Multi-Tech MTXDOT-WW1 xDot Developer Kit Instruction Manual

Multi-Tech MTXDOT-WW1 xDot Developer Kit

Product Information

Specifications

• Models: MTXDOT-NA1 and MTXDOT-WW1
• Part Number: S000820, Version 2.0 2023-12-11
• Manufacturer: Multi-Tech Systems, Inc.
• Trademark: MultiTech, MultiConnect, Conduit, xDot
• Website: https://www.multitech.com
• Support Email: sales@multitech.com
• Support Phone: +1 763-785-3500

Product Usage Instructions

Overview

The xDot Developer Guide provides detailed information on the xDot device and developer kit. It includes mechanical drawings, specifications, safety and regulatory information, as well as other device-specific content.

Related Documentation

• xDot AT Command Guide: S000768 – Details on the AT commands available for xDots.
• MultiTech Developer Site: Information on using the Conduit with xDots at www.multitech.net.

Product Build Options

The xDot is available in different configurations based on region and features:

• MTXDOT-NA1-B10-TR-500: xDot Advanced, UFL/Tace antenna support. Tape and Reel, North America 500 pack.
• MTXDOT-WW1-B10-TR-500: xDot Advanced, UFL/Tace antenna support. Tape and Reel, Worldwide 500 pack.
• MTXDOT-NA1-B15-TR-500: xDot Essential, Tace antenna support. Tape and Reel, North America 500 pack.
• MTXDOT-WW1-B15-TR-500: xDot Essential, Tace antenna support. Tape and Reel, Worldwide 500 pack.

Developer Kit Information

The developer kit provides design considerations, schematics, installation, and operation information for working with the xDot device. For more details, refer to the current version of the manual at https://www.multitech.com/resources/manuals.

Frequently Asked Questions

• Q: Where can I find warranty information for the product?
  • A: You can find the warranty statement for your product at https://www.multitech.com/legal/warranty.
• Q: How can I access immediate support for MultiTech products?
  • A: For immediate access to support information and resolutions for MultiTech products, visit the Knowledge Base at https://www.multitech.com/kb.go.
    You can also create a support case directly on the Support Portal at https://support.multitech.com.

MTXDot® Developer Kit
Developer Guide

CONTENTS

xDot Developer Guide
Models: MTXDOT-NA1 and MTXDOT-WW1

Part Number: S000820, Version 2.0 2023-12-11

Copyright
This publication may not be reproduced, in whole or in part, without the specific and express prior written permission signed by an executive officer of Multi-Tech Systems, Inc. All rights reserved. Copyright © 2023 by Multi- Tech Systems, Inc.

Multi-Tech Systems, Inc. makes no representations or warranties, whether express, implied or by estoppels, with respect to the content, information, material and recommendations herein and specifically disclaims any implied warranties of merchantability, fitness for any particular purpose and noninfringement.

Multi-Tech Systems, Inc. reserves the right to revise this publication and to make changes from time to time in the content hereof without obligation of Multi-Tech Systems, Inc. to notify any person or organization of such revisions or changes.

Trademarks and Registered Trademarks
MultiTech, the MultiTech logo, MultiConnect, Conduit, and xDot are registered trademarks and mCard and mDot is a trademark of Multi-Tech Systems, Inc. All other products and technologies are the trademarks or registered trademarks of their respective holders.

Legal Notices
The MultiTech products are not designed, manufactured or intended for use, and should not be used, or sold or re-sold for use, in connection with applications requiring fail-safe performance or in applications where the failure of the products would reasonably be expected to result in personal injury or death, significant property damage, or serious physical or environmental damage. Examples of such use include life support machines or other life preserving medical devices or systems, air traffic control or aircraft navigation or communications systems, control equipment for nuclear facilities, or missile, nuclear, biological or chemical weapons or other military applications (“Restricted Applications”). Use of the products in such Restricted Applications is at the user’s sole risk and liability. MULTITECH DOES NOT WARRANT THAT THE TRANSMISSION OF DATA BY A PRODUCT OVER A CELLULAR COMMUNICATIONS NETWORK WILL BE UNINTERRUPTED, TIMELY, SECURE OR ERROR FREE, NOR DOES MULTITECH WARRANT ANY CONNECTION OR ACCESSIBILITY TO ANY CELLULAR COMMUNICATIONS NETWORK. MULTITECH WILL HAVE NO LIABILITY FOR ANY LOSSES, DAMAGES, OBLIGATIONS, PENALTIES, DEFICIENCIES, LIABILITIES, COSTS OR EXPENSES (INCLUDING WITHOUT LIMITATION REASONABLE ATTORNEYS FEES) RELATED TO TEMPORARY INABILITY TO ACCESS A CELLULAR COMMUNICATIONS NETWORK USING THE PRODUCTS.

The MultiTech products and the final application of the MultiTech products should be thoroughly tested to ensure the functionality of the MultiTech products as used in the final application. The designer, manufacturer and reseller has the sole responsibility of ensuring that any end user product into which the MultiTech product is integrated operates as intended and meets its requirements or the requirements of its direct or indirect customers. MultiTech has no responsibility whatsoever for the integration, configuration, testing, validation, verification, installation, upgrade, support or maintenance of such end user product, or for any liabilities, damages, costs or expenses associated therewith, except to the extent agreed upon in a signed written document. To the extent MultiTech provides any comments or suggested changes related to the application of its products, such comments or suggested changes is performed only as a courtesy and without any representation or warranty whatsoever.

CSoanletsacting MultiTech
sales@multitech.com +1 763-785-3500

Support support@multitech.com +1 763-717-5863

Website
https://www.multitech.com
Knowledge Base
For immediate access to support information and resolutions for MultiTech products, visit https://www.multitech.com/kb.go.
Support Portal
To create an account and submit a support case directly to our technical support team, visit: https://support.multitech.com.
Warranty
To read the warranty statement for your product, visit https://www.multitech.com/legal/warranty.
World Headquarters
Multi-Tech Systems, Inc. 2205 Woodale Drive, Mounds View, MN 55112 USA

xDot® Developer Guide

PRODUCT OVERVIEW

Chapter 1 ­ Product Overview
Overview
The xDot (MTXDOT) is a programmable, low-power RF module that provides long- range, low bit rate M2M data connectivity to sensors, industrial and agricultural equipment, and remote appliances. The xDot is LoRaWAN® 1.0.4 capable communication up to 10 miles/15 km line-of-sight and 1-3 miles / 2 km into buildings using sub-GHz ISM bands in North America, Europe and worldwide. MTXDOT-NA1 is for USA and Canada only and covered by FCC 15.247 MTXDOT-WW1 is for the Rest of the world The xDot is a compact surface-mount device with enhanced security. Includes a comprehensive AT command instruction set. xDot Developer Kit includes three USB developer boards with either xDot Advanced modules attached or three USB developer boards with xDot Essential modules attached. *Actual distance depends on conditions, configuration, antennas, desired throughput, and usage frequency. In dense urban environments, a typical range is 1-2 miles.
Documentation Overview
This document includes: xDot device information: Mechanical drawings, specifications, safety and regulatory information, and other device specific content Developer Kit information: Design considerations, schematics, and installation and operation information.
This current version of this manual is available at https://www.multitech.com/resources/manuals.
Related Documentation
xDot AT Command Guide: (S000768) Includes details on the AT commands available for xDots. MultiTech Developer Site: This site includes information on using the Conduit with xDots. Go to: www.multitech.net Documentation for related products, such as the Conduit gateways and LoRa accessory cards are available at https://www.multitech.com/resources/manuals

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PRODUCT OVERVIEW

Product Build Options

Product ordering part numbers Description

Region

MTXDOT-NA1-B10-TR-500

xDot Advanced, UFL/Tace antenna support. Tape and Reel, North America 500 pack.

