Shanghai Chipfresh Internet Of Things Technology X-C13SG Wi-Fi (802.11b/g/n) and BLE5.0 Wireless Standards User Manual
- June 6, 2024
- Shanghai Chipfresh Internet Of Things Technology
Table of Contents
Shanghai Chipfresh Internet Of Things Technology X-C13SG Wi-Fi
(802.11b/g/n) and BLE5.0 Wireless Standards User Manual
Module Overview
Features
MCU
- TG7100C embedded,32-bit RISC-V single-core processor
- 160MHz CPU
- 276 KB RAM
- 28 KB ROM
- 1 Kb eFuse
Wi-Fi
- IEEE 802.11 b/g/n-compliant
- Operation Frequency： 2412-2462MHz (802.11b/g/n ht20)
- Supports 20MHz bandwidth in 2.4 GHz band
- Transmit Power (Max 22dBm)
- Modulation method (DSSS OFDM)
- Security Mechanisms (WEP/WPA-PSK/WPA2- PSK/WPA3-SAE)
- Encryption (WEP64/WEP128/TKIP/AES)
- Support Wi-Fi STA/AP Mode
- Support UART Data Communication with Wi-Fi or BLE
- Support AP Link and BLELINK Config
- Support Wireless and Remote Firmware Upgrade Function
- Support Software SDK for Develop
- Support PCB
- Support PCB /IPEX Antenna Option
BLE
- Operation Frequency: 2402-2480MHz
- Transmit Power (10.30 dBm(BLE)
- Receiver Sensitivity (-97 dBm)
- Advertising extensions
Hardware
-
Peripherals: GPIO、SPI、UART、ADC、 DAC、IR、LED、PWM
-
Support XTAL 24/32/38.4/40MHz • 2MB SPI flash
-
Operating voltage/Power supply：2.7~ 3.6 V
-
Operating ambient temperature:
Operating Temp: -40 ~ 85°C
Storage Temp: -40 ~ 105°C
Humidity/MSL: <85% / Level 3 -
Operating Current: Peak (1ms for every 100ms):<350mA
Average (STA,No data): 45mA
Average (STA, Continuous TX): 60mA
Average (AP): 70mA
Standby: 310uA(Reset Pin set to low)
Description
X-C13SG is a fully self-contained small form-factor, single stream, 802.11b/g/n Wi-Fi and BLE baseband/MAC designs, which provide a wireless interface to any equipment with a serial or other interface for data transfer.
X-C13SG integrate MAC, base band processor, RF transceiver in hardware and all Wi-Fi protocol and configuration functionality and networking stack, embedded firmware to make a fully self-contained solution for a variety of applications.
Applications
- Light control
- Smart plug
- Industrial control
- Industrial sensors and controls
- Health Care
- Consumer Electronics
- Smart Agriculture
- Retail and Catering
Hardware Introduction
Pin Layout
- X-C13SG comes with a on-board PCB antenna
X-C13SG Pin Layout (Top View). Fig.2.
Pin Description
The module has 23 pins. See pin definitions in Table 1.
Pin
| Description| Type|
Function
---|---|---|---
1,8,14,16,23| Ground| P| GND
2| GPIO8| IPD| Internal 10K pull-down resistor,
Boot select:
Low: boot from module flash.
High: boot from external UART.
This is used for factory firmware program, leave it unconnected for user
application
3| RESET| I,PU| “Low” effective reset input.
4| UART1_RX GPIO11| I| 3.3V TTL UART1 Debug Input SPI, PWM
5| GPIO14| IPU/O| SPI, DAC, ADC
6| UART0_RX GPIO7| I| 3.3V TTL UART0 Communication Input
7| UART0_TX GPIO16| O,PU| 3.3V TTL UART0 Communication Output
9| GPIO12| I/O| SPI, PWM. ADC
10| GPIO1| IPU/O| SPI,PWM
11| GPIO3 Factory| IPU| press this button ( “Low” > 4s ) and loose to make the
module recover to factory setting.
12| GPIO4 Ready| O| “0” – Boot-up OK;
“1” – Boot-up Fail;
13| GPIO5
Link| IPU/O| “0” – Wi-Fi connect to router
“1” – Wi-Fi unconncted;
15| +3.3V| P| The maximum output current of the external power supply is
recommended to be above 500mA.
17| GPIO22| IPU/O| SPI,PWM
18| GPIO0| IPU/O| SPI,PWM
19| GPIO2| I/O| SPI,PWM
20| GPIO21| IPU/O| SPI,PWM
21| GPIO20| IPU/O| SPI,PWM
22| UART1_TX GPIO17| O| 3.3V TTL UART1 Debug Output
Physical Dimensions
- X-C13SG Physical Dimensions (Unit: mm)
Fig.3. X-C13SG Physical Dimensions
PCB Antenna
X-C13SG support internal PCB antenna option. When customer select internal antenna, you shall comply with following antenna design rules and module location suggestions:
- For customer PCB, module antenna area can’t put componet or paste GND net;(See the following red arrow area)
- Antenna must away from metal or high components at least 20mm;
- Antenna can’t be shieldedby any meal enclosure; All cover, include plastic, shall away from antenna at least 20mm;
suggest module better locate in following region at customer board, which to
reduce the effect to antenna and wireless signal, and better consult ChipFresh
technical people when you structure your module placement and PCB layout.
