GPIO_3
I2C_SCL I2C_SDA GPIO
UULP_VBAT_GPIO_1 SENSOR_ENABLE
VDD_SENSOR
SENSOR_I2C_SCL SENSOR_I2C_SDA ALS_INT 0: Sensor is not powered 1: Sensor is
powered
VEML6035
Ambient Light Sensor
Figure 3.8. VEML6035 Ambient Light Sensor
3.4.5 External Memory
The SiWx917 Dev Kit includes a 64 Mbit QSPI PSRAM that is isolated through
switch to the SiWG917. The APS6404L-3SQR-ZR device features a high speed, low
pin count interface. To keep current consumption down, it is important that
the PSRAM is always put in power off mode when not used. This is done by
controlling a slide switch to turn off the supply to 6 channel multiplexer.
The multiplexer provides the I/O and power isolation to the PSRAM. The figure
below shows how the QSPI PSRAM is connected to the SiWG917.
SiWG917
VMCU OFF ON
GPIO_52 GPIO_53 GPIO_54 GPIO_56 GPIO_57 GPIO_55
QSPI_SCLK QSPI_SIO0 QSPI_SIO1 QSPI_SIO2 QSPI_SIO3 QSPI_CS
QSPI_SCLK QSPI_SIO0 QSPI_SIO1 QSPI_SIO2 QSPI_SIO3 QSPI_CS
[64 -Mbit] APS6404L
QSPI PSRAM
TS3A27518E
Figure 3.9. QSPI PSRAM
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Rev. 1.0 | 13
UG581: SiWx917 Wi-Fi 6 and Bluetooth LE Dev Kit User’s Guide
Hardware
3.4.6 Push Buttons and RGB LED
The kit has two user push buttons marked BTN0 and BTN1. They are connected
directly to the SiWG917 and are debounced by RC filters with a time constant
of 1 ms. The buttons are connected to pins UULP_VBAT_GPIO_2 and GPIO_49.
The kit also features an RGB LED marked LED0, controlled by GPIO pins on the
SiWG917. The LED is connected in an active-low configuration, and each color
can be controlled using the SiWG917’s GPIO pins.
SiWG917 UULP_VBAT_GPIO_2 GPIO_49
GPIO_50 GPIO_51 GPIO_15
BUTTON0 BUTTON1 LEDR LEDG LEDB
User Buttons & RGB LED
Figure 3.10. Buttons and RGB LED
3.4.7 ISP Mode Button The kit feature an ISP button for In System Programming, which helps to load firmware to SiWx devices.
SiWG917
JTAG_TDO_SWO
ISP_ENABLE
ISP Mode Button
Figure 3.11. ISP Mode Button
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Hardware
3.5 On-board Debugger
The SiWx917 Dev Kit contains a microcontroller separate from the SiWG917
Wireless that provides the user with an on-board J-Link debugger through the
USB Type-C port. This microcontroller is referred to as the “on-board
debugger” and is not programmable by the user. When the USB cable is removed,
the on-board debugger goes into a very low power shutoff mode (EM4S).
In addition to providing code download and debug features, the on-board
debugger also presents a virtual COM port for general purpose application
serial data transfer.
The figure below shows the connections between the target SiWG917 device and
the on-board debugger. The figure also shows the Mini Simplicity Connector,
and how this is connected to the same I/O pins.
Refer to section 4. Debugging for more details on debugging.
Mini Simplicity Connector SiWEFGR93127MG
Host PC
DBG_VCOM_TX
DBG_VCOM_RX
USB
On-Board
DBG_SWCLK_C2CK
J-Link
DBG_SWDIO_C2D
Debugger
DBG_SWO
DBG_RESET
ULP_GPIO_11 (ULP_UART_TX) ULP_GPIO_9 (ULP_UART_RX) JTAG_TCK_SWCLK (JTAG_TCK/SWCLK) JTAG_TMS_SWDIO (TAG_TMS/SWDIO) JTAG_TDO_SWO (JTAG_TDO/SWO/ISP_ENABLE) POC_IN
Figure 3.12. On-Board Debugger Connections
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UG581: SiWx917 Wi-Fi 6 and Bluetooth LE Dev Kit User’s Guide
Hardware
3.6 Connectors
The SiWx917 Dev Kit features a Mini Simplicity Connector, a USB Type-C
connector, and 26 breakout pads. The connectors are placed on the either side
of the board, and their placement and pinout are shown in the figure below.