MTXDOT-WW1-B10-TR-500

xDot Advanced, UFL/ Tace antenna support. Tape and Reel, Worldwide 500 pack.

MTXDOT-NA1-B15-TR-500 MTXDOT-WW1-B15-TR-500 Developer Kits

xDot Essential, Tace antenna support. Tape and Reel, 500 pack.
xDot Essential, Tace antenna support. Tape and Reel, 500 pack.

North America Worldwide

MTMDK-XDOT-NA1-B10

xDot Advanced, LoRa Developer Kit.

North America

MTMDK-XDOT-WW1-B10 MTMDK-XDOT-NA1-B14

xDot Advanced LoRa Developer Kit. xDot Essential LoRa Developer Kit

Worldwide North America

MTMDK-XDOT-WW-B14

xDot Essential LoRa Developer Kit.

Worldwide

Note:
Important: MTXDOT-WW1 xDot does not have a default frequency band. You must set the frequency band to use the device. MTXDOT-NA1 defaults to US915 band and cannot be changed.

Developer Kit Package Contents

Your xDot Developer Kit includes the following:

Developer Board Customer Notices

3 – xDot Developer Boards with xDot modules attached. 3 – Quick Start Guides

xDot® Developer Guide

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GETTING STARTED WITH THE XDOT DEVELOPER KIT

Chapter 2 ­ Getting Started with the xDot Developer Kit
The xDot Developer kit consists of an xDot module pre-attached to the USB developer board. It ships with preinstalled firmware that supports AT Commands. For AT Commands, refer to the separate xDot AT Command Reference Guide. Two serial interfaces are available through the USB interface, one is used to send AT commands to the xDot and the other is for debug messages. Refer to MTXDOT Specifications for pin information. To send AT commands to the xDot:
1. Plug the developer board into a USB port. 2. Open communications software, such as TeraTerm, Putty, or Minicom. 3. Set the following:
Baud rate = 115,200 Data bits = 8 Parity = N Stop bits = 1 Flow control = Off For steps on deploying xDots with a Conduit gateway or access point, refer to the Appendix.
COM Port Enumeration by Operating System
xDots create an AT Commands port and a debug port.
Linux
The following COM ports are created on Linux systems: /dev/ttyACMx /dev/ttyACMy
Where x and y may be 0 and 1, 3 and 4, etc. The COM port with lower number is the AT command port and COM port with the higher number is the debug port.
Windows
On Windows systems, COM ports appear in the Device Manager: Debug Port: USB Serial Device AT Command Port: XR21V1410 USB UART
You may need to install a driver for the debug port to function properly. Go to: https://developer.Mbed.org/handbook/Windows-serial-configuration

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GETTING STARTED WITH THE XDOT DEVELOPER KIT
Mac
On Mac systems, COM ports appear in the Device Manager as: /dev/cu.usbmodemx
Where x is a string of numbers and possibly letters, ending in a number. The COM port with lower number is the AT command port and COM port with the higher number is the debug port.
Common Functions
This topic includes commands commonly used when getting started with the xDot. Consult the xDot AT Command Reference Guide for more information on these and other AT Commands.
Factory Default
To look at factory default settings:
AT&F
Setting Frequency Sub Band
With US915 and AU915 you usually need to set a Frequency Sub Band. Set this to match your LoRa network server’s Frequency Sub Band
AT+FSB=1
Setting Up the xDot on a Network
1. Set the Network ID (AppEUI/Join EUI) using AT+NI. AT+NI=, Example setting: AT+NI=0,0011223344556677
2. Set the Network Key (AppKey) AT+NK=, Example setting: AT+NK=0,00112233445566778899AABBCCDDEEFF
3. Save settings. AT&W
4. Send a Join request to the server. AT+JOIN
Sending Text or Bytes
Once the xDot has successfully joined, you can send text or bytes. To send text:
AT+SEND=HelloWorld To send bytes:

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AT+SENDB=01F4E25671

GETTING STARTED WITH THE XDOT DEVELOPER KIT

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UPDATING FIRMWARE

Chapter 3 ­ Updating Firmware

Use one of the following methods to update xDot firmware:
1. Drag and drop firmware onto the xDot on the developer board. 2. Ymodem over serial port using the xDot bootloader either on the developer board or in system. 3. In system/circuit programming (versus programming devices in production). 4. xDot Advanced onlyUpdating Firmware with FOTA (FUOTA)on the xDot either on the developer
board or in system.
.
Firmware Files
Firmware files for the xDot are available at: https://www.multitech.net/developer/downloads#xdot

Differential and Compressed Upgrade Files
Differenital and compressed upgrade files can be used to reduce the size of firmware upgrades sent over-the-air (FOTA). Smaller files reduce the time required to deliver an update. Smaller FOTA sessions increase end-device battery life.
Creating Differential and Compressed Files
To package application firmware binaries for Dot devices with compression or deltas, use the mtsmultitool utility. The output is a binary file that can be sent to the bootloader over serial YMODEM or FOTA.
For more details on the utility, see: https://pypi.org/project/mtsmultitool/ .
The utility requries Python v3.8 installed. To install the utility, open a command prompt and enter: pip install mtsmultitool

Updating Firmware via Drag and Drop
To use the drag and drop method of updating firmware:
1. Plug the Developer Kit into a computer. 2. Wait for enumeration to complete. 3. Drag and drop the firmware file onto the device.
When the progress bar reaches 100%, the window closes and reopens in the update is complete.

Updating Firmware Using the xDot Bootloader

To update firmware via ymodem in the xDot bootloader:

m t s .

1. Enter the bootloader: On the debug serial port, type any key on power up.
On the AT command port, on power up type the letters

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UPDATING FIRMWARE

2. upgrade .

At the bootloader command prompt, type Send firmware file with CRC appended via ymodem.

Updating Firmware with FOTA (FUOTA)

xDot Advanced only
Firmware Over the Air (FOTA) also known as Firmware Update Over the Air (FUOTA) is a way to upgrade xDot end devices using multicast and file fragmentation packages defined in the LoRaWAN specification. FOTA allows the Conduit to update the firmware on many xDots at once using multicast and error correction packets.
xDot Advanced includes flash memory for FOTA . Flash memory stores images for firmware updates. EEPROM stores device configuration and session information. Using EEPROM insures the Device EUI isn’t lost if the internal flash is erased.
File space is statically allocated. There is no traditional file system. The xDot reserves space for new application firmware, a backup of the current application, and an upgrade result file. A total of 436 KB (0x6A000 bytes) of free space is required.
Note: FOTA is enabled by default.
To start the FOTA process, the Conduit sends two setup downlinks to the xDot. First, the Conduit then sends a multicast session setup request to the xDot. The xDot responds with a multicast session setup answer. The Conduit sends a fragmentation setup request. The xDot responds by sending back a fragmentation setup answer. Once setup is complete, the xDot waits until the start of the multicast session. At the start of the session, the xDot switches to class C with the specified data rate and frequency to receive the file fragments sent by the Conduit. After the file fragments are sent, the Conduit starts sending parity fragments. At any point when the xDot is able to reconstruct the firmware file, the Cyclical Redundancy Check (CRC) is calculated and the CRC message ID sent in Class A. This could happen any time after the last fragment is sent to after the last parity is sent.
For details on the FOTA AT Commands, go to xDot AT Command Reference Guide (S000768).
FOTA Stages
A FOTA session has four stages: 1) session setup, 2) fragmentation, 3) parity, and 4) verification.
Session Setup
For a multicast session to work with class A devices, a start time must be agreed upon by the network server and each device. This requires the devices to synchronize their time with the server. These critical tasks are done during session setup.
Class A devices must periodically send uplinks to open downlink windows making the time required to complete an operation setup directly tied to the frequency of device uplinks. For each device involved in the operation, some extra time should be added to the total setup time to account for latency in queuing each device’s message.
Setup messages are sent up to 3 times. Worst-case timing for operation setup would be ((3 device_uplink_period 2) + (overhead * number_of_devices)).
The included diagram illustrates the events that occur during a best-case setup with no messages missed and welltimed device uplinks. Each device follows these steps:
1. FOTA operation queues Multicast setup message with network server.

