unicore UM982 GPS Multi Frequency High Precision Positioning and Heading Module Installation Guide

unicore UM982 GPS Multi Frequency High Precision Positioning and Heading Module

Revision History

requirement for V_BCKP;

Add chapter 3.1: Recommended Minimal Design; Table 2-4: Update the IO threshold;

Chapter 5.2: Update the description of the humidity indicator;

Table 1-1: Update the heading accuracy (0.1°/1m baseline)

| 2022-09-09
R1.2| Add Chapter 3.5 Recommended PCB Package Design; Optimize Chapter 3.2 Antenna Feed Design;

Optimize Chapter 3.3 Power-on and Power-off

| 2023-04
R1.3| Add PPP accuracy in section 1.2| 2023-09

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Should you purchase our product and encounter any inconsistency, please contact us or our local authorized distributor for the most up-to-date version of this manual along with any addenda or corrigenda.

Foreword

This document describes the information of the hardware, package, specification and the use of Unicore UM982 module.

Target Readers

This document applies to technicians who possess the expertise on GNSS receivers.

Introduction

UM982 is a new generation of GNSS high precision positioning and heading module developed by Unicore Communications. It supports GPS/BDS/GLONASS/Galileo/QZSS, and can simultaneously track GPS L1/L2/L5, BDS B1I/B2I/B3I, GLONASS G1/G2, Galileo E1/E5a/E5b, and QZSS L1/L2/L5. The module is mainly used in UAVs, lawn mowers, precision agriculture, and intelligent driving. With the support of on-chip RTK positioning and dual-antenna heading solution, UM982 can be used as a rover or base station.
UM982 is based on NebulasⅣTM, a GNSS SoC which integrates RF, baseband and high precision algorithm. Besides, the SoC integrates a dual-core CPU, a high speed floating point processor and an RTK co-processor, with 22 nm low power design, and it supports 1408 super channels. All these above enable stronger signal processing capability.
UM982 allows a flexible configuration of multi-system joint positioning or single system standalone positioning. With the built-in advanced anti-jam unit, the module can achieve high accuracy even in the complex electromagnetic environment.
Furthermore, UM982 supports abundant interfaces such as UART, I 2C , SPI , as well as 1PPS, EVENT, CAN* , which meets the customers’ needs in different applications.

Figure 1-1 UM982 Module

Key Features

• 16 mm × 21 mm × 2.6 mm, surface-mount device
• Supports all-constellation multi-frequency on-chip RTK positioning and dualantenna heading solution
• Supports BDS B1I/B2I/B3I + GPS L1/L2/L5 + GLONASS G1/G2 + Galileo E1/E5a/E5b + QZSS L1/L2/L5 + SBAS
• Dual-RTK engine technology
• Adaptive recognition of RTCM input data format
• Dual antenna input
• Supports 3 × UART, 1 × I2C, 1 × SPI and 1 × CAN*

Key Specifications

Table 1-1 Technical Specifications

Basic Information|
---|---
Channels| 1408 channels, based on NebulasIVTM
Constellations| BDS/GPS/GLONASS/Galileo/QZSS
Master Antenna Frequencies| BDS: B1I, B2I, B3I
GPS: L1 C/A, L2P (Y)/L2C, L5
GLONASS: G1, G2
Galileo: E1, E5a, E5b
QZSS: L1, L2, L5
Slave Antenna Frequencies| BDS: B1I, B2I, B3I
GPS: L1 C/A, L2C
GLONASS: G1, G2
Galileo: E1, E5b
QZSS: L1, L2
Power|
---|---
Voltage| +3.0 V ~ +3.6 V DC
Power Consumption| 600 mW1

*I2C, SPI, CAN: reserved interfaces, not supported currently

Performance2

Positioning Accuracy| Single Point Positioning3 (RMS)| Horizontal: 1.5 m
Vertical: 2.5 m
DGPS (RMS)3,4| Horizontal: 0.4 m + 1ppm
Vertical: 0.8 m + 1ppm
RTK (RMS)3, 4| Horizontal: 0.8 cm + 1 ppm
Vertical: 1.5 cm + 1 ppm
PPP (RMS)5| Horizontal: 5 cm
Vertical: 10 cm
Observation Accuracy (RMS)| BDS| GPS| GLONASS| Galileo
B1I/L1 C/A/G1/E1 Pseudorange| 10 cm| 10 cm| 10 cm| 10 cm
B1I/L1 C/A/G1/E1 Carrier Phase| 1 mm| 1 mm| 1 mm| 1 mm
B3I/L2P(Y)/L2C/G2 Pseudorange| 10 cm| 10 cm| 10 cm| 10 cm
B3I/L2P(Y)/L2C/G2 Carrier Phase| 1 mm| 1 mm| 1 mm| 1 mm
B2I/L5/E5a/E5b Pseudorange| 10 cm| 10 cm10 cm| | 10 cm
B2I/L5/E5a/E5b Carrier Phase| 1 mm| 1 mm1 mm| 1 mm|
Heading Accuracy (RMS)| 0.1°/1m baseline
Time Pulse Accuracy (RMS)| 20 ns
Velocity Accuracy6 (RMS)| 0.03 m/s