For additional information on the connectors, see the following sub-chapters.
Breakout Pads
qwiic Connector
GND GPIO_25 – GPIO GPIO_26 – GPIO GPIO_27 – GPIO GPIO_28 – GPIO GPIO_29 – GPIO
GPIO_30 – GPIO ULP_GPIO_7 – ULP_I2C_SCL BOARD_ID_SCL BOARD_ID_SDA
GPIO_6 – GPIO GPIO_10 – GPIO GPIO_12 – GPIO
VMCU ULP_SPI_MOSI – ULP_GPIO_1 ULP_SPI_MISO – ULP_GPIO_2 ULP_SPI_CLK – ULP_GPIO_8 ULP_SPI_CS – ULP_GPIO_10 ULP_UART_TX – ULP_GPIO_11 ULP_UART_RX – ULP_GPIO_9 ULP_I2C_SDA – ULP_GPIO_6 5V 3V3 GPIO – GPIO_11 GPIO – GPIO_7 GND
GND VMCU I2C_SDA – ULP_GPIO_6 I2C_SCL – ULP_GPIO_7
USB Type-C Connector
qwiic Connector
Mini Simplicity Connector (not mounted)
PTI_DATA – NC SWCLK – JTAG_TCK_SWCLK
SWO – JTAG_TDO_SWO VCOM_RX – ULP_GPIO_9
GND
NC – PTI_FRAME JTAG_TMS_SWDIO – SWDIO ULP_GPIO_11 – VCOM_TX RST VMCU
Pin 1
Figure 3.13. SiWx917 Dev Kit Connectors
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Hardware
3.6.1 Breakout Pads
Twenty six breakout pads are provided and allow connection of peripherals or
add-on boards. Thirteen of the pads are located along the left side of the
board and thirteen are located on the right side. The breakout pads expose I/O
pins that can be used with most of the SiWG917’s features. Additionally, the
VMCU (main power rail), 3V3 (LDO regulator output), and 5V power rails are
also exposed.
The breakout pads are pinned out similar to the EXP header found on other
Silicon Labs Starter Kits, which ensures that commonly used peripherals such
as SPI, UART, and I2C buses are available on fixed locations. The rest of the
pins are used for general purpose IO. The EXP header allows the definition of
EXP boards that can plug into a number of different Silicon Labs starter kits.
The pin-routing on SiWG917 is very flexible, so most peripherals can be routed
to any pin. However, pins may be shared between the breakout pads and other
functions on the SiWx917 Dev Kit. The table below includes an overview of the
EXP header and functionality that is shared with the kit.
Table 3.2. Expansion Header Pinout
Pin
Connection
EXP Header Function
Shared Feature
Right-side Breakout Pins
2
VMCU
SiWG917 voltage domain, included in AEM measurements.
4
ULP_GPIO_1
SPI_MOSI
IMU & Flash
6
ULP_GPIO_2
SPI_MISO
IMU & Flash
8
ULP_GPIO_8
SPI_CLK
IMU & Flash
10
ULP_GPIO_10
SPI_CS
IMU_SPI_CS (when SENSOR_ENABLE = 1)
12
ULP_GPIO_11
UART_TX
VCOM & Mini Simplicity
14
ULP_GPIO_9
UART_RX
VCOM & Mini Simplicity
16
ULP_GPIO_6
I2C_SDA
Qwiic I2C bus
18
5V
Board USB voltage
20
3V3
Board controller supply
22
GPIO_11
GPIO
—
24
GPIO_7
GPIO
—
26
GND
Ground
Left-side Breakout Pins
1
GND
Ground
3
GPIO_25
GPIO
—
5
GPIO_26
GPIO
—
7
GPIO_27
GPIO
—
9
GPIO_28
GPIO
—
11
GPIO_29
GPIO
—
13
GPIO_30
GPIO
—
15
ULP_GPIO_7
I2C_SCL
Qwiic I2C bus
17
BOARD_ID_SCL Connected to Board Controller for identification of add-on boards.
