Hangzhou Yaguan Technology YGC-C302 Module User Manual

June 6, 2024
Hangzhou Yaguan Technology

User’s manual

General Description

YGC-C302 is a wireless module based on WiFi BLE single-chip SoC which can satisfy the low power consumption and the high-performance IoT application development. The module core processor BL602 integrates 2.4 G Wi-Fi (802.11b/g/n) and BLE 5.0 baseband and MAC design. The on-chip processor uses RISC-V 32-bit with floating-point. With a high-speed processing memory system (see the L1C chapter for details), to achieve high-quality computing efficiency. External to the processor is a multilayer 32-bit AHB architecture with low power consumption, low latency, and high flexibility. The memory section contains high-speed tightly coupled memory, as well as cache and system, shared memory. Off-chip memory supports Flash expansion.
YGC-C302 have a wealth of peripherals, such as PWM、I2C、UART、IR remote、ADC、DAC、PIR、SPI、SDIO and GPIO.

 Features

  • 16.0±0.3mm (W)×24±0.3mm (L)×3.0±0.3mm (H)

  • Working voltage:3.3±0.3V

  • Working temperature:-30℃ to 105℃

  • ARM cortex-m4 processing core, 100MHz main frequency

  • Built-in board-mounted antenna, antenna gain 2dBi

  • 2MB Flash

  • UART download

  • 50 MHz clock frequency SDIO

  • 5 channel PWM signal generation supported

  • WIFI

  • Compliance with b/g/n 1×1 802.11 standards

  • Channel 1-13@2.4 GHz

  • WPA/WPA2 security model supported

  • STA/Soft AP work model supported

  • Output power up to 15 dBm in 802.11 b mode ,54 dBm,HT20MCS7 output power 14 dBm 13

  • BLE:

  • Bluetooth 5.0 supported

  • Maximum output power 0 dBm~15 dBm, typical 6 dBm

  • Maximum sensitivity -92 dBm

  • Application area

  • Smart Buildings

  • Smart Home / Home Appliances / Smart Socket / Smart Lamp
    - PWM 1/2/3/4/5 dimming bulb
    - PWM 1/2/3/4/5 trimming bulb
    - PWM 1/2/3/4/5 dimming ceiling

  • Industrial wireless control

  • Babies/network monitoring

  • Smart bus

Block diagram of main core as shown in Figure 1

Electrical Parameters

Absolute electrical parameters
Parameter Description Minimum Maximum Unit
Ts Storage temperature -45 135
VCC supply voltage 3.0 3.6 V
ESD_HBM Electrostatic release voltage human model) 2000 V
ESD_MM Electrostatic release voltage (Machine Model) 200 V
Normal working conditions
Parameter Description Min Typical Max Unit
Ta Working temperature -30 105
VCC Supply voltage 3.0 3.3 3.6 V
VIL IO low-level input -0.3 VCC*0.25 V
VIA IO high-level input VCC*0.75 VCC V
VOL IO low-level output VCC*0.1 V
VEOH IO high-level Output VCC-0.3 VCC V
Ima IO input/output drive capability 12 mA
Power consumption during continuous transmission and reception

Working condition| Mode| Rate| Transmission power/receive| Representative value| Peak value| Unit
---|---|---|---|---|---|---
transmit| 11b| 11Mbps| 15dBm| 300| 350| mA
transmit| 11g| 54Mbps| 14dBm| 270| 350| mA
transmit| 11n| MCS7| 13dBm| 265| 350| mA
receive| 11b| 11Mbps| Continuous reception| 99| | mA
receive| 11g| 54Mbps| Continuous reception| 99| | mA
receive| 11n| MCS7| Continuous reception| 99| | mA

RF Parameters

 WIFI
Working frequency 2.400~2.4835GHz
Channel WiFi:

USA/Canada: channel 1~11 Europe/China/Australia: channel 1~13 Japan: channel 1~14
Rate of data signaling| WiFi:
802.11b: 11,5.5,2,1 Mbps
802.11g: 54,48,36,24,18,12,9,6 Mbps
802.11n: HT20 MCS0~7;
Average output power| WiFi:
802.11b 11Mbps: 15±2dBm
802.11g 54Mbps: 14±2dBm
802.11n MCS7: 13±2dBm
EVM| 802.11b EVM≦35%
802.11g EVM≦-25dB
802.11n EVM≦-28dB
RX sensitivity| WiFi: 802.11b@8% PER 1Mbps -98dBm 11Mbps -91dBm 802.11g@10% PER 6Mbps -93dBm 54Mbps -77dBm 802.11n_HT20@10% PER MCS 0 -93dBm MCS 7 -73dBm