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13

2. Device sends an uplink. 3. Multicast setup message is downlinked to the device. 4. Device sends a multicast setup response. 5. FOTA operation queues fragmentation setup message. 6. Device sends an uplink. 7. Fragmentation setup is downlinked to the device. 8. Device sends a fragmentation setup response from device.

UPDATING FIRMWARE

Fragmentation

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UPDATING FIRMWARE

During this stage, the device should only send uplinks as necessary, too many can cause excessive fragment loss. Applications on the device should not perform heavy processing activities during FOTA. Doing so can cause fragments to overlap and excessive fragment loss. The number of fragments required to send a file depends on the Data Rate. The device clears the file system to ensure enough free space to save update firmware and a backup copy of the current firmware saved by the bootloader. User files are removed when the fragmentation session is set up.
Parity
Multicast messages are unconfirmed meaning some loss of fragments is expected. The device can recover a certain number of fragments though parity.
The xDot can tolerate up to 150 lost fragments.
Verification
Once a device completes its fragmented file, it calculates a CRC64 and sends a request to the server to verify the CRC. The server sends a response indicating if the CRC matches or not. If the CRC is verified the device reboots and performs the upgrade. If the CRC does not match, the downloaded file is discarded.
Potential Problems
If the xDot misses either setup message, the FOTA session will not be successful. The xDot attempts to receive both messages multiple times. If the xDot is unsuccessful, it resets the fragmentation sessions and multicast session. If the xDot does not receive a CRC response from the Conduit, it resets the fragmentation and multicast sessions and deletes the fragmentation file. The xDot can reset the multicast/fragmentation session at any time using AT+FOTA=2. When using AT+SLEEP, make sure to wake up the xDot before a scheduled FOTA session. Using AT+FOTA=3 will return the time in seconds before the FOTA session is scheduled to start. If AT+SLEEP is used during the FOTA session, the xDot will miss packets and the session will likely fail. The FOTA session sends down packets every 1.5 seconds (assuming no duty cycle) and parity packets every 3 seconds by default. For best results, Multitech recommends users suspend all normal xDot operations until the FOTA session is complete.
Troubleshooting FOTA
Problem: xDotdoes not receive any file fragments.
Troubleshooting: The xDot must receive two setup messages for the FOTA session to work, fragmentation setup request and multicast setup request. Verify if the xDot received the fragmentation setup request. This comes down on port 201. When the xDot receives this request, it sends an answer. Check the xDot debug log for Sending Fragmentation Response. After sending the fragmentation response, the xDot receives a multicast setup request. Check for this message on port 201. The xDot responds with a multicast setup answer. Check the xDot debug log for Sending Multicast Response. Make sure the xDot is in Class C at the start of the FOTA session (AT+DC). The xDot must also be awake and will not wake up to start the FOTA/Multicast session. The command AT+FOTA=3 displays the time before a FOTA session starts.

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UPDATING FIRMWARE
Make sure the Conduit is sending the fragments by checking the Conduit logs in /var/log/log_fota.
Problem: xDot cannot complete the FOTA session.
Troubleshooting: If the xDot misses too many packets, the FOTA session cannot be completed. If the xDotwas able to reconstruct the file using parity fragments, it sends a CRC check to the Conduit. Check the xDot debug log for Sending CRC. If the Dot does not receive a response or the Conduit responds with CRC not correct, the xDot discards the file.
Problem: xDot fails to process parity fragments.
Troubleshooting: If the Conduit sends parity fragments faster than the xDot can process them, the xDot starts failing to properly receive the fragments. This results in failed MIC checks or wrong address, which is noted in the xDot debug log. To correct this, increase the delay between parity fragments on the Conduit.
Problem: xDot is unexpected state.
Troubleshooting: If the xDot is in a bad or unknown state, use ATZ to reset the xDot and clear the multicast and FOTA states. AT+FOTA=2 also resets FOTA and Multicast states.
Troubleshooting FOTA on the Conduit
Problem: FOTA Session not starting.
Troubleshooting: Verify that there is not a current FOTA session. If there is no current FOTA session and a FOTA session will not start, reboot the Conduit. If the Conduit does not receive at least one response from an xDot, the FOTA session will not start. The process will go from SETUP (10%) to TEARDOWN (90%). Check the log (/var/log/log_fota) to make sure the Conduit is receiving the setup answers.
Problem: FOTA Session not successful.
Troubleshooting: For a FOTA Session to be successful, the xDothas to be able to reconstruct the file. If the xDot misses too many packets, the FOTA session will not be successful and the xDot will not send a CRC to the Conduit. If the Conduit receives a CRC from an xDot check the FOTA log (/var/log/log_fota*) to make sure the CRC matches the Conduit and the CRC correct answer is sent back to the xDot. Check the xDotdebug log to verify if the device received the CRC answer.

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UPDATING FIRMWARE
Problem: Stop FOTA Session / FOTA Session won’t start (FOTA in progress) / Stop Multicast Session
Troubleshooting: To end a FOTA session that is in progress, send ‘ps -A | grep fota’. Find the PID associated with lora-fota (not lora-fota-demo). Then send ‘kill (pid of lora-fota)’. Also send ‘rm -r -f ~/.fota/’. Devices may be in Class C or Class A depending on the FOTA session status before it ended. Make sure to change the devices back to their appropriate class. Make sure the FOTA daemon is running by ‘/etc/init.d/fotad restart’. To end a Multicast session that is in progress, use ‘ps -A | grep mcm’. Find the PID associated with loramcm. Then use ‘kill (pid of lora-mcm)’. Also send ‘rm -r -f ~/.fota/’. Wiping out the .fota directory removes any future FOTA/multicast sessions scheduled that have not setup.

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MECHANICAL DRAWINGS WITH PINOUTS

Chapter 4 ­ Mechanical Drawings with Pinouts
xDot

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MECHANICAL DRAWINGS WITH PINOUTS
Note: The xDot development board uses a land pattern that matches the xDot land pattern in the previous image. All pads are 0.028 inches square except the large one, which is 0.098 inches x 0.028 inches.

Note: The xDot development board uses a land pattern that matches the xDot land pattern in the previous image. All pads are 0.028 inches square except the large one, which is 0.098 inches x 0.028 inches.