19
BOARD_ID_SDA Connected to Board Controller for identification of add-on boards.
21
GPIO_6
GPIO
—
23
GPIO_10
GPIO
—
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Rev. 1.0 | 17
Pin
Connection
25
GPIO_12
UG581: SiWx917 Wi-Fi 6 and Bluetooth LE Dev Kit User’s Guide
Hardware
EXP Header Function GPIO
Shared Feature —
3.6.2 Qwiic Connector The SiWx917 Dev Kit features a Qwiic connector
compatible with Qwiic Connect System hardware. The Qwiic connector provides an
easy way to expand the functionality of the SiWx917 Dev Kit with sensors,
LCDs, and other peripherals over the I2C interface. The Qwiic connector is a
4-pin polarized JST connector, which ensures the cable is inserted the right
way. Qwiic Connect System hardware is daisy chain-able as long as each I2C
device in the chain has a unique I2C address. Note: The Qwiic I2C lines are
shared with the on-board I2C sensors, and are also exposed on the breakout
pads.
The table below gives an overview of the Qwiic connections to the SiWG917.
Table 3.3. Qwiic Connector Pinout
Qwiic Pin Ground 3.3V SDA SCL
Connection
ULP_GPIO_6 ULP_GPIO_7
GND VMCU
Shared Feature
Breakout pads, I2C sensors Breakout pads, I2C sensors
3.6.3 Mini Simplicity Connector
The Mini Simplicity connector is a 10-pin, 1.27 mm pitch connector that allows
the use of an external debugger such as the one found on a Silicon Labs
Wireless Starter Kit mainboard. See section for more details. The pinout of
the connector on the board is described in the table below with the names
being referenced from the SiWG917.
Table 3.4. Mini Simplicity Connector Pin Descriptions
Pin number 1
2 3 4 5 6 7 8 9 10
Function AEM
GND RST VCOM_RX VCOM_TX SWO SWDIO SWCLK PTI_FRAME PTI_DATA
Connection VMCU
GND RESET PA06 PA05 PA03 PA02 PA01 PC07 PC06
Description Target voltage on the debugged application. May be supplied and monitored by the AEM on an external debugger. Ground SiWG917 reset Virtual COM Rx Virtual COM Tx Serial Wire Output Serial Wire Data Serial Wire Clock Packet Trace Frame Packet Trace Data
3.6.4 Debug USB Type-C Connector
The debug USB port can be used for uploading code, debugging, and as a Virtual
COM port. More information is available in section 4. Debugging.
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UG581: SiWx917 Wi-Fi 6 and Bluetooth LE Dev Kit User’s Guide
Debugging
4. Debugging
The SiWx917 Dev Kit contains an on-board SEGGER J-Link Debugger that
interfaces to the target SiWG917 using the Serial Wire Debug (SWD) interface.
The debugger allows the user to download code and debug applications running
in the target SiWG917. Additionally, it also provides a VCOM port to the host
computer that is connected to the target device’s serial port for general
purpose communication between the running application and the host computer.
The Packet Trace Interface (PTI) is also supported by the on-board debugger
which offers invaluable debug information about transmitted and received
packets in wireless links. The on-board debugger is accessible through the USB
Type-C connector.
An external debugger can be used instead of the on-board debugger by
connecting it to the Mini Simplicity Connector. This allows advanced debugging
features as described in section 4.2 External Debugger. When using an external
debugger it is very important to make sure that there is no power source
present on the SiWx917 Dev Kit, as the external debugger might source a
voltage on the target power domain (VMCU).
Important: When connecting an external debugger that sources voltage to the
VMCU net, the USB cable must be removed from the SiWx917 Dev Kit. Failure to
do so will create power conflicts.
The figure below shows the possible debug options.
On-board debugger
External debugger*
Conflict between debuggers
*USB power sources must be removed before connecting an external debugger that sources
voltage to the VMCU net.
Figure 4.1. SiWx917 Dev Kit Debugging Possibilities
4.1 On-board Debugger
The on-board debugger is a SEGGER J-Link debugger running on an EFM32 Giant
Gecko. The debugger is directly connected to the debug and VCOM pins of the
target SiWG917.