BLE
Working frequency 2.402~2.480GHz
Transmitting power Maximum output power 0 dBm~15 dBm, typical 6 dBm
RX sensitivity -92dBm

 Pin Definition

Pin Definition Sigal Type Description
1 RSS I/PU Low effective hardware reset input pin, internal reset circuit,

external no

need to add pull resistance, corresponding to IC CHIP_EN

2| ADC| I/O| SPI, I2C,UART,PWM,AUXADC,GPIO,corresponding to IC GPIO_11
3| NC| /| /
4| GPIO20| I/O| FLASH, SPI, I2C, UART, PWM,GPIO,corresponding to IC GPIO_20
5| PWM2| I/O| SPI, I2C,UART,PWM,AUXADC,GPIO,corresponding to IC GPIO_12
6| PWM4| I/O| SPI, I2C,UART,PWM,AUXADC,GPIO,corresponding to IC GPIO_14
7| PWM1| I/O| SDIO,FLASH,SPI,I2C,UART,PWM,GPIO,corresponding to IC GPIO_1
8| VCC| Power| External supply 3.3V
9| GND| Power| GND
10| GPIO2| I/O| SDIO,FLASH,SPI,I2C, UART, PWM, GPIO,corresponding to IC GPIO_2
11| GPIO4| I/O| SDIO, SPI, I2C, UART, PWM, GPIO, corresponding to IC GPIO_4
12| GPIO5| I/O| SDIO, SPI, I2C, UART, PWM, GPIO, corresponding to IC GPIO_5
13| PWM0| I/O| SDIO, FLASH, SPI, I2C,UART,PWM,GPIO,corresponding to IC GPIO_0
14| PWM3| I/O| SDIO, SPI, I2C, UART, PWM, GPIO, corresponding to IC GPIO_3
15| RX| I| SPI, I2C, UART, PWM, AUXADC, GPIO, corresponding to IC GPIO_7
16| TX| O/PU| SPI, I2C, UART, PWM, GPIO,corresponding to IC GPIO_16
17| GPIO8| I/O| Start selection, default drop-down level, keep suspended, do not recommend user use. Corresponding to IC GPIO_8
Drop: Start the program from Flash
Pull high: Start the program from the serial port

: I — input; O — output; PU — internal weak resistance pull up ; PD — Internal Weak Resistance Drop-down; P — power

 Size Package

The module has 17 pins on both sides of the module, the pin spacing is 2.0±0.1 mm.
Size dimension:16.0±0.3mm (W)×24.0±0.3mm (L)×3.0±0.3mm (H)。

Recommended Reflow Profile

Recommended furnace temperature curve.

Referred to IPC/JEDEC standard. Peak Temperature:<250℃.Number of Times: ≤2 times

 Storage conditions of factory modules

A. moisture-proof bags must be stored in an environment with temperature <30℃ and humidity <85%RH.
B. The shelf life of dry-packed products should be 6 months from the date of sealing.
Notes:
A. in the whole process of production, all station operators must wear electrostatic rings.
B. Strictly prevent the module from being contaminated with water or dirt during operation.

FCC Statement

Warning: Changes or modifications to this unit not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception,  which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the equipment and receiver.
  • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help

The device must not be co-located or operating in conjunction with any other antenna or transmitter.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions :
(1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

The minimum separation generally be used is at least 20 cm.
modular Transmitter Assembled Products
The DUT is produced with a standard PVC enclosure that does not affect wireless transmission and reception characteristics.

KDB996369 D03

2.2 List of applicable FCC rules
List the FCC rules that are applicable to the modular transmitter. These are the rules that specifically establish the bands of operation, the power, spurious emissions, and operating fundamental frequencies.
DO NOT list compliance to unintentional-radiator rules (Part 15 Subpart B) since that is not a condition of a module grant that is extended to a host manufacturer. See also  Section 2.10 below concerning the need to notify host manufacturers that further testing is required.
Explanation: This module meets all the requirements of FCC part 15 -247

2.3 Summarize the specific operational use conditions
Describe use conditions that are applicable to the modular transmitter, including for example any limits on antennas, etc. For example, if point-to- point antennas are used that require reduction in power or compensation for cable loss, then this information must be in the instructions. If the use condition limitations extend to professional users, then instructions must state that this information also extends to the host manufacturer’s instruction manual. In addition, certain information may also be needed, such as peak gain per frequency band and minimum gain, specifically for master devices in 5 GHz DFS bands.
Explanation: The EUT uses an unchangeable PCB antenna with a maximum gain of 2dbi. There is no restriction on the installation method.