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SPECIFICATIONS AND PIN INFORMATION

Chapter 5 ­ Specifications and Pin Information

MTXDOT Specifications

Category General Compatibility Interfaces
CPU Performance CPU CPU SRAM CPU Flash FOTA/FUOTA Max Clock Flash Memory EEPROM Physical Description Weight Dimensions RF Connectors -UFL -Trace Environment Operating Temperature Storage Temperature Humidity Power Requirements1

Description
LoRaWAN 1.1 specifications Note that pin functions are multiplexed. Up to 19 digital I/O I2C SPI Wake pin Reset pin Full UART Simple UART (RX & TX only) Programming interface
100 MHz 160 KB 384 KB
32 MHz 8 MB 16 KB
0.0001 oz. (0.003g) Refer to Mechanical Drawings for Dimensions.
U.FL Trace Connection
-40° C to +85° C -40° C to +85° C 20%-90% RH, non-condensing

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SPECIFICATIONS AND PIN INFORMATION

1Operating range is 2.4-3.57V. When operating voltage is below 3.3V, radio power is affected as shown in the following table:

SX1262 SX1262

+22 dBm +22 dBm

VBAT = 2.7 V -2dB VBAT = 2.4 V -3dB

868 MHz ISM Band Specifications and Approvals

Category

Description

Radio Frequency ISM Bands

Europe: 863-870 MHz United Kingdom: 863-870 MHz

Certifications and Compliance EMC

EU: EN55032 Class B EU: EN55035/CISPR35

Radio
Safety ROHS

EU: EN 300 220-1 V3.1.1 EU: EN 301 489-03 V2.1.1 EU: IEC 62368-1 2nd Edition EU: EN IEC 63000:2018

868 MHz Receive Sensitivity

Note: RFS_L125: RF sensitivity, Long-Range Mode, highest LNA gain, LNA boost, 125 kHz bandwidth using split Rx/Tx path.

Spreading Factor

Receive Sensitivity (dBm)

Link Budget (dB)1

5

-116

122

6

-118

124

7

-123

129

8

-126

132

9

-129

135

10

-132

138

11

-134.5

140.5

12

-137

143

1Greater link budget is possible with higher gain antenna.

915 MHz ISM Band Specifications and Approvals

Category Radio Frequency

Description

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SPECIFICATIONS AND PIN INFORMATION

Category ISM Bands Certifications and Compliance EMC Radio
Safety

Description North America: US902-928 MHz Other Asia-Pacific: AS920-923 MHz (“AS1”)
US: FCC Part 15 Class B CA: ICES-003 US: FCC 15.247:2022 / CA: RSS-247 2:2017 US: FCC 15.109:2023 US: FCC 15.107:2023 US: UL 60950-1 2nd Edition CA: cUL 60950-1 2nd Edition US: UL/cUL 62368-1 2nd Edition IEC 62368-1:2014

915 MHz Receive Sensitivity

Note: RFS_L500: RF sensitivity, Long-Range Mode, highest LNA gain, LNA boost, 500 kHz bandwidth using split Rx/Tx path.

Spreading Factor

Receive Sensitivity (dBm)

Link Budget (dB)1

5

-111

117

6

-112

118

7

-117

123

8

-120

126

9

-123

129

10

-126

132

11

-128.5

134.5

12

-131

137

1Greater link budget is possible with higher gain antenna.

Electrical and Timing Characteristics
For electrical and timing characteristics, refer to the MAX32670 datasheet https://www.analog.com/media/en/technical-documentation/data- sheets/MAX32670-MAX32671.pdf

Measuring the Power Draw
To measure the power draw on an xDot developer board: 1. Unplug the xDot developer board from the computer 2. Connect current meter across JP30 on the developer board.

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SPECIFICATIONS AND PIN INFORMATION
3. Plug the xDot developer board back into the computer. 4. Set wake pin to wake, AT+WP=6. 5. Set wake mode to interrupt, AT+WM=1. 6. Put the xDot to sleep, AT+SLEEP=0|1. 7. Put jumper across JP5.
Note: After this step, AT command and debug ports no longer work. 8. Measure current draw. 9. Press the S2 button on the developer board to wake the xDot

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SPECIFICATIONS AND PIN INFORMATION

Power Draw

Note:
Voltage 3.3 V

Inrush charge is the highest observed value from took five separate measurements. Power measurements are similar for all models.
Power measurements are the same for packet sizes of 11 bytes and 53 bytes. Multi-Tech Systems, Inc. recommends that you incorporate a 10% buffer into the power source when determining product load.

Standby Mode Standby Mode Stop Mode Stop Mode Idle Current Current Sleep Current Sleep Current (Sleep Current (Sleep Average = 0, WM=1 = 0, WM=0 =1), WM=0 =1), WM=1

Spreading Factor Setting

1.0 uA

3.0 uA

7.7 uA

5.6 uA

4.4 mA

DR1 SF9BW125

Peak Transmit Power Peak Transmit Power Peak Transmit Power Total Inrush Charge

at TXP = 2

at TXP = 11

at TXP = 21

measured in

MilliCoulombs (mC)

24.3 mA

53.2 mA

111 mA

.029 mC

Total Inrush Charge DURATION during Powerup (INRUSH Duration)
65 uS

Pin Information

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SPECIFICATIONS AND PIN INFORMATION

Pin Information

Note:

Using the mbed platform expands your pin functionality options. Pins are on a 0.07 inch grid, and are 0.028 inches square (except for upper left) The xDot is 0.045 x 0.045, board is 0.93 x 0.93

xDot Pin Number

xDot Pin Name

MAX32670 Pin Number

MAX32670 Pin Name MAX32670 Net Name

30

SWDIO

4

P0.0

SWDIO

29

SWDCLK

5

P0.1

SWDCLK

12

SPI_MISO

6

P0.2

SPI_MISO

11

SPI_MOSI

7

P0.3

SPI_MOSI

10

SPI_SCK

8

P0.4

SPI_SCK

9

SPI_NSS

9

P0.5

SPI_NSS

N/A

10

P0.6

EEPROM_SE_I2C_SCL

N/A

11

P0.7

EEPROM_SE_I2C_SDA

14

UART_RX

20

P0.8

UART_RX

13

UART_TX

21

P0.9

UART_TX

32

UART_CTS

22

P0.10

UART_CTS

31

UART_RTS

23

P0.11

UART_RTS

27

I2C_SCL

24

P0.12

I2C_SCL

28

I2C_SDA

25

P0.13

I2C_SDA

N/A

26

P0.14

LORA_MISO

N/A

27

P0.15

LORA_MOSI

N/A

28

P0.16

LORA_SCK

N/A

29

P0.17

LORA_NSS

N/A

30

P0.18

RF_SW_CTRL

34

WAKE

31

P0.19

WAKE

N/A

1

P0.20

LORA_RESET

N/A

2

P0.21

LORA_BUSY

N/A

3

P0.22

LORA_DIO1

N/A

12

P0.23

FLASH_CS

N/A

13

P0.24

MEM_PWR_EN

23

GPIO3

14

P0.25

GPIO3

24

GPIO2

15

P0.26

GPIO2

25

GPIO1

16

P0.27

GPIO1

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SPECIFICATIONS AND PIN INFORMATION

xDot Pin Number

xDot Pin Name

16

UART1_RX

15

UART1_TX)

26

GPIO0

33

NRESET

N/A

N/A

3,4 -VDD

VDD3_3

1, 5, 17,

GND

20,35, 36, 38,

39, 40, 41, 42,

43, 44, 45, 46,

48, 49, 50, 51,

52, 53, 54, 55,

56, 57, 58

N/A

N/A

N/A

N/A

37 – ANT1

ANT1

2, 6, 7, 8, 18, NC 19, 21, 22 Reserved

47 – RFU

NC

(ANT2)