When the debug USB cable is inserted, the on-board debugger is automatically
activated and takes control of the debug and VCOM interfaces. This means that
debug and communication will not work with an external debugger connected at
the same time. The onboard LDO is also activated, providing power to the
board.
When the board is powered from the Mini Simplicity Connector, the on-board
debugger goes into a very low power shutoff mode (EM4S), consuming about 80
nA. This means that current consumption measurement of SiWx917 using the Mini
Simplicity Connector will not be affected too much by the on-board debugger
power consumption.
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UG581: SiWx917 Wi-Fi 6 and Bluetooth LE Dev Kit User’s Guide
Debugging
4.2 External Debugger
A Wireless mainboard from Silicon Labs can be connected to the Mini Simplicity
Connector and used for debugging instead of the onboard debugger. For
instruction on using the mainboard for debugging, see AN958: Debugging and
Programming Interfaces for Custom Designs. Note that the Wireless STK
Mainboard (BRD4001A) requires a BRD8010A STK/WSTK Debug Adapter to get access
to the Mini Simplicity Connector. Debugging with an external Wireless
mainboard gives access to the following debugging features:
· Debugging of the target device through SWD · Communication using the VCOM
port · Packet Trace Interface (for wireless devices only) · Advanced Energy
Monitor
Note that the Mini Simplicity Connector cannot be used at the same time that
the on-board debugger is active (USB cable is plugged in). For information on
how to correctly connect to the kit, see Figure 4.1 SiWx917 Dev Kit Debugging
Possibilities on page 19.
Powering the board when using the Mini Simplicity Connector with a Wireless
mainboard can be done using the AEM voltage supply of the Wireless mainboard.
When doing this, remove both the USB cable and the coin cell battery from the
SiWx917 Dev Kit before connecting the Wireless mainboard to the Mini
Simplicity Connector. The power switch on the Wireless mainboard should be set
in “AEM.” Power-cycling of the board, if necessary, is easily done by flipping
the power switch on the Wireless to “BAT” and back to “AEM,” assuming a
battery is not inserted in the Wireless mainboard.
It is possible to have the SiWx917 Dev Kit powered by a battery and still use
the Mini Simplicity Connector with a Wireless mainboard for debugging and
communication. In this case, the power switch on the Wireless mainboard must
be set to the “BAT” position and the coin cell battery on the Wireless
mainboard must be removed. In this case, level shifters on the Wireless
mainboard itself take care of interfacing to different voltage levels on the
SiWx917 Dev Kit. Connecting the board to an external debugger in other ways
than those described above might create power conflicts, compromise the
ability to monitor power consumption, and hazardously feed power back to the
on-board battery.
4.2.1 External Debugger Considerations
4.2.1.1 Power On Control (POC) and Reset
The power on control has two control options.
POC_OUT Connected to POC_IN:
The POC_IN input of the chip, should be made high only after supplies are
valid to ensure the IC is in safe state until valid power supply is available.
The POC_IN can be connected externally to the internally generated POC_OUT
signal or can be controlled from external source like R/C circuit.
During power up, until the VBATT reaches 1.6 V , the POC_OUT signal stays low.
Once the VBATT supply exceeds 1.6 V, the POC_OUT becomes high and the RESET_N
is high at least 1.6 ms after VBATT supply is stable.
External Control for POC_IN:
The POC_IN and RESET_N signals can be controlled from external source like R/C
circuits, RESET_N will be pulled low if POC_IN is low. POC_IN should be made
high only after supplies are valid to ensure the IC is in safe state . For
this a pull-up R/C circuit is applied across it to provide a delay, so that
POC_IN should be high after 0.6 ms and RESET_N should be high after 1 ms of
POC_IN high.
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Debugging
4.3 Virtual COM Port
The virtual COM port (VCOM) is a connection to a UART on the SiWG917 and
allows serial data to be sent and received from the device. The on-board
debugger presents this connection as a virtual COM port on the host computer
that shows up when the USB cable is inserted.
Data is transferred between the host computer and the debugger through the USB
connection, which emulates a serial port using the USB Communication Device
Class (CDC). From the debugger, the data is passed on to the target device
through a physical UART connection.
The serial format is 115200 bps, 8 bits, no parity, and 1 stop bit by default.