2.4 Limited module procedures
If a modular transmitter is approved as a “limited module,” then the module manufacturer is responsible for approving the host environment that the limited module is used. The manufacturer of a limited module must describe, both in the filing and in the installation instructions, the alternative means that the limited module manufacturer uses to verify that the host meets the necessary requirements to satisfy the module limiting conditions.
A limited module manufacturer has the flexibility to define its alternative method to address the conditions that limit the initial approval, such as shielding, minimum signaling amplitude, buffered modulation/data inputs, or power supply regulation. The alternative method could include that the limited module manufacturer reviews detailed test data or host designs prior to giving the host manufacturer approval. This limited module procedure is also applicable for RF exposure evaluation when it is necessary to demonstrate compliance in a specific host. The module manufacturer must state how control of the product into which the modular transmitter will be installed will be maintained such that full compliance of the product is always ensured. For additional hosts other than the specific host originally granted with a limited module, a Class II permissive change is  required on the module grant to register the additional host as a specific host also approved with the module.
Explanation: not appliable

2.5 Trace antenna designs
For a modular transmitter with trace antenna designs, see the guidance in Question 11 of KDB Publication 996369 D02 FAQ – Modules for Micro-Strip Antennas and traces.  The integration information shall include for the TCB review the integration instructions for the following aspects: layout of trace design, parts list (BOM), antenna, connectors, and isolation requirements.
a) Information that includes permitted variances (e.g., trace boundary limits, thickness, length, width, shape(s), dielectric constant, and impedance as applicable for each type of  antenna);
b) Each design shall be considered a different type (e.g., antenna length in multiple(s) of frequency, the wavelength, and antenna shape (traces in phase) can affect antenna gain  and must be considered);
c) The parameters shall be provided in a manner permitting host manufacturers to design the printed circuit (PC) board layout;
d) Appropriate parts by manufacturer and specifications;
e) Test procedures for design verification; and
f) Production test procedures for ensuring compliance.
Explanation: not appliable. this module without trance antenna designs, use a fixed-length PCB antenna

2.6 RF exposure considerations
It is essential for module grantees to clearly and explicitly state the RF exposure conditions that permit a host product manufacturer to use the module. Two types of instructions are required for RF exposure information: (1) to the host product manufacturer, to define the application conditions (mobile, portable – xx cm from a person’s body); and (2) additional text needed for the host product manufacturer to provide to end-users in their end-product manuals. If RF exposure statements and use conditions are not provided, then the host product manufacturer is required to take responsibility for the module through a change in FCC ID (new application).
Explanation: This module complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This module is designed to comply with the FCC statement, fcc id is:2AYYQ-YGC-C302

2.7 Antennas
A list of antennas included in the application for certification must be provided in the instructions. For modular transmitters approved as limited modules, all applicable professional installer instructions must be included as part of the information to the host product manufacturer. The antenna list shall also identify the antenna types  (monopole, PIFA, dipole, etc. (note that for example an “omnidirectional antenna” is not considered to be a specific “antenna type”)).
For situations where the host product manufacturer is responsible for an external connector, for example with an RF pin and antenna trace design, the integration instructions shall inform the installer that a unique antenna connector must be used on Part 15 authorized transmitters used in the host product. The module manufacturers shall provide a  list of acceptable unique connectors.
Explanation: This module uses a PCB antenna. Antenna Gain:2dBi

2.8Label and compliance information
Grantees are responsible for the continued compliance of their modules to the FCC rules. This includes advising host product manufacturers that they need to provide a  physical or e-label stating “Contains FCC ID” with their finished product. See Guidelines for Labeling and User Information for RF Devices – KDB Publication 784748.
Explanation: On the metal shielding shell, there is space for printing basic information such as the name and model of the product, and the id :2AYYQ-YGC-C302 is included.

2.9 Information on test modes and additional testing requirements5
Additional guidance for testing host products is given in KDB Publication 996369 D04 Module Integration Guide.
Test modes should take into consideration different operational conditions for a stand-alone modular transmitter in a host, as well as for multiple simultaneously transmitting modules or other transmitters in a host product.
The grantee should provide information on how to configure test modes for host product evaluation for different operational conditions for a stand-alone modular transmitter in a host, versus with multiple, simultaneously transmitting modules or other transmitters in a host.
Grantees can increase the utility of their modular transmitters by providing special means, modes, or instructions that simulate or characterize a connection by enabling a  transmitter. This can greatly simplify a host manufacturer’s determination that a module as installed in a host complies with FCC requirements.
Explanation: Data transfer module demo board can control the EUT work in RF test mode at a specified test channel.

2.10 Additional testing, Part 15 Subpart B disclaimer
The grantee should include a statement that the modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.
Explanation: The module is without unintentional-radiator digital circuity, so the module does not require an evaluation by FCC part15 subpart B. The host should be evaluated by the FCC subpart B.

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