TRESKY T-5100 Die Bonder and Component Placer User Guide
- October 30, 2023
- TRESKY
Table of Contents
TRESKY T-5100 Die Bonder and Component Placer
Product Information
The T-5100 is a versatile machine that is used for micro-assembly tasks. It is a manual machine that is flexible and adaptable to many tasks in the R&D area, and it is just as popular for small-scale and pilot production. It comes with various features such as Waffle/Gel Pack Sub-Micron Alignment Accuracy Flip- Chip, Eutectic Die Bonding, Epoxy Dispensing/Stamping, Pick from Wafer, Ultrasonic, UV Curing, and micro assembly. It is part of the T-5000 series manufactured by Dr. TRESKY AG Switzerland. The machine has many different holders for various substrate and package types, waffle/gel packs (2, 4) and trays. It has a True Vertical TechnologyTM with XY-table having parallel linear guides and active arrest for rapid and exact manual positioning withrelease/clamp button; micrometer screws for precise adjustment in X and Y. FLIP-CHIP MPA 5000 High-resolution placement unit with beam splitter and high- resolution camera, LED lighting for upward / downward and Coax looking or superimposed inspection, for ultra-precise Multi Point Alignment (range 45x50mm) at sub-micronresolution. The machine also has a T-5100-W version that features up to a 200mm wafer table which sits below the main table with Tresky’s pneumatic die ejection system. The machine is extremely rigid and compact enough to fit on a lab desk. It can be expanded with many different modules to cover an enormous range of applications. The machine has Preset knobs for pick and place Z-positions, PC Touch-Screen for parameter settings and bond force monitor, Monitor screen or PC for image from Beam Splitter camera, Pick/Place Z-Axis with force sensor and Bond Force measurement. The machine also has optional features such as Scrubbing motion or Ultrasonic bonding action, Stamping unit for adhesive application by specialized stamping tools, and 2nd spindle for preform pickup can be added.
Product Usage Instructions
The T-5100 is an intuitive machine to operate. A few minutes of training is sufficient to start working with the machine. The accuracy and repeatability of placing parts are superb thanks to a number of well-thought-out features. To use the machine:
- Insert the substrate or package type in holders provided on the machine.
- Set the Preset knobs for pick and place Z-positions as per requirement.
- Use the PC Touch-Screen for parameter settings and bond force monitor.
- Use the Monitor screen or PC for image from Beam Splitter camera to check placement accuracy.
- Use Pick/Place Z-Axis with force sensor and Bond Force measurement for precise placement.
- Use optional features such as Scrubbing motion or Ultrasonic bonding action, Stamping unit for adhesive application by specialized stamping tools, and 2nd spindle for preform pickup as per requirement.
- To use the T-5100-W version, place the wafer on the wafer table, which sits below the main table with Tresky’s pneumatic die ejection system for extremely gentle die ejection from wafer ring or frame.
The technical data of the machine is as follows:
- XY- Movement (placement stage): 220mm x 220mm (manual)
- Z- Movement : 120mm (manual)
- Spindle Rotation : unlimited
- Bond Force : 20g – 1000g
- Max. PC Board-/ Substrate Size: 400mm x 280mm
- Placement accuracy : sub-micron accuracy
- Optical Resolution (Flip-Chip Optic 1x option): high-resolution placement unit with beam splitter and high-resolution camera, LED lighting for upward / downward and Coax looking or superimposed inspection, for ultra-precise Multi Point Alignment (range 45x50mm) at sub-micron resolution.
- Optical Resolution (Flip-Chip Optic 2x option): high-resolution placement unit with beam splitter and high-resolution camera, LED lighting for upward / downward and Coax looking or superimposed inspection, for ultra-precise Multi Point Alignment (range 22.5x25mm) at sub-micron resolution.
- Dimensions (with PC or Monitor): N/A
- Weight : N/A
- Voltage : N/A
For over 40 years now, Tresky has been synonymous for perfect micro-assembly equipment in the world of R&D and small-scale production. Customers know and love Tresky because the equipment is so easy to learn and use: you can be productive from day one. Manufactured with Swiss precision and dedication to engineering, the machines can remain in use for many years, and they can be adapted and expanded for a large variety of new and evolving appli-cations, keeping the investment always at the cutting edge of technology. The T-5100 is the universal workhorse for a wide range of micro-assembly tasks. The manual operation makes it so very flexible and adaptable to many tasks in the R&D area, and it is just as popular for small-scale and pilot production.