MAX32670 Pin Number 17 18 19 35 40 32 37 36
38 39 33 34 N/A N/A
N/A

MAX32670 Pin Name MAX32670 Net Name

P0.28 P0.29 P0.30 RSTN VCORE VREG1 VDD VSS

MBED_RX MBED_TX GPIO0 NRESET NC NC VDD3_3 GND

32KOUT 32KIN HFXIN HFXOUT N/A N/A
N/A

32KOUT 32KIN HFXIN HFXOUT N/A N/A
N/A

Pull-Up/Down

PU/PD PU PU PU PU PU PU PD PD PD

xDot Pin 33 N/A N/A N/A N/A N/A 11 10 N/A

Pin Name RESET P0.17 P0.24 P0.6 P0.7 P0.23 P0.3 P0.4 P0.15

SW Name

Value

10K

NSS to LORA radio 100K

MEM_PWR_EN

10K

EEPROM_SE_I2C_SCL 10K

EEPROM_SE_I2C_SDA 10K

FLASH_CS

100K

SPI_MOSI

100K

SPI_SCK

100K

MOSI for LoRa Radio 100K

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PU/PD PD

xDot Pin N/A

LoRa
Pin P0.14 P0.15 P0.16 P0.17 P0.20 P0.21 P0.22

Sleep and Wake Pins
Pin P0.8 P0.30 P0.27 P0.26 P0.25 P0.19

Pin Name P0.16
Function LORA_MISO LORA_MOSI LORA_SCK LORA_NSS LORA_RESET LORA_BUSY LORA_DIO1
xDot Pin 14 26 25 24 23 34

SPECIFICATIONS AND PIN INFORMATION

SW Name SCK for LoRa Radio

Value 100K

Description UART1_RX GPIO0 GPIO1 GPIO2 GPIO3 Wake

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SPECIFICATIONS AND PIN INFORMATION
xDot Pinout Design Notes
Refer to the mechanical drawing for your model for pin locations. All I/O pins that go off board are directly connected to the processor Refer to Pin Information table for pull up and pull down information.
xDots allow you to program pins depending on your application: Serial: Available out of the box. See Serial Pinout Notes for details. mbed: Designed with the MAX32670GTL processor, this option provides the most flexibility. For more information about processor capabilities, see the processor datasheet.
Serial Pinout Notes
These pins are available for serial applications. If using AT firmware, serial pins are the AT command port. If writing an app, you need to configure the UART before using. Refer to the pinout image for pin locations.
xDot 13 P0.9 UART_TX xDot 14 P0.8 UART_RX xDot 15 P0.29 UART1_TX xDot 16 P0.28 UART1_RX xDot 31 P0.11 UART_RTS xDot 32 P0.10 UART_CTS
Serial Settings
When creating a serial connection with the device on the developer board, open communications software (such as TeraTerm, Putty, or Minicom ), and use the following settings:
Baud rate = 115,200 Data bits = 8 Parity = N Stop bits = 1 Flow control = Off
LoRa
Throughput Rates
Theoretical maximum speeds for LoRa mode with ACKs off are: Using spreading factor 7 at 125kHz, the throughput rate is 5470 bps (5.47 kbps). Using spreading factor 7 at 500kHz the receiving throughput rate is 21900 bps (21.9 kbps).
Note: Data rates in the LoRaWAN specification vary by geographic region.

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SPECIFICATIONS AND PIN INFORMATION
Range
Variables effecting the range include TX power, antenna gain, RX sensitivity, fade margin1, earth’s curvature. Use the following formula to calculate the maximum range:
1Fade margin is an allowance used to account for unknown variables. The higher the fade margin, the better the overall link quality will be. With a fade margin set to zero, the link budget is still valid, but only in LOS conditions, which is not practical for most designs. The amount of fade margin to include in a calculation depends on the environment in which you will deploy the system. A fade margin of 12 dBm is good, but a better number would be 20 to 30 dBm.

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Resetting the xDot
To reset the xDot
1. Drive the RESET signal low for at least T . NRESET 2. Select either:
Allow RESET to float. The internal pull-up resistor pulls it up. Drive the RESET line high.
The processor starts executing code after the RESET line is high.

SPECIFICATIONS AND PIN INFORMATION

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DEVELOPER KIT OVERVIEW

Chapter 6 ­ Developer Kit Overview

xDot Developer Kit

The xDot developer kit comes with an xDot already mounted on the developer board. Simply plug the developer kit into a USB port on your computer to test, program, and evaluate your application.

Developer Kit Package Contents
Your Developer Kit includes the following:

Developer Board Customer Notices

1 – xDot Developer Board with xDot Quick Start

Firmware Updates
Before starting your project development, make sure you have the latest firmware for the Developer Kit and xDot. Go to the xDot mbed page for firmware. https://developer.mbed.org/platforms/MTS-xDot-32670/
Programming Devices in Production
Consult In-System Programming of xDotfor programming options.

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xDot Developer Kit Mechanical Drawings

DEVELOPER KIT OVERVIEW

xDot® Developer Kit Developer Guide for AT Command Users

32

Note: The Reset and Wake buttons reset and wake the xDot processor.

DEVELOPER KIT OVERVIEW

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33

Micro Developer Board LEDs

LED LED1 SDA PWR

Description User-definable LED. Programming Status. Power, blue light when the board has power.

DEVELOPER KIT OVERVIEW

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ANTENNAS

Chapter 7 ­ Antennas
Antenna System
The LoRa antenna performance depends on the implementation and antenna design. The integration of the antenna system into the product is a critical part of the design process; therefore, it is essential to consider it early so the performance is not compromised. If changes are made to the device’s certified antenna system, then recertification will be required.
This radio transmitter has been tested with the Pulse Antenna listed. Antennas having a greater gain than the maximum gain indicated for the listed type, are strictly prohibited for use with this device.
A C2PC will be needed to use a trace Antenna.
U.FL and Trace Antenna Options
Note: The xDot on the Developer Kit uses an on board chip antenna by default. If using U.FL or trace antennas, note the following:
For a simple trace to RF antennas: Routing must follow standard RF design rules and practices for 50ohm impedance controlled transmission line.. Use the developer board schematics for a reference circuit for the trace antenna. For U.FL antennas: The antenna and cable combination in your design cannot exceed the performance of the SMA antenna as listed in the next topic. To use the U.FL connector on the xDot, do not connect anything to ANT1 (pin 37) or ANT2 (pin 47).

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ANTENNAS

LoRa Antenna

Manufacturer: Description: Model Number:

Pulse Larsen Antenna 868-928 MHz RP-SMA Antenna, 8″ W1063

MultiTech ordering information:

Ordering Part Number AN868-915A-1HRA AN868-915A-10HRA AN868-915A-50HRA

Quantity 1 10 50

LoRa Antenna Specifications

Category Frequency Range Impedance VSWR Gain Radiation Polarization

Description 868-928 MHz 50 Ohms < 2.0 1.0 dBi Omni Vertical

RSMA-to-U.FL Coaxial Cables

Coaxial Cable Specifications
Optional antenna cables can be ordered from MultiTech.

Cable Type Attenuation Connector Impedance Maximum Cable Length

Coaxial Cable <1.0db 50 ohm 16″ (40 cm)

OEM Integration
FCC & IC Information to Consumers
The user manual for the consumer must contain the statements required by the following FCC and IC regulations: 47 C.F.R. 15.19(a)(3), 15.21, 15.105 and RSS-Gen Issue 4 Sections 8.3 and 8.4.