Ordering Information
Fig.5. Ordering Information
Electrical Characteristics
- Absolute Maximum Ratings
Parameter| Symbol| Min| Max| Unit
---|---|---|---|---
Power supply voltage| VDD| -0.3| 3.6| V
I/O PIN| –| -0.3| VDD+0.3| V
Storage temperature| –| -40| 125| ℃
Table 2. Absolute Maximum Ratings
- Recommended Operating Conditions
Parameter| Symbol| Min| Type| Max| Unit
---|---|---|---|---|---
Power supply voltage| VDD| 2.1| 3.3| 3.6| V
Operating ambient temperature| –| -40| –| 85| ℃ - ESD
Name| Description| Typ| Unit
---|---|---|---
ESD-HBM| Human body model class 2| +/- 2000| V
ESD-MM| Moisture sensitivity level| 2| –
ESD-CDM| Charge device model| +/-500| V
Table4. ESD
- WiFi/BLE RF Standards
Class| Item| Parameters| Typ
---|---|---|---
Wi-Fi| Wireless standard| 802.11 b/g/n| –
Frequency range| 2412MHz-2462MHz| –
Maximum Peak Output Power (Conducted):| 802.11b/g/n| 21.51 dBm
BLE| Wireless standard| Bluetooth 5| –
Frequency range| 2402MHz-2480MHz| –
Maximum Peak Output Power (Conducted):| –| 10.30 dBm
Product Handling
Reflow Profile
Solder the module in a single reflow.
- Ramp-up zone: Temp.: 25 ~ 150 ℃ Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 ℃/s
- Preheating zone: Temp.: 150 ~ 200 ℃ Time: 60 ~ 120 s
- Reflow zone: Temp: >217 ℃ 7LPH: 60 ~ 90 s; Peak Temp.: 235 ~ 250 ℃ Time: 30 ~ 70 s
- Cooling zone: Peak Temp. ~ 180 ℃ Ramp-down rate: –1 ~ –5 ℃/s
- Solder: Sn-Ag-Cu (SAC305) lead-free solder alloy
Storage Conditions
- Shelf life in sealed bag: 12 months, at <30℃ and <60% relative humidity (RH).
- Recommend to store at ≦10% RH with vacuum packing.
- The module is rated at the moisture sensitivity level (MSL) of 3.
Device Handling Instruction (Module IC SMT Preparation)
- Baked required with 24 hours at 125+-5℃ before rework process.
- After bag is opened, devices that will be re-baked required after last baked with window time 168 hours.
- Recommend to oven bake with N2 supplied
- Recommend end to reflow oven with N2 supplied
- If SMT process needs twice reflow:
- Top side SMT and reflow
- Bottom side SMT and reflow
Case 1: Wifi module mounted on top side. Need to bake when bottom side process over 168 hours window time, no need to bake within 168 hours
Case 2: Wifi module mounted on bottom side, follow normal bake rule before process
Note: Window time means from last bake end to next reflow start that has 168 hours space.
Contact Information
Address: Room 1315, #2 Building, No.268 Zhouzhu Road, Pudong District,
Shanghai,China
Web: www.chipfresh.com
Sales Contact: sales@chipfresh.com
FCC Statement
Any Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
- This device may not cause harmful interference ,and
- this device must accept any interference received, including interference that may cause undesired operation.
OEM Guidance
-
Applicable FCC rules:
This module is granted by Single Modular Approval. It complies to the requirements of FCC part 15C, section 15.247 rules. -
The specific operational use conditions:
This module can be used in IoT devices. The input voltage to the module is nominally 2.7 ~ 3.6 V DC. The operational ambient temperature of the module is -40 to 85 degree C. Only the embedded PCB antenna is allowed. Any other external antenna is prohibited. -
Limited module procedures:
N/A -
Trace antenna design:
N/A -
RF exposure considerations:
The equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment can operated with minimum distance 20cm between the radiator and your body. -
Antenna:
Antenna type :PCB Antenna; Antenna Max. Peak Gain 2 dBi -
Label and compliance information
An exterior label on OEM’s end product can use wording such as the following: “Contains FCC ID:2A3M5-X-C13SG ” -
Information on test modes and additional testing requirements
- The modular transmitter has been fully tested by the module grantee on the required number of channels, modulation types, and modes, it should not be necessary for the host installer to re-test all the available transmitter modes or settings. It is recommended that the host product manufacturer, installing the modular transmitter, perform some investigative measurements to confirm that the resulting composite system does not exceed the spurious emissions limits or band edge limits (e.g., where a different antenna may be causing additional emissions).
- The testing should check for emissions that may occur due to the intermixing of emissions with the other transmitters, digital circuitry, or due to physical properties of the host product (enclosure). This investigation is especially important when integrating multiple modular transmitters where the certification is based on testing each of them in a stand alone configuration. It is important to note that host product manufacturers should not assume that because the modular transmitter is certified that they do not have any responsibility for final product compliance.
- If the investigation indicates a compliance concern the host product manufacturer is obligated to mitigate the issue. Host products using a modular transmitter are subject to all the applicable individual technical rules as well as to the general conditions of operation in Sections 15.5, 15.15, and 15.29 to not cause interference. The operator of the host product will be obligated to stop operating the device until the interference have been corrected.
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