- Pick from Waffle/Gel Pack
- Sub-Micron Alignment Accuracy
- Flip-Chip
- Epoxy Dispensing/Stamping
- Pick from Wafer
- Ultrasonic
- UV Curing
Operating a Tresky die bonder/placer is intuitive. A few minutes’ training is sufficient to start working with the machine. The accuracy and repeatability of placing parts is superb thanks to a number of well-thought out features like a true, linear Z-Axis, Force Control, XY Fine Control and high-resolution optics that allow flip-chip placing down to sub-micron accuracy. The extremely rigid machine base is compact and fits on a lab desk. It can be expanded with many different modules to cover an enormous range of applications. The T-5100-W version features up to a 200mm wafer table which sits below the main table with Tresky’s pneumatic die ejection system.
FLIP-CHIP MPA 5000
High-resolution placement unit with beam splitter and high-resolution camera,
LED lighting for upward / downward and Coax looking or superimposed
inspection, for ultra-precise Multi Point Alignment (range 45x50mm) at sub-
micron resolution.
Many different holders for various substrate and package types, waffle/gel packs (2”, 4”) and trays
T-5100-W
Wafer XY table drawer with proprietary, pneumatic, Tresky die-ejection system
for extremely gentle die ejection from wafer ring or frame
Substrate holders, heatable up to 450°C with external tempera-ture controllers, optional versions with tool heating and for flooding with cold or heated forming gas
Optional:
Scrubbing motion or Ultrasonic bonding action
Optional:
Stamping unit for adhesive application by specialized stamping tools
Optional:
2nd spindle for preform pickup can be added
Typical and customized Applications
- Die sorting from wafer into waffle packs or gel packs
- Die attach with adhesive (stamped or dispensed)
- 3D packaging of MEMS, MOEMS, Photonics, …
- High-precision placement with visual adjustment by beam-splitter unit for look-up inspection of edges, corners or patterns, e.g. for laser bars
- Flip-Chip with ultrasonic die attach
- Flip-Chip with adhesives or anisotropic foils
- Sensor assembly
- UV curing of die attach
- Eutectic bonding of AuSi, Copper Pillar and others
Technical Data
- XY- Movement (placement stage): 220mm x 220mm (manual)
- Z- Movement : 120mm (manual)
- Spindle Rotation : 360° (unlimited)
- Bond Force : 20g – 1000g
- Max. PC Board-/ Substrate Size : 400mm x 280mm
- Placement accuracy : ±10μm; <±1μm optional (process and option depending)
- Optical Resolution (Flip-Chip Optic 1x option): 1.25μm
- Optical Resolution (Flip-Chip Optic 2x option) : 0.625μm
- Dimensions (with PC or Monitor): 1155mm x790mm x728mm
- Weight : 90kg (+30kg option depending)
- Voltage : 110V / 220V
treskY – Solutions for Microelectronics assembly
Dr. Tresky AG offers manual and semi-manual Die Bonding solutions for small and medium sized electronics assembly facilities, laboratories and R&D. As a solutions provider, we support specific applications with our highly accurate and innovative systems. Starting from manual to semi automatic, from adhesives to tools, exactly as per our customer’s need. This is made possible by our extensive experience and modular setup which allows adapting various basic systems with an huge selction of options for new processes. With almost 2000 devices installed across the world, often with special & customized equipment,we diligently work to fulfill complex process requirements. Supported by a fast, flexible and professional team ready to be tested, we look forward to your challenge
Headquarters
Dr. TRESKY AG Boenirainstr. 13 CH-8800 Thalwil Switzerland
- Tel.: +41 44 772 1941
- tresky@tresky.com
TRESKY Corporation 704 Ginesi Drive, Suite 11A Morganville, NJ 07751 USA
- Tel.: +1 732 536 8600
- sales@tresky.com
- www.tresky.com
References
Read User Manual Online (PDF format)
Read User Manual Online (PDF format) >>