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ANTENNAS
FCC Grant Notes
The OEM should follow all the grant notes listed below. Otherwise, further testing and device approvals may be necessary.
FCC Definitions
Portable: (§2.1093) — A portable device is defined as a transmitting device designed to be used so that the radiating structure(s) of the device is/are within 20 centimeters of the body of the user.
Mobile: (§2.1091) — A mobile device is defined as a transmitting device designed to be used in other than fixed locations and to generally be used in such a way that a separation distance of at least 20 centimeters is normally maintained between the transmitter’s radiating structure(s) and the body of the user or nearby persons. Actual content pending Grant: This device is a mobile device with respect to RF exposure compliance. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons, and must not be collocated or operate in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product guidelines. Installers and end-users must be provided with specific information required to satisfy RF exposure compliance for installations and final host devices. (See note under Grant Limitations.) Compliance of this device in all final host configurations is the responsibility of the Grantee.
Note: Host design configurations constituting a device for portable use (<20 cm from human body) require separate FCC/IC approval.
Host Labeling
The following statements are required to be on the host label:
This device contains FCC ID: AU792U23B16873 This device contains equipment certified under IC: 125A-0070 For labeling examples, see Cellular Approvals and Labeling Requirements.
Integration Notes
Once you’ve integrated the xDot into your device, spot check for excess emissions occurring due to the digital circuitry or physical properties of your final product. Refer to the Testing and Compliance chapter of the xDot AT Command Reference Guide for information on commands used for compliance testing. Text of first list item.

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SAFETY INFORMATION

Chapter 8 ­ Safety Information
Handling Precautions
To avoid damage due to the accumulation of static charge use proper precautions, such as an ESD strap, when handling any cellular device to avoid exposure to electronic discharge during handling and mounting the device.
Radio Frequency (RF) Safety
Due to the possibility of radio frequency (RF) interference, it is important that you follow any special regulations regarding the use of radio equipment. Follow the safety advice given below.
Operating your device close to other electronic equipment may cause interference if the equipment is inadequately protected. Observe any warning signs and manufacturers’ recommendations. Different industries and businesses restrict the use of cellular devices. Respect restrictions on the use of radio equipment in fuel depots, chemical plants, or where blasting operations are in process. Follow restrictions for any environment where you operate the device. Do not place the antenna outdoors. Switch OFF your wireless device when in an aircraft. Using portable electronic devices in an aircraft may endanger aircraft operation, disrupt the cellular network, and is illegal. Failing to observe this restriction may lead to suspension or denial of cellular services to the offender, legal action, or both. Switch OFF your wireless device when around gasoline or diesel-fuel pumps and before filling your vehicle with fuel. Switch OFF your wireless device in hospitals and any other place where medical equipment may be in use.
Sécurité relative aux appareils à radiofréquence (RF)
À cause du risque d’interférences de radiofréquence (RF), il est important de respecter toutes les réglementations spéciales relatives aux équipements radio. Suivez les conseils de sécurité ci-dessous.
Utiliser l’appareil à proximité d’autres équipements électroniques peut causer des interférences si les équipements ne sont pas bien protégés. Respectez tous les panneaux d’avertissement et les recommandations du fabricant. Certains secteurs industriels et certaines entreprises limitent l’utilisation des appareils cellulaires. Respectez ces restrictions relatives aux équipements radio dans les dépôts de carburant, dans les usines de produits chimiques, ou dans les zones où des dynamitages sont en cours. Suivez les restrictions relatives à chaque type d’environnement où vous utiliserez l’appareil. Ne placez pas l’antenne en extérieur. Éteignez votre appareil sans fil dans les avions. L’utilisation d’appareils électroniques portables en avion est illégale: elle peut fortement perturber le fonctionnement de l’appareil et désactiver le réseau cellulaires. S’il ne respecte pas cette consigne, le responsable peut voir son accès aux services cellulaires suspendu ou interdit, peut être poursuivi en justice, ou les deux. Éteignez votre appareil sans fil à proximité des pompes à essence ou de diesel avant de remplir le réservoir de votre véhicule de carburant. Éteignez votre appareil sans fil dans les hôpitaux ou dans toutes les zones où des appareils médicaux sont susceptibles d’être utilisés.

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SAFETY INFORMATION
Interference with Pacemakers and Other Medical Devices
Potential interference
Radio frequency energy (RF) from cellular devices can interact with some electronic devices. This is electromagnetic interference (EMI). The FDA helped develop a detailed test method to measure EMI of implanted cardiac pacemakers and defibrillators from cellular devices. This test method is part of the Association for the Advancement of Medical Instrumentation (AAMI) standard. This standard allows manufacturers to ensure that cardiac pacemakers and defibrillators are safe from cellular device EMI.
The FDA continues to monitor cellular devices for interactions with other medical devices. If harmful interference occurs, the FDA will assess the interference and work to resolve the problem.
Precautions for pacemaker wearers
If EMI occurs, it could affect a pacemaker in one of three ways:
Stop the pacemaker from delivering the stimulating pulses that regulate the heart’s rhythm. Cause the pacemaker to deliver the pulses irregularly. Cause the pacemaker to ignore the heart’s own rhythm and deliver pulses at a fixed rate. Based on current research, cellular devices do not pose a significant health problem for most pacemaker wearers. However, people with pacemakers may want to take simple precautions to be sure that their device doesn’t cause a problem.
Keep the device on the opposite side of the body from the pacemaker to add extra distance between the pacemaker and the device. Avoid placing a turned-on device next to the pacemaker (for example, don’t carry the device in a shirt or jacket pocket directly over the pacemaker).
Device Maintenance
Do not attempt to disassemble the device. There are no user serviceable parts inside.
When maintaining your device:
Do not misuse the device. Follow instructions on proper operation and only use as intended. Misuse could make the device inoperable, damage the device and/or other equipment, or harm users. Do not apply excessive pressure or place unnecessary weight on the device. This could result in damage to the device or harm to users. Do not use this device in explosive or hazardous environments unless the model is specifically approved for such use. The device may cause sparks. Sparks in explosive areas could cause explosion or fire and may result in property damage, severe injury, and/or death. Do not expose your device to any extreme environment where the temperature or humidity is high. Such exposure could result in damage to the device or fire. Refer to the device specifications regarding recommended operating temperature and humidity. Do not expose the device to water, rain, or spilled beverages. It is not waterproof. Exposure to liquids could result in damage to the device. Using accessories, such as antennas, that MultiTech has not authorized or that are not compliant with the device’s accessory specifications may invalidate the warranty.

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SAFETY INFORMATION
If the device is not working properly, contact MultiTech Technical Support.
User Responsibility
Respect all local regulations for operating your wireless device. Use the security features to block unauthorized use and theft. End user must operate product per country laws and rules.