1. Dual antenna 10 Hz PVT + 10 Hz RTK + 10 Hz Heading
2. Performance specifications of the master antenna
3. Test results may be biased due to atmospheric conditions, baseline length, GNSS antenna type, multipath, number of visible satellites, and satellite geometry
4. The measurement uses a 1 km baseline and a receiver with good antenna performance, regardless of possible errors of antenna phase center offset
5. After 20 minutes of convergence under open sky without jamming
6. Open sky, unobstructed scene, 99% @ static

Hot Start < 4 s
Initialization Time3| < 5 s (Typical)
Initialization Reliability3| > 99.9%
Data Update Rate| 20 Hz Positioning & Heading 20 Hz Raw Data observation
Differential Data| RTCM 3.X
Data Format| NMEA-0183, Unicore

Physical Characteristics

• Package 48 pin LGA
• Dimensions 21 mm × 16 mm × 2.6 mm
• Weight 1.82 g ± 0.03 g

Environmental Specifications

• Operating Temperature -40 °C ~ +85 °C
• Storage Temperature -55 °C ~ +95 °C
• Humidity 95% No condensation
• Vibration GJB150.16A-2009, MIL-STD-810F
• Shock GJB150.18A-2009, MIL-STD-810F

Functional Ports

• UART × 3
• I 2C*× 1
• **SPI*** × 1 Slave
• **CAN*** × 1 Shared with UART3

-130dBm @ more than 12 available satellites
*I2C, SPI, CAN: reserved interfaces, not supported currently

Block Diagram

Figure 1-2 UM982 Block Diagram

• RF Part
  The receiver gets filtered and enhanced GNSS signal from the antenna via a coaxial cable. The RF part converts the RF input signals into the IF signals, and converts IF analog signals into digital signals required for NebulasIVTM chip (UC9810).

• NebulasIVTM SoC (UC9810)
  NebulasIV (UC9810) is UNICORECOMM’s new generation high precision GNSS SoC with 22 nm low power design, supporting all constellations, multiple frequencies, and 1408 super channels. It integrates a dual-core CPU, a high speed floating point processor and an RTK co-processor, which can fulfill the high precision baseband processing and RTK positioning/heading independently.

• External Interfaces
  The external interfaces of UM982 include UART, I 2C , SPI , CAN* , PPS, EVENT, RTK_STAT, PVT_STAT, ERR_STAT, RESET_N, etc.

Hardware

Pin Definition

Figure 2-1 UM982 Pin Definition

to RTC and relevant register. Level requirement: 2.0 V ~ 3.6 V, and the working current should be less than 60 μA at 25 °C. If you do not use the hot start function, connect V_BCKP to VCC. Do NOT connect it to
| | | ground or leave it floating.
6| SPIS_CSN| I| Chip select pin for SPI slave
7| SPIS_MOSI| I| Master Out / Slave In. This pin is used to receive data in slave mode.
8| SPIS_CLK| I| Clock input pin for SPI slave
9| SPIS_MISO| | Master In / Slave Out. This pin is used to transmit
O
| data in slave mode.
10| SPIS_SDRY| O| Interrupt output of SPI slave
11| RSV| —| Reserved, floating
12| RSV| —| Reserved, floating
13| RSV| —| Reserved, floating
| | | Error status: active high;
14| ERR_STAT| O| outputs high when failing self-test, and low when
| | | passing self-test
| | | PVT status: active high;
15| PVT_STAT| O| outputs high when positioning and low when not
| | | positioning
| | | RTK status: active high;
16| RTK_STAT| O| outputs high for RTK fixed solution and low for
| | | other positioning status or no positioning
17| RXD1| I| COM1 input, LVTTL level
18| TXD1| O| COM1 output, LVTTL level
19| RXD2| I| COM2 input, LVTTL level
20| TXD2| O| COM2 output, LVTTL level
21| SCL| I/O| I2C clock
22| SDA| I/O| I2C data
23| VCC| POWER| Power supply (+3.3 V)
24| VCC| POWER        Power supply (+3.3 V)
25| BIF| Built-in function; recommended to add a through- hole testing point and a 10 kΩ pull-up resistor; —
| | cannot connect ground or power supply, cannot input/output data, and cannot be floating Built-in function; recommended to add a through- hole testing point and a 10 kΩ pull-up resistor;
26| BIF| —
| | cannot connect ground or power supply, cannot input/output data, and cannot be floating COM3 output, which can be used as CAN TXD,
27| TXD3| O
COM3 output, which can be used as CAN TXD, LVTTL level
28| RXD3| I
COM3 input, which can be used as CAN RXD, LVTTL level
29| RSV| –
Reserved, floating
30| PPS| O
Pulse per second, with adjustable pulse width and polarity
31| RSV| –
Reserved, floating
32| EVENT| I
Event mark input, with adjustable frequency and polarity
33| RESET_N| I
System reset, active low, and the active time should be no less than 5 m
34| GND| –
Ground
35| GND| –
Ground
36| ANT2_IN| I
GNSS slave antenna signal input
37| GND| –
Ground
38| RSV| –
Reserved, floating
39| RSV| –
Reserved, floating
40| RSV| –
Reserved, floating
41| GND| –
Ground
42| RSV| –
Reserved, floating
43| GND| –
Ground
44| RSV| –
Reserved, floating
45| GND| –
Ground
46| RSV| –
Reserved, floating
47| RSV| –
Reserved, floating
48| RSV| –
Reserved, floating