Note: Changing the baud rate for the COM port on the PC side does not
influence the UART baud rate between the debugger and the target device.
However, it is possible to change the VCOM baud rate through the kits’ Admin
Console available through Simplicity Studio.
Alternatively, the VCOM port can also be used through the Mini Simplicity
Connector with an external Wireless mainboard. Using the VCOM port through the
Mini Simplicity Connector with an external Wireless mainboard works in a
similar way, but it requires that the USB cable to the on-board debugger is
unplugged. The board controller on the Wireless mainboard then makes the data
available over USB (CDC) or an IP socket. Flow control is not available over
the Mini Simplicity Connector.
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UG581: SiWx917 Wi-Fi 6 and Bluetooth LE Dev Kit User’s Guide
Schematics, Assembly Drawings, and BOM
5. Schematics, Assembly Drawings, and BOM
Schematics, assembly drawings, and Bill of Materials (BOM) are available
through Simplicity Studio when the kit documentation package has been
installed. They are also available from the kit page on the Silicon Labs
website: silabs.com.
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Rev. 1.0 | 22
6. Kit Revision History and Errata
UG581: SiWx917 Wi-Fi 6 and Bluetooth LE Dev Kit User’s Guide
Kit Revision History and Errata
6.1 Revision History
The kit revision can be found printed on the box label of the kit, as outlined
in the figure below. The kit revision history is summarized in Table 6.1 Kit
Revision History on page 23. The revision history given in this section may
not list every kit revision. Revisions with minor changes may be omitted.
SiWx917 Wi-Fi 6 and Bluetooth LE Dev Kit
SiWx917-DK2605A
09-09-24
1632000960 A00
Figure 6.1. Revision Info Table 6.1. Kit Revision History
Kit Revision A00
Released 9 September 2024
Description Initial kit revision with BRD2605A Rev. A02.
6.2 Errata There are no known errata at present.
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7. Board Revision History and Errata
UG581: SiWx917 Wi-Fi 6 and Bluetooth LE Dev Kit User’s Guide
Board Revision History and Errata
7.1 Revision History
The board revision can be found laser printed on the board, and the board
revision history is summarized in Table 7.1 Board Revision History on page 24.
The revision history given in this section may not list every board revision.
Revisions with minor changes may be omitted.
Table 7.1. Board Revision History
Revision A00
Released 4 June 2024
Description Initial release.
7.2 Errata There are no known errata at present.
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Rev. 1.0 | 24
8. Document Revision History
Revision 1.0 September, 2024 · Initial document release.
UG581: SiWx917 Wi-Fi 6 and Bluetooth LE Dev Kit User’s Guide
Document Revision History
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Rev. 1.0 | 25
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www.silabs.com/simplicity
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www.silabs.com/community
Disclaimer Silicon Labs intends to provide customers with the latest,
accurate, and in-depth documentation of all peripherals and modules available
for system and software implementers using or intending to use the Silicon
Labs products. Characterization data, available modules and peripherals,
memory sizes and memory addresses refer to each specific device, and “Typical”
parameters provided can and do vary in different applications. Application
examples described herein are for illustrative purposes only. Silicon Labs
reserves the right to make changes without further notice to the product
information, specifications, and descriptions herein, and does not give
warranties as to the accuracy or completeness of the included information.
Without prior notification, Silicon Labs may update product firmware during
the manufacturing process for security or reliability reasons. Such changes
will not alter the specifications or the performance of the product. Silicon
Labs shall have no liability for the consequences of use of the information
supplied in this document. This document does not imply or expressly grant any
license to design or fabricate any integrated circuits. The products are not
designed or authorized to be used within any FDA Class III devices,
applications for which FDA premarket approval is required or Life Support
Systems without the specific written consent of Silicon Labs. A “Life Support
System” is any product or system intended to support or sustain life and/or
health, which, if it fails, can be reasonably expected to result in
significant personal injury or death. Silicon Labs products are not designed
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limited to) nuclear, biological or chemical weapons, or missiles capable of
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warranties and shall not be responsible or liable for any injuries or damages
related to use of a Silicon Labs product in such unauthorized applications.
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herein are trademarks of their respective holders.
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www.silabs.com
References
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