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LABELS

Chapter 9 ­ Labels
Label Examples
Note: Actual labels vary depending on the regulatory approval markings and content. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. The label shown is not the actual size. QR code contains the Node ID
Example xDot example Device Labels

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C 8

LABELS
Chapter 10 ­ Developer Board Assembly Diagram and Schematics
Assembly Diagram – Top
L1 C34 and R30 share the same spot
View from Top side (Scale 3:1)
R32 R33
R44
P30
C14 CR1

P 1

P 3

P 5

P 7

P 9

P11

R26

JP 3

C2 7

C 1

TP3
R38

R35

TP4

U 8

TP5

C23 C24

P23

P21

P19

P17

P15

P13

LED2

LED3

LED1

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DEVELOPER BOARD ASSEMBLY DIAGRAM AND SCHEMATICS

Assembly Diagram – Bottom

View from Bottom side (Scale 3:1)

P 4

P 2

R25 R39 R42 R43

R40 R24

R41

C21

R27

R22

R45

R1

C11

R14 C29

C6 R16

C7 R20 R46

R15

C13 C12

C22 C32 C33
U10 C25 U4

U 6

C 9

R18

P 6

Y 3

P 8

R17

U11

P10

C28

P12

R21

C16 C15
R7 R13 R4

U16

C3 C4

R31

C35 R9 R8 R10
R11

C18 C17

C20 C19

R19

ANT1
C26 PCB1 C10

R2

R23

R3

P24

P22

R37

TP6

R28

R29

TP2

R36

TP1 TP7

R6 R12 R5

P20

P18

P16

P14

C31 C2

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Block Diagram

1

2

DEVELOPER BOARD ASSEMBLY DIAGRAM AND SCHEMATICS

3

4

5

6

OpenSDA DEBUG USB VCP SWD INTERFACE

USB A CONNECTOR

USB HUB

5V to 3.3V LDO

USB SERIAL

SERIAL INTERFACE SWD INTERFACE
OpenSDA CONNECTOR
BUFFERS
XDOT MODULE

Flash (FOTA)

-NOTICE-

Project Title XDOT DK
Model Name

DISPLAYED, USED DISTRIBUTED OR MODIFIED WITHOUT THE PRIOR WRITTEN 2022 MULTI- TECH SYSTEMS, INC. ALL RIGHTS RESERVED

Antenna Type

Build Configuration 7-Level

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Power

DEVELOPER BOARD ASSEMBLY DIAGRAM AND SCHEMATICS

Note: Test Points through-hole test points in the interior
JP5: Isolate xDot

UART1_RX_X

SWCLK_X

VMK_33 VMK_33 VMK_33

USB to UART

UART1_RX

No Relief

MBED_RX_B

VMK_33 VMK_33

S1: Reset Button

-NOTICE-

Project Title XDOT DK
Model Name

DISPLAYED, USED DISTRIBUTED OR MODIFIED WITHOUT THE PRIOR WRITTEN 2022 MULTI- TECH SYSTEMS, INC. ALL RIGHTS RESERVED

Antenna Type

XDOT-NA1-A00-SLZD

S2: User Button ANTENNA CHIP 900MHZ ISM 6X2
Flash for FOTA
Build Configuration 7-Level

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USB Hub/Linear Regulator

DEVELOPER BOARD ASSEMBLY DIAGRAM AND SCHEMATICS

4-PIN-USB
USB Connector

USB_U_D_N

USB Hub

OVCJ and PWRJ are disabled

Linear Regulator

Test headers for VCC_USB5V, VCC, VDD3_3, VMK_33, and GND

-NOTICE-

Project Title XDOT DK
Model Name

DISPLAYED, USED DISTRIBUTED OR MODIFIED WITHOUT THE PRIOR WRITTEN 2022 MULTI- TECH SYSTEMS, INC. ALL RIGHTS RESERVED

Antenna Type

Build Configuration 7-Level

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DESIGN CONSIDERATIONS

Chapter 11 ­ Design Considerations
Noise Suppression Design
Adhere to engineering noise-suppression practices when designing a printed circuit board (PCB). Noise suppression is essential to the proper operation and performance of the device and surrounding equipment.
Any OEM board design must consider both on-board and off-board generated noise that can affect digital signal processing. Both on-board and off-board generated noise that is coupled on-board can affect interface signal levels and quality. Noise in frequency ranges that affect device performance is of particular concern.
On-board generated electromagnetic interference (EMI) noise that can be radiated or conducted off-board is equally important. This type of noise can affect the operation of surrounding equipment. Most local government agencies have certification requirements that must be met for use in specific environments.
Proper PC board layout (component placement, signal routing, trace thickness and geometry, and so on) component selection (composition, value, and tolerance), interface connections, and shielding are required for the board design to achieve desired device performance and to attain EMI certification.
Other aspects of proper noise-suppression engineering practices are beyond the scope of this guide. Consult noise suppression techniques described in technical publications and journals, electronics and electrical engineering text books, and component supplier application notes.
PC Board Layout Guideline
In a 4-layer design, provide adequate ground plane covering the entire board. In 4-layer designs, power and ground are typically on the inner layers. Ensure that all power and ground traces are 0.05 inches wide.
Use spacers to hold the device vertically in place during the wave solder process. For an xDot the recommended landing pad size is the same as the xDot’s pad size, 0.28 in (0.71 cm).
Electromagnetic Interference
The following guidelines are offered specifically to help minimize EMI generation. Some of these guidelines are the same as, or similar to, the general guidelines. To minimize the contribution of device-based design to EMI, you must understand the major sources of EMI and how to reduce them to acceptable levels.
Keep traces carrying high frequency signals as short as possible. Provide a good ground plane or grid. In some cases, a multilayer board may be required with full layers for ground and power distribution. Decouple power from ground with decoupling capacitors as close to the device’s power pins as possible. Eliminate ground loops, which are unexpected current return paths to the power source and ground. Locate high frequency circuits in a separate area to minimize capacitive coupling to other circuits. Locate cables and connectors to avoid coupling from high frequency circuits. Lay out the highest frequency signal traces next to the ground grid. If using a multilayer board design, make no cuts in the ground or power planes and be sure the ground plane covers all traces. Minimize the number of through-hole connections on traces carrying high frequency signals.

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DESIGN CONSIDERATIONS
Avoid right angle turns on high frequency traces. Forty-five degree corners are good; however, radius turns are better. On 2-layer boards with no ground grid, provide a shadow ground trace on the opposite side of the board to traces carrying high frequency signals. This will be effective as a high frequency ground return if it is three times the width of the signal traces. Distribute high frequency signals continuously on a single trace rather than several traces radiating from one point.
Electrostatic Discharge Control
Handle all electronic devices with precautions to avoid damage due to the static charge accumulation.
See the ANSI/ESD Association Standard (ANSI/ESD S20.20-1999) ­ a document “for the Development of an Electrostatic Discharge Control for Protection of Electrical and Electronic Parts, Assemblies and Equipment.” This document covers ESD Control Program Administrative Requirements, ESD Training, ESD Control Program Plan Technical Requirements (grounding/bonding systems, personnel grooming, protected areas, packaging, marking, equipment, and handling), and Sensitivity Testing.
MultiTech strives to follow these recommendations. Input protection circuitry is incorporated in MultiTech devices to minimize the effect of static buildup. Take precautions to avoid exposure to electrostatic discharge during handling.
MultiTech uses and recommends that others use anti-static boxes that create a faraday cage (packaging designed to exclude electromagnetic fields). MultiTech recommends that you use our packaging when returning a product and when you ship your products to your customers.