Electrical Specifications

Absolute Maximum Ratings

Table 2-2 Absolute Maximum Ratings

Operating Conditions

Table 2-3 Operating Conditions

IO Threshold

Table 2-4 IO Threshold

Antenna Feature

Table 2-5 Antenna Feature

The voltage range of VCC (3.0 V ~ 3.6 V) has already included the ripple voltage.
Since the product has capacitors inside, inrush current occurs during power- on. You should evaluate in the actual environment in order to check the effect of the supply voltage drop caused by inrush current in the system.

Dimensions

Table 2-6 Dimensions

Figure 2-2 UM982 Mechanical Dimensions

Hardware Design

Recommended Minimal Design

Figure 3-1 Recommended Minimal Design

L1 : 68 nH RF inductor in 0603 package is recommended
C1 : 100 nF + 100 pF capacitors connected in parallel is recommended
C2 : 100 pF capacitor is recommended
C3 : N 10 μF + 1 100 nF capacitors connected in parallel is recommended, and the total inductance should be no less than 30 μF
R1 : 10 kΩ resistor is recommended

Antenna Feed Design

When feeding the antenna from the outside, you can use devices with high power and that can withstand high voltage. Gas discharge tube, varistor, TVS tube and other high power protective devices may also be used in the power supply circuit to improve the protection.

If the antenna feed supply ANT_BIAS and the module’s main supply VCC use the same power rail, the ESD, surge and overvoltage from the antenna will have an effect on VCC, which may cause damage to the module. Therefore, it is recommended to design an independent power rail for the ANT_BIAS to reduce the possibility of module damage.

Figure 3-2 UM982 External Antenna Feed Reference Circuit

Notes

• L1 and L2: feed inductor, 68 nH RF inductor in 0603 package is recommended
• C1and C3: decoupling capacitor, recommended to connect two capacitors of 100 nF / 100 pF in parallel
• C2 and C4: DC blocking capacitor, recommended 100 pF capacitor
• D1and D4: ESD diode, choose the ESD protection device that supports high frequency signals (above 2000 MHz)
• D2 and D3: TVS diode, choose the TVS diode with appropriate clamping specification according to the requirement of feed voltage and antenna withstand voltage

Power-on and Power-off

VCC

• The VCC initial level when power-on should be less than 0.4 V.
• The VCC ramp when power-on should be monotonic, without plateaus.
• The voltages of undershoot and ringing should be within 5% VCC.
• VCC power-on waveform: The time interval from 10% rising to 90% must be within 100 μs ~1 ms.
• Power-on time interval: The time interval between the power-off (VCC < 0.4 V) to the next power-on must be larger than 500 ms.

V_BCKP

• The V_BCKP initial level when power-on should be less than 0.4 V.
• The V_BCKP ramp when power-on should be monotonic, without plateaus.
• The voltages of undershoot and ringing should be within 5% V_BCKP.
• V_BCKP power-on waveform: The time interval from 10% rising to 90% must be within 100 μs ~1 ms.
• Power-on time interval: The time interval between the power-off (V_BCKP < 0.4 V) to the next power-on must be larger than 500 ms.

Grounding and Heat Dissipation

Figure 3-3 Grounding and Heat Dissipation Pad (Bottom View)

The 35 pads in the rectangle in Figure 3-3 are for grounding and heat dissipation. In the PCB design, the pads should be connected to a large sized ground to strengthen the heat dissipation.

Recommended PCB Package Design

See the following figure for the recommended PCB package design.

Figure 3-4 Recommended PCB Package Design

Notes:

For the convenience of testing, the soldering pads of the pins are designed long, exceeding the module border much more. For example:

• The pads denoted as detail C are 1.77 mm longer than the module border.
• The pad denoted as detail A is 0.47 mm longer than the module border. It is relatively short as it is an RF pin pad, so we hope the trace on the surface is as short as possible to reduce the impact of external interference on the RF signals.

Production Requirement

Recommended soldering temperature curve is as follows:

Figure 4-1 Soldering Temperature (Lead-free)

Temperature Rising Stage

• Rising slope: Max. 3 °C/s
• Rising temperature range: 50 °C ~ 150 ° C

Preheating Stage

• Preheating time: 60s ~ 120 s
• Preheating temperature range: 150 ° C ~ 180 °C

Reflux Stage

• Over melting temperature (217 °C) time: 40s ~ 60 s
• Peak temperature for soldering: no higher than 245 ° C

Cooling Stage

• Cooling slope: Max. 4 °C / s

• In order to prevent falling off during soldering of the module, do not solder it on the back of the board during design, and it is not recommended to go through soldering cycle twice.

• The setting of soldering temperature depends on many factors of the factory, such as board type, solder paste type, solder paste thickness, etc. Please also refer to the relevant IPC standards and indicators of solder paste.

• Since the lead soldering temperature is relatively low, if using this method, please give priority to other components on the board.

• The opening of the stencil needs to meet your design requirement and comply with the examine standards. The thickness of the stencil is recommended to be larger than 0.15 mm.

Packaging

Label Description

Figure 5-1 Label Description

Product Packaging

The UM982 module uses carrier tape and reel (suitable for mainstream surface mount devices), packaged in vacuum-sealed aluminum foil antistatic bags, with a desiccant inside to prevent moisture. When using reflow soldering process to solder modules, please strictly comply with IPC standard to conduct temperature and humidity control. As packaging materials such as the carrier tape can only withstand the temperature of 55 °C, modules shall be removed from the package during baking.

Figure 5-2 UM982 Package

Dimensions

E| 1.75±0.10
F| 20.20±0.10
S| 40.40±0.10
P2| 2.00±0.10
Do| 1.50 ± 0.10
0.00
D1|
Po| 4.00±0.10
10Po| 40.00±0.20
W| 44.00±0.30
P| 24.00±0.10
Ao| 16.80±0.10
B0| 21.80±0.10
K0| 3.30±0.10
t| 0.35±0.05

Note:

1. The cumulative tolerance of 10 side holes should not exceed ± 0.2 mm.
2. Material of the tape: Black antistatic PS (surface impedance 105-1011) (surface static voltage <100 V), thickness: 0.35 mm.
3. Total length of the 13-inch reel package: 6.816 m (Length of the first part of empty packets: 0.408 m, length of packets containing modules: 6 m, length of the last part of empty packets: 0.408 m).
4. Total number of packets in the 13-inch reel package: 284 (Number of the first part of empty packets: 17; actual number of modules in the packets: 250; number of the last part of empty packets: 17).
5. All dimension designs are in accordance with EIA-481-C-2003.
6. The maximum bending degree of the carrier tape within the length of 250 mm should not exceed 1 mm (see the figure below).

Figure 5-3 UM982 Reel Package Diagram

Table 5-1 Package Description

External diameter: 330 ± 2 mm,
Internal diameter: 180 ± 2mm,
Width: 44.5 ± 0.5 mm
Thickness: 2.0 ± 0.2 mm
Carrier Tape| Space between (center-to-center distance): 24 mm

Before surface mounting, make sure that the color of the 30% circle on the HUMIDITY INDICATOR is blue (see Figure 5-4). If the color of the 20% circle is pink and the color of the 30% circle is lavender (see Figure 5-5), you must bake the module until it turns to blue.

Figure 5-4 Normal Humidity Indication

Figure 5-5 Abnormal Humidity Indication

The UM982 is rated at MSL level 3. Please refer to the IPC/JEDEC J-STD-033 standards for the package and operation requirements. You may access to the website www.jedec.org to get more information.

The shelf life of the UM982 module packaged in vacuum-sealed aluminum foil antistatic bags is one year.

Customer Support

Unicore Communications, Inc.
F3, No.7, Fengxian East Road, Haidian, Beijing, P.R.China,
100094
www.unicorecomm.com
Phone : 86-10-69939800
Fax : 86-10-69939888
info@unicorecomm.com

References

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