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REGULATORY INFORMATION

Chapter 12 ­ Regulatory Information
EMC, Safety, and Radio Equipment Directive (RED) Compliance
The CE mark is affixed to this product to confirm compliance with the following European Community Directives: Council Directive 2011/65/EU on the restriction of the use of certain hazardous substances in electrical and electronic equipment; and Council Directive 2014/53/EU on radio equipment and telecommunications terminal equipment and the mutual recognition of their conformity. MultiTech declares that this device is in compliance with the essential requirements and other relevant provisions of Directive 2014/53/EU. The declaration of conformity may be downloaded at https://www.multitech.com/red
EMC, Safety, and Radio Equipment Regulations (UKCA)
For models designated for use in the UK, the following applies:

The UKCA mark is to confirm conformity with the relevant UKCA harmonization legislation:

2017 No 1206 2016 No 1101 2016 No 1091 2012 No 3032

The Radio Equipment Regulations 2017
The Electrical Equipment Safety Regulations 2016 The Electromagnetic Compatibility Regulations 2016 The Restriction of the Use of Hazardous Substances in Electrical and Electronic Equipment Regulations 2012

MultiTech declares that this device is in compliance with the essential requirements and other relevant provisions of the above regulations. The UKCA Declaration of Conformity may be requested at https://www.multitech.com/support/support

47 CFR Part 15 Regulation Class B Devices
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.
If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

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REGULATORY INFORMATION

Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Warning: Changes or modifications to this unit not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.
FCC Interference Notice
Per FCC 15.19(a)(3) and (a)(4) This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
FCC Notice

Per FCC KDB 996369, the Grantee of a transmitter seeking modular approval must provide integration instructions for host product manufacturers with each of the following items addressed:
2.2 List of applicable FCC rules FCC 15.247
2.3 Summarize the specific operational use conditions: The MTXDOT-NA1 is designed to be used for sensors or device tracking using the latest Lora Technology to communicate back to a Lora Gateway that could be nearby or many miles away depending on the install. 2.4 Limited module procedures N/A 2.5 Trace antenna designs The MTXDOT-NA1 allows for a customer to design in a trace antenna and will be left to the integrator to do C2PC if they decide they need or want to use a trace antenna that has different characteristics the antenna used with the ufl connection. 2.6 RF exposure considerations See Chapter 7 of this guide. 2.7 Antennas See Chapter 7 of this Guide. 2.8 Label and compliance information See chapter 9 2.9 Information on test modes and additional testing requirements See AT command section of this document.
2.10 Additional testing, Part 15 Subpart B disclaimer

Per FCC 15.19(a)(3) and (a)(4) This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

MultiTech provides software code meant to operate the radio to a level that maintains compliance with the operating modes under which these radio devices were certified. To ensure this level of compliance, the software code is provided in binary form only. Users are prohibited from making any changes that affect the operation of the radio performance. Accessing or controlling the radio through any means other than the provided binary

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software will void the certification of this product.

REGULATORY INFORMATION

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REGULATORY INFORMATION
Industry Canada Class B Notice
This Class B digital apparatus meets all requirements of the Canadian Interference-Causing Equipment Regulations.
Cet appareil numérique de la classe B respecte toutes les exigences du Reglement Canadien sur le matériel brouilleur.
This device complies with Industry Canada license-exempt RSS standard(s). The operation is permitted for the following two conditions:
1. the device may not cause interference, and 2. this device must accept any interference, including interference that may cause undesired operation of
the device.
Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes:
1. l’appareil ne doit pas produire de brouillage, et 2. l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en
compromettre le fonctionnement.

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ENVIRONMENTAL NOTICES
Chapter 13 ­ Environmental Notices
Waste Electrical and Electronic Equipment Statement
Note: This statement may be used in documentation for your final product applications.
WEEE Directive
The WEEE Directive places an obligation on EU-based manufacturers, distributors, retailers, and importers to takeback electronics products at the end of their useful life. A sister directive, ROHS (Restriction of Hazardous Substances) complements the WEEE Directive by banning the presence of specific hazardous substances in the products at the design phase. The WEEE Directive covers all MultiTech products imported into the EU as of August 13, 2005. EU- based manufacturers, distributors, retailers and importers are obliged to finance the costs of recovery from municipal collection points, reuse, and recycling of specified percentages per the WEEE requirements.
Instructions for Disposal of WEEE by Users in the European Union
The symbol shown below is on the product or on its packaging, which indicates that this product must not be disposed of with other waste. Instead, it is the user’s responsibility to dispose of their waste equipment by handing it over to a designated collection point for the recycling of waste electrical and electronic equipment. The separate collection and recycling of your waste equipment at the time of disposal will help to conserve natural resources and ensure that it is recycled in a manner that protects human health and the environment. For more information about where you can drop off your waste equipment for recycling, contact your local city office, your household waste disposal service or where you purchased the product.
July, 2005
REACH-SVHC Statement
Registration of Substances
Multi-Tech Systems, Inc. confirms that none of its products or packaging contain any of the Substances of Very High Concern (SVHC) on the REACH Candidate List, in a concentration above the 0.1% by weight allowable limit. For the current REACH-SVHC statement, refer to additional regulatory documents at: https://www.multitech.com/support/support

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ENVIRONMENTAL NOTICES
Restriction of the Use of Hazardous Substances (RoHS)
Multi-Tech Systems, Inc.
Certificate of Compliance
2015/863
Multi-Tech Systems, Inc. confirms that its embedded products comply with the chemical concentration limitations set forth in the directive 2015/863 of the European Parliament (Restriction of the use of certain Hazardous Substances in electrical and electronic equipment – RoHS 3). These MultiTech products do not contain the following banned chemicals1:
Lead, [Pb] < 1000 PPM Mercury, [Hg] < 100 PPM Cadmium, [Cd] < 100 PPM Hexavalent Chromium, [Cr+6] < 1000 PPM Polybrominated Biphenyl, [PBB] < 1000 PPM Polybrominated Diphenyl Ethers, [PBDE] < 1000 PPM Bis(2-Ethylhexyl) phthalate (DEHP): < 1000 ppm Benzyl butyl phthalate (BBP): < 1000 ppm Dibutyl phthalate (DBP): < 1000 ppm Diisobutyl phthalate (DIBP): < 1000 ppm Environmental considerations:
Moisture Sensitivity Level (MSL) =1 Maximum Soldering temperature = 260C (in SMT reflow oven) 1Lead usage in some components is exempted by the following RoHS annex, therefore higher lead concentration would be found in some modules (>1000 PPM);
Resistors containing lead in a glass or ceramic matrix compound.

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MOUNTING XDOTS AND PROGRAMMING EXTERNAL TARGETS

Chapter 14 ­ Tape and Reel Specifications and Guidelines
Text of first paragraph. Text of second paragraph.
Note: Text of note. Text of third paragraph.
1. Text of first list item. 2. Text of second list item. 3. Text of third list item.

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MOUNTING XDOTS AND PROGRAMMING EXTERNAL TARGETS

Chapter 15 ­ Mounting xDots and Programming External Targets

Mounting the Device on Your Board
A footprint diagram is included on the xDot Mechanical Drawing in Chapter 4.
Stencil
Match the stencil aperture size and layout to the mechanical footprint of the xDot (1:1). We recommend a stencil thickness of 5 mil.

Solder Profile

Note: Because this device goes through a no-clean assembly process, if you perform additional reflow processes, we recommend using a no-clean process.
Solder Paste: AIM M8 Lead-Free

Note: Calculate slope over 120 seconds

Name

Low Limit

Max Rising Slope (Target=1.0) 0

Max Falling Slope

-2

Soak Time 150-170C

15

Peak Temperature

235

Total Time Above 218C

30

High Limit 2 -0.1 45 250 90

Units Degrees/Second Degrees/Second Seconds Degrees Celsius Seconds

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MOUNTING XDOTS AND PROGRAMMING EXTERNAL TARGETS

Setpoints (Celsius)

Zone

1

2

3

4

5

6

Top

130

160

170

190

230

245

Bottom

130

160

170

190

230

245

Conveyer Speed

32.0 inch/minute

TC 1 2 3 Delta

Max Rising Slope Max Falling Slope Soak Time 150170C

Position Slope PWI Slope PWI Time PWI